Process window analysis for contact hole shrinking: A simulation study

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Process window analysis for contact hole shrinking: A simulation study Andreas Erdmann 1, Przemysław Michalak 1, Mohamed Ismail 1,2, Tim Fühner 1, Maxime Argoud 3, Raluca Tiron 3, Ahmed Gharbi 3,

1 Process window analysis for contact hole shrinking: A simulation study Andreas Erdmann 1, Przemysław Michalak 1, Mohamed Ismail 1,2, Tim Fühner 1, Maxime Argoud 3, Raluca Tiron 3, Ahmed Gharbi 3, Juan Carlos Orozco Rey 4, Ulrich Welling 4, Marcus Müller 4 1 Fraunhofer IISB, Schottkystr. 10, Erlangen, Germany 2 Friedrich-Alexander-Universität Erlangen-Nürnberg, MAOT, Paul Gordan Strasse 6, Erlangen, Germany 3 CEA-LETI, MINATEC, 17 Rue des Martyrs, Grenoble, cedex 9, France 3 Institut für Theoretische Physik, Georg-August-Universität, Göttingen, Germany

2 Outline Introduction Modeling approaches for DSA, Ohta-Kawasaki model, experimental process flow, coupled litho-dsa simulations Contact hole shrink Parameter calibration and comparison with experiment Contact multiplication Comparison with experimentally observed morphologies, multiple runs with random initial conditions, impact of segregation strength on process windows Conclusions 2

3 Introduction Modeling approaches for DSA equilibrium 1s 1ms time scale atomistic models continuum models 1ps C H reduced models coarse-grained models length scale 1nm 100 nm 1 mm see: 3

4 Introduction Ohta-Kawasaki model local interactions nonlocal interactions external (guiding pattern) T. Ohta & K. Kawasaki, Macromolecules 19 (1986), O. Wodo et al: J. of Computational Physics 230 (2011), K. Yoshimoto et al.: J. of Photopolymer Science and Technology 26 (2013),

Resist SiARC SOC BCP self-assembly BCP BCP part A BCP part B BCP self assembly Chemical surface

5 Introduction Process flow for contact shrinking SiARC SOC SiARC SOC Resist SiARC SOC SiARC SOC e-beam Si Double SiARC/SOC stack coating Si Resist for guiding pattern litho coating Guiding pattern litho Resist SiARC SOC BCP self-assembly BCP BCP part A BCP part B BCP self assembly Chemical surface affinity control and BCP coating Guiding pattern etching see R. Tiron et al: Proc. SPIE 8680 (2013)

$volume fraction: 0.$ roadrunner model D.

6 Introduction Coupled litho- and DSA simulations e-beam exposure: convolution with a triple Gaussian PSF OK-model: sidewalls: minority attractive substrate: neutral volume fraction: 0.31 photoresist (CAR): roadrunner model D. Flagello et. al., Proc. SPIE 8326 (2012) 83260R T. Fühner et al., Fraunhofer Simulation Workshop, Behringersmühle, September

7 Outline Introduction Modeling approaches for DSA, Ohta-Kawasaki model, experimental process flow, coupled litho-dsa simulations Contact hole shrink Parameter calibration and comparison with experiment Contact multiplication Comparison with experimentally observed morphologies, multiple runs with random initial conditions, impact of segregation strength on process windows Conclusions 7

8 Single Contact Shrink Impact of a-parameter extraction of CD after DSA for single cylinder morphologies a can be tuned to match the length scale (natural period L 0 ) of the BCP and the experimentally observed patterns e 2 = 1.0 8

9 Single Contact Shrink Comparison with experimental data tuning of a and e provides good agreement with the experimentally observed process window a = e 2 = after DSA Ohta-Kawasaki model 9

Single Contact Shrink Is there a unique set of a and e? a = 0.0075 e 2 = 1.4 a = s 0.0075 e 2 = s 1.

10 Single Contact Shrink Is there a unique set of a and e? a = e 2 = 1.4 a = s e 2 = s 1.4 almost no impact on observed morphology & length scale impacts segregation strength -cn parameter 10

Single Contact Shrink Quantitative evaluation for multiple runs with random initial conditions opening yield: probability to obtain a single cylinder diameter of

11 Single Contact Shrink Quantitative evaluation for multiple runs with random initial conditions opening yield: probability to obtain a single cylinder diameter of cylinder of minority block (CD) and template error enhancement factor (TEEF) Y. Ma, L. Lei, A. Torres et al., J. Micro/Nanolith. MEMS MOEMS., 2015, 14,

12 Outline Introduction Modeling approaches for DSA, Ohta-Kawasaki model, experimental process flow, coupled litho-dsa simulations Contact hole shrink Parameter calibration and comparison with experiment Contact multiplication Comparison with experimentally observed morphologies, multiple runs with random initial conditions, impact of segregation strength on process windows Conclusions 12

13 Contact Multiplication Basic phenomenon Resist profile / Guiding pattern after litho Block copolymer after DSA annealing previous modeling studies: A. Latypov et al.: Jpn. J. Appl. Phys. 53 (2014) 06JC01. M. Muramatsu et al.: Proc. SPIE 9049 (2014) N. Laachi et al.: Journal of Polymer Science Part B: Polymer Physics 53 (2015) here: focus on impact of guiding pattern neutral affinity of substrate mostly 2D 13

14 Contact Multiplication Comparison to experiment: calibrated model single contact shrink a = e 2 = 1.4 A. A. Gharbi, R. Tiron, M. Argoud et al., SPIE Advanced Lithography

15 Contact Multiplication Multiple runs with random initial conditions fluctuations of the number of cylinders: increase with aspect ratio very high in transition regions 15

16 Contact Multiplication Metrology extraction of number, positions and sizes of cylinders 16

17 Contact Multiplication Quantitative evaluation for multiple runs with random initial conditions number of cylinders position (y) + CD (x/y), position (x) process windows width guiding pattern: 55nm scaling factor: s=1.0 17

18 Contact Multiplication Impact of scaling factor / segregation strength large process windows require: appropriate L 0 and cn width guiding pattern: 55nm 18

19 Contact Multiplication Impact of width of guiding pattern scaling factor: s=1.2 19

20 Contact Multiplication Prediction of 3D Ohta-Kawasaki model high segregation (s=1.0) low segregation (s=2.0) 20

the lithographically fabricated guiding pattern Quantitative predictability of OK-model depends on:

21 Conclusions DSA process windows are determined by the natural period L 0 and by the segregation strength (cn) of the block copolymers OK model can predict morphologies and their sensitivities to variation of the lithographically fabricated guiding pattern Quantitative predictability of OK-model depends on: natural period L 0 : a combination of a and e with segregation strength: scaling factor s surface affinities 21

22 Acknowledgements Thanks to the CoLiSA.MMP project consortium The research leading to these results has received funding from the European Union Seventh Framework Programme (FP7/ ) under grant agreement no CoLiSA.MMP. 22

23 Single Contact Shrink Prediction of 3D Ohta-Kawasaki model high segregation (s=1.0) low segregation (s=2.0) 23

TEMPLATE AFFINITY ROLE IN CONTACT SHRINK BY DSA PLANARIZATION

TEMPLATE AFFINITY ROLE IN CONTACT SHRINK BY DSA PLANARIZATION A. Gharbi, R. Tiron, M. Argoud, P. Pimenta Barros, S. Bos, G. Chamiotmaitral, I. Servin, A. Fouquet, J. Hazart (CEA-LETI) X. Chevalier, C.