CMOS Analog Integrated Circuits: Models, Analysis, & Design
|
|
- Shana Hancock
- 6 years ago
- Views:
Transcription
1 CMOS Analog Integrated Ciruits: Models, Analysis, & Design Dr. John Choma, Jr. Professor of Eletrial Engineering University of Southern California Department of Eletrial Engineering-Eletrophysis University Park; Mail Code: 071 os Angeles, California [OFF] [HOME] [FAX] (E-MAI) EE448 MOS Ciruit evel Models Fall 001
2 eture Overview Stati Model Cutoff Region Ohmi (Triode) Region Model Saturation Region Model Subthreshold Model Short Channel Effets In Saturation Channel ength Modulation Substrate/Bulk Phenomena Mobility Degradation Carrier Veloity Saturation Small Signal Model In Saturation Forward Transondutane Bulk Transondutane Capaitanes Sample Ciruit Analysis (Inverter) Gain Bandwidth
3 N Channel MOSFET d d S G D Silion Dioxide T ox X d N Soure N Drain W P Type Substrate (Conentration = N D m -3 ) B V gd G I g I d I b B D V ds I s = I d I g I b I g 0 I b 0, for V bs < 0 V gs I s V bs S V ds I s I d = V gs V gd 3
4 P Channel MOSFET d d S G D Silion Dioxide T ox X d P Soure P Drain W N Type Substrate (Conentration = N D m -3 ) B V dg I d D I s = I d I g I b I g 0 G I g I b B V sd I b 0, for V sb < 0 V sg I s V sb S V sd I s I d = V sg V dg 4
5 Charateristi Curves: Cutoff And Ohmi Regimes Cutoff Regime: I d = 0 Threshold Voltage, Funtion Of Bulk Soure Voltage V hn V gs < V hn Ohmi Regime: I d = K n W V gs V hn and V ds < V gs V hn V ds V gs V hn V ds K n = µ n C ox = µ n ε ox (Hundreds Of µmhos/volt) T ox Comments W/ Is Gate Channel Aspet Ratio, A Designable Parameter V ds = V gs V gd < V gs V hn Implies V gd > V hn Temperature Effets (Holes And Eletrons): µ(t) µ(t o ) T o T 3/ Resistane For Small Drain Soure Voltage: I d V ds 1 = K W R n ds V gs V hn V ds = I d V ds V gs V hn V ds V gs V hn V ds I d V ds 5
6 Charateristi Curves: Saturated Regime Saturation Regime: I d = V dss I dss K n = K n W V gs V hn & V ds V gs V hn V gs V hn V gs V hn Drain Saturation Voltage W V dss Comments Square aw Voltage Controlled Current Soure Drain Current Shows Negative Temperature Coeffiient Beause Of Its Proportionality To Mobility Differential Current Of Two Mathed Devies Is inear With Differential Gate Soure Voltage V DM, Provided Common Mode Gate Soure Voltage Is A Constant V CM Drain Saturation Current I d1 I d = K n W V gs1 V hn V gs V hn I d1 I d = K n W I d1 I d = K n W V gs1 V gs V CM V hn V DM V hn V gs1 V gs 6
7 Simple Differential Pair V DD Inputs R V o R V gs1 = V CM V DM I d1 I d V gs = V CM V DM V DM M1 M V DM V gs1 V gs = V CM V gs1 V gs = V DM V CM Response I d1 I d = K W n V CM V hn V DM V o = R I d1 I d = K n R W V CM V hn V DM Note Differential Output Current And Voltage Are inear With Respet To Differential Input Voltage Without Invoking Small Signal Approximation 6a
8 Charateristi Curves: Subthreshold Regime Subthreshold Regime: V gs < V hn n V T & V ds 3 V T V T = k T q = 6 7 8C 1. < n <.0 I d = K n W nv T ε e ( V gs V hn ) / nv T Comments Bipolar Type I V Ation Indigenous To Subthreshold Regime Subthreshold Operation Corresponds To Gate Channel Interfae Potentials ying Between One And Two Fermi Potentials Useful Only For ow Speed, ow Power Appliations 7
9 Sample Simplified MOS Stati Charateristis Drain Current (miroamperes) volts Ohmi Regime Drain Saturation Current 4 volts Saturation Regime K n W = 80 µmho/volt V hn = 1. volts 3 volts 100 Gate-Soure Voltage = volts Drain-Soure Voltage (volts) 8
10 Cutoff Regime S V gs G V ds SiO D I d Depletion V ds 0 0 < V gs < V hn N Soure Fixed Immobile Charges DEPETION AYER, V > 0 ds DEPETION AYER, V = 0 ds N Drain V bs 0 Zero Current V gs = V ox V y V ox Voltage Aross Oxide P Type Substrate V y Interfae Potential V bs B 9
11 Channel Inversion: Ohmi Regime S G D N Soure P Type Substrate N Drain V gs > V hn V ds = 0 S G D V gs > V hn N Soure N Drain 0 V ds V gs V hn V dss DV ds V gd > V hn ' D P Type Substrate Metal or Polysilion Inversion ayer Silion Dioxide Depletion 10
12 Channel Inversion: Saturation Regime S G D N Soure P Type Substrate N Drain V gs > V hn 0 V ds = V gs V hn V gd V hn S G D V gs > V hn N Soure N Drain 0 V ds > V gs V hn V gd < V hn V dss V ds ' P Type Substrate Metal or Polysilion Inversion ayer Silion Dioxide Depletion 11
13 S Channel ength Modulation G D N Soure N Drain V dss V ds ' D Modified Saturation Regime Current I d V ds > V dss = I dss = K n Channel Modulation Voltage W V gs V hn 1 V ds V dss V λ V λ qn = A V ε ds V dss V j s (Typially Under 0 Volts And As Small As 1/3 Volt For Deep Submiron MOSFETs) V dss = V gs V hn V j = k T q ln N D N A N ib 1
14 Channel ength Modulation Parameters Modified Saturation Regime Current I d V ds > V dss = I dss = K n W V gs V hn 1 V ds V dss V λ V dss = V gs V hn V j = Parameters Average Substrate Impurity Conentration N A e s k T q ln N D N A N ib Dieletri Constant Of Silion (1.05 pf/m) q Eletroni Charge Magnitude V l Channel ength Modulation Voltage V j Built In Substrate Drain/Soure Juntion Potential Note arge Channel ength Redues Channel Modulation Small Substrate Conentration Inreases Channel Modulation V λ = qn A ε s V ds V dss V j 13
15 Substrate/Bulk Phenomena Effet On Threshold Voltage I d V h = V ho V θ V F V T 1 V θ = qn Aε s T = q N A ε ox s (High Hundreds Of µvolts) V F = V T ln N A (Few Tenths Of Volts) Parameters Fermi Potential; Renders Channel Surfae Intrinsi V F N ib Intrinsi Carrier Conentration In Substrate Dieletri Constant Of Silion Dioxide (345 ff/m) εox = K n C ox W N ib V gs V hn 1 ε ox V ds V dss V λ V bs V F V T 1 Note Small Oxide Thikness Redues Threshold Modulation Small Substrate Conentration Redues Threshold Modulation 14
16 Threshold Voltage Modulation Threshold Corretion (volts) 0.7 Oxide Thikness = 1,500 A N ib = m 3 ; N A = (10) 14 m A A 100 A Bulk Soure Voltage, Vbs (volts) 0 15
17 Mobility Degradation Due To To Vertial Field Eletri Field Problems Thin Oxide ayers Condue arge Gate -To- Channel Fields For Even Small -To- Moderate Gate Soure Voltages These Enhaned Fields Impart Inreasing Energies To Carriers, Thereby Causing More Carrier Collisions And Degraded Mobilities Mobility: µ neff 1 µ n V gs V hn V E V E (500)(106 )T ox (ow Hundreds Of Volts) Parameters Effetive Carrier Mobility In Channel µ neff V E Vertial Field Degradation Voltage Parameter Crude One Dimension Approximation To Two Dimensional Problem in MKS Units Yields In Volts T ox V E 16
18 Impat Of Of Mobility Degradation Stati Drain Current K n = µ n C ox K neff = µ neff C ox I d = K n W V gs V hn 1 1 V gs V hn V E V ds V dss V λ Other Effets Redued Bandwidth And Inreased Carrier Transit Time Smaller Current For Given Gate Soure Bias Redued Forward Transondutane 17
19 Mobility Degradation Due To To ateral Field Eletri Field Problems Short Channels Condue arge Drain -To- Soure Fields For Even Small -To- Moderate Drain Soure Voltages These Enhaned Fields Impart Inreasing Energies To Carriers, Thereby Causing More Carrier Collisions And Degraded Mobilities At Very arge Horizontal Fields, Carrier Veloities Ultimately Saturate To A Value Of v sat, Whih Is About 0.1 µm/psec Saturation Ours When Horizontal Field, E h,equals Or Exeeds A Critial Value,, Whih Is About 5 V/µm Mobility And Field µ ne E 1 v sat = µ n E v = µ ne E h µ n = E h E E h V gs V hn E µ n E h E 1 h E v sat E h 18
20 Veloity Mobility Field Relationships Carrier Veloity (µm/pse) 0.1 Normalized Carrier Mobility Carrier Veloity Normalized Mobility ateral Eletri Field (V/µm) a
21 Mobility And ateral Field Mobility And Field µ ne 1 µ n E h E 1 µ n V gs V hn E = 1 µ n V dss E E h V gs V hn = V dss Eletri Field Problems Crude Approximation For Horizontal Field, Free Carriers Exist Only Over Channel Where Voltage With Respet To The Soure Is At Most V dss = V gs V hn Channel ength,, Should Be Effetive Channel ength, ', But This Shrinkage Is Already Aounted For By Channel ength Modulation Voltage Parameter, V λ E Is About 1.75 Volts For = 0.35 µm E h 19
22 Volt Ampere Impat Of Of High ateral Field Stati Drain Current Very High Fields V gs V hn >> E K n = µ n C ox K neff = µ neff C ox I d I d = K n W WC ox v sat (V gs V hn ) 1 1 V gs V hn E V gs V hn 1 V ds V dss V λ V ds V dss V l Comments Drain Current Sales Approximately With W, As Opposed To W/ Drain Current Almost inear W/R To Gate Soure Voltage 0
23 MOS arge Signal Model C old D i d Stati Drain Current C gd C gs Gate-Drain Capaitane Gate-Soure Capaitane C gd r dd DBD r db C db Drain-Bulk Capaitane G C gs I d C db DBS r sb r bb B C sb C old C ols Soure-Bulk Capaitane Drain Overlap Capaitane Soure Overlap Capaitane r ss C sb r dd Drain Ohmi Resistane C ols S r ss r bb Soure Ohmi Resistane Bulk Ohmi Resistane DBD Bulk-Drain Diode r sb Bulk Spreading Resistane DBS Bulk-Soure Diode r db Bulk Spreading Resistane 1
24 Devie Capaitanes In In Saturation D G C old C gd i d r dd I d DBD C db r db C gd C old C old = W d C ox C gs = W C ox 3 A d C jo C db = 1 V bd V j d C gs r ss DBS C sb r sb r bb B C sb = A s W C jo 1 V bs V j C ols C ols = W d C ox C db C sb C gs S arge (Hundreds Of ff) arge (Hundreds Of ff) Moderate (High Tens Of ff) A d A s C jo Drain-Bulk Juntion Area Soure-Bulk Juntion Area Zero Bias Depletion Capaitane Density C gd, C old, C ols Small (Tens Of ff)
25 Approximate (ong Channel) Small Signal Model C old C gd D C db g mf I d V gs Q K n W I dq g mb I d = λ b g mf g mf v ga g mb v ba g o V bs Q G C gs v ga C ols S C sb v ba B λ b = g o I d V θ / V F V T V bsq V ds Q V λ V ds I dq V dss Assumptions All Series Ohmi Resistanes Are Negligible Transistor Operates In Saturation Regime "ong Channel" Approximation Invoked For Stati Drain Current Model To Be Used As A Preursor To Computer Based Studies 3
26 Short Channel Small Signal Model Drain Current: I d Intermediate Parameters: = K n W V gs V hn 1 1 f λ = V ds V dss V λ g mf = K W n V gs V hn E V ds V dss V λ f = V dss E I dq λ b = V θ / V F V T V bsq Forward Transondutane: g mfs = g mf 1 f λ 1 f 1 V dss /V λ 1 f λ f / 1 f Bulk Transondutane: g mbs = λ b g mfs Output Condutane: g o = V λ V ds I dq V dss 4
27 Hypothetial Devie Physial Parameters N A = 5 (10) 14 m 3 N D = 5 (10) 0 m 3 N ib = (10) 10 m 3 ε s ε ox = 1.05 pf/m = 345 ff/m µ n = 400 m / volt-se E = 4 volts / µm Devie Parameters T ox = 50 Angstroms = 0.35 µm V hn = 0.65 volts T = 300 8K W / = 5 Ciruit Parameters V ds = volts V gs = 1. volts V bs = 3 volts 5
28 Peripheral Calulations V F = 80.0 mv V j = mv V u = µv Stati Performane (Fermi Potential) (Juntion Potential) (Body Effet Potential) V hn = 685. mv (Compensated Threshold) V hn = 35. mv V dss = mv (Drain Saturation Voltage) V = mv λ E = 1.4 volts (Channel ength Voltage) (ateral Field Voltage) K n = 76.0 µmho / volt (Transondutane Parameter) f =.18 (Channel ength Parameter) λ f = (ateral Field Parameter) Stati Drain Current I d = 18.9 µa I d = 430. µa (ong Channel Drain Current) (Short Channel Drain Current) Note Short Channel -To- ong Channel Ratio of.35; Ratio Is Generally Between 1.5 And 3.0 6
29 Small Signal Parameters Forward Transondutane g mf = 1.09 mmho g mf = 1.5 mmho (Inorporating Short Channel Effets) Note Short Channel -To- ong Channel Ratio of 1.14; Ratio Is Generally Between 0.5 And.0 Bulk Transondutane λ (10) 3 b = 5.0 g mb = 6.5 µmho (Ignoring Short Channel Effets) (Bulk Parameter) (Inorporating Short Channel Effets) Note Bulk Transondutane Is About 00 Times Smaller Than Forward Transondutane Drain Soure Condutane g o = µmho (Inorporating Short Channel Effets) Corresponds To Shunt Output Resistane Of About 5 KΩ Mandates Condutane Enhanement Strategies When Designing High Performane Transondutors 7
30 V dd Devie Unity Gain Frequeny D C AC Short Ciruit gd C old I bias C big g mf v 1 g mb v g o i out i in i out i in G C gs C ols v 1 S v B i out = i in s g mf s C gd C old C gs C ols C gd C old ω T g mf C gs C ols C gd C old µ n V gs V hn 3 3 d Comments Unity Gain Frequeny Is Good Devie Figure Of Merit; Crude Ciruit Performane Figure Of Merit Result Assumes ω T C gd << g mf 8
31 Common Soure Inverter M V DD R eff R eff MD C V o MD C V os V s V GG V s Shemati Diagram AC Shemati Diagram 9
32 Inverter oad Resistane Calulations r ddl V x M I x v ga g mfl v ga g mbl v ba r ol v ba V x r ssl I x r bbl v ga = v ba = V x r ssl I x V x = r ssl r ddl I x r ol I x g mfl v ga g mbl v ba R eff V x I x = r ssl r ddl r ol 1 1 λ bl g mfl r ol 1 1 λ bl g mfl 30
33 Inverter Gain Calulations R' R out R eff V os V s MD C V os V s v ga g mfd v ga r ddd g mbd v ba r ssd r od R eff v ba r bbd C Ignore For ow Frequenies A v = V os V s = g mfd R eff 1 1 λ bd g mfd r ssd R eff r ddd r ssd r od g mfd R eff g mfd 1 λ bl g mfl A v 1 1 λ bl W d / W l / 31
34 Inverter Bandwidth Calulations r ddd R' V x I x v ga g mfd v ga g mbd v ba r od v ba r ssd r bbd B 3dB = 1 R out C = 1 R / R eff C 1 R eff C R / = V x I x = r ddd r ssd 1 1 λ bl g mfd r ssd r od B 3dB 1 R eff C 1 λ bl g mfl C GBP Av B 3dB = g mfd C 3
MOS Transistor I-V Characteristics and Parasitics
ECEN454 Digital Integrated Circuit Design MOS Transistor I-V Characteristics and Parasitics ECEN 454 Facts about Transistors So far, we have treated transistors as ideal switches An ON transistor passes
More informationThe Devices. Devices
The The MOS Transistor Gate Oxyde Gate Source n+ Polysilicon Drain n+ Field-Oxyde (SiO 2 ) p-substrate p+ stopper Bulk Contact CROSS-SECTION of NMOS Transistor Cross-Section of CMOS Technology MOS transistors
More information6.012 Electronic Devices and Circuits Spring 2005
6.012 Electronic Devices and Circuits Spring 2005 May 16, 2005 Final Exam (200 points) -OPEN BOOK- Problem NAME RECITATION TIME 1 2 3 4 5 Total General guidelines (please read carefully before starting):
More informationThe Devices. Jan M. Rabaey
The Devices Jan M. Rabaey Goal of this chapter Present intuitive understanding of device operation Introduction of basic device equations Introduction of models for manual analysis Introduction of models
More informationThe Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction
More informationELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model
ELEC 3908, Physical Electronics, Lecture 23 The MOSFET Square Law Model Lecture Outline As with the diode and bipolar, have looked at basic structure of the MOSFET and now turn to derivation of a current
More informationMOSFET: Introduction
E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major
More informationIntegrated Circuits & Systems
Federal University of Santa Catarina Center for Technology Computer Science & Electronics Engineering Integrated Circuits & Systems INE 5442 Lecture 10 MOSFET part 1 guntzel@inf.ufsc.br ual-well Trench-Isolated
More informationCircuits. L2: MOS Models-2 (1 st Aug. 2013) B. Mazhari Dept. of EE, IIT Kanpur. B. Mazhari, IITK. G-Number
EE610: CMOS Analog Circuits L: MOS Models- (1 st Aug. 013) B. Mazhari Dept. of EE, IIT Kanpur 3 NMOS Models MOS MODEL Above Threshold Subthreshold ( GS > TN ) ( GS < TN ) Saturation ti Ti Triode ( DS >
More informationFIELD-EFFECT TRANSISTORS
FIEL-EFFECT TRANSISTORS 1 Semiconductor review 2 The MOS capacitor 2 The enhancement-type N-MOS transistor 3 I-V characteristics of enhancement MOSFETS 4 The output characteristic of the MOSFET in saturation
More informationMicroelectronics Part 1: Main CMOS circuits design rules
GBM8320 Dispositifs Médicaux telligents Microelectronics Part 1: Main CMOS circuits design rules Mohamad Sawan et al. Laboratoire de neurotechnologies Polystim! http://www.cours.polymtl.ca/gbm8320/! med-amine.miled@polymtl.ca!
More informationEE105 - Fall 2005 Microelectronic Devices and Circuits
EE105 - Fall 005 Microelectronic Devices and Circuits ecture 7 MOS Transistor Announcements Homework 3, due today Homework 4 due next week ab this week Reading: Chapter 4 1 ecture Material ast lecture
More informationEE 560 MOS TRANSISTOR THEORY PART 2. Kenneth R. Laker, University of Pennsylvania
1 EE 560 MOS TRANSISTOR THEORY PART nmos TRANSISTOR IN LINEAR REGION V S = 0 V G > V T0 channel SiO V D = small 4 C GC C BC substrate depletion region or bulk B p nmos TRANSISTOR AT EDGE OF SATURATION
More informationLecture 5: CMOS Transistor Theory
Lecture 5: CMOS Transistor Theory Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline q q q q q q q Introduction MOS Capacitor nmos I-V Characteristics
More informationECE 342 Electronic Circuits. 3. MOS Transistors
ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to
More informationFinal Examination EE 130 December 16, 1997 Time allotted: 180 minutes
Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes Problem 1: Semiconductor Fundamentals [30 points] A uniformly doped silicon sample of length 100µm and cross-sectional area 100µm 2
More informationQuantitative MOSFET. Step 1. Connect the MOS capacitor results for the electron charge in the inversion layer Q N to the drain current.
Quantitative MOSFET Step 1. Connect the MOS capacitor results for the electron charge in the inversion layer Q N to the drain current. V DS _ n source polysilicon gate y = y * 0 x metal interconnect to
More informationEE 560 MOS TRANSISTOR THEORY
1 EE 560 MOS TRANSISTOR THEORY PART 1 TWO TERMINAL MOS STRUCTURE V G (GATE VOLTAGE) 2 GATE OXIDE SiO 2 SUBSTRATE p-type doped Si (N A = 10 15 to 10 16 cm -3 ) t ox V B (SUBSTRATE VOLTAGE) EQUILIBRIUM:
More informationCMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor
CMPEN 411 VLSI Digital Circuits Lecture 03: MOS Transistor Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN 411 L03 S.1
More informationMOSFET Model with Simple Extraction Procedures, Suitable for Sensitive Analog Simulations
ROMANIAN JOURNAL OF INFORMATION SCIENCE AND TECHNOLOGY Volume 10, Number 2, 2007, 189 197 MOSFET Model with Simple Extraction Procedures, Suitable for Sensitive Analog Simulations S. EFTIMIE 1, ALEX. RUSU
More informationLECTURE 3 MOSFETS II. MOS SCALING What is Scaling?
LECTURE 3 MOSFETS II Lecture 3 Goals* * Understand constant field and constant voltage scaling and their effects. Understand small geometry effects for MOS transistors and their implications modeling and
More informationLecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET:
Lecture 15: MOS Transistor models: Body effects, SPICE models Context In the last lecture, we discussed the modes of operation of a MOS FET: oltage controlled resistor model I- curve (Square-Law Model)
More informationMOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA
MOS Transistors Prof. Krishna Saraswat Department of Electrical Engineering S Stanford, CA 94305 saraswat@stanford.edu 1 1930: Patent on the Field-Effect Transistor! Julius Lilienfeld filed a patent describing
More informationEEC 118 Lecture #2: MOSFET Structure and Basic Operation. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation
EEC 118 Lecture #2: MOSFET Structure and Basic Operation Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation Announcements Lab 1 this week, report due next week Bring
More informationIntroduction and Background
Analog CMOS Integrated Circuit Design Introduction and Background Dr. Jawdat Abu-Taha Department of Electrical and Computer Engineering Islamic University of Gaza jtaha@iugaza.edu.ps 1 Marking Assignments
More informationLecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOS Capacitor with External Bias
ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 5: Januar 6, 17 MOS Operating Regions, pt. 1 Lecture Outline! 3 Regions of operation for MOSFET " Subthreshold " Linear " Saturation! Level
More informationChapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan
Chapter 2 CMOS Transistor Theory Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Outline Introduction MOS Device Design Equation Pass Transistor Jin-Fu Li, EE,
More informationChapter 4 Field-Effect Transistors
Chapter 4 Field-Effect Transistors Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 5/5/11 Chap 4-1 Chapter Goals Describe operation of MOSFETs. Define FET characteristics in operation
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 23, 2018 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2018 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor
More informationLecture 12: MOSFET Devices
Lecture 12: MOSFET Devices Gu-Yeon Wei Division of Engineering and Applied Sciences Harvard University guyeon@eecs.harvard.edu Wei 1 Overview Reading S&S: Chapter 5.1~5.4 Supplemental Reading Background
More informationEE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region
EE105 Fall 014 Microelectronic Devices and Circuits Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel
More informationLecture 29 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 20, 2007
6.720J/3.43J - Integrated Microelectronic Devices - Spring 2007 Lecture 29-1 Lecture 29 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 20, 2007 Contents: 1. Non-ideal and second-order
More informationECE315 / ECE515 Lecture-2 Date:
Lecture-2 Date: 04.08.2016 NMOS I/V Characteristics Discussion on I/V Characteristics MOSFET Second Order Effect NMOS I-V Characteristics ECE315 / ECE515 Gradual Channel Approximation: Cut-off Linear/Triode
More informationMOS Capacitor MOSFET Devices. MOSFET s. INEL Solid State Electronics. Manuel Toledo Quiñones. ECE Dept. UPRM.
INEL 6055 - Solid State Electronics ECE Dept. UPRM 20th March 2006 Definitions MOS Capacitor Isolated Metal, SiO 2, Si Threshold Voltage qφ m metal d vacuum level SiO qχ 2 E g /2 qφ F E C E i E F E v qφ
More informationELEC 3908, Physical Electronics, Lecture 26. MOSFET Small Signal Modelling
ELEC 3908, Physical Electronics, Lecture 26 MOSFET Small Signal Modelling Lecture Outline MOSFET small signal behavior will be considered in the same way as for the diode and BJT Capacitances will be considered
More informationNanoscale CMOS Design Issues
Nanoscale CMOS Design Issues Jaydeep P. Kulkarni Assistant Professor, ECE Department The University of Texas at Austin jaydeep@austin.utexas.edu Fall, 2017, VLSI-1 Class Transistor I-V Review Agenda Non-ideal
More informationFundamentals of the Metal Oxide Semiconductor Field-Effect Transistor
Triode Working FET Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor The characteristics of energy bands as a function of applied voltage. Surface inversion. The expression for the
More informationII III IV V VI B C N. Al Si P S. Zn Ga Ge As Se Cd In Sn Sb Te. Silicon (Si) the dominating material in IC manufacturing
II III IV V VI B N Al Si P S Zn Ga Ge As Se d In Sn Sb Te Silicon (Si) the dominating material in I manufacturing ompound semiconductors III - V group: GaAs GaN GaSb GaP InAs InP InSb... The Energy Band
More informationECE-305: Fall 2017 MOS Capacitors and Transistors
ECE-305: Fall 2017 MOS Capacitors and Transistors Pierret, Semiconductor Device Fundamentals (SDF) Chapters 15+16 (pp. 525-530, 563-599) Professor Peter Bermel Electrical and Computer Engineering Purdue
More informationThe Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002
igital Integrated Circuits A esign Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The evices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction
More informationECE 342 Electronic Circuits. Lecture 6 MOS Transistors
ECE 342 Electronic Circuits Lecture 6 MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2
More informationDigital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices.
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The July 30, 2002 1 Goal of this chapter Present intuitive understanding of device operation Introduction
More informationMOS Transistor Theory
MOS Transistor Theory So far, we have viewed a MOS transistor as an ideal switch (digital operation) Reality: less than ideal EE 261 Krish Chakrabarty 1 Introduction So far, we have treated transistors
More informationThe Devices: MOS Transistors
The Devices: MOS Transistors References: Semiconductor Device Fundamentals, R. F. Pierret, Addison-Wesley Digital Integrated Circuits: A Design Perspective, J. Rabaey et.al. Prentice Hall NMOS Transistor
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 2017 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2017 Khanna Lecture Outline! Semiconductor Physics " Band gaps "
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 5: January 25, 2018 MOS Operating Regions, pt. 1 Lecture Outline! 3 Regions of operation for MOSFET " Subthreshold " Linear " Saturation!
More informationMOS Transistor Theory
CHAPTER 3 MOS Transistor Theory Outline 2 1. Introduction 2. Ideal I-V Characteristics 3. Nonideal I-V Effects 4. C-V Characteristics 5. DC Transfer Characteristics 6. Switch-level RC Delay Models MOS
More informationMOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET. MOS Symbols and Characteristics. nmos Enhancement Transistor
MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET Calculation of t and Important 2 nd Order Effects SmallSignal Signal MOSFET Model Summary Material from: CMOS LSI Design By Weste
More informationChapter 5 MOSFET Theory for Submicron Technology
Chapter 5 MOSFET Theory for Submicron Technology Short channel effects Other small geometry effects Parasitic components Velocity saturation/overshoot Hot carrier effects ** Majority of these notes are
More informationDevice Models (PN Diode, MOSFET )
Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed
More informationLecture 5 Review Current Source Active Load Modified Large / Small Signal Models Channel Length Modulation
Lecture 5 Review Current Source Active Load Modified Large / Small Signal Models Channel Length Modulation Text sec 1.2 pp. 28-32; sec 3.2 pp. 128-129 Current source Ideal goal Small signal model: Open
More informationChapter 13 Small-Signal Modeling and Linear Amplification
Chapter 13 Small-Signal Modeling and Linear Amplification Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 1/4/12 Chap 13-1 Chapter Goals Understanding of concepts related to: Transistors
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 29, 2019 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2019 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor
More informationFigure 1: MOSFET symbols.
c Copyright 2008. W. Marshall Leach, Jr., Professor, Georgia Institute of Technology, School of Electrical and Computer Engineering. The MOSFET Device Symbols Whereas the JFET has a diode junction between
More informationMOS Transistor Properties Review
MOS Transistor Properties Review 1 VLSI Chip Manufacturing Process Photolithography: transfer of mask patterns to the chip Diffusion or ion implantation: selective doping of Si substrate Oxidation: SiO
More informationPractice 3: Semiconductors
Practice 3: Semiconductors Digital Electronic Circuits Semester A 2012 VLSI Fabrication Process VLSI Very Large Scale Integration The ability to fabricate many devices on a single substrate within a given
More informationThe Gradual Channel Approximation for the MOSFET:
6.01 - Electronic Devices and Circuits Fall 003 The Gradual Channel Approximation for the MOSFET: We are modeling the terminal characteristics of a MOSFET and thus want i D (v DS, v GS, v BS ), i B (v
More informationReview of Band Energy Diagrams MIS & MOS Capacitor MOS TRANSISTORS MOSFET Capacitances MOSFET Static Model
Content- MOS Devices and Switching Circuits Review of Band Energy Diagrams MIS & MOS Capacitor MOS TRANSISTORS MOSFET Capacitances MOSFET Static Model A Cantoni 2009-2013 Digital Switching 1 Content- MOS
More informationDevice Models (PN Diode, MOSFET )
Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed
More informationP. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions
P. R. Nelson 1 ECE418 - VLSI Midterm Exam Solutions 1. (8 points) Draw the cross-section view for A-A. The cross-section view is as shown below.. ( points) Can you tell which of the metal1 regions is the
More informationToday s lecture. EE141- Spring 2003 Lecture 4. Design Rules CMOS Inverter MOS Transistor Model
- Spring 003 Lecture 4 Design Rules CMOS Inverter MOS Transistor Model Today s lecture Design Rules The CMOS inverter at a glance An MOS transistor model for manual analysis Important! Labs start next
More information6.012 Electronic Devices and Circuits
Page 1 of 10 YOUR NAME Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology 6.012 Electronic Devices and Circuits Exam No. 2 Thursday, November 5, 2009 7:30 to
More informationUniversity of Toronto. Final Exam
University of Toronto Final Exam Date - Dec 16, 013 Duration:.5 hrs ECE331 Electronic Circuits Lecturer - D. Johns ANSWER QUESTIONS ON THESE SHEETS USING BACKS IF NECESSARY 1. Equation sheet is on last
More information! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 3, 018 MOS Transistor Theory, MOS Model Lecture Outline! CMOS Process Enhancements! Semiconductor Physics " Band gaps " Field Effects!
More informationLecture #27. The Short Channel Effect (SCE)
Lecture #27 ANNOUNCEMENTS Design Project: Your BJT design should meet the performance specifications to within 10% at both 300K and 360K. ( β dc > 45, f T > 18 GHz, V A > 9 V and V punchthrough > 9 V )
More informationLecture 3: CMOS Transistor Theory
Lecture 3: CMOS Transistor Theory Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V Characteristics Gate and Diffusion Capacitance 2 Introduction So far, we have treated transistors
More informationVLSI Design The MOS Transistor
VLSI Design The MOS Transistor Frank Sill Torres Universidade Federal de Minas Gerais (UFMG), Brazil VLSI Design: CMOS Technology 1 Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V
More informationECEN474/704: (Analog) VLSI Circuit Design Spring 2018
ECEN474/704: (Analog) SI Circuit Design Spring 2018 ecture 2: MOS ransistor Modeling Sam Palermo Analog & Mixed-Signal Center exas A&M University Announcements If you haven t already, turn in your 0.18um
More informationChapter 2 MOS Transistor theory
Chapter MOS Transistor theory.1 Introduction An MOS transistor is a majority-carrier device, which the current a conductg channel between the source and the dra is modulated by a voltage applied to the
More informationSection 12: Intro to Devices
Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si
More informationEE105 - Fall 2006 Microelectronic Devices and Circuits
EE105 - Fall 2006 Microelectronic Devices and Circuits Prof. Jan M. Rabaey (jan@eecs) Lecture 7: MOS Transistor Some Administrative Issues Lab 2 this week Hw 2 due on We Hw 3 will be posted same day MIDTERM
More informationMOS Transistor. EE141-Fall 2007 Digital Integrated Circuits. Review: What is a Transistor? Announcements. Class Material
EE-Fall 7 igital Integrated Circuits MO Transistor Lecture MO Transistor Model Announcements Review: hat is a Transistor? Lab this week! Lab next week Homework # is due Thurs. Homework # due next Thurs.
More informationVLSI Design and Simulation
VLSI Design and Simulation Performance Characterization Topics Performance Characterization Resistance Estimation Capacitance Estimation Inductance Estimation Performance Characterization Inverter Voltage
More informationEPC2052 Enhancement Mode Power Transistor
Enhanement Mode Power Transistor V DS, V R DS(on),. mω I D, 8. G D S EFFICIENT POWER CONVERSION HL Gallium Nitride s exeptionally high eletron mobility and low temperature oeffiient allows very low R DS(on),
More information3. Basic building blocks. Analog Design for CMOS VLSI Systems Franco Maloberti
Inverter with active load It is the simplest gain stage. The dc gain is given by the slope of the transfer characteristics. Small signal analysis C = C gs + C gs,ov C 2 = C gd + C gd,ov + C 3 = C db +
More informationEPC2053 Enhancement Mode Power Transistor
Enhanement Mode Power Transistor V DS, V R DS(on), 3.8 mω I D, 8 G D S EFFICIENT POWER CONVERSION HL Gallium Nitride s exeptionally high eletron mobility and low temperature oeffiient allows very low R
More informationThe transistor is not in the cutoff region. the transistor is in the saturation region. To see this, recognize that in a long-channel transistor ifv
ECE 440 Spring 005 Page 1 Homework Assignment No. Solutions P.4 For each transistor, first determine if the transistor is in cutoff by checking to see if GS is less than or greater than. may have to be
More informationESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Refinement. Last Time. No Field. Body Contact
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 10: September 6, 01 MOS Transistor Basics Today MOS Transistor Topology Threshold Operating Regions Resistive Saturation
More information1. The MOS Transistor. Electrical Conduction in Solids
Electrical Conduction in Solids!The band diagram describes the energy levels for electron in solids.!the lower filled band is named Valence Band.!The upper vacant band is named conduction band.!the distance
More informationand V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS )
ECE 4420 Spring 2005 Page 1 FINAL EXAMINATION NAME SCORE /100 Problem 1O 2 3 4 5 6 7 Sum Points INSTRUCTIONS: This exam is closed book. You are permitted four sheets of notes (three of which are your sheets
More informationSemiconductor Physics Problems 2015
Semiconductor Physics Problems 2015 Page and figure numbers refer to Semiconductor Devices Physics and Technology, 3rd edition, by SM Sze and M-K Lee 1. The purest semiconductor crystals it is possible
More information6.012 MICROELECTRONIC DEVICES AND CIRCUITS
MASSACHUSETTS INSTITUTE OF TECHNOLOGY Department of Electrical Engineering and Computer Science 6.012 MICROELECTRONIC DEVICES AND CIRCUITS Answers to Exam 2 Spring 2008 Problem 1: Graded by Prof. Fonstad
More informationMicroelectronics Main CMOS design rules & basic circuits
GBM8320 Dispositifs médicaux intelligents Microelectronics Main CMOS design rules & basic circuits Mohamad Sawan et al. Laboratoire de neurotechnologies Polystim mohamad.sawan@polymtl.ca M5418 6 & 7 September
More informationLecture 4: CMOS Transistor Theory
Introduction to CMOS VLSI Design Lecture 4: CMOS Transistor Theory David Harris, Harvey Mudd College Kartik Mohanram and Steven Levitan University of Pittsburgh Outline q Introduction q MOS Capacitor q
More informationN Channel MOSFET level 3
N Channel MOSFET level 3 mosn3 NSource NBulk NSource NBulk NSource NBulk NSource (a) (b) (c) (d) NBulk Figure 1: MOSFET Types Form: mosn3: instance name n 1 n n 3 n n 1 is the drain node, n is the gate
More informationin Electronic Devices and Circuits
in Electronic Devices and Circuits Noise is any unwanted excitation of a circuit, any input that is not an information-bearing signal. Noise comes from External sources: Unintended coupling with other
More informationNon Ideal Transistor Behavior
Non Ideal Transistor Behavior Slides adapted from: N. Weste, D. Harris, CMOS VLSI Design, Addison- Wesley, 3/e, 2004 1 Non-ideal Transistor I-V effects Non ideal transistor Behavior Channel Length ModulaJon
More informationEE 330 Lecture 16. Devices in Semiconductor Processes. MOS Transistors
EE 330 Lecture 16 Devices in Semiconductor Processes MOS Transistors Review from Last Time Model Summary I D I V DS V S I B V BS = 0 0 VS VT W VDS ID = μcox VS VT VDS VS V VDS VS VT L T < W μc ( V V )
More information! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 9, 019 MOS Transistor Theory, MOS Model Lecture Outline CMOS Process Enhancements Semiconductor Physics Band gaps Field Effects
More informationSECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University
NAME: PUID: SECTION: Circle one: Alam Lundstrom ECE 305 Exam 5 SOLUTIONS: April 18, 2016 M A Alam and MS Lundstrom Purdue University This is a closed book exam You may use a calculator and the formula
More informationECE 497 JS Lecture - 12 Device Technologies
ECE 497 JS Lecture - 12 Device Technologies Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 NMOS Transistor 2 ρ Source channel charge density
More informationUniversity of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA
University of Pennsylvania Department of Electrical Engineering ESE 570 Midterm Exam March 4, 03 FORMULAS AND DATA. PHYSICAL CONSTANTS: n i = intrinsic concentration undoped) silicon =.45 x 0 0 cm -3 @
More informationElectronic Circuits 1. Transistor Devices. Contents BJT and FET Characteristics Operations. Prof. C.K. Tse: Transistor devices
Electronic Circuits 1 Transistor Devices Contents BJT and FET Characteristics Operations 1 What is a transistor? Three-terminal device whose voltage-current relationship is controlled by a third voltage
More informationErrata of CMOS Analog Circuit Design 2 nd Edition By Phillip E. Allen and Douglas R. Holberg
Errata 2 nd Ed. (5/22/2) Page Errata of CMOS Analog Circuit Design 2 nd Edition By Phillip E. Allen and Douglas R. Holberg Page Errata 82 Line 4 after figure 3.2-3, CISW CJSW 88 Line between Eqs. (3.3-2)
More informationMetal-oxide-semiconductor field effect transistors (2 lectures)
Metal-ide-semiconductor field effect transistors ( lectures) MOS physics (brief in book) Current-voltage characteristics - pinch-off / channel length modulation - weak inversion - velocity saturation -
More informationLecture 04 Review of MOSFET
ECE 541/ME 541 Microelectronic Fabrication Techniques Lecture 04 Review of MOSFET Zheng Yang (ERF 3017, email: yangzhen@uic.edu) What is a Transistor? A Switch! An MOS Transistor V GS V T V GS S Ron D
More informationCMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance
CMOS INVERTER Last Lecture Metrics for qualifying digital circuits»cost» Reliability» Speed (delay)»performance 1 Today s lecture The CMOS inverter at a glance An MOS transistor model for manual analysis
More informationEECS130 Integrated Circuit Devices
EECS130 Integrated Circuit Devices Professor Ali Javey 10/30/2007 MOSFETs Lecture 4 Reading: Chapter 17, 19 Announcements The next HW set is due on Thursday. Midterm 2 is next week!!!! Threshold and Subthreshold
More informationLECTURE 380 TWO-STAGE OPEN-LOOP COMPARATORS - II (READING: AH ) Trip Point of an Inverter
Lecture 380 Two-Stage Open-Loop Comparators-II (4/5/02) Page 380-1 LECTURE 380 TWO-STAGE OPEN-LOOP COMPARATORS - II (READING: AH 445-461) Trip Point of an Inverter V DD In order to determine the propagation
More informationLong-channel MOSFET IV Corrections
Long-channel MOSFET IV orrections Three MITs of the Day The body ect and its influence on long-channel V th. Long-channel subthreshold conduction and control (subthreshold slope S) Scattering components
More information