Vgs Forms a Channel CS/EE MOS Capacitor. N-type Transistor

Size: px
Start display at page:

Download "Vgs Forms a Channel CS/EE MOS Capacitor. N-type Transistor"

Transcription

1 V Form a hannel S/EE 670 MOS Tranitor Model Electrical Effect Propaation Delay N-type Tranitor MOS apacitor ate and body form MOS capacitor Operatin mode Accumulation V < Depletion Inverion (a) polyilicon ate ilicon dioxide inulator p-type body 0 < V < V t depletion reion + - D + (b) +V S Vd - i electron V > V t + - inverion reion depletion reion (c) Another utaway View Thank to National entral Univerity for Some imae Tranitor haracteritic Three conduction characteritic utoff eion No inverion layer in channel Id = 0 Nonaturated, or linear reion Weak inverion of the channel D Id depend on V and Vd Saturated reion Stron inverion of channel Id i independent of Vd +V S Vd A an aide, at very hih drain voltae: avalanche breakdown or punch throuh ate ha no control of Id + - Id

2 nmos utoff: V<Vt No channel I d = 0 V = 0 n+ n+ p-type body b V d d Baic N-Type MOS Tranitor ondition for the reion of operation utoff: If V < Vt, then Id i eentially 0 Vt i the Threhold Voltae Linear: If V>Vt and Vd < (V Vt) then Id depend on both V and Vd hannel become deeper a V oe up Saturated: If V>Vt and Vd > (V Vt) then Id i eentially contant (Saturated) D + Vd Id electron +V S - nmos Linear: V>Vt, mall Vd hannel form urrent flow from d to e - from to d I d increae with V d Similar to linear reitor V > V t V > V t n+ n+ p-type body b n+ n+ p-type body b V d = V d V d = 0 V > V d > V t d I d 0 < V d < V -V t Tranitor ain β i the MOS tranitor ain factor β = (με/t ox )(W/L) Proce-dependent Layout dependent μ = mobility of carrier Note that N-type i twice a ood a P-type ε = permittivity of ate inulator ε = 3.9 ε 0 for SiO (ε 0 = 8.85x0-4 F/cm) T ox = thickne of ate oxide Alo, ε/t ox = ox The oxide capacitance β = (μ ox )(W/L) = k (W/L) = KP(W/L) Increae W/L to increae ain nmos Saturation: Vd>V-Vt hannel pinche off onduction by drift becaue of poitive drain voltae Electron are injected into depletion reion I d independent of V d We ay that the current aturate Similar to current ource V > V t n+ n+ p-type body b V d < V t d I d V d > V -V t Example We will be uin a 0.6 μm proce for your project From AMI Semiconductor t ox = 00 Å.5 V = 5 μ = 350 cm / V*.5 V V t = 0.7 V = 4 V Plot I d v. V = 3 d 0.5 V = V = 0,,, 3, 4, 5 V 0 = Ue W/L = 4/ λ V d 4 W W W β = μox = ( 350) 0 μa/ V 8 L 00 0 = L L I d (ma)

3 Saturated Tranitor In the 0 < (V Vt) < Vd cae Id urrent i effectively contant hannel i pinched off and conduction i accomplihed by drift of carrier Voltae acro pinched off channel (I.e. Vd) i fixed at V Vt Thi i why you don t ue an N-type to pa! Hih voltae i deraded by Vt If Vt i.0v, 5v in one ide, 4.0v out the other 5v 4.0v S D 5v N-type Pa Tranitor 5v 4.0v 0.0v 5v Another option i a keeper tranitor fed back from the output Thi pull the internal node hih when the output i 0 But i diconnected when output i hih Make ure the ize i riht Aide: N-type Pa Tranitor A B ~S Out N-type Pa Tranitor In practice, they are ued fairly often, but be aware of what you re doin For example, read/write circuit in a eiter File * S If it weren t for the threhold drop, N-type pa tranitor (without the P-type tranmiion ate) would be nice -way Mux Example WE E0 E Write Data D0 D ead Data N-type Pa Tranitor 5v 4.0v 0.0v 5v One one hand, the deraded hih voltae from the pa tranitor will be retored by the inverter On the other hand, the P-device may not turn off completely reultin in extra power bein ued Back to the Saturated Tranitor What influence the contant Id in the aturated cae? hannel lenth hannel width Threhold voltae Vt Thickne of ate oxide Dielectric contant of ate oxide arrier mobility μ Velocity Saturation 3

4 Threhold Voltae: Vt The V voltae at which Id i eentially 0 Vt =.67v for nmo and -.9v for pmo in our proce Tiny Id i exponentially related to V, Vd Take 570/670 for ubthrehold circuit idea Vt i affected by ate conductor material ate inulator material ate inulator thickne hannel dopin Impuritie at Si/inulator interface Voltae between ource and ubtrate (Vb) Id urve nd Order Effect: Body Effect P-type Tranitor A econd order effect that raie Vt ecall that Vt i affected by Vb (voltae between ource and ubtrate) Normally thi i contant becaue of common ubtrate But, when tranitor are in erie, Vb (V Vubtrate) may be chaned Vt > Vt Vt Vt Vb = 0 Vb = 0 -V S Vd D + - i hole Baic D Equation for Id P-type Tranitor utoff eion D + V < Vt, Id = 0 Vd Id Linear eion 0 < Vd < (V Vt) +V S - Id = β[(v Vt)Vd Vd /] Note that thi i only linear if Vd / i very mall, I.e. Vd << V Vt Saturated eion 0 < (V Vt) < Vd Id = β[(v Vt) /] 4

5 P-type Tranitor Source i Vdd intead of ND V = (Vdd - Vin), Vd = (Vdd -Vout), Vt i neative utoff: (Vdd-Vin) < -Vt, Id=0 -V S Vd Linear eion D (Vdd-Vout) < (Vdd - Vin + Vt) Id = β[(vdd-vin+vt)(vdd-vout) (Vdd-Vout) /] Saturated eion ((Vdd - Vin) + Vt) < (Vdd - Vout) Id = β[(vdd -Vin + Vt) /] + - i nd Order Effect: Velocity Saturation With weak field, current increae linearly with lateral electric field At hiher field, carrier drift velocity roll off and aturate Due to carrier catterin eult i le current than you think! For a μ channel lenth, effect tart around 4v Vdd For 80nm, effect tart at 0.36v Vdd! Pa Tranitor kt nd Order Effect: Velocity Saturation V SS When the carrier reach their peed limit in ilicon hannel lenth have been caled o that vertical and horizontal EM field are lare and interact with each other V = 0 Vertical field ~ 5x0 6 V/cm n+ n+ p-type body b V d d Horiz field = ~0 5 V/cm Pa Tranitor kt nd Order Effect: Velocity Saturation V = -V tn V = V tp VDD -Vtn VDD-Vtn V - tn -V tn -V tn When the carrier reach their peed limit in ilicon Mean that relationhip between Id and V i cloer to linear than quadratic Alo the aturation point i maller than predicted For example, 80nm proce t order model =.3v eally i 0.6v V SS 5

6 nd Order Effect: Velocity Saturation nd Order Effect: Body Effect Thi i a baic difference between lonand hort-channel device The trenth of the horizontal EM field in a hort channel device caue the carrier to reach their velocity limit early Device aturate fater and deliver le current than the quadratic model predict nd Order Effect: Velocity Saturation onider two device with the ame W/L ratio in our proce (V=5v, Vdd=5v) 00/0 v 4.6/. They hould have the ame current Becaue of velocity aturation in the hortchannel device, it ha 47% le current! nd Order Effect: Body Effect onider an nmo tranitor in a 80nm proce Nominal Vt of 0.4v Body i tied to round How much doe the Vt increae if the ource i at.v intead of 0v? Becaue of the body effect, Vt increae by 0.8v to be 0.68v! nd Order Effect: Body Effect nd Order Effect A econd order effect that raie Vt ecall that Vt i affected by Vb (voltae between ource and ubtrate) Normally thi i contant becaue of common ubtrate But, when tranitor are in erie, Vb (V Vubtrate) may be chaned Vt > Vt Vt Vt Vb = 0 Vb = 0 6

7 nd Order Effect Inverter Switchin Point Inverter witchin point i determined by ratio of βn/βp If βn/βp =, then witchin point i Vdd/ If W/L of both N and P tranitor are equal Then βn/βp = μ n / μ p = electron mobility / hole mobility Thi ratio i uually between and 3 Mean ratio of W ptree /W ntree need to be between and 3 for βn/βp = For thi cla, we ll ue W ptree /W ntree = nd Order Effect Inverter Switchin Point nd Order Effect Inverter Operatin eion Linear Linear 7

8 ate Size Aume minimum inverter i Wp/Wn = / (L = Lmin, Wn = Wmin, Wp = Wn) Thi become a x inverter To drive larer capacitive load, you need more ain, more Id Increae width to et x inverter Wp/Wn i till /, but Wp and Wn are double the ize For mot ate, diminihin return after about 4x ize Inverter Noie Marin To maximize noie marin, elect loic level at: unity ain point of D tranfer characteritic V OH V OL V out 0 V tn V IL Unity ain Point Slope = - V V IH DD - V tp V in β p /β n > V in V out Inverter β atio Performance Etimation Firt we need to have a model for reitance and capacitance Delay are caued (to firt order) by delay charin and dicharin capaciter All thee layer on the chip have and aociated with them Motly thi i handled in the Spectre imulator But it ood to have an idea what oin on Inverter Noie Marin How much noie can a ate ee before it doen t work riht? Loical Hih Output ane Loical Low Output ane Output haracteritic Input haracteritic V OH NM H V IH Indeterminate V eion IL NM L V OL ND Loical Hih Input ane Loical Low Input ane eitance = (ρ/t)(l/w) = (L/W) ρ = reitivity of the material t = thickne = heet reitance in Ω/quare Typical value of Min Typ Max M M, M Poly Silicide 3 6 Diffuion Nwell k k 5k 8

9 apacitance Three main form: ate capacitance (ate of tranitor) Diffuion capacitance (drain reion) outin capacitance (metal, etc.) d D S b db b ubtrate = b + + d Approximated by = oxa ox = thin oxide cap A = area of ate Wire Delay Example = 0Ω/q = 4 x 0-4 pf/um L = mm K = 0.7 T = kl / T = (0.7) (0) (4 x 0-5 )(000) / delay =. n outin apacitance Firt order effect i layer->ubtrate Approximate uin parallel plate model = (ε/t)a ε = permittivity of inulator t = thickne of inulator A = area Frinin field increae effective area apacitance between layer become very complex! rotalk iue Wire/Buffer Delay Example Now plit into mm ement with a buffer T = x (0.7)(0)(4x0-5 )(000) )/+ Tbuf = 5.6n + Tbuf Aumin Tbuf i le than 5.6n (which it will be), the plit wire i a win Ditributed on Wire Wire look like ditributed delay Lon reitive wire can look like tranmiion line Inertin buffer can really help delay Tn = n(n+)/ T = kl / a the number of ement become lare K = contant (I.e. 0.7) = reitance per unit lenth = capacitance per unit lenth L = lenth of wire Another Example: lock 50pF clock load ditributed acro 0mm chip in um metal lock lenth = 0mm = 0.05Ω/q, = 50pF/0mm T = (0.7)(/)L = (6.5X0-7 )(0,000) = 7.5n 0mm 9

10 Different Ditribution Scheme Propaation Delay Put clock driver in the middle of the chip Widen clock line to 0um wire lock lenth = 0mm = 0.05Ω/q, = 50pF/0mm T = (0.7)(/)L = (0.3X0-7 )(0,000) = 0.n educe by a factor of 0, L by Increae 0mm a tiny bit um v 0um apacitance Dein uide Invertin Propaation Delay et a table of typical capacitance per unit quare for each layer apacitance to round apacitance to another layer Add them up See, for example, Table 4.8, 4.9 in your book Wire Lenth Dein uide Non-Invertin Delay How much wire can you ue in a conductin layer before the delay approache that of a unit inverter? Metal3 =,500u Metal =,000u Metal =,50u Silicide = 50u Poly = 50u Diffuion = 5u 0

11 Where to Meaure Delay? Proce orner When part are pecified, under what operatin condition? Temp: three rane ommercial: 0 to 70 Indutrial: -40 to 85 Military: -55 to 5 Vdd: Should vary ± 0% 4.5 to 5.5v for example Proce variation: Slow N Fat P Slow N Slow P Each tranitor type can be low or fat Fat N Fat P Fat N Slow P Example Non-Invertin ate What Ele Affect ate Delay? What Affect ate Delay? Inv_Tet Schematic Environment Increain Vdd decreae delay Decreain temperature decreae delay Fabrication effect, fat/low device Uually meaure delay for at leat three cae: Bet - hih Vdd, low temp, fat N, Fat P Wort - low Vdd, hih temp, low N, Slow P Typical - typ Vdd, room temp (5), typ N, typ P

12 loeup of Inv-Tet Note the ize I ued for thi example Delay Model Ue equivalent circuit for MOS tranitor Ideal witch + capacitance and ON reitance Unit nmos ha reitance, capacitance Unit pmos ha reitance, capacitance apacitance proportional to width eitance inverely proportional to width d d k /k k k k d k k k /k d k Analo Simulation Output Note different waveform for different ize of tranitor Value apacitance = = = d = ff/μm of ate width Value imilar acro many procee eitance 6 KΩ*μm in 0.6um proce Improve with horter channel lenth Unit tranitor May refer to minimum contacted device (4/ λ) Or maybe μm wide device Doen t matter a lon a you are conitent Effective eitance Shockley model have limited value Not accurate enouh for modern tranitor Too complicated for much hand analyi Simplification: treat tranitor a reitor eplace I d (V d, V ) with effective reitance I d = V d / averaed acro witchin of diital ate Too inaccurate to predict current at any iven time But ood enouh to predict delay A Inverter Delay Etimate Etimate the delay of a fanout-of- inverter Y

13 Inverter Delay Etimate What a Standard Load? Etimate the delay of a fanout-of- inverter A Y Y A Inverter Delay Etimate Etimate the delay of a fanout-of- inverter Y Y What About ate in Serie Baically we want every ate to have the delay of a tandard inverter Standard inverter tart with / P/N ratio ate in erie? Sum the conductance to et the erie conductance βn-eff = /( /β + /β + /β3) βn-eff = βn/3 Effect i like increain L by 3 ompenate by increain W by 3 A Inverter Delay Etimate Etimate the delay of a fanout-of- inverter Y d = 6 Y Power Diipation Three main contributor:. Static leakae current (P ). Dynamic hort-circuit current durin witchin (P c ) 3. Dynamic witchin current from charin and dicharin capacitor (P d ) Becomin a HUE problem a chip et bier, clock et fater, tranitor et leakier! Power typically et diipated a heat 3

14 Static Leakae Power Small tatic leakae current due to: evere bia diode leakae between diffuion and ubtrate (PN junction) Subthrehold conduction in the tranitor Leakae current can be decribed by the diode current equation I o = i (e qv/kt ) Etimate at 0.nA 0.5nA per device at room temperature Short-ircuit Diipation So, with hort-circuit current on every tranition of the output, interate under that current curve to et the total current It work out to be: Pc = B/(Vdd Vt) 3 (Trf / Tp) Aume that Tr = Tf, Vtn = -Vtp, and Bn = Bp Note that Pc depend on B, and on input waveform rie and fall time Static Leakae Power That the leakae current For tatic power diipation: P = SUM of (I X Vdd) for all n device For example, inverter at 5v leak about - nw in a.5u technoloy Not much but, it et MUH wore a feature ize hrink! Dynamic Diipation harin and dicharin all thoe capacitor! By far the laret component of power diipation Pd = L Vdd f Watch out for lare capacitive node that witch at hih frequency Like clock Short-ircuit Diipation When a tatic ate witche, both N and P device are on for a hort amount of time Thu, current flow durin that witchin time Total Power Thee are pretty rouh etimate It hard to be more precie without AD tool upport It all depend on frequency, averae witchin activity, number of device, etc. There are proram out there that can help But, even a rouh etimate can be a valuable dein uide P total = P + P c + P d 4

CS/EE N-type Transistor

CS/EE N-type Transistor CS/EE 6710 MOS Transistor Models Electrical Effects Propagation Delay N-type Transistor D + G Vds i electrons +Vgs S - 1 Another Cutaway View Thanks to National Central University for Some images Vgs Forms

More information

CS/ECE 5710/6710. N-type Transistor

CS/ECE 5710/6710. N-type Transistor CS/ECE 5710/6710 MOS Transistor Models Electrical Effects Propagation Delay N-type Transistor D + G Vds i electrons +Vgs S - 1 Another Cutaway View Thanks to National Central University for Some images

More information

N-type Transistor CS/ECE 5710/6710. Vgs Forms a Channel. Another Cutaway View. MOS Capacitor

N-type Transistor CS/ECE 5710/6710. Vgs Forms a Channel. Another Cutaway View. MOS Capacitor N-type Transistor C/ECE 5710/6710 MO Transistor Models Electrical Effects Propagation elay +Vgs Vds + - i electrons Another Cutaway View Vgs Forms a Channel Thanks to National Central University for ome

More information

Introduction to CMOS VLSI. Chapter 2: CMOS Transistor Theory. Harris, 2004 Updated by Li Chen, Outline

Introduction to CMOS VLSI. Chapter 2: CMOS Transistor Theory. Harris, 2004 Updated by Li Chen, Outline Introduction to MOS VLSI Design hapter : MOS Transistor Theory copyright@david Harris, 004 Updated by Li hen, 010 Outline Introduction MOS apacitor nmos IV haracteristics pmos IV haracteristics Gate and

More information

MOS: Metal-Oxide-Semiconductor

MOS: Metal-Oxide-Semiconductor hapter 5 MOS apacitor MOS: Metal-Oxide-Semiconductor metal ate ate SiO 2 N + SiO 2 N + Si body P-body MOS capacitor MOS tranitor Semiconductor Device for Interated ircuit (. Hu) Slide 5-1 hapter 5 MOS

More information

MOS Transistor Theory

MOS Transistor Theory MOS Transistor Theory So far, we have viewed a MOS transistor as an ideal switch (digital operation) Reality: less than ideal EE 261 Krish Chakrabarty 1 Introduction So far, we have treated transistors

More information

55:041 Electronic Circuits

55:041 Electronic Circuits 55:04 Electronic ircuit Frequency epone hapter 7 A. Kruger Frequency epone- ee page 4-5 of the Prologue in the text Important eview co Thi lead to the concept of phaor we encountered in ircuit In Linear

More information

EE105 - Spring 2007 Microelectronic Devices and Circuits. Structure and Symbol of MOSFET. MOS Capacitor. Metal-Oxide-Semiconductor (MOS) Capacitor

EE105 - Spring 2007 Microelectronic Devices and Circuits. Structure and Symbol of MOSFET. MOS Capacitor. Metal-Oxide-Semiconductor (MOS) Capacitor EE105 - Spring 007 Microelectronic Device and ircuit Metal-Oide-Semiconductor (MOS) apacitor Lecture 4 MOS apacitor The MOS tructure can be thought of a a parallel-plate capacitor, with the top plate being

More information

Thermionic Emission Theory

Thermionic Emission Theory hapter 4. PN and Metal-Semiconductor Junction Thermionic Emiion Theory Energy band diagram of a Schottky contact with a forward bia V applied between the metal and the emiconductor. Electron concentration

More information

Lecture 4: CMOS Transistor Theory

Lecture 4: CMOS Transistor Theory Introduction to CMOS VLSI Design Lecture 4: CMOS Transistor Theory David Harris, Harvey Mudd College Kartik Mohanram and Steven Levitan University of Pittsburgh Outline q Introduction q MOS Capacitor q

More information

MOSFET Models. The basic MOSFET model consist of: We will calculate dc current I D for different applied voltages.

MOSFET Models. The basic MOSFET model consist of: We will calculate dc current I D for different applied voltages. MOSFET Model The baic MOSFET model conit of: junction capacitance CBS and CB between ource (S) to body (B) and drain to B, repectively. overlap capacitance CGO and CGSO due to gate (G) to S and G to overlap,

More information

ECEN620: Network Theory Broadband Circuit Design Fall 2018

ECEN620: Network Theory Broadband Circuit Design Fall 2018 ECEN60: Network Theory Broadband Circuit Deign Fall 08 Lecture 6: Loop Filter Circuit Sam Palermo Analog & Mixed-Signal Center Texa A&M Univerity Announcement HW i due Oct Require tranitor-level deign

More information

UT Austin, ECE Department VLSI Design 4. CMOS Transistor Theory

UT Austin, ECE Department VLSI Design 4. CMOS Transistor Theory UT Autin, EE Department S Dein 4. MOS Tranitor Theory 4. MOS Tranitor Theory at moule: mplementin loic function with MOS tranitor Thi moule: Baic ehavior of MOS tranitor at the electrical level D. Z. Pan

More information

4. CMOS Transistor Theory CS755

4. CMOS Transistor Theory CS755 4. CMOS Tranitor Theory Lat moule: mplementin loic function with CMOS tranitor Thi moule: Baic behavior of CMOS tranitor at the electrical level Electrical Propertie Neceary to unertan the baic electrical

More information

MOS Transistor I-V Characteristics and Parasitics

MOS Transistor I-V Characteristics and Parasitics ECEN454 Digital Integrated Circuit Design MOS Transistor I-V Characteristics and Parasitics ECEN 454 Facts about Transistors So far, we have treated transistors as ideal switches An ON transistor passes

More information

Chapter 17 Amplifier Frequency Response

Chapter 17 Amplifier Frequency Response hapter 7 Amplifier Frequency epone Microelectronic ircuit Deign ichard. Jaeger Travi N. Blalock 8/0/0 hap 7- hapter Goal eview tranfer function analyi and dominant-pole approximation of amplifier tranfer

More information

The Physical Structure (NMOS)

The Physical Structure (NMOS) The Physical Structure (NMOS) Al SiO2 Field Oxide Gate oxide S n+ Polysilicon Gate Al SiO2 SiO2 D n+ L channel P Substrate Field Oxide contact Metal (S) n+ (G) L W n+ (D) Poly 1 Transistor Resistance Two

More information

MOS Transistor Theory

MOS Transistor Theory CHAPTER 3 MOS Transistor Theory Outline 2 1. Introduction 2. Ideal I-V Characteristics 3. Nonideal I-V Effects 4. C-V Characteristics 5. DC Transfer Characteristics 6. Switch-level RC Delay Models MOS

More information

Lecture 8. MOS (Metal Oxide Semiconductor) Structures

Lecture 8. MOS (Metal Oxide Semiconductor) Structures Lecture 8 MOS (Metal Oie Semiconuctor) Structure In thi lecture you will learn: The funamental et of equation governing the behavior of MOS capacitor Accumulation, Flatban, Depletion, an Inverion Regime

More information

Lecture 5: DC & Transient Response

Lecture 5: DC & Transient Response Lecture 5: DC & Transient Response Outline q Pass Transistors q DC Response q Logic Levels and Noise Margins q Transient Response q RC Delay Models q Delay Estimation 2 Activity 1) If the width of a transistor

More information

Question 1 Equivalent Circuits

Question 1 Equivalent Circuits MAE 40 inear ircuit Fall 2007 Final Intruction ) Thi exam i open book You may ue whatever written material you chooe, including your cla note and textbook You may ue a hand calculator with no communication

More information

EE5780 Advanced VLSI CAD

EE5780 Advanced VLSI CAD EE5780 Advanced VLSI CAD Lecture 4 DC and Transient Responses, Circuit Delays Zhuo Feng 4.1 Outline Pass Transistors DC Response Logic Levels and Noise Margins Transient Response RC Delay Models Delay

More information

Introduction to CMOS RF Integrated Circuits Design

Introduction to CMOS RF Integrated Circuits Design Introduction to CMO F Interated Circuit Dein III. Low Noie Aplifier Introduction to CMO F Interated Circuit Dein Fall 0, Prof. JianJun Zhou III- Outline Fiure of erit Baic tructure Input and output atchin

More information

DC and Transient. Courtesy of Dr. Daehyun Dr. Dr. Shmuel and Dr.

DC and Transient. Courtesy of Dr. Daehyun Dr. Dr. Shmuel and Dr. DC and Transient Courtesy of Dr. Daehyun Lim@WSU, Dr. Harris@HMC, Dr. Shmuel Wimer@BIU and Dr. Choi@PSU http://csce.uark.edu +1 (479) 575-604 yrpeng@uark.edu Pass Transistors We have assumed source is

More information

MOSFET DC Models. In this set of notes we will. summarize MOSFET V th model discussed earlier. obtain BSIM MOSFET V th model

MOSFET DC Models. In this set of notes we will. summarize MOSFET V th model discussed earlier. obtain BSIM MOSFET V th model n thi et of note we will MOSFET C Model ummarize MOSFET V th model dicued earlier obtain BSM MOSFET V th model decribe V th model parameter ued in BSM develop piece-wie compact MOSFET S model: baic equation

More information

Lecture 5: DC & Transient Response

Lecture 5: DC & Transient Response Lecture 5: DC & Transient Response Outline Pass Transistors DC Response Logic Levels and Noise Margins Transient Response RC Delay Models Delay Estimation 2 Pass Transistors We have assumed source is grounded

More information

MOS electrostatic: Quantitative analysis

MOS electrostatic: Quantitative analysis MOS electrotatic: Quantitative analyi In thi cla, we will Derive analytical expreion for the charge denity, electric field and the electrotatic potential. xpreion for the depletion layer width Decribe

More information

EE 508 Lecture 16. Filter Transformations. Lowpass to Bandpass Lowpass to Highpass Lowpass to Band-reject

EE 508 Lecture 16. Filter Transformations. Lowpass to Bandpass Lowpass to Highpass Lowpass to Band-reject EE 508 Lecture 6 Filter Tranformation Lowpa to Bandpa Lowpa to Highpa Lowpa to Band-reject Review from Lat Time Theorem: If the perimeter variation and contact reitance are neglected, the tandard deviation

More information

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Chapter 2 CMOS Transistor Theory Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Outline Introduction MOS Device Design Equation Pass Transistor Jin-Fu Li, EE,

More information

FUNDAMENTALS OF POWER SYSTEMS

FUNDAMENTALS OF POWER SYSTEMS 1 FUNDAMENTALS OF POWER SYSTEMS 1 Chapter FUNDAMENTALS OF POWER SYSTEMS INTRODUCTION The three baic element of electrical engineering are reitor, inductor and capacitor. The reitor conume ohmic or diipative

More information

Lecture 12 CMOS Delay & Transient Response

Lecture 12 CMOS Delay & Transient Response EE 471: Transport Phenomena in Solid State Devices Spring 2018 Lecture 12 CMOS Delay & Transient Response Bryan Ackland Department of Electrical and Computer Engineering Stevens Institute of Technology

More information

Lecture 3: CMOS Transistor Theory

Lecture 3: CMOS Transistor Theory Lecture 3: CMOS Transistor Theory Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V Characteristics Gate and Diffusion Capacitance 2 Introduction So far, we have treated transistors

More information

Metal-Semiconductor Interfaces. Metal-Semiconductor contact. Schottky Barrier/Diode. Ohmic Contacts MESFET. UMass Lowell Sanjeev Manohar

Metal-Semiconductor Interfaces. Metal-Semiconductor contact. Schottky Barrier/Diode. Ohmic Contacts MESFET. UMass Lowell Sanjeev Manohar Metal-Semiconductor Interface Metal-Semiconductor contact Schottky Barrier/iode Ohmic Contact MESFET UMa Lowell 10.5 - Sanjeev evice Building Block UMa Lowell 10.5 - Sanjeev UMa Lowell 10.5 - Sanjeev Energy

More information

Lecture 12 - Non-isolated DC-DC Buck Converter

Lecture 12 - Non-isolated DC-DC Buck Converter ecture 12 - Non-iolated DC-DC Buck Converter Step-Down or Buck converter deliver DC power from a higher voltage DC level ( d ) to a lower load voltage o. d o ene ref + o v c Controller Figure 12.1 The

More information

Lecture 5: CMOS Transistor Theory

Lecture 5: CMOS Transistor Theory Lecture 5: CMOS Transistor Theory Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline q q q q q q q Introduction MOS Capacitor nmos I-V Characteristics

More information

μ + = σ = D 4 σ = D 3 σ = σ = All units in parts (a) and (b) are in V. (1) x chart: Center = μ = 0.75 UCL =

μ + = σ = D 4 σ = D 3 σ = σ = All units in parts (a) and (b) are in V. (1) x chart: Center = μ = 0.75 UCL = Our online Tutor are available 4*7 to provide Help with Proce control ytem Homework/Aignment or a long term Graduate/Undergraduate Proce control ytem Project. Our Tutor being experienced and proficient

More information

VLSI GATE LEVEL DESIGN UNIT - III P.VIDYA SAGAR ( ASSOCIATE PROFESSOR) Department of Electronics and Communication Engineering, VBIT

VLSI GATE LEVEL DESIGN UNIT - III P.VIDYA SAGAR ( ASSOCIATE PROFESSOR) Department of Electronics and Communication Engineering, VBIT VLSI UNIT - III GATE LEVEL DESIGN P.VIDYA SAGAR ( ASSOCIATE PROFESSOR) contents GATE LEVEL DESIGN : Logic Gates and Other complex gates, Switch logic, Alternate gate circuits, Time Delays, Driving large

More information

EE 508 Lecture 16. Filter Transformations. Lowpass to Bandpass Lowpass to Highpass Lowpass to Band-reject

EE 508 Lecture 16. Filter Transformations. Lowpass to Bandpass Lowpass to Highpass Lowpass to Band-reject EE 508 Lecture 6 Filter Tranformation Lowpa to Bandpa Lowpa to Highpa Lowpa to Band-reject Review from Lat Time Theorem: If the perimeter variation and contact reitance are neglected, the tandard deviation

More information

MOSFET: Introduction

MOSFET: Introduction E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major

More information

Lecture 12: MOS Capacitors, transistors. Context

Lecture 12: MOS Capacitors, transistors. Context Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those

More information

f max = GHz I ave PartAData 2 :=

f max = GHz I ave PartAData 2 := NTU 6342 / EE 24 Homework #3 SOLUTIONS Problem #: Delay time: t p_fo4_2 :=.424n t p_fo4_ := 2.2n Simulation value: T min := 2 t p_fo4_2 T max := 2 t p_fo4_ T min =.848 n T max = 4.24 n f max := T min Part

More information

ENEE 359a Digital VLSI Design

ENEE 359a Digital VLSI Design SLIDE 1 ENEE 359a Digital VLSI Design & Logical Effort Prof. blj@ece.umd.edu Credit where credit is due: Slides contain original artwork ( Jacob 2004) as well as material taken liberally from Irwin & Vijay

More information

Several schematic symbols for a capacitor are shown below. The symbol resembles the two conducting surfaces separated with a dielectric.

Several schematic symbols for a capacitor are shown below. The symbol resembles the two conducting surfaces separated with a dielectric. Capacitor Capacitor are two terminal, paive energy torage device. They tore electrical potential energy in the form of an electric field or charge between two conducting urface eparated by an inulator

More information

VLSI Design The MOS Transistor

VLSI Design The MOS Transistor VLSI Design The MOS Transistor Frank Sill Torres Universidade Federal de Minas Gerais (UFMG), Brazil VLSI Design: CMOS Technology 1 Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V

More information

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components Objective: Power Components Outline: 1) Acknowledgements 2) Objective and Outline 1 Acknowledgement This lecture note has been obtained from similar courses all over the world. I wish to thank all the

More information

Fig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B)

Fig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B) 1 Introduction to Transistor-Level Logic Circuits 1 By Prawat Nagvajara At the transistor level of logic circuits, transistors operate as switches with the logic variables controlling the open or closed

More information

Section J8b: FET Low Frequency Response

Section J8b: FET Low Frequency Response ection J8b: FET ow Frequency epone In thi ection of our tudie, we re o to reiit the baic FET aplifier confiuration but with an additional twit The baic confiuration are the ae a we etiated ection J6 of

More information

Lecture 6: DC & Transient Response

Lecture 6: DC & Transient Response Lecture 6: DC & Transient Response Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline Pass Transistors DC Response Logic Levels and Noise Margins

More information

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS )

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS ) ECE 4420 Spring 2005 Page 1 FINAL EXAMINATION NAME SCORE /100 Problem 1O 2 3 4 5 6 7 Sum Points INSTRUCTIONS: This exam is closed book. You are permitted four sheets of notes (three of which are your sheets

More information

EE115C Digital Electronic Circuits Homework #4

EE115C Digital Electronic Circuits Homework #4 EE115 Digital Electronic ircuits Homework #4 Problem 1 Power Dissipation Solution Vdd =1.0V onsider the source follower circuit used to drive a load L =20fF shown above. M1 and M2 are both NMOS transistors

More information

MAE140 Linear Circuits Fall 2012 Final, December 13th

MAE140 Linear Circuits Fall 2012 Final, December 13th MAE40 Linear Circuit Fall 202 Final, December 3th Intruction. Thi exam i open book. You may ue whatever written material you chooe, including your cla note and textbook. You may ue a hand calculator with

More information

Adder Circuits Ivor Page 1

Adder Circuits Ivor Page 1 Adder Circuit Adder Circuit Ivor Page 4. The Ripple Carr Adder The ripple carr adder i probabl the implet parallel binar adder. It i made up of k full-adder tage, where each full-adder can be convenientl

More information

ECE 546 Lecture 10 MOS Transistors

ECE 546 Lecture 10 MOS Transistors ECE 546 Lecture 10 MOS Transistors Spring 2018 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu NMOS Transistor NMOS Transistor N-Channel MOSFET Built on p-type

More information

Social Studies 201 Notes for November 14, 2003

Social Studies 201 Notes for November 14, 2003 1 Social Studie 201 Note for November 14, 2003 Etimation of a mean, mall ample ize Section 8.4, p. 501. When a reearcher ha only a mall ample ize available, the central limit theorem doe not apply to the

More information

HY:433 Σχεδίαση Αναλογικών/Μεικτών και Υψισυχνών Κυκλωμάτων

HY:433 Σχεδίαση Αναλογικών/Μεικτών και Υψισυχνών Κυκλωμάτων HY:433 Σχεδίαση Αναλογικών/Μεικτών και Υψισυχνών Κυκλωμάτων «Low Noie Aplifier» Φώτης Πλέσσας fplea@e-ce.uth.r F eceiver Antenna BPF LNA BPF Mixer BPF3 IF Ap Deodulator F front end LO LNA De Conideration

More information

Source slideplayer.com/fundamentals of Analytical Chemistry, F.J. Holler, S.R.Crouch. Chapter 6: Random Errors in Chemical Analysis

Source slideplayer.com/fundamentals of Analytical Chemistry, F.J. Holler, S.R.Crouch. Chapter 6: Random Errors in Chemical Analysis Source lideplayer.com/fundamental of Analytical Chemitry, F.J. Holler, S.R.Crouch Chapter 6: Random Error in Chemical Analyi Random error are preent in every meaurement no matter how careful the experimenter.

More information

Lecture 11: MOS Transistor

Lecture 11: MOS Transistor Lecture 11: MOS Transistor Prof. Niknejad Lecture Outline Review: MOS Capacitors Regions MOS Capacitors (3.8 3.9) CV Curve Threshold Voltage MOS Transistors (4.1 4.3): Overview Cross-section and layout

More information

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals ESE570, Spring 017 Final Wednesday, May 3 4 Problems with point weightings shown.

More information

VLSI Design I; A. Milenkovic 1

VLSI Design I; A. Milenkovic 1 ourse dministration PE/EE 47, PE 57 VLI esign I L6: tatic MO Logic epartment of Electrical and omputer Engineering University of labama in Huntsville leksandar Milenkovic ( www. ece.uah.edu/~milenka )

More information

Proposal of the Thin Film Pirani Vacuum Sensor Still Sensitive Above 1 Atmosphere ABSTRACT INTRODUCTION

Proposal of the Thin Film Pirani Vacuum Sensor Still Sensitive Above 1 Atmosphere ABSTRACT INTRODUCTION P1.11 Propoal of the Thin Film Pirani Vacuum Senor Still Senitive Above 1 Atmophere Takahima Noriaki and Kimura Mituteru Faculty of Engineering, Tohoku Gakuin Univerity 13-1, Chuo-1, Tagajo, Miyagi, 985-8537,

More information

55:041 Electronic Circuits

55:041 Electronic Circuits 55:04 Electronic ircuit Frequency eone hater 7 A. Kruger Frequency eone- ee age 4-5 o the Prologue in the text Imortant eview v = M co ωt + θ m = M e e j ωt+θ m = e M e jθ me jωt Thi lead to the concet

More information

VLSI Design I; A. Milenkovic 1

VLSI Design I; A. Milenkovic 1 PE/EE 47, PE 57 VLI esign I L6: tatic MO Logic epartment of Electrical and omputer Engineering University of labama in Huntsville leksandar Milenkovic ( www. ece.uah.edu/~milenka ) www. ece.uah.edu/~milenka/cpe57-3f

More information

6.012 Electronic Devices and Circuits Spring 2005

6.012 Electronic Devices and Circuits Spring 2005 6.012 Electronic Devices and Circuits Spring 2005 May 16, 2005 Final Exam (200 points) -OPEN BOOK- Problem NAME RECITATION TIME 1 2 3 4 5 Total General guidelines (please read carefully before starting):

More information

EE105 - Fall 2006 Microelectronic Devices and Circuits

EE105 - Fall 2006 Microelectronic Devices and Circuits EE105 - Fall 2006 Microelectronic Devices and Circuits Prof. Jan M. Rabaey (jan@eecs) Lecture 7: MOS Transistor Some Administrative Issues Lab 2 this week Hw 2 due on We Hw 3 will be posted same day MIDTERM

More information

16-Bit D-Type Flip-Flop with 3-State Outputs. Product Features. Product Description. Logic Block Diagram

16-Bit D-Type Flip-Flop with 3-State Outputs. Product Features. Product Description. Logic Block Diagram 123468901234689012346890121234689012346890123468901212346890123468901234689012123468901234689012346890121234689012 with 3-State Product Feature The PI4CX Family i deigned for low voltage operation, = 8

More information

Spiral 2 7. Capacitance, Delay and Sizing. Mark Redekopp

Spiral 2 7. Capacitance, Delay and Sizing. Mark Redekopp 2-7.1 Spiral 2 7 Capacitance, Delay and Sizing Mark Redekopp 2-7.2 Learning Outcomes I understand the sources of capacitance in CMOS circuits I understand how delay scales with resistance, capacitance

More information

Power Consumption in CMOS CONCORDIA VLSI DESIGN LAB

Power Consumption in CMOS CONCORDIA VLSI DESIGN LAB Power Consumption in CMOS 1 Power Dissipation in CMOS Two Components contribute to the power dissipation:» Static Power Dissipation Leakage current Sub-threshold current» Dynamic Power Dissipation Short

More information

! PN Junction. ! MOS Transistor Topology. ! Threshold. ! Operating Regions. " Resistive. " Saturation. " Subthreshold (next class)

! PN Junction. ! MOS Transistor Topology. ! Threshold. ! Operating Regions.  Resistive.  Saturation.  Subthreshold (next class) ESE370: ircuitlevel Modeling, Design, and Optimization for Digital Systems Lec 7: September 20, 2017 MOS Transistor Operating Regions Part 1 Today! PN Junction! MOS Transistor Topology! Threshold! Operating

More information

EEE 421 VLSI Circuits

EEE 421 VLSI Circuits EEE 421 CMOS Properties Full rail-to-rail swing high noise margins» Logic levels not dependent upon the relative device sizes transistors can be minimum size ratioless Always a path to V dd or GND in steady

More information

EE 330 Lecture 16. MOSFET Modeling CMOS Process Flow

EE 330 Lecture 16. MOSFET Modeling CMOS Process Flow EE 330 Lecture 16 MOFET Modeling CMO Process Flow Review from Last Lecture Limitations of Existing Models V V OUT V OUT V?? V IN V OUT V IN V IN V witch-level Models V imple square-law Model Logic ate

More information

Chapter 2 Sampling and Quantization. In order to investigate sampling and quantization, the difference between analog

Chapter 2 Sampling and Quantization. In order to investigate sampling and quantization, the difference between analog Chapter Sampling and Quantization.1 Analog and Digital Signal In order to invetigate ampling and quantization, the difference between analog and digital ignal mut be undertood. Analog ignal conit of continuou

More information

ECE 325 Electric Energy System Components 6- Three-Phase Induction Motors. Instructor: Kai Sun Fall 2015

ECE 325 Electric Energy System Components 6- Three-Phase Induction Motors. Instructor: Kai Sun Fall 2015 ECE 35 Electric Energy Sytem Component 6- Three-Phae Induction Motor Intructor: Kai Sun Fall 015 1 Content (Material are from Chapter 13-15) Component and baic principle Selection and application Equivalent

More information

Semiconductor Physics and Devices

Semiconductor Physics and Devices EE321 Fall 2015 Semiconductor Phyic and Device November 30, 2015 Weiwen Zou ( 邹卫文 ) Ph.D., Aociate Prof. State Key Lab of advanced optical communication ytem and network, Dept. of Electronic Engineering,

More information

Tuning of High-Power Antenna Resonances by Appropriately Reactive Sources

Tuning of High-Power Antenna Resonances by Appropriately Reactive Sources Senor and Simulation Note Note 50 Augut 005 Tuning of High-Power Antenna Reonance by Appropriately Reactive Source Carl E. Baum Univerity of New Mexico Department of Electrical and Computer Engineering

More information

ECE 438: Digital Integrated Circuits Assignment #4 Solution The Inverter

ECE 438: Digital Integrated Circuits Assignment #4 Solution The Inverter ECE 438: Digital Integrated Circuits Assignment #4 The Inverter Text: Chapter 5, Digital Integrated Circuits 2 nd Ed, Rabaey 1) Consider the CMOS inverter circuit in Figure P1 with the following parameters.

More information

University of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA

University of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA University of Pennsylvania Department of Electrical Engineering ESE 570 Midterm Exam March 4, 03 FORMULAS AND DATA. PHYSICAL CONSTANTS: n i = intrinsic concentration undoped) silicon =.45 x 0 0 cm -3 @

More information

CARNEGIE MELLON UNIVERSITY DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING DIGITAL INTEGRATED CIRCUITS FALL 2002

CARNEGIE MELLON UNIVERSITY DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING DIGITAL INTEGRATED CIRCUITS FALL 2002 CARNEGIE MELLON UNIVERSITY DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING 18-322 DIGITAL INTEGRATED CIRCUITS FALL 2002 Final Examination, Monday Dec. 16, 2002 NAME: SECTION: Time: 180 minutes Closed

More information

VLSI Design I; A. Milenkovic 1

VLSI Design I; A. Milenkovic 1 Review Voltage wing of PT Driving an Inverter PE/EE 47, PE 57 VLI Design I L9: MO & Wire apacitances Department of Electrical and omputer Engineering University of labama in Huntsville leksandar Milenkovic

More information

MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET. MOS Symbols and Characteristics. nmos Enhancement Transistor

MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET. MOS Symbols and Characteristics. nmos Enhancement Transistor MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET Calculation of t and Important 2 nd Order Effects SmallSignal Signal MOSFET Model Summary Material from: CMOS LSI Design By Weste

More information

Digital Integrated Circuits 2nd Inverter

Digital Integrated Circuits 2nd Inverter Digital Integrated Circuits The Inverter The CMOS Inverter V DD Analysis Inverter complex gate Cost V in V out complexity & Area Integrity and robustness C L Static behavior Performance Dynamic response

More information

VLSI Design I; A. Milenkovic 1

VLSI Design I; A. Milenkovic 1 ourse dministration PE/EE 47, PE 57 VLI esign I L6: omplementary MO Logic Gates epartment of Electrical and omputer Engineering University of labama in Huntsville leksandar Milenkovic ( www.ece.uah.edu/~milenka

More information

NOTE: The items d) and e) of Question 4 gave you bonus marks.

NOTE: The items d) and e) of Question 4 gave you bonus marks. MAE 40 Linear ircuit Summer 2007 Final Solution NOTE: The item d) and e) of Quetion 4 gave you bonu mark. Quetion [Equivalent irciut] [4 mark] Find the equivalent impedance between terminal A and B in

More information

Lecture 6: Resonance II. Announcements

Lecture 6: Resonance II. Announcements EES 5 Spring 4, Lecture 6 Lecture 6: Reonance II EES 5 Spring 4, Lecture 6 Announcement The lab tart thi week You mut how up for lab to tay enrolled in the coure. The firt lab i available on the web ite,

More information

Digital Microelectronic Circuits ( )

Digital Microelectronic Circuits ( ) Digital Microelectronic ircuits (361-1-3021 ) Presented by: Dr. Alex Fish Lecture 5: Parasitic apacitance and Driving a Load 1 Motivation Thus far, we have learned how to model our essential building block,

More information

The Devices. Jan M. Rabaey

The Devices. Jan M. Rabaey The Devices Jan M. Rabaey Goal of this chapter Present intuitive understanding of device operation Introduction of basic device equations Introduction of models for manual analysis Introduction of models

More information

Liquid cooling

Liquid cooling SKiiPPACK no. 3 4 [ 1- exp (-t/ τ )] + [( P + P )/P ] R [ 1- exp (-t/ τ )] Z tha tot3 = R ν ν tot1 tot tot3 thaa-3 aa 3 ν= 1 3.3.6. Liquid cooling The following table contain the characteritic R ν and

More information

ECE 497 JS Lecture - 12 Device Technologies

ECE 497 JS Lecture - 12 Device Technologies ECE 497 JS Lecture - 12 Device Technologies Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 NMOS Transistor 2 ρ Source channel charge density

More information

CHAPTER 13 FILTERS AND TUNED AMPLIFIERS

CHAPTER 13 FILTERS AND TUNED AMPLIFIERS HAPTE FILTES AND TUNED AMPLIFIES hapter Outline. Filter Traniion, Type and Specification. The Filter Tranfer Function. Butterworth and hebyhev Filter. Firt Order and Second Order Filter Function.5 The

More information

Course Administration. CPE/EE 427, CPE 527 VLSI Design I L04: MOS Transistors. Review: CMOS Process at a Glance

Course Administration. CPE/EE 427, CPE 527 VLSI Design I L04: MOS Transistors. Review: CMOS Process at a Glance Course Administration CPE/EE 7, CPE 7 VLI esign I L: MO Transistors epartment of Electrical and Computer Engineering University of Alabama in Huntsville Aleksandar Milenkovic ( www.ece.uah.edu/~milenka

More information

Chapter 4 Field-Effect Transistors

Chapter 4 Field-Effect Transistors Chapter 4 Field-Effect Transistors Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 5/5/11 Chap 4-1 Chapter Goals Describe operation of MOSFETs. Define FET characteristics in operation

More information

PI74VCX Bit Transparent D-Type Latch with 3-State Outputs. Features. Description. Block Diagram

PI74VCX Bit Transparent D-Type Latch with 3-State Outputs. Features. Description. Block Diagram Feature The PI4CX Family i deigned for low voltage operation, = 8 to 3.6 3.6 I/O Tolerant and Support Live Inertion Balanced Drive, ±24mA Ue patented Noie Reduction Circuitry Typical OLP ( Ground Bounce)

More information

Basic parts of an AC motor : rotor, stator, The stator and the rotor are electrical

Basic parts of an AC motor : rotor, stator, The stator and the rotor are electrical INDUCTION MOTO 1 CONSTUCTION Baic part of an AC motor : rotor, tator, encloure The tator and the rotor are electrical circuit that perform a electromagnet. CONSTUCTION (tator) The tator - tationary part

More information

Device Models (PN Diode, MOSFET )

Device Models (PN Diode, MOSFET ) Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed

More information

L ECE 4211 UConn F. Jain Scaling Laws for NanoFETs Chapter 10 Logic Gate Scaling

L ECE 4211 UConn F. Jain Scaling Laws for NanoFETs Chapter 10 Logic Gate Scaling L13 04202017 ECE 4211 UConn F. Jain Scaling Laws for NanoFETs Chapter 10 Logic Gate Scaling Scaling laws: Generalized scaling (GS) p. 610 Design steps p.613 Nanotransistor issues (page 626) Degradation

More information

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

Social Studies 201 Notes for March 18, 2005

Social Studies 201 Notes for March 18, 2005 1 Social Studie 201 Note for March 18, 2005 Etimation of a mean, mall ample ize Section 8.4, p. 501. When a reearcher ha only a mall ample ize available, the central limit theorem doe not apply to the

More information

Parameter Analysis and Design of A 1.5GHz, 15mw Low Noise Amplifier

Parameter Analysis and Design of A 1.5GHz, 15mw Low Noise Amplifier 0 International Conference on Circuit, Sytem and Simulation IPCSIT vol.7 (0 (0 IACSIT Pre, Sinapore Parameter Analyi and Dein of A.5GHz, 5mw Low Noie Amplifier Dan Zhan, Wei Wu Collee of Science, Shanhai

More information

Name Section Lab on Motion: Measuring Time and Gravity with a Pendulum Introduction: Have you ever considered what the word time means?

Name Section Lab on Motion: Measuring Time and Gravity with a Pendulum Introduction: Have you ever considered what the word time means? Name Section Lab on Motion: Meaurin Time and Gravity with a Pendulum Introduction: Have you ever conidered what the word time mean? For example what i the meanin of when we ay it take two minute to boil

More information

FIELD-EFFECT TRANSISTORS

FIELD-EFFECT TRANSISTORS FIEL-EFFECT TRANSISTORS 1 Semiconductor review 2 The MOS capacitor 2 The enhancement-type N-MOS transistor 3 I-V characteristics of enhancement MOSFETS 4 The output characteristic of the MOSFET in saturation

More information

Chapter 5. The Inverter. V1. April 10, 03 V1.1 April 25, 03 V2.1 Nov Inverter

Chapter 5. The Inverter. V1. April 10, 03 V1.1 April 25, 03 V2.1 Nov Inverter Chapter 5 The Inverter V1. April 10, 03 V1.1 April 25, 03 V2.1 Nov.12 03 Objective of This Chapter Use Inverter to know basic CMOS Circuits Operations Watch for performance Index such as Speed (Delay calculation)

More information