SPECIFICATION FOR APPROVAL

Transcription

1 Laird Technologies,Co., Ltd. Customer : All Manufacturer : Laird Technologies Co.,Ltd. Product : Laird P/N : MGV2Series Customer P/N : N/A Issued Date : Rev : A Customer Response Approved By: Signature: Date: Approved By Laird Signature Checked By Prepared By Chiang Siemens Mi Denny Chen Laird (Foshan) Magnetics Co., Ltd. Fu an Industrial Zone, Leliu Town, Shunde, Foshan City, Guangdong, China Tel: +86 (757) Fax: +86 (757) ISO 9 ISO china@lairdtech.com Website: OHSAS

2 Rev Items Before After A Owner Denny Date 8.2.8

3 .MECHANICAL & DIMENSIONS (UNIT: mm) A A 3.±. B 3.±. C.±. D.±. E.±. E L G 4. ref.9 ref B C D H.45 ref L REMARK G H 2.PART NUMBER NOMENCLATOR: MGV 2 M - X A B C D E A: Product Series. B: Series number, part size C: Inductance code D: Inductance Tolerance. (M=±%,N=±%) E: "X"=:Standard catalog part number "X"=-9:Controlled customized part or different performance than std catalog part. And "5-9" is for automotive grade. 3.EQUIVALENT CIRCUIT: Page : /9

4 PART NUMBER MGV2R68M- INDUCTANCE (uh) MGV2RN-.±% MGV2R22N- 2±% MGV2R47M-.47±% MGV2R82M-.82±% MGV2RM-.±% MGV2R2M-.±% MGV23R3M- 3.±% MGV2R5M-.±% MGV22R2M- 2.±% ±% MGV24R7M- 4.±% MGV26R8M- 6.±% Irms(A) Typ. Isat(A) Typ. DCR(mΩ) Typ DCR(mΩ) Max MGV2M-.±% REMARK GENERAL SPECIFICATION:, Test conditions(l): KHz, Vrms 2, Operating temperature: -55 to +25 (Including self-heating) 3, Storage temperature: - to + 4, Humidity range: % RH Max. 5, Heat Rated Current (Irms) will cause the coil temperature rise approximately t of C 6, Saturation Current (Isat) will cause L to drop approximately %. 7, Part Temperature (Ambient+Temp. Rise) : Should not exceed 25 C under worst case operating condit 8, Storage condition (component in its packaging) Page 2/9

5 Characteristics Curve.2 MGV2RN- 5 MGV2R22N MGV2R47M-.8 MGV2R68M MGV2R82M-.2 MGV2RM Page 3/9

6 Characteristics Curve.4 MGV2R2M-.8 MGV2R5M MGV22R2M- 4 MGV23R3M MGV24R7M- 8 MGV26R8M Page 4/9

7 Characteristics Curve 2 MGV2M Page 5/9

8 T E M P E R A T U R E C Recommended Soldering Conditions For Lead-Free Application Figure. Re-flow Soldering Within 4 sec Reflow times: 3 times max Figure 2. Hand Soldering P R E -H E A T IN G S O L D E R IN G N A T U R A L C O O L IN G 2 2 O v e r m in. W ith in 3 s e c. G ra d u a l C o o lin g Hand solder times: time max page 6/9

9 Reliability and Testing Conditions / Pin Type Power Inductors SMD series(consumer) Item Operating temperature range Storage temperature and humidity range High Temperature Exposure (Storage) Reference -55 ~ +25 (Including self-temperature rise) - to +, % RH Max MIL-STD-2 Method 8 85±2, 68+24hours Additional Requirements Temperature Cycling JESD22 Method JA , transforming interval:s, cycles Operational Life MIL-PRF-2 85±, 68+24hours Apply maximum rated voltage and current according part drawing External Visual MIL-STD-883 Method 9 Inspect device construction, marking and workmanship. Electrical Test not required. Physical Dimension Vibration JESD22 Method JB- MIL-STD-2 Method 4 Verify physical dimensions to the applicable device detail specification. Note: User(s) and Suppliers spec. Electrical Test not required ~55Hz,.5mm, 2 hours in each 3mutually Resistance to Soldering Heat MIL-STD-2 Method 2. Max. 2±5,±s, 2 times 2.Solder Composition: Sn/3Ag/.5Cu Solderability J-STD-2 245±5, 5±sec, Solder: Sn/3.Ag/.5Cu Electrical Characterization Print Spec Board Flex AEC-Q-5 Terminal Strength(SMD) AEC-Q-6 Parametrically test per lot and sample size requirements, summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max Operating temperatures 2mm,±s N, 5S, X,Y direct Page 7/9

10 D C B PACKAGING Reel Dimension A Type A(mm) B(mm) C(mm) D(mm) 3'x /- ± /- 3 Tape Dimension W E F P A B P2 P K t D 2.±.3.75±. 5.5±. 8±. 3.5±. 3.8±. 2.±. 4.±. 2.3±..35±.5.5Ref. Packaging Quantity P/N MGV2Series Chip/Reel pcs Size Peeling Off Force The force peeling off cove tape is to grams in the arrow direction under the following conditions Room Temp ( ) Room Humidity 5~35 45~85 Storage Conditions. Temperature and humidity conditions: --+ and % RH. 2. Recommended products should be used within 2 mont from the time of manufacturing. 3. The packaging material should be kept where no chlorin or sulfur exists in the air. 4. Allowable stacking condition of Packaging box:max height.5m or 5 boxes stacking Room atrn (hpa) 8~ Teaming Speed Page 8/9

11 MATERIAL IDENTIFICATION ITEM DESCRIPTION Spec SGS No. SUPPLIERS Powder Iron Powder SCL3H68 Laird 2 Copper Wire AIB SCLGE PACIFIC 3 Coating Paint RHSG64 BERLIN 4 Clip Clip CAN6783 HUIGAO Page 9/9