Microsystems Technology Laboratories, MIT. Teledyne Scientific Company (TSC)

Size: px
Start display at page:

Download "Microsystems Technology Laboratories, MIT. Teledyne Scientific Company (TSC)"

Transcription

1 Extraction of Virtual-Source Injection Velocity in sub-100 nm III-V HFETs 1,2) D.-H. Kim, 1) J. A. del Alamo, 1) D. A. Antoniadis and 2) B. Brar 1) Microsystems Technology Laboratories, MIT 2) Teledyne Scientific Company (TSC) Sponsors: Intel, FCRP-MSD, TSC Discussions with R. Chau & M. Radosavljevic IEDM December-9 th,

2 Contents 1. Introduction - Virtual Source Injection Velocity (v x0 ) 2. Methodology to extract v x0 3. Virtual Source FET Model 4. Conclusions 2

3 Virtual Source Injection Velocity V G V S V D I 1-r D r I D R S Q i_x0 R D v E C E C v x0 k B T l Virtual Source 0 x L x o I D = Q i_x0 v in fully Ballistic case = Q i_x0 v x0 with scattering v x0 : FOM to determine I D and gate delay ( ). Goal of this work: measure v x0 in III-V channel Ref: Prof. Lundstrom, Purdue Univ. 3

4 v x0 - How to extract? Approaches: - 1) Inversion charge is linear with V GS for V GS > V T. g GS GS T I D = Q i_x0 v x0 = C gi ( V GSi V T ) v x0 I D v x0 = Cgi ( V GSi V T ) Limitation: Linearity assumption underestimates Q i_x0. - 2) Transconductace method. (I D ) g mi (V GSi ) = g mi = C gi v x0 v x0 = Cgi Limitation: Assumes v x0 constant with V GS. x0 GS Ref: 1) D. A. Antoniadis (IBM Journal-06), 2) G. Dewey (EDL-08) 4

5 Contents 1. Introduction - Virtual Source Injection Velocity (v x0 ) 2. Methodology to extract v x0 3. Virtual Source FET Model 4. Conclusions 5

6 v x0 Proposed Methodology V V G V I D = Q i_x0 v x0 v x0 = I D / Q i _ x0 I D -I D : Measured Drain Current E C R S Q i_x0 v x0 R D -Q i_x0 : Sheet Charge Density Q i_x0 = C gi d(v GS,i ) where C = 10 mv -R s and R d correction i = I D (R S +R D ) L 0 x x o V GSi = V GS I D R S - V T roll-off off correction in Q i_x0 - DIBL correction in Q i_x0 6

7 Device Technology: III-V HEMT Gate PR Gate Metal Ti/Pt/Au S Oxide t ins t ch D Cap Etch stopper Barrier Channel Buffer Barrier = In 0.52 Al 0.48 As ( 4 or 10 nm ) 4nmIn Al As Channel = In 0.53 Ga 0.47 As ( 2 nm ) 2 nm In 0.53 Ga 0.47 As Channel = In 0.7 Ga 0.3 As ( 8 nm ) Core or InAs ( 5 nm ) 5 nm InAs, 8 nm In 0.7 Ga 0.3 As Channel = In 0.53 Ga 0.47 As ( 3 nm ) 3nmIn 0.53 Ga 0.47 As Buffer = In 0.52 Al 0.48 As (~400 nm) t ch = 10 nm ch In 0.52 Al 0.48 As Substrate = InP (~300 nm) -L g : 200 nm ~ 30 nm, t ins = ~ 4 nm - Channel: In 0.53 Ga 0.47 As, In 0.7 Ga 0.3 As, InAs Refs: Kim et al., iedm-08, iprm-09 7

8 C gi - How to extract in small L g device? C gi intrinsic gate capacitance per unit area [ff/ m 2 ] (from S-parameters at linear region, = 10 mv) C g C gi C C g = C gi x L g + 2C gext_inner + 2C gext_outer f(v GSi - V T T) C g C g (OFF) = C gi x L g + 2C gext_inner

9 Q i_x0 - How to extract? Q i_x0 = C gi d(v GS,i ), where C = 10 mv 12 L g = 30 nm x C gi 3 C F/ m 2 gi [ff ] 4 Q i_xo 2 1 Qi Xo = 10 mv V GSi [V] 0 9

10 v x0 = I D / Q i_x0 L g = 30 nm In 0.7 Ga 0.3 As HEMTs with t ins = 4 nm =005V 0.05 = 0.2 V = 0.35 V = 0.5 V 4 x = 0.05 V = 0.2 V = 0.35 V = 0.5 V [ma/ m] 0.4 Q i_x0 2 I D DIBL correction V GSi [V] V GSi [V] v x0 can be extracted t at any bias condition. As V GSi, less DIBL correction due to i. 10

11 Bias Dependent v x0-30 nm InGaAs HFET 4 v [10 7 x0 cm/s] = 0.05 V = 0.2 V =05V 0.5 = 0.35 V V GSi [V] v x0 V GSi v x0 Extracted v x0 is NOT constant with V GSi. x0 (I D ) (Q i_x0 ) GSi (v x0 ) (V GSi ) = v x0 + Q i_x0 (V GSi ) (V GSi ) 11

12 v x0 for different L g 4 x 107 L g 3 v x0 [cm m/s] 2 L g = 30 nm L g = 40 nm 1 L g = 60 nm L g = 80 nm = 0.5 V L g = 130 nm As L g, g, V GS gs - V V T T [V] v x0 improves and then saturates at L g ~ 40 nm. 12

13 v x0 vs. L g for different channels 4 (InAs) n ~ 13,000 cm 2 /V-s 3 cm/s] v x0 [10 7 n ~ 11,000 cm 2 /V-s 2 (In Ga As) n ~ 9,500 cm 2 /V-s (In 0.53 Ga 0.47 As) 1 *Strain-Si *Si nfets = 0.5 V (V 0 DS = 1.1 ~ 1.3 V) L g [nm] - III-Vs shows 2X higher v x0 than Si, even at = 0.5 V. - As InAs composition, v x0 due to m e*. Ref: * Khakifirooz et al., TED, 1674 (08) 13

14 v x0 vs. DIBL 4 3 InAs InAs HFETs HFETs [5] In 0.7 Ga 0.3 As HFETs [6] In 0.53 Ga 0.47 As HFETs m/s] x0 [107 cm v x and 45-nm node devices with V dd = 1.1 to 1.3 V [9] [1] 1 7X Strained nfets with V V[4] 0 dd = 0.5 [2] DIBL [mv/v] 7X higher v DIBL = 100 mv/v, V dd = 0.5 V Ref: 1) Khakifirooz et al., TED, 1674 (08), 2) G. Dewey (EDL-08) 14

15 Contents 1. Introduction - Virtual Source Injection Velocity (v x0 ) 2. Methodology to extract v x0 3. Virtual Source FET Model 4. Conclusions 15

16 The Virtual Source FET Model A Simple, Physical Universal-Short Channel FET Semi-empirical Model (based on Si MOSFET model [1]) I D = Q i_x0 v x0-m F sat VS I D = Q i_x0 v x0 F sat : Semiempirical saturation function V G V D Known Device Parameters C inv ox : Q ix0 = C inv ox f(s, V GSi,i, V t* ) : V * t = V t0 - i DIBL, From I D (i )vs vs. V GSi S : Subthreshold swing: From log(i D ) vs. V GSi : Threshold Voltage at V D ~0 (from I off and DIBL) V t0 R S,D : V GSi =V GS -I D R S ; i = -2I D (R S +R D ) E C R s v x0 Q i_x0 0x L eff x o Fitted Physical Parameters V x0-m : Maximum carrier velocity at virtual source (x=x 0 ) eff : Effective mobility, assumed constant [1] Khakifirooz et al., TED, 1674 (08)

17 Comparison - 30 nm In 0.7 Ga 0.3 As HFET Fitting parameters: eff, v x0m Measured V GS =05V 0.5 Modeled V ds =0.5 V V ds =0.5 V 0.35 V 0.2 V 0.05 V 0.05 V Excellent agreement: - from linear to saturation, and weak to strong inversion. - eff = 1500 cm 2 /Vs, v x0m = cm/s 17

18 Comparison: v x0 = v x0m F sat L g = 30 nm In 0.7 Ga 0.3 As Extracted Modeled =0.5 V 0.35 V 0.20 V 0.05 V Excellent agreement with extracted values of v x0. 18

19 v x0 NEGF simulation 30 nm In 0.7 Ga 0.3 As HEMTs v x0 = 3.1 x 10 7 cm/s: close to experimental value. Acknowledgement : Y. Yang and M. S. Lundstrom, Purdue Univ. 19

20 Conclusions Methodology to extract injection velocity (v x0 ) at virtual source. Sub-100 nm InGaAs HEMTs - v x0 > cm/s at = V for In Ga As - Peak v xo = cm/s for InAs sub-channel -7 higher than Si at DIBL = 100 mv/v and = 0.5 V Virtual Source FET model - Excellent description of I-V characteristics of III-V HEMTs with physically meaningful values of v x0. 20

III-V CMOS: What have we learned from HEMTs? J. A. del Alamo, D.-H. Kim 1, T.-W. Kim, D. Jin, and D. A. Antoniadis

III-V CMOS: What have we learned from HEMTs? J. A. del Alamo, D.-H. Kim 1, T.-W. Kim, D. Jin, and D. A. Antoniadis III-V CMOS: What have we learned from HEMTs? J. A. del Alamo, D.-H. Kim 1, T.-W. Kim, D. Jin, and D. A. Antoniadis Microsystems Technology Laboratories, MIT 1 presently with Teledyne Scientific 23rd International

More information

30 nm In 0.7 Ga 0.3 As Inverted-type HEMT with Reduced Gate Leakage Current for Logic Applications

30 nm In 0.7 Ga 0.3 As Inverted-type HEMT with Reduced Gate Leakage Current for Logic Applications 30 nm In 0.7 Ga 0.3 As Inverted-type HEMT with Reduced Gate Leakage Current for Logic Applications T.-W. Kim, D.-H. Kim* and J. A. del Alamo Microsystems Technology Laboratories MIT Presently with Teledyne

More information

The Prospects for III-Vs

The Prospects for III-Vs 10 nm CMOS: The Prospects for III-Vs J. A. del Alamo, Dae-Hyun Kim 1, Donghyun Jin, and Taewoo Kim Microsystems Technology Laboratories, MIT 1 Presently with Teledyne Scientific 2010 European Materials

More information

Ultra-Scaled InAs HEMTs

Ultra-Scaled InAs HEMTs Performance Analysis of Ultra-Scaled InAs HEMTs Neerav Kharche 1, Gerhard Klimeck 1, Dae-Hyun Kim 2,3, Jesús. A. del Alamo 2, and Mathieu Luisier 1 1 Network for Computational ti Nanotechnology and Birck

More information

Prospects for Ge MOSFETs

Prospects for Ge MOSFETs Prospects for Ge MOSFETs Sematech Workshop December 4, 2005 Dimitri A. Antoniadis Microsystems Technology Laboratories MIT Sematech Workshop 2005 1 Channel Transport - I D I D =WQ i (x 0 )v xo v xo : carrier

More information

Performance Analysis of Ultra-Scaled InAs HEMTs

Performance Analysis of Ultra-Scaled InAs HEMTs Purdue University Purdue e-pubs Birck and NCN Publications Birck Nanotechnology Center 2009 Performance Analysis of Ultra-Scaled InAs HEMTs Neerav Kharche Birck Nanotechnology Center and Purdue University,

More information

Quantum-size effects in sub-10 nm fin width InGaAs finfets

Quantum-size effects in sub-10 nm fin width InGaAs finfets Quantum-size effects in sub-10 nm fin width InGaAs finfets Alon Vardi, Xin Zhao, and Jesús A. del Alamo Microsystems Technology Laboratories, MIT December 9, 2015 Sponsors: DTRA NSF (E3S STC) Northrop

More information

ECE-305: Spring 2016 MOSFET IV

ECE-305: Spring 2016 MOSFET IV ECE-305: Spring 2016 MOSFET IV Professor Mark Lundstrom Electrical and Computer Engineering Purdue University, West Lafayette, IN USA lundstro@purdue.edu Lundstrom s lecture notes: Lecture 4 4/7/16 outline

More information

Simple Theory of the Ballistic Nanotransistor

Simple Theory of the Ballistic Nanotransistor Simple Theory of the Ballistic Nanotransistor Mark Lundstrom Purdue University Network for Computational Nanoechnology outline I) Traditional MOS theory II) A bottom-up approach III) The ballistic nanotransistor

More information

EECS130 Integrated Circuit Devices

EECS130 Integrated Circuit Devices EECS130 Integrated Circuit Devices Professor Ali Javey 10/30/2007 MOSFETs Lecture 4 Reading: Chapter 17, 19 Announcements The next HW set is due on Thursday. Midterm 2 is next week!!!! Threshold and Subthreshold

More information

Components Research, TMG Intel Corporation *QinetiQ. Contact:

Components Research, TMG Intel Corporation *QinetiQ. Contact: 1 High-Performance 4nm Gate Length InSb P-Channel Compressively Strained Quantum Well Field Effect Transistors for Low-Power (V CC =.5V) Logic Applications M. Radosavljevic,, T. Ashley*, A. Andreev*, S.

More information

Towards a Scalable EKV Compact Model Including Ballistic and Quasi-Ballistic Transport

Towards a Scalable EKV Compact Model Including Ballistic and Quasi-Ballistic Transport 2011 Workshop on Compact Modeling Towards a Scalable EKV Compact Model Including Ballistic and Quasi-Ballistic Transport Christian Enz 1,2, A. Mangla 2 and J.-M. Sallese 2 1) Swiss Center for Electronics

More information

Performance Enhancement of P-channel InGaAs Quantum-well FETs by Superposition of Process-induced Uniaxial Strain and Epitaxially-grown Biaxial Strain

Performance Enhancement of P-channel InGaAs Quantum-well FETs by Superposition of Process-induced Uniaxial Strain and Epitaxially-grown Biaxial Strain Performance Enhancement of P-channel InGaAs Quantum-well FETs by Superposition of Process-induced Uniaxial Strain and Epitaxially-grown Biaxial Strain Ling Xia 1, Vadim Tokranov 2, Serge R. Oktyabrsky

More information

ECE 305 Exam 5 SOLUTIONS: Spring 2015 April 17, 2015 Mark Lundstrom Purdue University

ECE 305 Exam 5 SOLUTIONS: Spring 2015 April 17, 2015 Mark Lundstrom Purdue University NAME: PUID: : ECE 305 Exam 5 SOLUTIONS: April 17, 2015 Mark Lundstrom Purdue University This is a closed book exam. You may use a calculator and the formula sheet at the end of this exam. Following the

More information

ECE-305: Fall 2017 MOS Capacitors and Transistors

ECE-305: Fall 2017 MOS Capacitors and Transistors ECE-305: Fall 2017 MOS Capacitors and Transistors Pierret, Semiconductor Device Fundamentals (SDF) Chapters 15+16 (pp. 525-530, 563-599) Professor Peter Bermel Electrical and Computer Engineering Purdue

More information

ECE 305: Fall MOSFET Energy Bands

ECE 305: Fall MOSFET Energy Bands ECE 305: Fall 2016 MOSFET Energy Bands Professor Peter Bermel Electrical and Computer Engineering Purdue University, West Lafayette, IN USA pbermel@purdue.edu Pierret, Semiconductor Device Fundamentals

More information

Nanoscale CMOS Design Issues

Nanoscale CMOS Design Issues Nanoscale CMOS Design Issues Jaydeep P. Kulkarni Assistant Professor, ECE Department The University of Texas at Austin jaydeep@austin.utexas.edu Fall, 2017, VLSI-1 Class Transistor I-V Review Agenda Non-ideal

More information

Self-Aligned InGaAs FinFETs with 5-nm Fin-Width and 5-nm Gate-Contact Separation

Self-Aligned InGaAs FinFETs with 5-nm Fin-Width and 5-nm Gate-Contact Separation Self-Aligned InGaAs FinFETs with 5-nm Fin-Width and 5-nm Gate-Contact Separation Alon Vardi, Lisa Kong, Wenjie Lu, Xiaowei Cai, Xin Zhao, Jesús Grajal* and Jesús A. del Alamo Microsystems Technology Laboratories,

More information

Chapter 5 MOSFET Theory for Submicron Technology

Chapter 5 MOSFET Theory for Submicron Technology Chapter 5 MOSFET Theory for Submicron Technology Short channel effects Other small geometry effects Parasitic components Velocity saturation/overshoot Hot carrier effects ** Majority of these notes are

More information

High Mobility Materials and Novel Device Structures for High Performance Nanoscale MOSFETs

High Mobility Materials and Novel Device Structures for High Performance Nanoscale MOSFETs High Mobility Materials and Novel Device Structures for High Performance Nanoscale MOSFETs Prof. (Dr.) Tejas Krishnamohan Department of Electrical Engineering Stanford University, CA & Intel Corporation

More information

Performance Analysis of 60-nm Gate-Length III-V InGaAs HEMTs: Simulations Versus Experiments

Performance Analysis of 60-nm Gate-Length III-V InGaAs HEMTs: Simulations Versus Experiments Purdue University Purdue e-pubs Birck and NCN Publications Birck Nanotechnology Center 7-2009 Performance Analysis of 60-nm Gate-Length III-V InGaAs HEMTs: Simulations Versus Experiments Neophytou Neophytos

More information

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor CMPEN 411 VLSI Digital Circuits Lecture 03: MOS Transistor Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN 411 L03 S.1

More information

Lecture 8: Ballistic FET I-V

Lecture 8: Ballistic FET I-V Lecture 8: Ballistic FET I-V 1 Lecture 1: Ballistic FETs Jena: 61-70 Diffusive Field Effect Transistor Source Gate L g >> l Drain Source V GS Gate Drain I D Mean free path much shorter than channel length

More information

Electric-Field Induced F - Migration in Self-Aligned InGaAs MOSFETs and Mitigation

Electric-Field Induced F - Migration in Self-Aligned InGaAs MOSFETs and Mitigation Electric-Field Induced F - Migration in Self-Aligned InGaAs MOSFETs and Mitigation X. Cai, J. Lin, D. A. Antoniadis and J. A. del Alamo Microsystems Technology Laboratories, MIT December 5, 2016 Sponsors:

More information

Negative-Bias Temperature Instability (NBTI) of GaN MOSFETs

Negative-Bias Temperature Instability (NBTI) of GaN MOSFETs Negative-Bias Temperature Instability (NBTI) of GaN MOSFETs Alex Guo and Jesús A. del Alamo Microsystems Technology Laboratories (MTL) Massachusetts Institute of Technology (MIT) Cambridge, MA, USA Sponsor:

More information

A Simple Semiempirical Short-Channel MOSFET Current- Voltage Model Continuous Across All Regions of Operation and Employing Only Physical Parameters

A Simple Semiempirical Short-Channel MOSFET Current- Voltage Model Continuous Across All Regions of Operation and Employing Only Physical Parameters A Simple Semiempirical Short-Channel MOSFET Current- Voltage Model Continuous Across All Regions of Operation and Employing Only Physical Parameters The MIT Faculty has made this article openly available.

More information

EE410 vs. Advanced CMOS Structures

EE410 vs. Advanced CMOS Structures EE410 vs. Advanced CMOS Structures Prof. Krishna S Department of Electrical Engineering S 1 EE410 CMOS Structure P + poly-si N + poly-si Al/Si alloy LPCVD PSG P + P + N + N + PMOS N-substrate NMOS P-well

More information

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA MOS Transistors Prof. Krishna Saraswat Department of Electrical Engineering S Stanford, CA 94305 saraswat@stanford.edu 1 1930: Patent on the Field-Effect Transistor! Julius Lilienfeld filed a patent describing

More information

Enhanced Mobility CMOS

Enhanced Mobility CMOS Enhanced Mobility CMOS Judy L. Hoyt I. Åberg, C. Ni Chléirigh, O. Olubuyide, J. Jung, S. Yu, E.A. Fitzgerald, and D.A. Antoniadis Microsystems Technology Laboratory MIT, Cambridge, MA 02139 Acknowledge

More information

Comparison of Ultra-Thin InAs and InGaAs Quantum Wells and Ultra-Thin-Body Surface-Channel MOSFETs

Comparison of Ultra-Thin InAs and InGaAs Quantum Wells and Ultra-Thin-Body Surface-Channel MOSFETs Comparison of Ultra-Thin InAs and InGaAs Quantum Wells and Ultra-Thin-Body Surface-Channel MOSFETs Cheng-Ying Huang 1, Sanghoon Lee 1, Evan Wilson 3, Pengyu Long 3, Michael Povolotskyi 3, Varistha Chobpattana

More information

Technology Development for InGaAs/InP-channel MOSFETs

Technology Development for InGaAs/InP-channel MOSFETs MRS Spring Symposium, Tutorial: Advanced CMOS Substrates, Devices, Reliability, and Characterization, April 13, 2009, San Francisco Technology Development for InGaAs/InP-channel MOSFETs Mark Rodwell University

More information

Electrical Degradation of InAlAs/InGaAs Metamorphic High-Electron Mobility Transistors

Electrical Degradation of InAlAs/InGaAs Metamorphic High-Electron Mobility Transistors Electrical Degradation of InAlAs/InGaAs Metamorphic High-Electron Mobility Transistors S. D. Mertens and J.A. del Alamo Massachusetts Institute of Technology Sponsor: Agilent Technologies Outline Introduction

More information

THE CARRIER velocity in a MOSFET channel near the

THE CARRIER velocity in a MOSFET channel near the 994 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 59, NO. 4, APRIL 2012 On the Interpretation of Ballistic Injection Velocity in Deeply Scaled MOSFETs Yang Liu, Mathieu Luisier, Amlan Majumdar, Dimitri A.

More information

The Critical Role of Quantum Capacitance in Compact Modeling of Nano-Scaled and Nanoelectronic Devices

The Critical Role of Quantum Capacitance in Compact Modeling of Nano-Scaled and Nanoelectronic Devices The Critical Role of Quantum Capacitance in Compact Modeling of Nano-Scaled and Nanoelectronic Devices Zhiping Yu and Jinyu Zhang Institute of Microelectronics Tsinghua University, Beijing, China yuzhip@tsinghua.edu.cn

More information

A Multi-Gate CMOS Compact Model BSIMMG

A Multi-Gate CMOS Compact Model BSIMMG A Multi-Gate CMOS Compact Model BSIMMG Darsen Lu, Sriramkumar Venugopalan, Tanvir Morshed, Yogesh Singh Chauhan, Chung-Hsun Lin, Mohan Dunga, Ali Niknejad and Chenming Hu University of California, Berkeley

More information

MOSFET. Id-Vd curve. I DS Transfer curve V G. Lec. 8. Vd=1V. Saturation region. V Th

MOSFET. Id-Vd curve. I DS Transfer curve V G. Lec. 8. Vd=1V. Saturation region. V Th MOSFET Id-Vd curve Saturation region I DS Transfer curve Vd=1V V Th V G 1 0 < V GS < V T V GS > V T V Gs >V T & Small V D > 0 I DS WQ inv WC v WC i V V VDS V V G i T G n T L n I D g V D (g conductance

More information

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors ECE 342 Electronic Circuits Lecture 6 MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2

More information

Lecture 11: MOSFET Modeling

Lecture 11: MOSFET Modeling Digital Integrated Circuits (83-313) Lecture 11: MOSFET ing Semester B, 2016-17 Lecturer: Dr. Adam Teman TAs: Itamar Levi, Robert Giterman 18 June 2017 Disclaimer: This course was prepared, in its entirety,

More information

MOS Transistor Theory

MOS Transistor Theory CHAPTER 3 MOS Transistor Theory Outline 2 1. Introduction 2. Ideal I-V Characteristics 3. Nonideal I-V Effects 4. C-V Characteristics 5. DC Transfer Characteristics 6. Switch-level RC Delay Models MOS

More information

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region EE105 Fall 014 Microelectronic Devices and Circuits Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel

More information

Chapter 3 Device Physics and Performance Potential of III-V Field-Effect Transistors

Chapter 3 Device Physics and Performance Potential of III-V Field-Effect Transistors Chapter 3 Device Physics and Performance Potential of III-V Field-Effect Transistors Yang Liu, Himadri S. Pal, Mark S. Lundstrom, Dae-Hyun Kim, Jesús A. del Alamo and Dimitri A. Antoniadis Abstract The

More information

InGaAs Double-Gate Fin-Sidewall MOSFET

InGaAs Double-Gate Fin-Sidewall MOSFET InGaAs Double-Gate Fin-Sidewall MOSFET Alon Vardi, Xin Zhao and Jesús del Alamo Microsystems Technology Laboratories, MIT June 25, 214 Sponsors: Sematech, Technion-MIT Fellowship, and NSF E3S Center (#939514)

More information

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

High aspect-ratio InGaAs FinFETs with sub-20 nm fin width

High aspect-ratio InGaAs FinFETs with sub-20 nm fin width High aspect-rati InGaAs FinFETs with sub-2 nm fin width Aln Vardi, Jianqiang Lin, Wenjie Lu, Xin Zha and Jesús A. del Alam Micrsystems Technlgy Labratries, MIT June 15, 216 Spnsrs: DTRA (HDTRA 1-14-1-57),

More information

Impact of 110 uniaxial strain on n-channel In0.15Ga0.85As high electron mobility transistors

Impact of 110 uniaxial strain on n-channel In0.15Ga0.85As high electron mobility transistors Impact of 110 uniaxial strain on n-channel In0.15Ga0.85As high electron mobility transistors The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story

More information

Lecture 35: Introduction to Quantum Transport in Devices

Lecture 35: Introduction to Quantum Transport in Devices ECE-656: Fall 2011 Lecture 35: Introduction to Quantum Transport in Devices Mark Lundstrom Purdue University West Lafayette, IN USA 1 11/21/11 objectives 1) Provide an introduction to the most commonly-used

More information

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes Problem 1: Semiconductor Fundamentals [30 points] A uniformly doped silicon sample of length 100µm and cross-sectional area 100µm 2

More information

The Devices. Jan M. Rabaey

The Devices. Jan M. Rabaey The Devices Jan M. Rabaey Goal of this chapter Present intuitive understanding of device operation Introduction of basic device equations Introduction of models for manual analysis Introduction of models

More information

Lecture #27. The Short Channel Effect (SCE)

Lecture #27. The Short Channel Effect (SCE) Lecture #27 ANNOUNCEMENTS Design Project: Your BJT design should meet the performance specifications to within 10% at both 300K and 360K. ( β dc > 45, f T > 18 GHz, V A > 9 V and V punchthrough > 9 V )

More information

Scaling Issues in Planar FET: Dual Gate FET and FinFETs

Scaling Issues in Planar FET: Dual Gate FET and FinFETs Scaling Issues in Planar FET: Dual Gate FET and FinFETs Lecture 12 Dr. Amr Bayoumi Fall 2014 Advanced Devices (EC760) Arab Academy for Science and Technology - Cairo 1 Outline Scaling Issues for Planar

More information

1464 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 63, NO. 4, APRIL 2016

1464 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 63, NO. 4, APRIL 2016 1464 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 63, NO. 4, APRIL 2016 Analysis of Resistance and Mobility in InGaAs Quantum-Well MOSFETs From Ballistic to Diffusive Regimes Jianqiang Lin, Member, IEEE,

More information

Lecture 3: Transistor as an thermonic switch

Lecture 3: Transistor as an thermonic switch Lecture 3: Transistor as an thermonic switch 2016-01-21 Lecture 3, High Speed Devices 2016 1 Lecture 3: Transistors as an thermionic switch Reading Guide: 54-57 in Jena Transistor metrics Reservoir equilibrium

More information

Analysis of Band-to-band. Tunneling Structures. Title of Talk. Dimitri Antoniadis and Judy Hoyt (PIs) Jamie Teherani and Tao Yu (Students) 8/21/2012

Analysis of Band-to-band. Tunneling Structures. Title of Talk. Dimitri Antoniadis and Judy Hoyt (PIs) Jamie Teherani and Tao Yu (Students) 8/21/2012 1 Analysis of Band-to-band Title of Talk Tunneling Structures Dimitri Antoniadis and Judy Hoyt (PIs) Jamie Teherani and Tao Yu (Students) 8/21/2012 A Science & Technology Center Vertical Type-II TFET Structure

More information

MOSFET: Introduction

MOSFET: Introduction E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major

More information

N Channel MOSFET level 3

N Channel MOSFET level 3 N Channel MOSFET level 3 mosn3 NSource NBulk NSource NBulk NSource NBulk NSource (a) (b) (c) (d) NBulk Figure 1: MOSFET Types Form: mosn3: instance name n 1 n n 3 n n 1 is the drain node, n is the gate

More information

P. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions

P. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions P. R. Nelson 1 ECE418 - VLSI Midterm Exam Solutions 1. (8 points) Draw the cross-section view for A-A. The cross-section view is as shown below.. ( points) Can you tell which of the metal1 regions is the

More information

Supporting information

Supporting information Supporting information Design, Modeling and Fabrication of CVD Grown MoS 2 Circuits with E-Mode FETs for Large-Area Electronics Lili Yu 1*, Dina El-Damak 1*, Ujwal Radhakrishna 1, Xi Ling 1, Ahmad Zubair

More information

The Devices: MOS Transistors

The Devices: MOS Transistors The Devices: MOS Transistors References: Semiconductor Device Fundamentals, R. F. Pierret, Addison-Wesley Digital Integrated Circuits: A Design Perspective, J. Rabaey et.al. Prentice Hall NMOS Transistor

More information

Carbon Nanotube Electronics

Carbon Nanotube Electronics Carbon Nanotube Electronics Jeorg Appenzeller, Phaedon Avouris, Vincent Derycke, Stefan Heinz, Richard Martel, Marko Radosavljevic, Jerry Tersoff, Shalom Wind H.-S. Philip Wong hspwong@us.ibm.com IBM T.J.

More information

ECE 342 Electronic Circuits. 3. MOS Transistors

ECE 342 Electronic Circuits. 3. MOS Transistors ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to

More information

Lecture 18 Field-Effect Transistors 3

Lecture 18 Field-Effect Transistors 3 Lecture 18 Field-Effect Transistors 3 Schroder: Chapters, 4, 6 1/38 Announcements Homework 4/6: Is online now. Due Today. I will return it next Wednesday (30 th May). Homework 5/6: It will be online later

More information

Lecture 5: CMOS Transistor Theory

Lecture 5: CMOS Transistor Theory Lecture 5: CMOS Transistor Theory Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline q q q q q q q Introduction MOS Capacitor nmos I-V Characteristics

More information

OMEN an atomistic and full-band quantum transport simulator for post-cmos nanodevices

OMEN an atomistic and full-band quantum transport simulator for post-cmos nanodevices Purdue University Purdue e-pubs Other Nanotechnology Publications Birck Nanotechnology Center 8-18-28 OMEN an atomistic and full-band quantum transport simulator for post-cmos nanodevices Mathieu Luisier

More information

The Future of CMOS. David Pulfrey. CHRONOLOGY of the FET. Lecture Lilienfeld s patent (BG FET) 1965 Commercialization (Fairchild)

The Future of CMOS. David Pulfrey. CHRONOLOGY of the FET. Lecture Lilienfeld s patent (BG FET) 1965 Commercialization (Fairchild) The Future of CMOS David Pulfrey 1 CHRONOLOGY of the FET 1933 Lilienfeld s patent (BG FET) 1965 Commercialization (Fairchild) 1991 The most abundant object made by mankind (C.T. Sah) 2003 The 10 nm FET

More information

MOSFET Capacitance Model

MOSFET Capacitance Model MOSFET Capacitance Model So far we discussed the MOSFET DC models. In real circuit operation, the device operates under time varying terminal voltages and the device operation can be described by: 1 small

More information

nmosfet Schematic Four structural masks: Field, Gate, Contact, Metal. Reverse doping polarities for pmosfet in N-well.

nmosfet Schematic Four structural masks: Field, Gate, Contact, Metal. Reverse doping polarities for pmosfet in N-well. nmosfet Schematic Four structural masks: Field, Gate, Contact, Metal. Reverse doping polarities for pmosfet in N-well. nmosfet Schematic 0 y L n + source n + drain depletion region polysilicon gate x z

More information

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS )

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS ) ECE 4420 Spring 2005 Page 1 FINAL EXAMINATION NAME SCORE /100 Problem 1O 2 3 4 5 6 7 Sum Points INSTRUCTIONS: This exam is closed book. You are permitted four sheets of notes (three of which are your sheets

More information

Reliability and Instability of GaN MIS-HEMTs for Power Electronics

Reliability and Instability of GaN MIS-HEMTs for Power Electronics Reliability and Instability of GaN MIS-HEMTs for Power Electronics Jesús A. del Alamo, Alex Guo and Shireen Warnock Microsystems Technology Laboratories Massachusetts Institute of Technology 2016 Fall

More information

Decemb er 20, Final Exam

Decemb er 20, Final Exam Fall 2002 6.720J/3.43J Integrated Microelectronic Devices Prof. J. A. del Alamo Decemb er 20, 2002 - Final Exam Name: General guidelines (please read carefully b efore starting): Make sure to write your

More information

Time Dependent Dielectric Breakdown in High Voltage GaN MIS HEMTs: The Role of Temperature

Time Dependent Dielectric Breakdown in High Voltage GaN MIS HEMTs: The Role of Temperature Time Dependent Dielectric Breakdown in High Voltage GaN MIS HEMTs: The Role of Temperature Shireen Warnock, Allison Lemus, and Jesús A. del Alamo Microsystems Technology Laboratories (MTL) Massachusetts

More information

Lecture 9. Strained-Si Technology I: Device Physics

Lecture 9. Strained-Si Technology I: Device Physics Strain Analysis in Daily Life Lecture 9 Strained-Si Technology I: Device Physics Background Planar MOSFETs FinFETs Reading: Y. Sun, S. Thompson, T. Nishida, Strain Effects in Semiconductors, Springer,

More information

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components Objective: Power Components Outline: 1) Acknowledgements 2) Objective and Outline 1 Acknowledgement This lecture note has been obtained from similar courses all over the world. I wish to thank all the

More information

VLSI Design The MOS Transistor

VLSI Design The MOS Transistor VLSI Design The MOS Transistor Frank Sill Torres Universidade Federal de Minas Gerais (UFMG), Brazil VLSI Design: CMOS Technology 1 Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V

More information

LECTURE 3 MOSFETS II. MOS SCALING What is Scaling?

LECTURE 3 MOSFETS II. MOS SCALING What is Scaling? LECTURE 3 MOSFETS II Lecture 3 Goals* * Understand constant field and constant voltage scaling and their effects. Understand small geometry effects for MOS transistors and their implications modeling and

More information

Analysis of Transconductances in Deep Submicron CMOS with EKV 3.0

Analysis of Transconductances in Deep Submicron CMOS with EKV 3.0 MOS Models & Parameter Extraction Workgroup Arbeitskreis MOS Modelle & Parameterextraktion XFAB, Erfurt, Germany, October 2, 2002 Analysis of Transconductances in Deep Submicron CMOS with EKV 3.0 Matthias

More information

II III IV V VI B C N. Al Si P S. Zn Ga Ge As Se Cd In Sn Sb Te. Silicon (Si) the dominating material in IC manufacturing

II III IV V VI B C N. Al Si P S. Zn Ga Ge As Se Cd In Sn Sb Te. Silicon (Si) the dominating material in IC manufacturing II III IV V VI B N Al Si P S Zn Ga Ge As Se d In Sn Sb Te Silicon (Si) the dominating material in I manufacturing ompound semiconductors III - V group: GaAs GaN GaSb GaP InAs InP InSb... The Energy Band

More information

Lecture 28 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 18, 2007

Lecture 28 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 18, 2007 6.720J/3.43J - Integrated Microelectronic Devices - Spring 2007 Lecture 28-1 Lecture 28 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 18, 2007 Contents: 1. Second-order and

More information

ECE 497 JS Lecture - 12 Device Technologies

ECE 497 JS Lecture - 12 Device Technologies ECE 497 JS Lecture - 12 Device Technologies Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 NMOS Transistor 2 ρ Source channel charge density

More information

6.012 MICROELECTRONIC DEVICES AND CIRCUITS

6.012 MICROELECTRONIC DEVICES AND CIRCUITS MASSACHUSETTS INSTITUTE OF TECHNOLOGY Department of Electrical Engineering and Computer Science 6.012 MICROELECTRONIC DEVICES AND CIRCUITS Answers to Exam 2 Spring 2008 Problem 1: Graded by Prof. Fonstad

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION Preparation of the GaSb/Al.2 Ga.8 Sb/InAs source wafers used for the epitaxial transfer process The source layers were grown in a solid source VG-8 molecular beam epitaxy (MBE) reactor on n-type (Te-doped,

More information

MOS Transistor I-V Characteristics and Parasitics

MOS Transistor I-V Characteristics and Parasitics ECEN454 Digital Integrated Circuit Design MOS Transistor I-V Characteristics and Parasitics ECEN 454 Facts about Transistors So far, we have treated transistors as ideal switches An ON transistor passes

More information

MOSFET SCALING ECE 663

MOSFET SCALING ECE 663 MOSFET SCALING Scaling of switches Moore s Law economics Moore s Law - #DRAM Bits per chip doubles every 18 months ~5% bigger chips/wafers ~5% design improvements ~50 % Lithography ability to print smaller

More information

Erik Lind

Erik Lind High-Speed Devices, 2011 Erik Lind (Erik.Lind@ftf.lth.se) Course consists of: 30 h Lectures (H322, and Fys B check schedule) 8h Excercises 2x2h+4h Lab Excercises (2 Computer simulations, 4 RF measurment

More information

Technische Universität Graz. Institute of Solid State Physics. 11. MOSFETs

Technische Universität Graz. Institute of Solid State Physics. 11. MOSFETs Technische Universität Graz Institute of Solid State Physics 11. MOSFETs Dec. 12, 2018 Gradual channel approximation accumulation depletion inversion http://lampx.tugraz.at/~hadley/psd/l10/gradualchannelapprox.php

More information

Physics-based compact model for ultimate FinFETs

Physics-based compact model for ultimate FinFETs Physics-based compact model for ultimate FinFETs Ashkhen YESAYAN, Nicolas CHEVILLON, Fabien PREGALDINY, Morgan MADEC, Christophe LALLEMENT, Jean-Michel SALLESE nicolas.chevillon@iness.c-strasbourg.fr Research

More information

ELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model

ELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model ELEC 3908, Physical Electronics, Lecture 23 The MOSFET Square Law Model Lecture Outline As with the diode and bipolar, have looked at basic structure of the MOSFET and now turn to derivation of a current

More information

GaN HEMT Reliability

GaN HEMT Reliability GaN HEMT Reliability J. A. del Alamo and J. Joh Microsystems Technology Laboratories, MIT ESREF 2009 Arcachon, Oct. 5-9, 2009 Acknowledgements: ARL (DARPA-WBGS program), ONR (DRIFT-MURI program) Jose Jimenez,

More information

MOSFET Physics: The Long Channel Approximation

MOSFET Physics: The Long Channel Approximation MOSFET Physics: The ong Channel Approximation A basic n-channel MOSFET (Figure 1) consists of two heavily-doped n-type regions, the Source and Drain, that comprise the main terminals of the device. The

More information

EE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing

EE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing EE115C Winter 2017 Digital Electronic Circuits Lecture 3: MOS RC Model, CMOS Manufacturing Agenda MOS Transistor: RC Model (pp. 104-113) S R on D CMOS Manufacturing Process (pp. 36-46) S S C GS G G C GD

More information

III V compound semiconductors have recently emerged as

III V compound semiconductors have recently emerged as 1504 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 57, NO. 7, JULY 2010 Scalability of Sub-100 nm InAs HEMTs on InP Substrate for Future Logic Applications Dae-Hyun Kim and Jesús A. del Alamo, Fellow, IEEE

More information

SECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University

SECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University NAME: PUID: SECTION: Circle one: Alam Lundstrom ECE 305 Exam 5 SOLUTIONS: April 18, 2016 M A Alam and MS Lundstrom Purdue University This is a closed book exam You may use a calculator and the formula

More information

Performance Comparisons of III-V and strained-si in Planar FETs and Non-planar FinFETs at Ultrashort Gate Length (12nm)

Performance Comparisons of III-V and strained-si in Planar FETs and Non-planar FinFETs at Ultrashort Gate Length (12nm) Purdue University Purdue e-pubs Birck and NCN Publications Birck Nanotechnology Center 4-212 Performance Comparisons of III-V and strained-si in Planar and Non-planar Fin at Ultrashort Gate Length (12nm)

More information

Long-channel MOSFET IV Corrections

Long-channel MOSFET IV Corrections Long-channel MOSFET IV orrections Three MITs of the Day The body ect and its influence on long-channel V th. Long-channel subthreshold conduction and control (subthreshold slope S) Scattering components

More information

Physics an performance of III-V nanowire heterojunction TFETs including phonon and impurity band tails:

Physics an performance of III-V nanowire heterojunction TFETs including phonon and impurity band tails: Physics an performance of III-V nanowire heterojunction TFETs including phonon and impurity band tails: An atomistic mode space NEGF quantum transport study. A. Afzalian TSMC, Leuven, Belgium (Invited)

More information

Physics of Nanoscale Transistors

Physics of Nanoscale Transistors Physics of Nanoscale ransistors Mark Electrical and Computer Engineering University, West Lafayette, IN 1. Introduction 2. he Ballistic MOSFE 3. Scattering heory of the MOSFE 4. Beyond the Si MOSFE 5.

More information

Technology Development & Design for 22 nm InGaAs/InP-channel MOSFETs

Technology Development & Design for 22 nm InGaAs/InP-channel MOSFETs 2008 Indium Phosphide and Related Materials Conference, May, Versailles, France Technology Development & Design for 22 nm InGaAs/InP-channel MOSFETs M. Rodwell University of California, Santa Barbara M.

More information

EE 560 MOS TRANSISTOR THEORY PART 2. Kenneth R. Laker, University of Pennsylvania

EE 560 MOS TRANSISTOR THEORY PART 2. Kenneth R. Laker, University of Pennsylvania 1 EE 560 MOS TRANSISTOR THEORY PART nmos TRANSISTOR IN LINEAR REGION V S = 0 V G > V T0 channel SiO V D = small 4 C GC C BC substrate depletion region or bulk B p nmos TRANSISTOR AT EDGE OF SATURATION

More information

GaN based transistors

GaN based transistors GaN based transistors S FP FP dielectric G SiO 2 Al x Ga 1-x N barrier i-gan Buffer i-sic D Transistors "The Transistor was probably the most important invention of the 20th Century The American Institute

More information

Sub-Boltzmann Transistors with Piezoelectric Gate Barriers

Sub-Boltzmann Transistors with Piezoelectric Gate Barriers Sub-Boltzmann Transistors with Piezoelectric Gate Barriers Raj Jana, Gregory Snider, Debdeep Jena Electrical Engineering University of Notre Dame 29 Oct, 2013 rjana1@nd.edu Raj Jana, E3S 2013, Berkeley

More information

HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7

HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 2 What do digital IC designers need to know? 5 EE4 EECS4 6 3 0< V GS - V T < V DS Pinch-off 7 For (V GS V T )

More information