Product/Process Change Notice

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Helen Watts
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1 To : Dear Valued Customers Doc. No. : PCN17114 Date : We hereby submit PCN for your review and approval. Application or type: Product/Process Change Notice CGRM4x Series add source and internal change. Detail of the change: CGRM4x Series add lead frame and wafer source. Current: Current assembly house. the change: New assembly house. Reason for the change: This notification is to advise our customers that we will add new assembly house and wafer source of CGRM4x Series to better support long-term demand for the affected products. The delivery time of current assembly site takes too long. It can t fully satisfy demand. Wafer source the same fabrication process. New chip size bigger than original chip, new wafer has better electrical characteristic and thermal dissipation than the original wafer. Attach new reliability reports. Information of Supplier: Company Name : Comchip Technology Co., Ltd. Address : No.586, Jianguo Rd., Yingge Dist., New Taipei City, Taiwan Evaluation items: Part No. affected:cgrm4x-hf Series, CGRM4x-G Series Implemented from: Effective Date:17 Nov 217 QR-78-3 版本 :A Comchip Technology Co., Ltd. 1

R&D Dept. Signature: QA Dept. Signature: Answer To PCN Please complete the form below duly signed and fax back to Comchip Technology Co. Please select your answer 1. Approved this PCN 2.

2 R&D Dept. Signature: QA Dept. Signature: Answer To PCN Please complete the form below duly signed and fax back to Comchip Technology Co. Please select your answer 1. Approved this PCN 2. Approved this PCN with conditions 3. Disapproved this PCN Date Responsibility By Please specify the condition or explain the reason if you select 2 or 3. Unless a Comchip Technology Co., Ltd. Sales representative is contacted in writing within 3 days of the posting of this notice, all changes described in this announcement are considered approved. QR-78-3 版本 :A Comchip Technology Co., Ltd. 2

3 Technology Co., Ltd. Reliability Test Report Part NO.:CGRM44-HF Thru. CGRM47-HF Diodes Date: ComChip Technology Co., Ltd. Add.:No. 586, Jianguo Rd., Yingge Dist., New Taipei City 23943, Taiwan Tel.: FAX: QR-83-2 Rev.F

4 Comchip Technology Co., Ltd. Discrete Semiconductor Component Qualification Plan User P/N: User Component Engineer: Judy Lin User Spec.#: General Specification: AEC-Q11 Rev-D Supplier: Comchip Supplier Manufacturing Site: Yingge, Taiwan Supplier Generic P/N: Required PPAP Submission Date: 217/1/2 Supplier Intermal P / N : CGRM44-HF Family Type: Reason for Qual: Annual sampling tests Item Test Test Conditions Exceptions Est. Start Est. Comp. # Lots S. S. Remarks 1 TEST Electrical 217/8/1 217/8/ PASS 2 Preconditioning per AEC-Q11 217/8/2 217/8/ PASS 3 External Visual per AEC-Q11 217/8/1 217/8/ PASS Reverse 4 V 4 HTRB Ta= 125 ± /8/11 217/9/22 1 PASS Test Time=1 hrs 5 Temperature Cycling Tamin = -55 to Tamax15, dwelled for 5 min, Cycle = 1 217/8/16 217/8/23 1 PASS 6 Autoclave Ta = 121, P = 15psig, RH = 1% Test Time=96hrs 217/8/25 217/8/29 1 PASS 7 HAST Reverse 42 V Ta= 13, RH= 85% 217/9/8 217/9/12 1 PASS Test Time=96 hrs 8 IOL Io = 1 A, T on/off = 2 minutes, cycles = 15, 217/8/31 217/1/12 1 PASS 9 ESD per AEC-Q11 CDM: 1 KV HBM: 2 KV 217/9/8 217/9/8 1 6 PASS 1 Physical Dimension per AEC-Q11 217/9/11 217/9/ PASS 11 Resistance to Solder Heat Solder Pot Temp. 26±5 Duration 4-6 sec 217/9/13 217/9/ PASS 12 Solderability Solder Pot Temp. 245±5 Duration 5-1 sec 217/9/22 217/9/ PASS 13 Thermal Resistance per AEC-Q11 217/8/7 217/8/9 1 1 PASS Conclusion: 1. The total test had 13 item of reability test. 2. There were test result of pass. Approval: Kevin Tseng Prepare: Judy Lin

5 Comchip Technology Co., Ltd. Date: 217/1/2 Reliability Test Summary P / N : CGRM44-HF L / N : Criteria: VF 11 1 ma IR 5 4 V VZ 4 ma No Test Item Test Condition Test Foundation Failure qty' S.S Parameter X Bar S Dev Max Min 1 Pre-conditioning Initial Electrical Test Visual Inspection Ta= 125 Time= 24 hrs Ta= 85 RH= 85% Time = 168 hrs 3 reflow cycles using profiles per IPC/JEDEC J-STD- 2 Dip 1s flux DI water rinse Room ambitent drying Final Electrical Test A High Temperature Reverse Bias VR= 4 V Ta= 125 ± 5.. (depend on product) Test Time 1 hrs. MIL-STD-75-1 M Temperature Cycle -55 to 15 dwelled for 5 min and transfer time not exceed 1 min; 1 cycles A Autoclave Ta= 121 Pressure= 15 Psi Time= 96 hrs A Highly Accelerated Stress Test VR= 42V Ta= 13 RH= 85% Test Time=96 hrs A Intermittent Operational Life Io = 1 A, T on/off = 2 minutes, cycles = 15, MIL-STD-75 Method

6 No 7 Date: P / N : CGRM44-HF L / N : Criteria: VF 11 1 ma IR 5 4 V VZ 4 ma Test Item Resistance to Solder Heat 8 Solderability ESD Characterization Physical Dimension Thermal Resistance Test Condition Ta= 125 Time=24hrs Ta= 85 RH= 85% Time=168 hrs one inch above the hot solder for 15 s Temp of solder pot=26±5 Time= 4~6 sec. Ta= 85, RH= 85% Time=1 hrs Ta= 1 Time=15min~1 hrs DI water rinse Room ambitent drying Temp.of solder Pot=245±5,Time= 5~1 sec. per AEC-Q11 per AEC-Q11 per AEC-Q11 Conclusion: 1. The total test had 11 item of reability test. 2. There were test result of pass. Comchip Technology Co., Ltd. Reliability Test Summary Test Foundation A-111 B-12 AEC Q11-1 and 5 B-1 JESD24-3, 24-4, 24-6 as appropriate Failure qty' 217/1/2 S.S Parameter X Bar S Dev Max Min Approval: Kevin Tseng Prepare: Judy Lin 3

7 Comchip Technology Co., Ltd. Discrete Semiconductor Component Qualification Plan User P/N: User Component Engineer: Judy Lin User Spec.#: General Specification: AEC-Q11 Rev-D Supplier: Comchip Supplier Manufacturing Site: Yingge, Taiwan Supplier Generic P/N: Required PPAP Submission Date: 217/1/2 Supplier Intermal P / N : CGRM45-HF Family Type: Reason for Qual: Annual sampling tests Item Test Test Conditions Exceptions Est. Start Est. Comp. # Lots S. S. Remarks 1 TEST Electrical 217/8/1 217/8/ PASS 2 Preconditioning per AEC-Q11 217/8/2 217/8/ PASS 3 External Visual per AEC-Q11 217/8/1 217/8/ PASS Reverse 6 V 4 HTRB Ta= 125 ± /8/11 217/9/22 1 PASS Test Time=1 hrs 5 Temperature Cycling Tamin = -55 to Tamax15, dwelled for 5 min, Cycle = 1 217/8/16 217/8/23 1 PASS 6 Autoclave Ta = 121, P = 15psig, RH = 1% Test Time=96hrs 217/8/25 217/8/29 1 PASS 7 HAST Reverse 42 V Ta= 13, RH= 85% 217/9/8 217/9/12 1 PASS Test Time=96 hrs 8 IOL Io = 1 A, T on/off = 2 minutes, cycles = 15, 217/8/31 217/1/12 1 PASS 9 ESD per AEC-Q11 CDM: 1 KV HBM: 2 KV 217/9/8 217/9/8 1 6 PASS 1 Physical Dimension per AEC-Q11 217/9/11 217/9/ PASS 11 Resistance to Solder Heat Solder Pot Temp. 26±5 Duration 4-6 sec 217/9/13 217/9/ PASS 12 Solderability Solder Pot Temp. 245±5 Duration 5-1 sec 217/9/22 217/9/ PASS 13 Thermal Resistance per AEC-Q11 217/8/7 217/8/9 1 1 PASS Conclusion: 1. The total test had 13 item of reability test. 2. There were test result of pass. Approval: Kevin Tseng Prepare: Judy Lin

8 Comchip Technology Co., Ltd. Date: 217/1/2 Reliability Test Summary P / N : CGRM47-HF L / N : Criteria: VF 1 1 ma IR 5 6 V VZ 6 ma No Test Item Test Condition Test Foundation Failure qty' S.S Parameter X Bar S Dev Max Min 1 Pre-conditioning Initial Electrical Test Visual Inspection Ta= 125 Time= 24 hrs Ta= 85 RH= 85% Time = 168 hrs 3 reflow cycles using profiles per IPC/JEDEC J-STD- 2 Dip 1s flux DI water rinse Room ambitent drying Final Electrical Test A High Temperature Reverse Bias VR= 6 V Ta= 125 ± 5.. (depend on product) Test Time 1 hrs. MIL-STD-75-1 M Temperature Cycle -55 to 15 dwelled for 5 min and transfer time not exceed 1 min; 1 cycles A Autoclave Ta= 121 Pressure= 15 Psi Time= 96 hrs A Highly Accelerated Stress Test VR= 42 V Ta= 13 RH= 85% Test Time=96 hrs A Intermittent Operational Life Io = 1 A, T on/off = 2 minutes, cycles = 15, MIL-STD-75 Method

9 No Date: P / N : CGRM47-HF L / N : Criteria: VF 1 1 ma IR 5 6 V VZ 6 ma Test Item Resistance to Solder Heat 8 Solderability ESD Characterization Physical Dimension Thermal Resistance Test Condition Ta= 125 Time=24hrs Ta= 85 RH= 85% Time=168 hrs one inch above the hot solder for 15 s Temp of solder pot=26±5 Time= 4~6 sec. Ta= 85, RH= 85% Time=1 hrs Ta= 1 Time=15min~1 hrs DI water rinse Room ambitent drying Temp.of solder Pot=245±5,Time= 5~1 sec. per AEC-Q11 per AEC-Q11 per AEC-Q11 Conclusion: 1. The total test had 11 item of reability test. 2. There were test result of pass. Comchip Technology Co., Ltd. Reliability Test Summary Test Foundation A-111 B-12 AEC Q11-1 and 5 B-1 JESD24-3, 24-4, 24-6 as appropriate Failure qty' 217/1/2 S.S Parameter X Bar S Dev Max Min Approval: Kevin Tseng Prepare: Judy Lin

10 Comchip Technology Co., Ltd. Discrete Semiconductor Component Qualification Plan User P/N: User Component Engineer: Judy Lin User Spec.#: General Specification: AEC-Q11 Rev-D Supplier: Comchip Supplier Manufacturing Site: Yingge, Taiwan Supplier Generic P/N: Required PPAP Submission Date: 217/1/2 Supplier Intermal P / N : CGRM47-HF Family Type: Reason for Qual: Annual sampling tests Item Test Test Conditions Exceptions Est. Start Est. Comp. # Lots S. S. Remarks 1 TEST Electrical 217/8/1 217/8/ PASS 2 Preconditioning per AEC-Q11 217/8/2 217/8/ PASS 3 External Visual per AEC-Q11 217/8/1 217/8/ PASS Reverse 1 V 4 HTRB Ta= 125 ± /8/11 217/9/22 1 PASS Test Time=1 hrs 5 Temperature Cycling Tamin = -55 to Tamax15, dwelled for 5 min, Cycle = 1 217/8/16 217/8/23 1 PASS 6 Autoclave Ta = 121, P = 15psig, RH = 1% Test Time=96hrs 217/8/25 217/8/29 1 PASS 7 HAST Reverse 42 V Ta= 13, RH= 85% 217/9/8 217/9/12 1 PASS Test Time=96 hrs 8 IOL Io = 1 A, T on/off = 2 minutes, cycles = 15, 217/8/31 217/1/12 1 PASS 9 ESD per AEC-Q11 CDM: 1 KV HBM: 2 KV 217/9/8 217/9/8 1 6 PASS 1 Physical Dimension per AEC-Q11 217/9/11 217/9/ PASS 11 Resistance to Solder Heat Solder Pot Temp. 26±5 Duration 4-6 sec 217/9/13 217/9/ PASS 12 Solderability Solder Pot Temp. 245±5 Duration 5-1 sec 217/9/22 217/9/ PASS 13 Thermal Resistance per AEC-Q11 217/8/7 217/8/9 1 1 PASS Conclusion: 1. The total test had 13 item of reability test. 2. There were test result of pass. Approval: Kevin Tseng Prepare: Judy Lin

11 Comchip Technology Co., Ltd. Date: 217/1/2 Reliability Test Summary P / N : CGRM47-HF L / N : Criteria: VF 11 1 ma IR 5 1 V VZ 1 ma No Test Item Test Condition Test Foundation Failure qty' S.S Parameter X Bar S Dev Max Min 1 Pre-conditioning Initial Electrical Test Visual Inspection Ta= 125 Time= 24 hrs Ta= 85 RH= 85% Time = 168 hrs 3 reflow cycles using profiles per IPC/JEDEC J-STD- 2 Dip 1s flux DI water rinse Room ambitent drying Final Electrical Test A High Temperature Reverse Bias VR= 1 V Ta= 125 ± 5.. (depend on product) Test Time 1 hrs. MIL-STD-75-1 M Temperature Cycle -55 to 15 dwelled for 5 min and transfer time not exceed 1 min; 1 cycles A Autoclave Ta= 121 Pressure= 15 Psi Time= 96 hrs A Highly Accelerated Stress Test VR= 42 V Ta= 13 RH= 85% Test Time=96 hrs A Intermittent Operational Life Io = 1 A, T on/off = 2 minutes, cycles = 15, MIL-STD-75 Method

12 No Date: P / N : CGRM47-HF L / N : Criteria: VF 11 1 ma IR 5 1 V VZ 1 ma Test Item Resistance to Solder Heat 8 Solderability ESD Characterization Physical Dimension Thermal Resistance Test Condition Ta= 125 Time=24hrs Ta= 85 RH= 85% Time=168 hrs one inch above the hot solder for 15 s Temp of solder pot=26±5 Time= 4~6 sec. Ta= 85, RH= 85% Time=1 hrs Ta= 1 Time=15min~1 hrs DI water rinse Room ambitent drying Temp.of solder Pot=245±5,Time= 5~1 sec. per AEC-Q11 per AEC-Q11 per AEC-Q11 Conclusion: 1. The total test had 11 item of reability test. 2. There were test result of pass. Comchip Technology Co., Ltd. Reliability Test Summary Test Foundation A-111 B-12 AEC Q11-1 and 5 B-1 JESD24-3, 24-4, 24-6 as appropriate Failure qty' 217/1/2 S.S Parameter X Bar S Dev Max Min Approval: Kevin Tseng Prepare: Judy Lin

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