AOS Semiconductor Product Reliability Report

Transcription

1 AOS Semiconductor Product Reliability Report AO64/AO64L, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 49 Mercury Drive Sunnyvale, CA 948 U.S. Tel: (48) Mar 8, 26 1

2 This AOS product reliability report summarizes the qualification result for AO64. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO64 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. Product Description II. Package and Die information III. Environmental Stress Test Summary and Result IV. Reliability Evaluation V. Quality Assurance Information I. Product Description: The AO64 uses advanced trench technology to provide excellent R DS(ON) with low gate charge. This device is suitable for use as a load switch or in PWM applications. Standard Product AO64 is Pb-free (meets ROHS & Sony 29 specifications). AO64L is a Green Product ordering option. AO64 and AO64L are electrically identical. Absolute Maximum Ratings T A =2 C unless otherwise noted Parameter Symbol Maximum Units Drain-Source Voltage V DS -3 V Gate-Source Voltage V GS ±2 V Continuous Drain T A =2 C - Current T A =1 C I D -4.2 Pulsed Drain Current I DM -2 T A =2 C P D 2 W Power Dissipation T A =1 C 1.4 Junction and Storage Temperature Range T J, T STG - to 1 C Thermal Characteristics Parameter Symbol Typ Max Units Maximum Junction-to- T 1s Ambient Maximum Junction-to- Ambient Maximum Junction-to-Lead C/W R Steady- θja State C/W Steady- State R θjl 37 C/W A 2

3 II. Die / Package Information: AO64 AO64L (Green Compound) Process Standard sub-micron Standard sub-micron low voltage P channel process low voltage P channel process Package Type 6 leads TSOP 6 leads TSOP Lead Frame Copper with Ni pad Copper with Ni pad Die Attach Ag epoxy Ag epoxy Bond wire Au 2mils Au 2mils Mold Material Epoxy resin with silica filler Epoxy resin with silica filler Filler % (Spherical/Flake) 9/1 1/ Flammability Rating UL-94 V- UL-94 V- Backside Metallization Ti / Ni / Ag Ti / Ni / Ag Moisture Level Up to Level 1 * Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AO64 (Standard) & AO64L (Green) Test Item Test Condition Time Point Solder Reflow Precondition HTGB Standard: 1hr PCT+3 cycle IR reflow@26 c Green: 168hr 8 c /8%RH +3 cycle IR reflow@26 c Temp = 1 c, Vgs=1% of Vgsmax hr 168 / hrs 1 hrs Lot Attribution Standard: 12 s Green: 7 s 2 s (Note A*) Total Sample size Number of Failures 28pcs 164pcs 77+ pcs / HTRB Temp = 1 c, Vds=8% of Vdsmax HAST Pressure Pot Temperature Cycle 13 +/- 2 c, 8%RH, 33.3 psi, Vgs = 8% of Vgs max 121 c, 1+/-1 PSIG, RH=1% -6 c to 1 c, air to air,.hr per cycle 168 / hrs 1 hrs 2 s (Note A*) 1 hrs Standard: 12 s Green: 6s 96 hrs Standard: 7 s Green: 7s 2 / cycles Standard: 12 s Green: 7s 164pcs 77+ pcs / 99pcs + pcs / 77pcs + pcs / 14pcs + pcs / 3

4 III. Result of Reliability Stress for AO64 (Standard) & AO64L (Green) Continues DPA Internal Vision Cross-section X-ray NA CSAM NA Bond Integrity Room Temp 1 c bake 1 c bake hr 2hr hr wires 4 wires 4 wires Solderability 23 c sec 1 1 leads Die shear 1 c hr 1 1 Note A: The HTGB and HTRB reliability data presents total of available AO64 and AO64L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AO64 and AO64L comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 32 MTTF = 367years In general, hrs of HTGB, 1 deg C accelerated stress testing is equivalent to 1 years of lifetime at deg C operating conditions (by applying the Arrhenius equation with an activation energy of.7ev and 6% of upper confidence level on the failure rate calculation). AOS reliability group also routinely monitors the product reliability up to 1 hr at and performs the necessary failure analysis on the units failed for reliability test(s). The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO64). Failure Rate Determination is based on JEDEC Standard JESD 8. FIT means one failure per billion hours. Failure Rate = Chi 2 x 1 9 / [2 (N) (H) (Af)] = 1.83 x 1 9 / [2 (164) (168) (28) + 2 (164) () (28)] = 32 MTTF = 1 9 / FIT =3.1 x 1 7 hrs =367years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea =.7eV and Tuse = C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u 1/Tj s)] Acceleration Factor ratio list: deg C 7 deg C 8 deg C 1 deg C 11 deg C 13 deg C 1 deg C Af Tj s = Stressed junction temperature in degree (Kelvin), K = C Tj u =The use junction temperature in degree (Kelvin), K = C k = Boltzmann s constant, X 1 - ev / K 4

5 V. Quality Assurance Information Acceptable Quality Level for outgoing inspection:.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 2 ppm Quality Sample Plan: conform to Mil-Std-1D