Microsystems Technology Laboratories, MIT. Teledyne Scientific Company (TSC)
|
|
- Roberta Reed
- 5 years ago
- Views:
Transcription
1 Extraction of Virtual-Source Injection Velocity in sub-100 nm III-V HFETs 1,2) D.-H. Kim, 1) J. A. del Alamo, 1) D. A. Antoniadis and 2) B. Brar 1) Microsystems Technology Laboratories, MIT 2) Teledyne Scientific Company (TSC) Sponsors: Intel, FCRP-MSD, TSC Discussions with R. Chau & M. Radosavljevic IEDM December-9 th,
2 Contents 1. Introduction - Virtual Source Injection Velocity (v x0 ) 2. Methodology to extract v x0 3. Virtual Source FET Model 4. Conclusions 2
3 Virtual Source Injection Velocity V G V S V D I 1-r D r I D R S Q i_x0 R D v E C E C v x0 k B T l Virtual Source 0 x L x o I D = Q i_x0 v in fully Ballistic case = Q i_x0 v x0 with scattering v x0 : FOM to determine I D and gate delay ( ). Goal of this work: measure v x0 in III-V channel Ref: Prof. Lundstrom, Purdue Univ. 3
4 v x0 - How to extract? Approaches: - 1) Inversion charge is linear with V GS for V GS > V T. g GS GS T I D = Q i_x0 v x0 = C gi ( V GSi V T ) v x0 I D v x0 = Cgi ( V GSi V T ) Limitation: Linearity assumption underestimates Q i_x0. - 2) Transconductace method. (I D ) g mi (V GSi ) = g mi = C gi v x0 v x0 = Cgi Limitation: Assumes v x0 constant with V GS. x0 GS Ref: 1) D. A. Antoniadis (IBM Journal-06), 2) G. Dewey (EDL-08) 4
5 Contents 1. Introduction - Virtual Source Injection Velocity (v x0 ) 2. Methodology to extract v x0 3. Virtual Source FET Model 4. Conclusions 5
6 v x0 Proposed Methodology V V G V I D = Q i_x0 v x0 v x0 = I D / Q i _ x0 I D -I D : Measured Drain Current E C R S Q i_x0 v x0 R D -Q i_x0 : Sheet Charge Density Q i_x0 = C gi d(v GS,i ) where C = 10 mv -R s and R d correction i = I D (R S +R D ) L 0 x x o V GSi = V GS I D R S - V T roll-off off correction in Q i_x0 - DIBL correction in Q i_x0 6
7 Device Technology: III-V HEMT Gate PR Gate Metal Ti/Pt/Au S Oxide t ins t ch D Cap Etch stopper Barrier Channel Buffer Barrier = In 0.52 Al 0.48 As ( 4 or 10 nm ) 4nmIn Al As Channel = In 0.53 Ga 0.47 As ( 2 nm ) 2 nm In 0.53 Ga 0.47 As Channel = In 0.7 Ga 0.3 As ( 8 nm ) Core or InAs ( 5 nm ) 5 nm InAs, 8 nm In 0.7 Ga 0.3 As Channel = In 0.53 Ga 0.47 As ( 3 nm ) 3nmIn 0.53 Ga 0.47 As Buffer = In 0.52 Al 0.48 As (~400 nm) t ch = 10 nm ch In 0.52 Al 0.48 As Substrate = InP (~300 nm) -L g : 200 nm ~ 30 nm, t ins = ~ 4 nm - Channel: In 0.53 Ga 0.47 As, In 0.7 Ga 0.3 As, InAs Refs: Kim et al., iedm-08, iprm-09 7
8 C gi - How to extract in small L g device? C gi intrinsic gate capacitance per unit area [ff/ m 2 ] (from S-parameters at linear region, = 10 mv) C g C gi C C g = C gi x L g + 2C gext_inner + 2C gext_outer f(v GSi - V T T) C g C g (OFF) = C gi x L g + 2C gext_inner
9 Q i_x0 - How to extract? Q i_x0 = C gi d(v GS,i ), where C = 10 mv 12 L g = 30 nm x C gi 3 C F/ m 2 gi [ff ] 4 Q i_xo 2 1 Qi Xo = 10 mv V GSi [V] 0 9
10 v x0 = I D / Q i_x0 L g = 30 nm In 0.7 Ga 0.3 As HEMTs with t ins = 4 nm =005V 0.05 = 0.2 V = 0.35 V = 0.5 V 4 x = 0.05 V = 0.2 V = 0.35 V = 0.5 V [ma/ m] 0.4 Q i_x0 2 I D DIBL correction V GSi [V] V GSi [V] v x0 can be extracted t at any bias condition. As V GSi, less DIBL correction due to i. 10
11 Bias Dependent v x0-30 nm InGaAs HFET 4 v [10 7 x0 cm/s] = 0.05 V = 0.2 V =05V 0.5 = 0.35 V V GSi [V] v x0 V GSi v x0 Extracted v x0 is NOT constant with V GSi. x0 (I D ) (Q i_x0 ) GSi (v x0 ) (V GSi ) = v x0 + Q i_x0 (V GSi ) (V GSi ) 11
12 v x0 for different L g 4 x 107 L g 3 v x0 [cm m/s] 2 L g = 30 nm L g = 40 nm 1 L g = 60 nm L g = 80 nm = 0.5 V L g = 130 nm As L g, g, V GS gs - V V T T [V] v x0 improves and then saturates at L g ~ 40 nm. 12
13 v x0 vs. L g for different channels 4 (InAs) n ~ 13,000 cm 2 /V-s 3 cm/s] v x0 [10 7 n ~ 11,000 cm 2 /V-s 2 (In Ga As) n ~ 9,500 cm 2 /V-s (In 0.53 Ga 0.47 As) 1 *Strain-Si *Si nfets = 0.5 V (V 0 DS = 1.1 ~ 1.3 V) L g [nm] - III-Vs shows 2X higher v x0 than Si, even at = 0.5 V. - As InAs composition, v x0 due to m e*. Ref: * Khakifirooz et al., TED, 1674 (08) 13
14 v x0 vs. DIBL 4 3 InAs InAs HFETs HFETs [5] In 0.7 Ga 0.3 As HFETs [6] In 0.53 Ga 0.47 As HFETs m/s] x0 [107 cm v x and 45-nm node devices with V dd = 1.1 to 1.3 V [9] [1] 1 7X Strained nfets with V V[4] 0 dd = 0.5 [2] DIBL [mv/v] 7X higher v DIBL = 100 mv/v, V dd = 0.5 V Ref: 1) Khakifirooz et al., TED, 1674 (08), 2) G. Dewey (EDL-08) 14
15 Contents 1. Introduction - Virtual Source Injection Velocity (v x0 ) 2. Methodology to extract v x0 3. Virtual Source FET Model 4. Conclusions 15
16 The Virtual Source FET Model A Simple, Physical Universal-Short Channel FET Semi-empirical Model (based on Si MOSFET model [1]) I D = Q i_x0 v x0-m F sat VS I D = Q i_x0 v x0 F sat : Semiempirical saturation function V G V D Known Device Parameters C inv ox : Q ix0 = C inv ox f(s, V GSi,i, V t* ) : V * t = V t0 - i DIBL, From I D (i )vs vs. V GSi S : Subthreshold swing: From log(i D ) vs. V GSi : Threshold Voltage at V D ~0 (from I off and DIBL) V t0 R S,D : V GSi =V GS -I D R S ; i = -2I D (R S +R D ) E C R s v x0 Q i_x0 0x L eff x o Fitted Physical Parameters V x0-m : Maximum carrier velocity at virtual source (x=x 0 ) eff : Effective mobility, assumed constant [1] Khakifirooz et al., TED, 1674 (08)
17 Comparison - 30 nm In 0.7 Ga 0.3 As HFET Fitting parameters: eff, v x0m Measured V GS =05V 0.5 Modeled V ds =0.5 V V ds =0.5 V 0.35 V 0.2 V 0.05 V 0.05 V Excellent agreement: - from linear to saturation, and weak to strong inversion. - eff = 1500 cm 2 /Vs, v x0m = cm/s 17
18 Comparison: v x0 = v x0m F sat L g = 30 nm In 0.7 Ga 0.3 As Extracted Modeled =0.5 V 0.35 V 0.20 V 0.05 V Excellent agreement with extracted values of v x0. 18
19 v x0 NEGF simulation 30 nm In 0.7 Ga 0.3 As HEMTs v x0 = 3.1 x 10 7 cm/s: close to experimental value. Acknowledgement : Y. Yang and M. S. Lundstrom, Purdue Univ. 19
20 Conclusions Methodology to extract injection velocity (v x0 ) at virtual source. Sub-100 nm InGaAs HEMTs - v x0 > cm/s at = V for In Ga As - Peak v xo = cm/s for InAs sub-channel -7 higher than Si at DIBL = 100 mv/v and = 0.5 V Virtual Source FET model - Excellent description of I-V characteristics of III-V HEMTs with physically meaningful values of v x0. 20
III-V CMOS: What have we learned from HEMTs? J. A. del Alamo, D.-H. Kim 1, T.-W. Kim, D. Jin, and D. A. Antoniadis
III-V CMOS: What have we learned from HEMTs? J. A. del Alamo, D.-H. Kim 1, T.-W. Kim, D. Jin, and D. A. Antoniadis Microsystems Technology Laboratories, MIT 1 presently with Teledyne Scientific 23rd International
More information30 nm In 0.7 Ga 0.3 As Inverted-type HEMT with Reduced Gate Leakage Current for Logic Applications
30 nm In 0.7 Ga 0.3 As Inverted-type HEMT with Reduced Gate Leakage Current for Logic Applications T.-W. Kim, D.-H. Kim* and J. A. del Alamo Microsystems Technology Laboratories MIT Presently with Teledyne
More informationThe Prospects for III-Vs
10 nm CMOS: The Prospects for III-Vs J. A. del Alamo, Dae-Hyun Kim 1, Donghyun Jin, and Taewoo Kim Microsystems Technology Laboratories, MIT 1 Presently with Teledyne Scientific 2010 European Materials
More informationUltra-Scaled InAs HEMTs
Performance Analysis of Ultra-Scaled InAs HEMTs Neerav Kharche 1, Gerhard Klimeck 1, Dae-Hyun Kim 2,3, Jesús. A. del Alamo 2, and Mathieu Luisier 1 1 Network for Computational ti Nanotechnology and Birck
More informationProspects for Ge MOSFETs
Prospects for Ge MOSFETs Sematech Workshop December 4, 2005 Dimitri A. Antoniadis Microsystems Technology Laboratories MIT Sematech Workshop 2005 1 Channel Transport - I D I D =WQ i (x 0 )v xo v xo : carrier
More informationPerformance Analysis of Ultra-Scaled InAs HEMTs
Purdue University Purdue e-pubs Birck and NCN Publications Birck Nanotechnology Center 2009 Performance Analysis of Ultra-Scaled InAs HEMTs Neerav Kharche Birck Nanotechnology Center and Purdue University,
More informationQuantum-size effects in sub-10 nm fin width InGaAs finfets
Quantum-size effects in sub-10 nm fin width InGaAs finfets Alon Vardi, Xin Zhao, and Jesús A. del Alamo Microsystems Technology Laboratories, MIT December 9, 2015 Sponsors: DTRA NSF (E3S STC) Northrop
More informationECE-305: Spring 2016 MOSFET IV
ECE-305: Spring 2016 MOSFET IV Professor Mark Lundstrom Electrical and Computer Engineering Purdue University, West Lafayette, IN USA lundstro@purdue.edu Lundstrom s lecture notes: Lecture 4 4/7/16 outline
More informationSimple Theory of the Ballistic Nanotransistor
Simple Theory of the Ballistic Nanotransistor Mark Lundstrom Purdue University Network for Computational Nanoechnology outline I) Traditional MOS theory II) A bottom-up approach III) The ballistic nanotransistor
More informationEECS130 Integrated Circuit Devices
EECS130 Integrated Circuit Devices Professor Ali Javey 10/30/2007 MOSFETs Lecture 4 Reading: Chapter 17, 19 Announcements The next HW set is due on Thursday. Midterm 2 is next week!!!! Threshold and Subthreshold
More informationComponents Research, TMG Intel Corporation *QinetiQ. Contact:
1 High-Performance 4nm Gate Length InSb P-Channel Compressively Strained Quantum Well Field Effect Transistors for Low-Power (V CC =.5V) Logic Applications M. Radosavljevic,, T. Ashley*, A. Andreev*, S.
More informationTowards a Scalable EKV Compact Model Including Ballistic and Quasi-Ballistic Transport
2011 Workshop on Compact Modeling Towards a Scalable EKV Compact Model Including Ballistic and Quasi-Ballistic Transport Christian Enz 1,2, A. Mangla 2 and J.-M. Sallese 2 1) Swiss Center for Electronics
More informationPerformance Enhancement of P-channel InGaAs Quantum-well FETs by Superposition of Process-induced Uniaxial Strain and Epitaxially-grown Biaxial Strain
Performance Enhancement of P-channel InGaAs Quantum-well FETs by Superposition of Process-induced Uniaxial Strain and Epitaxially-grown Biaxial Strain Ling Xia 1, Vadim Tokranov 2, Serge R. Oktyabrsky
More informationECE 305 Exam 5 SOLUTIONS: Spring 2015 April 17, 2015 Mark Lundstrom Purdue University
NAME: PUID: : ECE 305 Exam 5 SOLUTIONS: April 17, 2015 Mark Lundstrom Purdue University This is a closed book exam. You may use a calculator and the formula sheet at the end of this exam. Following the
More informationECE-305: Fall 2017 MOS Capacitors and Transistors
ECE-305: Fall 2017 MOS Capacitors and Transistors Pierret, Semiconductor Device Fundamentals (SDF) Chapters 15+16 (pp. 525-530, 563-599) Professor Peter Bermel Electrical and Computer Engineering Purdue
More informationECE 305: Fall MOSFET Energy Bands
ECE 305: Fall 2016 MOSFET Energy Bands Professor Peter Bermel Electrical and Computer Engineering Purdue University, West Lafayette, IN USA pbermel@purdue.edu Pierret, Semiconductor Device Fundamentals
More informationNanoscale CMOS Design Issues
Nanoscale CMOS Design Issues Jaydeep P. Kulkarni Assistant Professor, ECE Department The University of Texas at Austin jaydeep@austin.utexas.edu Fall, 2017, VLSI-1 Class Transistor I-V Review Agenda Non-ideal
More informationSelf-Aligned InGaAs FinFETs with 5-nm Fin-Width and 5-nm Gate-Contact Separation
Self-Aligned InGaAs FinFETs with 5-nm Fin-Width and 5-nm Gate-Contact Separation Alon Vardi, Lisa Kong, Wenjie Lu, Xiaowei Cai, Xin Zhao, Jesús Grajal* and Jesús A. del Alamo Microsystems Technology Laboratories,
More informationChapter 5 MOSFET Theory for Submicron Technology
Chapter 5 MOSFET Theory for Submicron Technology Short channel effects Other small geometry effects Parasitic components Velocity saturation/overshoot Hot carrier effects ** Majority of these notes are
More informationHigh Mobility Materials and Novel Device Structures for High Performance Nanoscale MOSFETs
High Mobility Materials and Novel Device Structures for High Performance Nanoscale MOSFETs Prof. (Dr.) Tejas Krishnamohan Department of Electrical Engineering Stanford University, CA & Intel Corporation
More informationPerformance Analysis of 60-nm Gate-Length III-V InGaAs HEMTs: Simulations Versus Experiments
Purdue University Purdue e-pubs Birck and NCN Publications Birck Nanotechnology Center 7-2009 Performance Analysis of 60-nm Gate-Length III-V InGaAs HEMTs: Simulations Versus Experiments Neophytou Neophytos
More informationCMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor
CMPEN 411 VLSI Digital Circuits Lecture 03: MOS Transistor Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN 411 L03 S.1
More informationLecture 8: Ballistic FET I-V
Lecture 8: Ballistic FET I-V 1 Lecture 1: Ballistic FETs Jena: 61-70 Diffusive Field Effect Transistor Source Gate L g >> l Drain Source V GS Gate Drain I D Mean free path much shorter than channel length
More informationElectric-Field Induced F - Migration in Self-Aligned InGaAs MOSFETs and Mitigation
Electric-Field Induced F - Migration in Self-Aligned InGaAs MOSFETs and Mitigation X. Cai, J. Lin, D. A. Antoniadis and J. A. del Alamo Microsystems Technology Laboratories, MIT December 5, 2016 Sponsors:
More informationNegative-Bias Temperature Instability (NBTI) of GaN MOSFETs
Negative-Bias Temperature Instability (NBTI) of GaN MOSFETs Alex Guo and Jesús A. del Alamo Microsystems Technology Laboratories (MTL) Massachusetts Institute of Technology (MIT) Cambridge, MA, USA Sponsor:
More informationA Simple Semiempirical Short-Channel MOSFET Current- Voltage Model Continuous Across All Regions of Operation and Employing Only Physical Parameters
A Simple Semiempirical Short-Channel MOSFET Current- Voltage Model Continuous Across All Regions of Operation and Employing Only Physical Parameters The MIT Faculty has made this article openly available.
More informationEE410 vs. Advanced CMOS Structures
EE410 vs. Advanced CMOS Structures Prof. Krishna S Department of Electrical Engineering S 1 EE410 CMOS Structure P + poly-si N + poly-si Al/Si alloy LPCVD PSG P + P + N + N + PMOS N-substrate NMOS P-well
More informationMOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA
MOS Transistors Prof. Krishna Saraswat Department of Electrical Engineering S Stanford, CA 94305 saraswat@stanford.edu 1 1930: Patent on the Field-Effect Transistor! Julius Lilienfeld filed a patent describing
More informationEnhanced Mobility CMOS
Enhanced Mobility CMOS Judy L. Hoyt I. Åberg, C. Ni Chléirigh, O. Olubuyide, J. Jung, S. Yu, E.A. Fitzgerald, and D.A. Antoniadis Microsystems Technology Laboratory MIT, Cambridge, MA 02139 Acknowledge
More informationComparison of Ultra-Thin InAs and InGaAs Quantum Wells and Ultra-Thin-Body Surface-Channel MOSFETs
Comparison of Ultra-Thin InAs and InGaAs Quantum Wells and Ultra-Thin-Body Surface-Channel MOSFETs Cheng-Ying Huang 1, Sanghoon Lee 1, Evan Wilson 3, Pengyu Long 3, Michael Povolotskyi 3, Varistha Chobpattana
More informationTechnology Development for InGaAs/InP-channel MOSFETs
MRS Spring Symposium, Tutorial: Advanced CMOS Substrates, Devices, Reliability, and Characterization, April 13, 2009, San Francisco Technology Development for InGaAs/InP-channel MOSFETs Mark Rodwell University
More informationElectrical Degradation of InAlAs/InGaAs Metamorphic High-Electron Mobility Transistors
Electrical Degradation of InAlAs/InGaAs Metamorphic High-Electron Mobility Transistors S. D. Mertens and J.A. del Alamo Massachusetts Institute of Technology Sponsor: Agilent Technologies Outline Introduction
More informationTHE CARRIER velocity in a MOSFET channel near the
994 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 59, NO. 4, APRIL 2012 On the Interpretation of Ballistic Injection Velocity in Deeply Scaled MOSFETs Yang Liu, Mathieu Luisier, Amlan Majumdar, Dimitri A.
More informationThe Critical Role of Quantum Capacitance in Compact Modeling of Nano-Scaled and Nanoelectronic Devices
The Critical Role of Quantum Capacitance in Compact Modeling of Nano-Scaled and Nanoelectronic Devices Zhiping Yu and Jinyu Zhang Institute of Microelectronics Tsinghua University, Beijing, China yuzhip@tsinghua.edu.cn
More informationA Multi-Gate CMOS Compact Model BSIMMG
A Multi-Gate CMOS Compact Model BSIMMG Darsen Lu, Sriramkumar Venugopalan, Tanvir Morshed, Yogesh Singh Chauhan, Chung-Hsun Lin, Mohan Dunga, Ali Niknejad and Chenming Hu University of California, Berkeley
More informationMOSFET. Id-Vd curve. I DS Transfer curve V G. Lec. 8. Vd=1V. Saturation region. V Th
MOSFET Id-Vd curve Saturation region I DS Transfer curve Vd=1V V Th V G 1 0 < V GS < V T V GS > V T V Gs >V T & Small V D > 0 I DS WQ inv WC v WC i V V VDS V V G i T G n T L n I D g V D (g conductance
More informationECE 342 Electronic Circuits. Lecture 6 MOS Transistors
ECE 342 Electronic Circuits Lecture 6 MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2
More informationLecture 11: MOSFET Modeling
Digital Integrated Circuits (83-313) Lecture 11: MOSFET ing Semester B, 2016-17 Lecturer: Dr. Adam Teman TAs: Itamar Levi, Robert Giterman 18 June 2017 Disclaimer: This course was prepared, in its entirety,
More informationMOS Transistor Theory
CHAPTER 3 MOS Transistor Theory Outline 2 1. Introduction 2. Ideal I-V Characteristics 3. Nonideal I-V Effects 4. C-V Characteristics 5. DC Transfer Characteristics 6. Switch-level RC Delay Models MOS
More informationEE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region
EE105 Fall 014 Microelectronic Devices and Circuits Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel
More informationChapter 3 Device Physics and Performance Potential of III-V Field-Effect Transistors
Chapter 3 Device Physics and Performance Potential of III-V Field-Effect Transistors Yang Liu, Himadri S. Pal, Mark S. Lundstrom, Dae-Hyun Kim, Jesús A. del Alamo and Dimitri A. Antoniadis Abstract The
More informationInGaAs Double-Gate Fin-Sidewall MOSFET
InGaAs Double-Gate Fin-Sidewall MOSFET Alon Vardi, Xin Zhao and Jesús del Alamo Microsystems Technology Laboratories, MIT June 25, 214 Sponsors: Sematech, Technion-MIT Fellowship, and NSF E3S Center (#939514)
More informationThe Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction
More informationHigh aspect-ratio InGaAs FinFETs with sub-20 nm fin width
High aspect-rati InGaAs FinFETs with sub-2 nm fin width Aln Vardi, Jianqiang Lin, Wenjie Lu, Xin Zha and Jesús A. del Alam Micrsystems Technlgy Labratries, MIT June 15, 216 Spnsrs: DTRA (HDTRA 1-14-1-57),
More informationImpact of 110 uniaxial strain on n-channel In0.15Ga0.85As high electron mobility transistors
Impact of 110 uniaxial strain on n-channel In0.15Ga0.85As high electron mobility transistors The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story
More informationLecture 35: Introduction to Quantum Transport in Devices
ECE-656: Fall 2011 Lecture 35: Introduction to Quantum Transport in Devices Mark Lundstrom Purdue University West Lafayette, IN USA 1 11/21/11 objectives 1) Provide an introduction to the most commonly-used
More informationFinal Examination EE 130 December 16, 1997 Time allotted: 180 minutes
Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes Problem 1: Semiconductor Fundamentals [30 points] A uniformly doped silicon sample of length 100µm and cross-sectional area 100µm 2
More informationThe Devices. Jan M. Rabaey
The Devices Jan M. Rabaey Goal of this chapter Present intuitive understanding of device operation Introduction of basic device equations Introduction of models for manual analysis Introduction of models
More informationLecture #27. The Short Channel Effect (SCE)
Lecture #27 ANNOUNCEMENTS Design Project: Your BJT design should meet the performance specifications to within 10% at both 300K and 360K. ( β dc > 45, f T > 18 GHz, V A > 9 V and V punchthrough > 9 V )
More informationScaling Issues in Planar FET: Dual Gate FET and FinFETs
Scaling Issues in Planar FET: Dual Gate FET and FinFETs Lecture 12 Dr. Amr Bayoumi Fall 2014 Advanced Devices (EC760) Arab Academy for Science and Technology - Cairo 1 Outline Scaling Issues for Planar
More information1464 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 63, NO. 4, APRIL 2016
1464 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 63, NO. 4, APRIL 2016 Analysis of Resistance and Mobility in InGaAs Quantum-Well MOSFETs From Ballistic to Diffusive Regimes Jianqiang Lin, Member, IEEE,
More informationLecture 3: Transistor as an thermonic switch
Lecture 3: Transistor as an thermonic switch 2016-01-21 Lecture 3, High Speed Devices 2016 1 Lecture 3: Transistors as an thermionic switch Reading Guide: 54-57 in Jena Transistor metrics Reservoir equilibrium
More informationAnalysis of Band-to-band. Tunneling Structures. Title of Talk. Dimitri Antoniadis and Judy Hoyt (PIs) Jamie Teherani and Tao Yu (Students) 8/21/2012
1 Analysis of Band-to-band Title of Talk Tunneling Structures Dimitri Antoniadis and Judy Hoyt (PIs) Jamie Teherani and Tao Yu (Students) 8/21/2012 A Science & Technology Center Vertical Type-II TFET Structure
More informationMOSFET: Introduction
E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major
More informationN Channel MOSFET level 3
N Channel MOSFET level 3 mosn3 NSource NBulk NSource NBulk NSource NBulk NSource (a) (b) (c) (d) NBulk Figure 1: MOSFET Types Form: mosn3: instance name n 1 n n 3 n n 1 is the drain node, n is the gate
More informationP. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions
P. R. Nelson 1 ECE418 - VLSI Midterm Exam Solutions 1. (8 points) Draw the cross-section view for A-A. The cross-section view is as shown below.. ( points) Can you tell which of the metal1 regions is the
More informationSupporting information
Supporting information Design, Modeling and Fabrication of CVD Grown MoS 2 Circuits with E-Mode FETs for Large-Area Electronics Lili Yu 1*, Dina El-Damak 1*, Ujwal Radhakrishna 1, Xi Ling 1, Ahmad Zubair
More informationThe Devices: MOS Transistors
The Devices: MOS Transistors References: Semiconductor Device Fundamentals, R. F. Pierret, Addison-Wesley Digital Integrated Circuits: A Design Perspective, J. Rabaey et.al. Prentice Hall NMOS Transistor
More informationCarbon Nanotube Electronics
Carbon Nanotube Electronics Jeorg Appenzeller, Phaedon Avouris, Vincent Derycke, Stefan Heinz, Richard Martel, Marko Radosavljevic, Jerry Tersoff, Shalom Wind H.-S. Philip Wong hspwong@us.ibm.com IBM T.J.
More informationECE 342 Electronic Circuits. 3. MOS Transistors
ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to
More informationLecture 18 Field-Effect Transistors 3
Lecture 18 Field-Effect Transistors 3 Schroder: Chapters, 4, 6 1/38 Announcements Homework 4/6: Is online now. Due Today. I will return it next Wednesday (30 th May). Homework 5/6: It will be online later
More informationLecture 5: CMOS Transistor Theory
Lecture 5: CMOS Transistor Theory Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline q q q q q q q Introduction MOS Capacitor nmos I-V Characteristics
More informationOMEN an atomistic and full-band quantum transport simulator for post-cmos nanodevices
Purdue University Purdue e-pubs Other Nanotechnology Publications Birck Nanotechnology Center 8-18-28 OMEN an atomistic and full-band quantum transport simulator for post-cmos nanodevices Mathieu Luisier
More informationThe Future of CMOS. David Pulfrey. CHRONOLOGY of the FET. Lecture Lilienfeld s patent (BG FET) 1965 Commercialization (Fairchild)
The Future of CMOS David Pulfrey 1 CHRONOLOGY of the FET 1933 Lilienfeld s patent (BG FET) 1965 Commercialization (Fairchild) 1991 The most abundant object made by mankind (C.T. Sah) 2003 The 10 nm FET
More informationMOSFET Capacitance Model
MOSFET Capacitance Model So far we discussed the MOSFET DC models. In real circuit operation, the device operates under time varying terminal voltages and the device operation can be described by: 1 small
More informationnmosfet Schematic Four structural masks: Field, Gate, Contact, Metal. Reverse doping polarities for pmosfet in N-well.
nmosfet Schematic Four structural masks: Field, Gate, Contact, Metal. Reverse doping polarities for pmosfet in N-well. nmosfet Schematic 0 y L n + source n + drain depletion region polysilicon gate x z
More informationand V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS )
ECE 4420 Spring 2005 Page 1 FINAL EXAMINATION NAME SCORE /100 Problem 1O 2 3 4 5 6 7 Sum Points INSTRUCTIONS: This exam is closed book. You are permitted four sheets of notes (three of which are your sheets
More informationReliability and Instability of GaN MIS-HEMTs for Power Electronics
Reliability and Instability of GaN MIS-HEMTs for Power Electronics Jesús A. del Alamo, Alex Guo and Shireen Warnock Microsystems Technology Laboratories Massachusetts Institute of Technology 2016 Fall
More informationDecemb er 20, Final Exam
Fall 2002 6.720J/3.43J Integrated Microelectronic Devices Prof. J. A. del Alamo Decemb er 20, 2002 - Final Exam Name: General guidelines (please read carefully b efore starting): Make sure to write your
More informationTime Dependent Dielectric Breakdown in High Voltage GaN MIS HEMTs: The Role of Temperature
Time Dependent Dielectric Breakdown in High Voltage GaN MIS HEMTs: The Role of Temperature Shireen Warnock, Allison Lemus, and Jesús A. del Alamo Microsystems Technology Laboratories (MTL) Massachusetts
More informationLecture 9. Strained-Si Technology I: Device Physics
Strain Analysis in Daily Life Lecture 9 Strained-Si Technology I: Device Physics Background Planar MOSFETs FinFETs Reading: Y. Sun, S. Thompson, T. Nishida, Strain Effects in Semiconductors, Springer,
More informationObjective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components
Objective: Power Components Outline: 1) Acknowledgements 2) Objective and Outline 1 Acknowledgement This lecture note has been obtained from similar courses all over the world. I wish to thank all the
More informationVLSI Design The MOS Transistor
VLSI Design The MOS Transistor Frank Sill Torres Universidade Federal de Minas Gerais (UFMG), Brazil VLSI Design: CMOS Technology 1 Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V
More informationLECTURE 3 MOSFETS II. MOS SCALING What is Scaling?
LECTURE 3 MOSFETS II Lecture 3 Goals* * Understand constant field and constant voltage scaling and their effects. Understand small geometry effects for MOS transistors and their implications modeling and
More informationAnalysis of Transconductances in Deep Submicron CMOS with EKV 3.0
MOS Models & Parameter Extraction Workgroup Arbeitskreis MOS Modelle & Parameterextraktion XFAB, Erfurt, Germany, October 2, 2002 Analysis of Transconductances in Deep Submicron CMOS with EKV 3.0 Matthias
More informationII III IV V VI B C N. Al Si P S. Zn Ga Ge As Se Cd In Sn Sb Te. Silicon (Si) the dominating material in IC manufacturing
II III IV V VI B N Al Si P S Zn Ga Ge As Se d In Sn Sb Te Silicon (Si) the dominating material in I manufacturing ompound semiconductors III - V group: GaAs GaN GaSb GaP InAs InP InSb... The Energy Band
More informationLecture 28 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 18, 2007
6.720J/3.43J - Integrated Microelectronic Devices - Spring 2007 Lecture 28-1 Lecture 28 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 18, 2007 Contents: 1. Second-order and
More informationECE 497 JS Lecture - 12 Device Technologies
ECE 497 JS Lecture - 12 Device Technologies Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 NMOS Transistor 2 ρ Source channel charge density
More information6.012 MICROELECTRONIC DEVICES AND CIRCUITS
MASSACHUSETTS INSTITUTE OF TECHNOLOGY Department of Electrical Engineering and Computer Science 6.012 MICROELECTRONIC DEVICES AND CIRCUITS Answers to Exam 2 Spring 2008 Problem 1: Graded by Prof. Fonstad
More informationSUPPLEMENTARY INFORMATION
Preparation of the GaSb/Al.2 Ga.8 Sb/InAs source wafers used for the epitaxial transfer process The source layers were grown in a solid source VG-8 molecular beam epitaxy (MBE) reactor on n-type (Te-doped,
More informationMOS Transistor I-V Characteristics and Parasitics
ECEN454 Digital Integrated Circuit Design MOS Transistor I-V Characteristics and Parasitics ECEN 454 Facts about Transistors So far, we have treated transistors as ideal switches An ON transistor passes
More informationMOSFET SCALING ECE 663
MOSFET SCALING Scaling of switches Moore s Law economics Moore s Law - #DRAM Bits per chip doubles every 18 months ~5% bigger chips/wafers ~5% design improvements ~50 % Lithography ability to print smaller
More informationErik Lind
High-Speed Devices, 2011 Erik Lind (Erik.Lind@ftf.lth.se) Course consists of: 30 h Lectures (H322, and Fys B check schedule) 8h Excercises 2x2h+4h Lab Excercises (2 Computer simulations, 4 RF measurment
More informationTechnische Universität Graz. Institute of Solid State Physics. 11. MOSFETs
Technische Universität Graz Institute of Solid State Physics 11. MOSFETs Dec. 12, 2018 Gradual channel approximation accumulation depletion inversion http://lampx.tugraz.at/~hadley/psd/l10/gradualchannelapprox.php
More informationPhysics-based compact model for ultimate FinFETs
Physics-based compact model for ultimate FinFETs Ashkhen YESAYAN, Nicolas CHEVILLON, Fabien PREGALDINY, Morgan MADEC, Christophe LALLEMENT, Jean-Michel SALLESE nicolas.chevillon@iness.c-strasbourg.fr Research
More informationELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model
ELEC 3908, Physical Electronics, Lecture 23 The MOSFET Square Law Model Lecture Outline As with the diode and bipolar, have looked at basic structure of the MOSFET and now turn to derivation of a current
More informationGaN HEMT Reliability
GaN HEMT Reliability J. A. del Alamo and J. Joh Microsystems Technology Laboratories, MIT ESREF 2009 Arcachon, Oct. 5-9, 2009 Acknowledgements: ARL (DARPA-WBGS program), ONR (DRIFT-MURI program) Jose Jimenez,
More informationMOSFET Physics: The Long Channel Approximation
MOSFET Physics: The ong Channel Approximation A basic n-channel MOSFET (Figure 1) consists of two heavily-doped n-type regions, the Source and Drain, that comprise the main terminals of the device. The
More informationEE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing
EE115C Winter 2017 Digital Electronic Circuits Lecture 3: MOS RC Model, CMOS Manufacturing Agenda MOS Transistor: RC Model (pp. 104-113) S R on D CMOS Manufacturing Process (pp. 36-46) S S C GS G G C GD
More informationIII V compound semiconductors have recently emerged as
1504 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 57, NO. 7, JULY 2010 Scalability of Sub-100 nm InAs HEMTs on InP Substrate for Future Logic Applications Dae-Hyun Kim and Jesús A. del Alamo, Fellow, IEEE
More informationSECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University
NAME: PUID: SECTION: Circle one: Alam Lundstrom ECE 305 Exam 5 SOLUTIONS: April 18, 2016 M A Alam and MS Lundstrom Purdue University This is a closed book exam You may use a calculator and the formula
More informationPerformance Comparisons of III-V and strained-si in Planar FETs and Non-planar FinFETs at Ultrashort Gate Length (12nm)
Purdue University Purdue e-pubs Birck and NCN Publications Birck Nanotechnology Center 4-212 Performance Comparisons of III-V and strained-si in Planar and Non-planar Fin at Ultrashort Gate Length (12nm)
More informationLong-channel MOSFET IV Corrections
Long-channel MOSFET IV orrections Three MITs of the Day The body ect and its influence on long-channel V th. Long-channel subthreshold conduction and control (subthreshold slope S) Scattering components
More informationPhysics an performance of III-V nanowire heterojunction TFETs including phonon and impurity band tails:
Physics an performance of III-V nanowire heterojunction TFETs including phonon and impurity band tails: An atomistic mode space NEGF quantum transport study. A. Afzalian TSMC, Leuven, Belgium (Invited)
More informationPhysics of Nanoscale Transistors
Physics of Nanoscale ransistors Mark Electrical and Computer Engineering University, West Lafayette, IN 1. Introduction 2. he Ballistic MOSFE 3. Scattering heory of the MOSFE 4. Beyond the Si MOSFE 5.
More informationTechnology Development & Design for 22 nm InGaAs/InP-channel MOSFETs
2008 Indium Phosphide and Related Materials Conference, May, Versailles, France Technology Development & Design for 22 nm InGaAs/InP-channel MOSFETs M. Rodwell University of California, Santa Barbara M.
More informationEE 560 MOS TRANSISTOR THEORY PART 2. Kenneth R. Laker, University of Pennsylvania
1 EE 560 MOS TRANSISTOR THEORY PART nmos TRANSISTOR IN LINEAR REGION V S = 0 V G > V T0 channel SiO V D = small 4 C GC C BC substrate depletion region or bulk B p nmos TRANSISTOR AT EDGE OF SATURATION
More informationGaN based transistors
GaN based transistors S FP FP dielectric G SiO 2 Al x Ga 1-x N barrier i-gan Buffer i-sic D Transistors "The Transistor was probably the most important invention of the 20th Century The American Institute
More informationSub-Boltzmann Transistors with Piezoelectric Gate Barriers
Sub-Boltzmann Transistors with Piezoelectric Gate Barriers Raj Jana, Gregory Snider, Debdeep Jena Electrical Engineering University of Notre Dame 29 Oct, 2013 rjana1@nd.edu Raj Jana, E3S 2013, Berkeley
More informationHW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7
HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 2 What do digital IC designers need to know? 5 EE4 EECS4 6 3 0< V GS - V T < V DS Pinch-off 7 For (V GS V T )
More information