QF K A B C D A : Series Name. D : Inductance Tolerance. ( K=±10% ) B : Dimension. C : Inductance. (220uH ) CIRCUIT

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1 SPECIFICTION HF COMPLINT 1.MECHNICL & DIMENSIONS B B (UNIT: mm) 5.2±.5 4.5±.5 C 5.8±.5 D D a 1.5ref 5.5ref C b c 2.15ref 1.7ref b CIRCUIT c a S PCB Layout F 2.ELECTRICL REQUIREMENTS: PRMETER SPECIFICTION L 22±1% uh DCR 157 max mohm I-sat.47 typ mps Irms.42 max mps 3.TEMPERTURE RTING: Operating -4 ~ 125 CONDITION 25 9% L ΔT 4 TEST INSTRUMENTS CH-162 LCR METER CH-52BC IMPEDNCE METER CH-332 LCR METER + CH-132 BIS DIGITL THERMOMTER: DM681 4.PRODUCT IDENTIFICTION: QF K B C D : Series Name. D : Inductance Tolerance. ( K=±1% ) B : Dimension. C : Inductance. (22uH ) 23/6/215 1 Copyright ll rights reserved.

2 5.TESTING DT: PRMETER L DCR I-sat Irms UNIT uh mohm mps mps SPECIFICTION 22±1% 157 max.47 typ.42 max CONDITION 25 9% L ΔT ok ok MEN R MBIENT CONDITION TEMPERTURE 25 ± 5 HUMIDITY 6 ± 1% 7.TEST DT NO B C D 5.2±.5 4.5±.5 5.8±.5 1.5ref MEN R /6/215 2 Copyright ll rights reserved.

3 INDUCTNCE ( UH ) 8.INDUCTNCE (uh) VS DC BIS (mps) PRT NO CONDITION: 1KHz, 1.Vrms % L 1.% 1.% 1.% 99.9% 98.64% 97.27% 95.% 89.55% 78.18% 58.18% (7)MRKING: NR DC BIS (mps) 23/6/215 3 Copyright ll rights reserved.

4 ΔT ( C ) 9.TEMPERTURE RISE ΔT ( C) VS DC BIS (mps) PRT NO CONDITION: 1KHz,.25Vrms DC BIS ( mps ) 23/6/215 4 Copyright ll rights reserved.

5 1. Reliability and Testing Conditions / SMD Power Inductors HF COMPLINT Item Specification Conditions Operating temperature range Storage temperature and humidity range -4 ~ ±5, 7% RH Max. 23 Preheatin Dipping Cooling Solderability More than 9% of the terminal electrode should be covered with solder ±1. Unit: Second Preheating Dipping Cooling 26 Solder Heat Resistance Inductance within ±1% of initial value ±.5 Unit: Second Heat resistance Inductance within ±1% of initial value. fter 5 hours in 125±5 and 2 hour drying under normal condition. Cold resistance Inductance within ±1% of initial value. fter 5 hours in -4±5 and 2 hour drying under normal condition. Thermal shock Inductance within ±1% of initial value. fter 1 cycles of following condition. Step Temperature ( ) Times (min.) 1-4±2 3 2 Room Temperature Within ±5 3 4 Room Temperature Within 3 Humidity Resistance Inductance within ±1% of initial value. fter 5 hours in 4±2 and 9 to 95% humidity, and 2 hour drying under normal condition. Vibration Test Inductance within ±5% of initial value and appearance shall not break. fter vibration for 1hour, In each of three orientations at sweep vibration (1~55~1Hz) with 1.52mm P-P mplitudes. 23/6/215 5 Copyright ll rights reserved.

6 Temperature ( ) Temperature ( ) 11. Recommended Soldering Conditions For Lead-Free pplication HF COMPLINT Figure 1. Re-flow Soldering Preheating Soldering Cooling Peak : 245±5 5±.5 sec or more to 12 Sec. Time (Sec.) Within 4 Figure 2. Hand Soldering PRE-HETING SOLDERING NTURL PRE-HETING SOLDERING NTURL COOLING COOLING Preheating Solderin Cooling 28 Within 3 sec. TEMPERTURE C Over 1 min. Over 1 min. Over 1 min. 23/6/215 6 Gradual Cooling Gradual Cooling Within 3 sec. Gradual Cooling Copyright ll rights reserved.

7 12.PCKGING Tape Dimension Series Name :QF-54 Unit: mm O BO KO P T W 5.5± ±.1 4.8±.1 8.±.1.35±.5 12±.3 Packaging Quantity (7)MRKING: NR6 Series Name :QF-54 Reel Inner Carton Quantity Reel Quantity Size 15pcs 2 3pcs Unit: mm Quter Carton Inner Carton Quantity Size 4 12pcs Storage Transportation 1. Temperature and humidity conditions: Less than 4 and 7% RH. 2. Recommended products should be used within 6 months form the time of delivery. 3. The packaging material should be kept where no chlorine 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and or sulfur exists in the air. mechanical shock are minimized. 23/6/215 7 Copyright ll rights reserved.