Sensing distance. 2 mm (slot width)
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1 Phoomicrosensor (Transmissive) EE-SX3 Ulra-Compac Slo / SMD Type (Slo widh: mm) PCB surface mouning ype. High resoluion wih a.3-mm-wide aperure. Be sure o read Safey Precauions on page 3. Ordering Informaion Phoomicrosensor Appearance Sensing mehod Connecing mehod Sensing disance Aperure size (H W) (mm) Oupu ype Model 5. 3 N56 Transmissive (slo ype) SMT mm (slo widh) Emier.. Deecor.3 Phoo IC EE-SX3 Raings, Characerisics and Exerior Specificaions Absolue Maximum Raings (Ta = 5 C) Emier Deecor Iem Symbol Raed value Uni Forward curren * ma Reverse volage VR 5 V Power supply volage 9 V Oupu volage V 7 V Oupu curren I 8 ma Permissible oupu dissipaion Sorage emperaure Tsg - o +9 * C Reflow soldering emperaure Tsol 55 * C *. Refer o he emperaure raing char if he ambien emperaure exceeds 5 C. *. Complee soldering wihin seconds for reflow soldering. Exerior Specificaions P 8 * mw Operaing emperaure Topr -3 o +85 * C Connecing mehod Weigh (g) Maerial Case SMT. PPS Elecrical and Opical Characerisics (Ta = 5 C) Iem Emier Forward volage Reverse curren Peak emission wavelengh Deecor Power supply volage Low-level oupu volage High-level oupu volage Curren consumpion Peak specral sensiiviy wavelengh LED curren when oupu is ON Symbol Value MIN. TYP. MAX. Uni Condiion VF V = ma IR ---. A VR = 5 V P nm = ma V --- VOL V IOH A =. o 7 V, = 7 ma, IOL = 8 ma =. o 7 V, = ma, VOH = 7 V ma = 7 V P nm =. o 7 V T ma =. o 7 V Hyseresis H % Response frequency Response delay ime f khz PLH s PHL s =. o 7 V * =. o 7 V, = 5 ma, IOL = 8 ma * =. o 7 V, = 5 ma, IOL = 8 ma *3 =. o 7 V, = 5 ma, IOL = 8 ma *3 *. Hyseresis denoes he difference in forward LED curren value, expressed in percenage, calculaed from he respecive forward LED currens when he phoo IC in urned from ON o OFF and when he phoo IC in urned from OFF o ON.
2 ( ) EE-SX3 *. The value of he response frequency is measured by roaing he disk as shown below. *3. The following illusraions show he definiion of response delay ime..5 mm.5 mm. mm Disk Inpu Oupu PHL PLH Engineering Daa (Reference value) Fig. Forward Curren vs. Collecor Dissipaion Temperaure Raing Fig. Forward Curren vs. Forward Volage Characerisics (Typical) Fig 3. LED Curren vs. Supply Volage (Typical) Forward curren (ma) 6 5 P Ambien emperaure Ta (ºC) 8 6 Oupu allowable dissipaion P (mw) Forward curren (ma) Ta = -3 C Ta = +5 C Ta = +7 C Forward volage VF (V) LED curren T (ma).5.5 T ON T OFF Ta = 5 C =.7 kω V Supply volage (V) Fig.LED Curren vs. Ambien Temperaure Characerisics (Typical) LED curren T (ma).5.5 T ON T OFF Vcc = 5 V =.7 kω V Ambien emperaure Ta (ºC) Fig 7. Curren Consumpion vs. Supply Volage (Typical) Curren consumpion (ma) Supply volage (V) Ta = 5ºC = ma V Fig 5. Low-level Oupu Volage vs. Oupu Curren (Typical) Low level oupu volage VOL (V)... Oupu curren IC (ma) Fig 8. Response Delay Time vs. Forward Curren (Typical) Response delay ime PHL, PLH (µs) PHL INPUT PUT V PHL Ta = 5ºC = 5 V IOL = 8 ma = 7 ma PLH PLH I 5 V.7 kω Ta Forward curren (ma) Fig 6. Low-level Oupu Volage vs. Ambien Temperaure Characerisics (Typical) Low level oupu volage VOL (V) V IOL = 8 ma IOL =.5 ma 6 8 Ambien emperaure Ta ( C) Fig 9. Repea Sensing Posiion Characerisics (Typical) Oupu ransisor ON OFF (Cener of opical axis) Ligh baffle d = 5 V = 7 ma Ta = 5ºC = 5 ma = 5 V =.7 kω n = repea imes d =.5 mm OFF....3 (ON) Disance d (mm) V
3 Safey Precauions EE-SX3 To ensure safe operaion, be sure o read and follow he Insrucion Manual provided wih he Sensor. CAUTION This produc is no designed or raed for ensuring safey of persons eiher direcly or indirecly. Do no use i for such purposes. Precauions for Safe Use Do no use he produc wih a volage or curren ha exceeds he raed range. Applying a volage or curren ha is higher han he raed range may resul in explosion or fire. Do no miswire such as he polariy of he power supply volage. Oherwise he produc may be damaged or i may burn. Do no shor-circui he load. Oherwise explosion or burning may occur. This produc does no resis waer. Do no use he produc in places where waer or oil may be sprayed ono he produc. Precauions for Correc Use Do no use he produc in amospheres or environmens ha exceed produc raings. This produc is for surface mouning. Refer o Soldering Informaion, Sorage and Baking for deails. Dispose of his produc as indusrial wase. Dimensions and Inernal Circui Phoomicrosensor (Uni: mm) EE-SX3 (6xC.) Ejecor pin, gae mark, or fla surface. mm dia. or.5 mm recess (MAX) Emier side () (6) Deecor side () (5) (3) () Aperure size (H x W) 5. Emier Deecor...3. Terminals are exposed in he end face of he board Opical axis ±..55 A B Terminals are exposed in he end face of he board Marking (upper: model, lower: lo No.).3 ±.5.8. R.3 R.3 Cross secion view B-B (Emier side).8 A B (.) (.).8 Cross secion view A-A (Deecor side) Inernal circui () (6) (5) () (3) () 3... Terminal No. Name () Anode ()(3) Cahode () ground (5) (6) Unless oherwise specified, he olerances are ±. mm. 3
4 EE-SX3 Tape and Reel Reel (Uni: mm) * ±.8 dia. ±.5 3±. dia. 8±dia. 33± dia. Produc name PHOTO MICROSENSOR Lo number Quaniy Counry of origin W = 3.5± W = 7.5± W W Tape (Uni: mm).5 dia. G V O K A Tape Pull-ou direcion Noe: Direcion of produc packing is upper figure. Tape quaniy, pcs./reel pcs./pack * * EE-SX3- ( pcs./pack) has no reel, only ape is aached.
5 Soldering Informaion Reflow soldering: Temperaure profile. The reflow soldering can be implemened in wo imes complying wih he following diagram. All he emperaures in he produc mus be wihin he diagram.. The recommended hickness of he meal mask for screen prining is beween. and.5 mm. Temperaure ( C) o C/s 5 o 8 C max. sec max. o C/s 6 C max. sec max. sec max. 55 C 3 C o C/sec EE-SX3 Manual soldering The manual soldering should no be applied o he producs, oherwise he housing may be deformed and/or he Au plaing may be peeled off by hea. Oher noes The use of infrared lamp causes he emperaure a he resin o rise paricularly oo high. All he emperaures in he produc mus be wihin he above diagram. Do no immerse he resin par ino he solder. Even if wihin he above emperaure diagram, here is a possibiliy ha he gold wire in he producs is broken in case ha he deformaion of PC board gives sress o he producs. Please confirm he condiions (including maerial and mehod of flux and cleaning) of he reflow soldering fully by acual solder reflow machine prior o he mass producion use. Time (s) Sorage Sorage condiions To proec he produc from he effecs of humidiy unil he package is opened, dry-box sorage is recommended. If his is no possible, sore he produc under he following condiions: Temperaure: o 3 C Humidiy: 6% RH max. Treamen afer open. Reflow soldering mus be done wihin 8 hours sored a he condiions of humidiy 6% RH or less and emperaure o 3 C.. If he produc mus be sored afer i is unpacked, sore i in a dry box or reseal i in a moisure-proof package wih desiccan a a emperaure of o 3 C and a humidiy of 6% RH or less. Even hen, moun he produc wihin one week. Baking In case ha i could no carry ou he above reamen, i is able o moun by he following baking reamen. However baking reamen shall be limied only ime. Recommended condiions: 6 C for o 8 hours (reeled one) C for 8 o hours (loose one) 5
6 Applicaion examples provided in his documen are for reference only. In acual applicaions, confirm equipmen funcions and safey before using he produc. Consul your OMRON represenaive before using he produc under condiions which are no described in he manual or applying he produc o nuclear conrol sysems, railroad sysems, aviaion sysems, vehicles, combusion sysems, medical equipmen, amusemen machines, safey equipmen, and oher sysems or equipmen ha may have a serious influence on lives and propery if used improperly. Make sure ha he raings and performance characerisics of he produc provide a margin of safey for he sysem or equipmen, and be sure o provide he sysem or equipmen wih double safey mechanisms. Noe: Do no use his documen o operae he Uni. OMRON Corporaion Elecronic and Mechanical Componens Company Conac: Ca. No. E59-E-6 7(86)(O)
onlinecomponents.com OPTOLOGIC OPTICAL INTERRUPTER SWITCH QVE00112 PACKAGE DIMENSIONS FEATURES 6/10/04
PACKAGE DIMENSIONS.714 (18.15).123 (3.125).189 (4.82).14 (.356).327 (8.31) Ø 3.3.1 (2.54).173 (4.4) OPTICAL C L 13.78 (35) ±.275 (7).316 (8.25) GRN WHT.464 (11.8).143 (3.625).118 (3.) GRY.173 (4.4).246.276
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