Quantitative MOSFET. Step 1. Connect the MOS capacitor results for the electron charge in the inversion layer Q N to the drain current.

Size: px
Start display at page:

Download "Quantitative MOSFET. Step 1. Connect the MOS capacitor results for the electron charge in the inversion layer Q N to the drain current."

Transcription

1 Quantitative MOSFET Step 1. Connect the MOS capacitor results for the electron charge in the inversion layer Q N to the drain current. V DS _ n source polysilicon gate y = y * 0 x metal interconnect to gate n polysilicon gate y p-type metal interconnect to bulk (a) W y* t ox E y (y * ) n drain gate oxide x channel electrons at position y = y * drifting with velocity v y (y * ) from source to drain x (b)

2 Drift Current Equation Drift current for electrons in the channel: J y ( x y) = Ðqnx ( y)v y () y The drain current at position y is the integral of the drift current density across the cross section. Since the conventional direction of is opposite to the direction of the y axis we insert a minus sign: x = ÐW J y ( x y)dx = 0 x Wv y () y qn( x y)dx 0 The integral is the negative of the electron charge in the channel per unit area at point y. The symbol for this quantity is - Q N (y): = ÐWv y ()Q y N () y Note that isnõt a function of the position in the channel

3 MOSFET DC Model: a First Pass metal interconnect to gate V GS _ n polysilicon gate Start simple -- small V DS makes the channel uniform V DS (< 0.1 V) n source 0 x y Q N p-type metal interconnect to bulk y = L n drain Channel charge: MOS capacitor in inversion with V GB =. Q N = ÐC ox ( V GB Ð V Tn ) = ÐC ox ( Ð V Tn ) Drift velocity: electric Þeld is just E y = - V DS / L so v y = - µ n (-V DS / L) Drain current equation for V DS ÒsmallÓ... say less than 0.1 V. W = µ n C ox ---- ( VGS Ð V L Tn )V DS Note that is proportional to V DS with channel resistance under gate control. This voltage controlled resistor region is sometimes useful.

4 Triode Region metal interconnect to gate n polysilicon gate Increase V DS -- channel charge becomes a function of position y. V DS _ n source 0 y x Q N (y) p-type metal interconnect to bulk n drain y = L First pass: approximate the drain current equation by taking averages of the channel charge and the drift velocity (Second pass: Section 4.4 (not assigned)) ÐWQ N v y Average drift velocity: still use µ n (V DS / L) -- which is a very rough approximation.

5 Triode Region (Cont.) Next approximate the average channel charge by averaging Q N (y=0) at the source end and Q N (y=l) at the drain end of the channel: Q N ( y=0) = ÐC ox ( Ð V Tn ) At the drain end the positive drain voltage reduces the magnitude of the channel charge... why? The effect can be approximated by using V GD (the drop from drain to channel at y = L) -- Q N ( y=l) = ÐC ox ( V GD Ð V Tn ) = ÐC ox ( Ð V DS Ð V Tn ) Note that V GD = - V DS > V Tn in order for there to be a channel left at the drain end. Substituting we derive the equation for the triode region which is defined by - V DS > V Tn and > V Tn. = µ n C W ox ---- ( VGS Ð V L Tn Ð V DS 2)V DS

6 Drain Characteristics Example: µ n C ox (W/L) = 50 µa/v 2 V Tn = 1 V and (W/L) = 4. (µa) = 4 V SAT = 3 V 200 = 2 V < V Tn V DS (V) What happens when V DS > - V Tn = V DS(sat)? Q N (y = L) = 0! Initial thought is that the lack of a channel at the drain end means that must drop to zero... WRONG! Drain terminal loses control over channel --> drain current ÒsaturatesÓ and remains constant (to Þrst approximation) at the value given by V DS = V DS(sat).

7 Saturation Region When > V Tn and V DS > V DS(sat) = - V T the drain current is: W = ( sat ) = µ n C ox ( VGS Ð V 2L Tn ) 2 V DSSAT metal interconnect to gate I V DSAT GS _ n polysilicon gate n source 0 y n drain x Q N (y = L) = 0 p-type metal interconnect to bulk Full model: (µa) triode region Eq. (4.17) SAT = 4 V vs. V DSSAT constant current (saturation) region Eq. (4.21) = 3 V 200 = 2 V V DS (V) < 1 V

8 MOSFET Circuit Models n-channel MOSFET drain current in cutoff triode and saturation: = 0 A ( V Tn ) = µ n C ox ( W L) [ Ð V Tn Ð ( V DS 2) ]( 1 λ n V DS )V DS ( VGS V Tn V DS Ð V Tn ) = µ n C ox ( W ( 2L) )( Ð V Tn ) 2 ( 1 λ n V DS ) ( VGS V Tn V DS Ð V Tn ) Numerical values: µ n is a function of along the channel and is much less than the mobility in the bulk (typical value 215 cm 2 /(Vs) ) -- therefore we consider that µ n C ox is a measured parameter. Typical value: µ n C ox = 50 µav -2 λ n sometimes called the channel length modulation parameter increases as the channel length L is reduced: 0.1µmV Ð1 λ n L The triode region equation has (1 λ n V DS ) added in order to avoid a jump at the boundary with the saturation region. For hand calculation of DC voltages and currents this term is usually omitted from. V Tn = threshold voltage = V typically for an n-channel MOSFET.

9 Backgate Effect The threshold voltage is a function of the bulk-to-source voltage V BS through the backgate effect. V Tn = V TOn γ n ( ÐV BS Ð2φ p Ð Ð2φ p ) where V TO is the threshold voltage with V BS = 0 and γ is the backgate effect parameter γ n = ( 2qε s N a ) C ox Physical origin: V BS (a negative voltage to avoid forward biasing the bulk-tosource pn junction) increases the depletion width which increases the bulk charge and thus the threshold voltage. = ( V DS V BS ) since V Tn = V Tn (V BS ) Common situation is that V BS = 0 by electrically shorting the source to the bulk (either the substrate or a deep diffused region called a well) source and bulk terminals are shorted together --> no backgate effect p n source p well n substrate n drain For this case V Tn = V TOn.

10 p-channel MOSFETs Structure is complementary to the n-channel MOSFET In a CMOS technology one or the other type of MOSFET is built into a well -- a deep diffused region -- so that there are electrically isolated ÒbulkÓ regions in the same substrate n-channel p-channel MOSFET MOSFET (a) A A common bulk contact for all n-channel MOSFETs (to ground or to the supply) isolated bulk contact with p-channel MOSFET shorted to source (b) p n source n drain p drain p source n p-type substrate n well

11 p-channel MOSFET Models DC drain current in the three operating regions: - > 0 ÐI D = 0 A ( V SG ÐV T ) ÐI D = µ p C ox ( W L) [ V SG V Tp Ð ( V SD 2) ]( 1 λ p V SD )V SD ( VSG ÐV Tp V SD V SG V Tp ) ÐI D = µ p C ox ( W ( 2L) )( V SG V Tp ) 2 ( 1 λ p V SD ) ( VSG ÐV Tp V SD V SG V Tp ) The threshold voltage with backgate effect is given by: Numerical values: V Tp = V TOp Ðγ p (( ÐV SB 2φ n ) Ð 2φ n ) µ p C ox is a measured parameter. Typical value: µ p C ox = 25 µav µmV Ð1 λ p L V Tp = -0.7 to -1.0 V which should be approximately -V Tn for a well-controlled CMOS process

EE105 - Fall 2005 Microelectronic Devices and Circuits

EE105 - Fall 2005 Microelectronic Devices and Circuits EE105 - Fall 005 Microelectronic Devices and Circuits ecture 7 MOS Transistor Announcements Homework 3, due today Homework 4 due next week ab this week Reading: Chapter 4 1 ecture Material ast lecture

More information

MOS Transistor Properties Review

MOS Transistor Properties Review MOS Transistor Properties Review 1 VLSI Chip Manufacturing Process Photolithography: transfer of mask patterns to the chip Diffusion or ion implantation: selective doping of Si substrate Oxidation: SiO

More information

EE105 - Fall 2006 Microelectronic Devices and Circuits

EE105 - Fall 2006 Microelectronic Devices and Circuits EE105 - Fall 2006 Microelectronic Devices and Circuits Prof. Jan M. Rabaey (jan@eecs) Lecture 7: MOS Transistor Some Administrative Issues Lab 2 this week Hw 2 due on We Hw 3 will be posted same day MIDTERM

More information

Lecture 9 MOSFET(II) MOSFET I V CHARACTERISTICS(contd.)

Lecture 9 MOSFET(II) MOSFET I V CHARACTERISTICS(contd.) Lecture 9 MOSFET(II) MOSFET I V CHARACTERISTICS(contd.) Outline 1. The saturation region 2. Backgate characteristics Reading Assignment: Howe and Sodini, Chapter 4, Section 4.4 6.012 Spring 2009 Lecture

More information

ELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model

ELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model ELEC 3908, Physical Electronics, Lecture 23 The MOSFET Square Law Model Lecture Outline As with the diode and bipolar, have looked at basic structure of the MOSFET and now turn to derivation of a current

More information

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region EE105 Fall 014 Microelectronic Devices and Circuits Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel

More information

The Gradual Channel Approximation for the MOSFET:

The Gradual Channel Approximation for the MOSFET: 6.01 - Electronic Devices and Circuits Fall 003 The Gradual Channel Approximation for the MOSFET: We are modeling the terminal characteristics of a MOSFET and thus want i D (v DS, v GS, v BS ), i B (v

More information

Chapter 4 Field-Effect Transistors

Chapter 4 Field-Effect Transistors Chapter 4 Field-Effect Transistors Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 5/5/11 Chap 4-1 Chapter Goals Describe operation of MOSFETs. Define FET characteristics in operation

More information

Charge Storage in the MOS Structure. The Inverted MOS Capacitor (V GB > V Tn )

Charge Storage in the MOS Structure. The Inverted MOS Capacitor (V GB > V Tn ) The Inverted MO Capacitor (V > V Tn ) We consider the surface potential as Þxed (ÒpinnedÓ) at φ s,max = - φ p φ(x).5 V. V V ox Charge torage in the MO tructure Three regions of operation: Accumulation:

More information

Practice 3: Semiconductors

Practice 3: Semiconductors Practice 3: Semiconductors Digital Electronic Circuits Semester A 2012 VLSI Fabrication Process VLSI Very Large Scale Integration The ability to fabricate many devices on a single substrate within a given

More information

Lecture 11: MOS Transistor

Lecture 11: MOS Transistor Lecture 11: MOS Transistor Prof. Niknejad Lecture Outline Review: MOS Capacitors Regions MOS Capacitors (3.8 3.9) CV Curve Threshold Voltage MOS Transistors (4.1 4.3): Overview Cross-section and layout

More information

MOS Transistor Theory

MOS Transistor Theory CHAPTER 3 MOS Transistor Theory Outline 2 1. Introduction 2. Ideal I-V Characteristics 3. Nonideal I-V Effects 4. C-V Characteristics 5. DC Transfer Characteristics 6. Switch-level RC Delay Models MOS

More information

MOS Transistor I-V Characteristics and Parasitics

MOS Transistor I-V Characteristics and Parasitics ECEN454 Digital Integrated Circuit Design MOS Transistor I-V Characteristics and Parasitics ECEN 454 Facts about Transistors So far, we have treated transistors as ideal switches An ON transistor passes

More information

Lecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET:

Lecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET: Lecture 15: MOS Transistor models: Body effects, SPICE models Context In the last lecture, we discussed the modes of operation of a MOS FET: oltage controlled resistor model I- curve (Square-Law Model)

More information

Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices.

Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices. Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The July 30, 2002 1 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

EE 330 Lecture 16. MOS Device Modeling p-channel n-channel comparisons Model consistency and relationships CMOS Process Flow

EE 330 Lecture 16. MOS Device Modeling p-channel n-channel comparisons Model consistency and relationships CMOS Process Flow EE 330 Lecture 16 MOS Device Modeling p-channel n-channel comparisons Model consistency and relationships CMOS Process Flow Review from Last Time Operation Regions by Applications Id I D 300 250 200 150

More information

Device Models (PN Diode, MOSFET )

Device Models (PN Diode, MOSFET ) Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed

More information

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors ECE 342 Electronic Circuits Lecture 6 MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2

More information

Lecture 28 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 18, 2007

Lecture 28 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 18, 2007 6.720J/3.43J - Integrated Microelectronic Devices - Spring 2007 Lecture 28-1 Lecture 28 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 18, 2007 Contents: 1. Second-order and

More information

Integrated Circuits & Systems

Integrated Circuits & Systems Federal University of Santa Catarina Center for Technology Computer Science & Electronics Engineering Integrated Circuits & Systems INE 5442 Lecture 10 MOSFET part 1 guntzel@inf.ufsc.br ual-well Trench-Isolated

More information

6.012 Electronic Devices and Circuits Spring 2005

6.012 Electronic Devices and Circuits Spring 2005 6.012 Electronic Devices and Circuits Spring 2005 May 16, 2005 Final Exam (200 points) -OPEN BOOK- Problem NAME RECITATION TIME 1 2 3 4 5 Total General guidelines (please read carefully before starting):

More information

MOSFET: Introduction

MOSFET: Introduction E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major

More information

Lecture 3: CMOS Transistor Theory

Lecture 3: CMOS Transistor Theory Lecture 3: CMOS Transistor Theory Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V Characteristics Gate and Diffusion Capacitance 2 Introduction So far, we have treated transistors

More information

Figure 1: MOSFET symbols.

Figure 1: MOSFET symbols. c Copyright 2008. W. Marshall Leach, Jr., Professor, Georgia Institute of Technology, School of Electrical and Computer Engineering. The MOSFET Device Symbols Whereas the JFET has a diode junction between

More information

Device Models (PN Diode, MOSFET )

Device Models (PN Diode, MOSFET ) Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed

More information

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA MOS Transistors Prof. Krishna Saraswat Department of Electrical Engineering S Stanford, CA 94305 saraswat@stanford.edu 1 1930: Patent on the Field-Effect Transistor! Julius Lilienfeld filed a patent describing

More information

EE 330 Lecture 16. MOSFET Modeling CMOS Process Flow

EE 330 Lecture 16. MOSFET Modeling CMOS Process Flow EE 330 Lecture 16 MOSFET Modeling CMOS Process Flow Model Extensions 300 Id 250 200 150 100 50 300 0 0 1 2 3 4 5 Vds Existing Model 250 200 Id 150 100 50 Slope is not 0 0 0 1 2 3 4 Actual Device Vds Model

More information

The Devices. Jan M. Rabaey

The Devices. Jan M. Rabaey The Devices Jan M. Rabaey Goal of this chapter Present intuitive understanding of device operation Introduction of basic device equations Introduction of models for manual analysis Introduction of models

More information

Microelectronics Part 1: Main CMOS circuits design rules

Microelectronics Part 1: Main CMOS circuits design rules GBM8320 Dispositifs Médicaux telligents Microelectronics Part 1: Main CMOS circuits design rules Mohamad Sawan et al. Laboratoire de neurotechnologies Polystim! http://www.cours.polymtl.ca/gbm8320/! med-amine.miled@polymtl.ca!

More information

FIELD-EFFECT TRANSISTORS

FIELD-EFFECT TRANSISTORS FIEL-EFFECT TRANSISTORS 1 Semiconductor review 2 The MOS capacitor 2 The enhancement-type N-MOS transistor 3 I-V characteristics of enhancement MOSFETS 4 The output characteristic of the MOSFET in saturation

More information

Lecture 4: CMOS Transistor Theory

Lecture 4: CMOS Transistor Theory Introduction to CMOS VLSI Design Lecture 4: CMOS Transistor Theory David Harris, Harvey Mudd College Kartik Mohanram and Steven Levitan University of Pittsburgh Outline q Introduction q MOS Capacitor q

More information

Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models

Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models Outline Lowfrequency smallsignal equivalent circuit model Highfrequency smallsignal equivalent circuit model Reading Assignment: Howe and Sodini;

More information

Lecture 12: MOS Capacitors, transistors. Context

Lecture 12: MOS Capacitors, transistors. Context Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those

More information

Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models

Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models Lecture 1 MOSFET (III) MOSFET Equivalent Circuit Models Outline Lowfrequency smallsignal equivalent circuit model Highfrequency smallsignal equivalent circuit model Reading Assignment: Howe and Sodini;

More information

MOS Transistor Theory

MOS Transistor Theory MOS Transistor Theory So far, we have viewed a MOS transistor as an ideal switch (digital operation) Reality: less than ideal EE 261 Krish Chakrabarty 1 Introduction So far, we have treated transistors

More information

ECE 342 Electronic Circuits. 3. MOS Transistors

ECE 342 Electronic Circuits. 3. MOS Transistors ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to

More information

EEC 118 Lecture #2: MOSFET Structure and Basic Operation. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation

EEC 118 Lecture #2: MOSFET Structure and Basic Operation. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation EEC 118 Lecture #2: MOSFET Structure and Basic Operation Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation Announcements Lab 1 this week, report due next week Bring

More information

Introduction and Background

Introduction and Background Analog CMOS Integrated Circuit Design Introduction and Background Dr. Jawdat Abu-Taha Department of Electrical and Computer Engineering Islamic University of Gaza jtaha@iugaza.edu.ps 1 Marking Assignments

More information

Fig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B)

Fig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B) 1 Introduction to Transistor-Level Logic Circuits 1 By Prawat Nagvajara At the transistor level of logic circuits, transistors operate as switches with the logic variables controlling the open or closed

More information

GEORGIA INSTITUTE OF TECHNOLOGY School of Electrical and Computer Engineering

GEORGIA INSTITUTE OF TECHNOLOGY School of Electrical and Computer Engineering NAME: GEORGIA INSTITUTE OF TECHNOLOGY School of Electrical and Computer Engineering ECE 4430 First Exam Closed Book and Notes Fall 2002 September 27, 2002 General Instructions: 1. Write on one side of

More information

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Chapter 2 CMOS Transistor Theory Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Outline Introduction MOS Device Design Equation Pass Transistor Jin-Fu Li, EE,

More information

Today s lecture. EE141- Spring 2003 Lecture 4. Design Rules CMOS Inverter MOS Transistor Model

Today s lecture. EE141- Spring 2003 Lecture 4. Design Rules CMOS Inverter MOS Transistor Model - Spring 003 Lecture 4 Design Rules CMOS Inverter MOS Transistor Model Today s lecture Design Rules The CMOS inverter at a glance An MOS transistor model for manual analysis Important! Labs start next

More information

Lecture 12: MOSFET Devices

Lecture 12: MOSFET Devices Lecture 12: MOSFET Devices Gu-Yeon Wei Division of Engineering and Applied Sciences Harvard University guyeon@eecs.harvard.edu Wei 1 Overview Reading S&S: Chapter 5.1~5.4 Supplemental Reading Background

More information

EE 330 Lecture 16. Devices in Semiconductor Processes. MOS Transistors

EE 330 Lecture 16. Devices in Semiconductor Processes. MOS Transistors EE 330 Lecture 16 Devices in Semiconductor Processes MOS Transistors Review from Last Time Model Summary I D I V DS V S I B V BS = 0 0 VS VT W VDS ID = μcox VS VT VDS VS V VDS VS VT L T < W μc ( V V )

More information

Lecture 5: CMOS Transistor Theory

Lecture 5: CMOS Transistor Theory Lecture 5: CMOS Transistor Theory Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline q q q q q q q Introduction MOS Capacitor nmos I-V Characteristics

More information

MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET. MOS Symbols and Characteristics. nmos Enhancement Transistor

MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET. MOS Symbols and Characteristics. nmos Enhancement Transistor MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET Calculation of t and Important 2 nd Order Effects SmallSignal Signal MOSFET Model Summary Material from: CMOS LSI Design By Weste

More information

VLSI Design The MOS Transistor

VLSI Design The MOS Transistor VLSI Design The MOS Transistor Frank Sill Torres Universidade Federal de Minas Gerais (UFMG), Brazil VLSI Design: CMOS Technology 1 Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V

More information

Circuits. L2: MOS Models-2 (1 st Aug. 2013) B. Mazhari Dept. of EE, IIT Kanpur. B. Mazhari, IITK. G-Number

Circuits. L2: MOS Models-2 (1 st Aug. 2013) B. Mazhari Dept. of EE, IIT Kanpur. B. Mazhari, IITK. G-Number EE610: CMOS Analog Circuits L: MOS Models- (1 st Aug. 013) B. Mazhari Dept. of EE, IIT Kanpur 3 NMOS Models MOS MODEL Above Threshold Subthreshold ( GS > TN ) ( GS < TN ) Saturation ti Ti Triode ( DS >

More information

ELEC 3908, Physical Electronics, Lecture 26. MOSFET Small Signal Modelling

ELEC 3908, Physical Electronics, Lecture 26. MOSFET Small Signal Modelling ELEC 3908, Physical Electronics, Lecture 26 MOSFET Small Signal Modelling Lecture Outline MOSFET small signal behavior will be considered in the same way as for the diode and BJT Capacitances will be considered

More information

High-to-Low Propagation Delay t PHL

High-to-Low Propagation Delay t PHL High-to-Low Propagation Delay t PHL V IN switches instantly from low to high. Driver transistor (n-channel) immediately switches from cutoff to saturation; the p-channel pull-up switches from triode to

More information

Lecture 210 Physical Aspects of ICs (12/15/01) Page 210-1

Lecture 210 Physical Aspects of ICs (12/15/01) Page 210-1 Lecture 210 Physical Aspects of ICs (12/15/01) Page 210-1 LECTURE 210 PHYSICAL ASPECTS OF ICs (READING: Text-Sec. 2.5, 2.6, 2.8) INTRODUCTION Objective Illustrate the physical aspects of integrated circuits

More information

! MOS Capacitances. " Extrinsic. " Intrinsic. ! Lumped Capacitance Model. ! First Order Capacitor Summary. ! Capacitance Implications

! MOS Capacitances.  Extrinsic.  Intrinsic. ! Lumped Capacitance Model. ! First Order Capacitor Summary. ! Capacitance Implications ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 7: February, 07 MOS SPICE Models, MOS Parasitic Details Lecture Outline! MOS Capacitances " Extrinsic " Intrinsic! Lumped Capacitance Model!

More information

Step 1. Finding V M. Goal: Þnd V M = input voltage for the output = V M both transistors are saturated at V IN = V M since

Step 1. Finding V M. Goal: Þnd V M = input voltage for the output = V M both transistors are saturated at V IN = V M since Step 1. Finding V M Goal: Þnd V M = input voltage for the output = V M both transistors are saturated at V IN = V M since V DSn = V M - 0 > V M - V Tn V SDp = V DD - V M = (V DD - V M ) V Tp Equate drain

More information

II III IV V VI B C N. Al Si P S. Zn Ga Ge As Se Cd In Sn Sb Te. Silicon (Si) the dominating material in IC manufacturing

II III IV V VI B C N. Al Si P S. Zn Ga Ge As Se Cd In Sn Sb Te. Silicon (Si) the dominating material in IC manufacturing II III IV V VI B N Al Si P S Zn Ga Ge As Se d In Sn Sb Te Silicon (Si) the dominating material in I manufacturing ompound semiconductors III - V group: GaAs GaN GaSb GaP InAs InP InSb... The Energy Band

More information

EE 330 Lecture 17. MOSFET Modeling CMOS Process Flow

EE 330 Lecture 17. MOSFET Modeling CMOS Process Flow EE 330 Lecture 17 MOSFET Modeling CMOS Process Flow Review from Last Lecture Limitations of Existing Models V DD V OUT V OUT V DD?? V IN V OUT V IN V IN V DD Switch-Level Models V DD Simple square-law

More information

The Devices. Devices

The Devices. Devices The The MOS Transistor Gate Oxyde Gate Source n+ Polysilicon Drain n+ Field-Oxyde (SiO 2 ) p-substrate p+ stopper Bulk Contact CROSS-SECTION of NMOS Transistor Cross-Section of CMOS Technology MOS transistors

More information

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 igital Integrated Circuits A esign Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The evices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor Triode Working FET Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor The characteristics of energy bands as a function of applied voltage. Surface inversion. The expression for the

More information

The transistor is not in the cutoff region. the transistor is in the saturation region. To see this, recognize that in a long-channel transistor ifv

The transistor is not in the cutoff region. the transistor is in the saturation region. To see this, recognize that in a long-channel transistor ifv ECE 440 Spring 005 Page 1 Homework Assignment No. Solutions P.4 For each transistor, first determine if the transistor is in cutoff by checking to see if GS is less than or greater than. may have to be

More information

ECE315 / ECE515 Lecture-2 Date:

ECE315 / ECE515 Lecture-2 Date: Lecture-2 Date: 04.08.2016 NMOS I/V Characteristics Discussion on I/V Characteristics MOSFET Second Order Effect NMOS I-V Characteristics ECE315 / ECE515 Gradual Channel Approximation: Cut-off Linear/Triode

More information

Lecture 29 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 20, 2007

Lecture 29 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 20, 2007 6.720J/3.43J - Integrated Microelectronic Devices - Spring 2007 Lecture 29-1 Lecture 29 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 20, 2007 Contents: 1. Non-ideal and second-order

More information

MOSFET Physics: The Long Channel Approximation

MOSFET Physics: The Long Channel Approximation MOSFET Physics: The ong Channel Approximation A basic n-channel MOSFET (Figure 1) consists of two heavily-doped n-type regions, the Source and Drain, that comprise the main terminals of the device. The

More information

EE382M-14 CMOS Analog Integrated Circuit Design

EE382M-14 CMOS Analog Integrated Circuit Design EE382M-14 CMOS Analog Integrated Circuit Design Lecture 3, MOS Capacitances, Passive Components, and Layout of Analog Integrated Circuits MOS Capacitances Type of MOS transistor capacitors Depletion capacitance

More information

ECE-305: Fall 2017 MOS Capacitors and Transistors

ECE-305: Fall 2017 MOS Capacitors and Transistors ECE-305: Fall 2017 MOS Capacitors and Transistors Pierret, Semiconductor Device Fundamentals (SDF) Chapters 15+16 (pp. 525-530, 563-599) Professor Peter Bermel Electrical and Computer Engineering Purdue

More information

Chapter 2 MOS Transistor theory

Chapter 2 MOS Transistor theory Chapter MOS Transistor theory.1 Introduction An MOS transistor is a majority-carrier device, which the current a conductg channel between the source and the dra is modulated by a voltage applied to the

More information

The Devices: MOS Transistors

The Devices: MOS Transistors The Devices: MOS Transistors References: Semiconductor Device Fundamentals, R. F. Pierret, Addison-Wesley Digital Integrated Circuits: A Design Perspective, J. Rabaey et.al. Prentice Hall NMOS Transistor

More information

Section 12: Intro to Devices

Section 12: Intro to Devices Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si

More information

ECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN

ECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN ECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN CMOS PROCESS CHARACTERIZATION VISHAL SAXENA VSAXENA@UIDAHO.EDU Vishal Saxena DESIGN PARAMETERS Analog circuit designers care about: Open-loop Gain: g m r o

More information

Lecture #27. The Short Channel Effect (SCE)

Lecture #27. The Short Channel Effect (SCE) Lecture #27 ANNOUNCEMENTS Design Project: Your BJT design should meet the performance specifications to within 10% at both 300K and 360K. ( β dc > 45, f T > 18 GHz, V A > 9 V and V punchthrough > 9 V )

More information

SECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University

SECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University NAME: PUID: SECTION: Circle one: Alam Lundstrom ECE 305 Exam 5 SOLUTIONS: April 18, 2016 M A Alam and MS Lundstrom Purdue University This is a closed book exam You may use a calculator and the formula

More information

ECE 497 JS Lecture - 12 Device Technologies

ECE 497 JS Lecture - 12 Device Technologies ECE 497 JS Lecture - 12 Device Technologies Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 NMOS Transistor 2 ρ Source channel charge density

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 5: January 25, 2018 MOS Operating Regions, pt. 1 Lecture Outline! 3 Regions of operation for MOSFET " Subthreshold " Linear " Saturation!

More information

ECE-343 Test 2: Mar 21, :00-8:00, Closed Book. Name : SOLUTION

ECE-343 Test 2: Mar 21, :00-8:00, Closed Book. Name : SOLUTION ECE-343 Test 2: Mar 21, 2012 6:00-8:00, Closed Book Name : SOLUTION 1. (25 pts) (a) Draw a circuit diagram for a differential amplifier designed under the following constraints: Use only BJTs. (You may

More information

HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7

HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 2 What do digital IC designers need to know? 5 EE4 EECS4 6 3 0< V GS - V T < V DS Pinch-off 7 For (V GS V T )

More information

The Physical Structure (NMOS)

The Physical Structure (NMOS) The Physical Structure (NMOS) Al SiO2 Field Oxide Gate oxide S n+ Polysilicon Gate Al SiO2 SiO2 D n+ L channel P Substrate Field Oxide contact Metal (S) n+ (G) L W n+ (D) Poly 1 Transistor Resistance Two

More information

Lecture 04 Review of MOSFET

Lecture 04 Review of MOSFET ECE 541/ME 541 Microelectronic Fabrication Techniques Lecture 04 Review of MOSFET Zheng Yang (ERF 3017, email: yangzhen@uic.edu) What is a Transistor? A Switch! An MOS Transistor V GS V T V GS S Ron D

More information

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE15 Spring 28 Lecture

More information

LECTURE 3 MOSFETS II. MOS SCALING What is Scaling?

LECTURE 3 MOSFETS II. MOS SCALING What is Scaling? LECTURE 3 MOSFETS II Lecture 3 Goals* * Understand constant field and constant voltage scaling and their effects. Understand small geometry effects for MOS transistors and their implications modeling and

More information

EE105 - Fall 2006 Microelectronic Devices and Circuits. Some Administrative Issues

EE105 - Fall 2006 Microelectronic Devices and Circuits. Some Administrative Issues EE105 - Fall 006 Microelectronic evices and Circuits Prof. Jan M. Rabaey (jan@eecs Lecture 8: MOS Small Signal Model Some Administrative Issues REIEW Session Next Week Tu Sept 6 6:00-7:30pm; 060 alley

More information

EE 560 MOS TRANSISTOR THEORY

EE 560 MOS TRANSISTOR THEORY 1 EE 560 MOS TRANSISTOR THEORY PART 1 TWO TERMINAL MOS STRUCTURE V G (GATE VOLTAGE) 2 GATE OXIDE SiO 2 SUBSTRATE p-type doped Si (N A = 10 15 to 10 16 cm -3 ) t ox V B (SUBSTRATE VOLTAGE) EQUILIBRIUM:

More information

ECE 546 Lecture 10 MOS Transistors

ECE 546 Lecture 10 MOS Transistors ECE 546 Lecture 10 MOS Transistors Spring 2018 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu NMOS Transistor NMOS Transistor N-Channel MOSFET Built on p-type

More information

EE 560 MOS TRANSISTOR THEORY PART 2. Kenneth R. Laker, University of Pennsylvania

EE 560 MOS TRANSISTOR THEORY PART 2. Kenneth R. Laker, University of Pennsylvania 1 EE 560 MOS TRANSISTOR THEORY PART nmos TRANSISTOR IN LINEAR REGION V S = 0 V G > V T0 channel SiO V D = small 4 C GC C BC substrate depletion region or bulk B p nmos TRANSISTOR AT EDGE OF SATURATION

More information

Introduction to CMOS VLSI. Chapter 2: CMOS Transistor Theory. Harris, 2004 Updated by Li Chen, Outline

Introduction to CMOS VLSI. Chapter 2: CMOS Transistor Theory. Harris, 2004 Updated by Li Chen, Outline Introduction to MOS VLSI Design hapter : MOS Transistor Theory copyright@david Harris, 004 Updated by Li hen, 010 Outline Introduction MOS apacitor nmos IV haracteristics pmos IV haracteristics Gate and

More information

P. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions

P. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions P. R. Nelson 1 ECE418 - VLSI Midterm Exam Solutions 1. (8 points) Draw the cross-section view for A-A. The cross-section view is as shown below.. ( points) Can you tell which of the metal1 regions is the

More information

CHAPTER 5 MOS FIELD-EFFECT TRANSISTORS

CHAPTER 5 MOS FIELD-EFFECT TRANSISTORS CHAPTER 5 MOS FIELD-EFFECT TRANSISTORS 5.1 The MOS capacitor 5.2 The enhancement-type N-MOS transistor 5.3 I-V characteristics of enhancement mode MOSFETS 5.4 The PMOS transistor and CMOS technology 5.5

More information

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOS Capacitor with External Bias

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOS Capacitor with External Bias ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 5: Januar 6, 17 MOS Operating Regions, pt. 1 Lecture Outline! 3 Regions of operation for MOSFET " Subthreshold " Linear " Saturation! Level

More information

6.012 MICROELECTRONIC DEVICES AND CIRCUITS

6.012 MICROELECTRONIC DEVICES AND CIRCUITS MASSACHUSETTS INSTITUTE OF TECHNOLOGY Department of Electrical Engineering and Computer Science 6.012 MICROELECTRONIC DEVICES AND CIRCUITS Answers to Exam 2 Spring 2008 Problem 1: Graded by Prof. Fonstad

More information

MOSFET Capacitance Model

MOSFET Capacitance Model MOSFET Capacitance Model So far we discussed the MOSFET DC models. In real circuit operation, the device operates under time varying terminal voltages and the device operation can be described by: 1 small

More information

Chapter 13 Small-Signal Modeling and Linear Amplification

Chapter 13 Small-Signal Modeling and Linear Amplification Chapter 13 Small-Signal Modeling and Linear Amplification Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 1/4/12 Chap 13-1 Chapter Goals Understanding of concepts related to: Transistors

More information

EE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing

EE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing EE115C Winter 2017 Digital Electronic Circuits Lecture 3: MOS RC Model, CMOS Manufacturing Agenda MOS Transistor: RC Model (pp. 104-113) S R on D CMOS Manufacturing Process (pp. 36-46) S S C GS G G C GD

More information

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics t ti Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE105 Fall 2007

More information

Charge-Storage Elements: Base-Charging Capacitance C b

Charge-Storage Elements: Base-Charging Capacitance C b Charge-Storage Elements: Base-Charging Capacitance C b * Minority electrons are stored in the base -- this charge q NB is a function of the base-emitter voltage * base is still neutral... majority carriers

More information

University of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA

University of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA University of Pennsylvania Department of Electrical Engineering ESE 570 Midterm Exam March 4, 03 FORMULAS AND DATA. PHYSICAL CONSTANTS: n i = intrinsic concentration undoped) silicon =.45 x 0 0 cm -3 @

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 23, 2018 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2018 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor

More information

EE5311- Digital IC Design

EE5311- Digital IC Design EE5311- Digital IC Design Module 1 - The Transistor Janakiraman V Assistant Professor Department of Electrical Engineering Indian Institute of Technology Madras Chennai October 28, 2017 Janakiraman, IITM

More information

VLSI Design and Simulation

VLSI Design and Simulation VLSI Design and Simulation Performance Characterization Topics Performance Characterization Resistance Estimation Capacitance Estimation Inductance Estimation Performance Characterization Inverter Voltage

More information

EE 330 Lecture 18. Small-signal Model (very preliminary) Bulk CMOS Process Flow

EE 330 Lecture 18. Small-signal Model (very preliminary) Bulk CMOS Process Flow EE 330 Lecture 18 Small-signal Model (very preliminary) Bulk CMOS Process Flow Review from Last Lecture How many models of the MOSFET do we have? Switch-level model (2) Square-law model Square-law model

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 7: February 4, 2016 MOS SPICE Models, MOS Parasitic Details Lecture Outline! MOS Capacitances " Extrinsic " Intrinsic! Lumped Capacitance

More information

CMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance

CMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance CMOS INVERTER Last Lecture Metrics for qualifying digital circuits»cost» Reliability» Speed (delay)»performance 1 Today s lecture The CMOS inverter at a glance An MOS transistor model for manual analysis

More information