74LVC374 Octal D-type flip-flop; positive edge-trigger (3-State) INTEGRATED CIRCUITS

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1 INTEGRATE CIRCUITS Octal -type flip-flop; positive edge-trigger (3-State) Supersedes data of February 1996 IC24 ata Handbook 1997 Mar 12

2 FEATURES Wide supply voltage range of 1.2V to 3.6V In accordance with JEEC standard no. 8-1A Inputs accept voltages up to 5.5V CMOS low power consumption irect interface with TTL levels 8-bit positive edge-triggered register Independent register and 3-State buffer operation Output drive capability 50 transmission 85 C ESCRIPTION The is a high-performance low-power, low-voltage Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3V or 5V devices. This feature allows the use of these devices as translators in a mixed 3.3V/5V environment. The 74LV374 is an octal -type flip-flop featuring separate -type inputs for each flip-flop and 3-State outputs for bus oriented applications. A clock () and an output enable (OE) input are common to all flip-flops. The eight flip-flops will store the state of their individual -inputs that meet the set-up and hold times requirements on the LOW-to-HIGH transition. When OE is LOW, the contents of the eight flip-flops is available at the outputs. When OE is HIGH, the outputs go to the high impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops. The 374 is functionally identical to the 574 but the 574 has a different pin arrangement. UICK REFERENCE ATA GN = 0V; T amb = 25 C; t r = t f 2.5 ns SYMBOL PARAMETER CONITIONS TYPICAL UNIT t PHL /t PLH f max Propagation delay to n Maximum clock frequency C L = 50pF V CC = 3.3V C L = 50pF V CC = 3.3V 4.8 ns 150 MHz C I Input capacitance 5.0 pf C P Power dissipation capacitance per flip-flop Notes 1 and 2 28 pf NOTES: 1. C P is used to determine the dynamic power dissipation (P in µw) P = C P V 2 CC f i Σ (C L V 2 CC f o ) where: f i = input frequency in MHz; C L = output load capacity in pf; f o = output frequency in MHz; V CC = supply voltage in V; Σ (C L V 2 CC f o ) = sum of the outputs. 2. The condition is V I = GN to V CC ORERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIE NORTH AMERICA NORTH AMERICA PKG. WG. # 20-Pin Plastic SO 40 C to +85 C SOT Pin Plastic SSOP Type II 40 C to +85 C B B SOT Pin Plastic TSSOP Type I 40 C to +85 C PW PW H SOT360-1 PIN CONFIGURATION PIN ESCRIPTION OE 1 20 V CC PIN NUMBER SYMBOL FUNCTION OE Output enable input (active-low) , 5, 6, 9, 12, 15, 16, 19 0 to 7 3-State flip-flop outputs , 4, 7, 8, 13, 14, 17, 18 0 to 7 ata inputs GN Ground (0V) Clock input (LOW-to-HIGH, edge-triggered) GN V CC Positive supply voltage SV Mar

3 LOGIC SYMBOL FUNCTIONAL IAGRAM OE FF1 3-STATE to 13 4 OUTPUTS FF SV OE LOGIC SYMBOL (IEEE/IEC) SV C1 EN1 FUNCTION TABLE OPERATING INPUTS INTERNAL OUTPUTS MOES OE n FLIP-FLOPS 0 to Load and read register Load register and disable outputs L L H H l h l h L H L H H = HIGH voltage level h = HIGH voltage level one set-up time prior to the LOW-to-HIGH transition L = LOW voltage level l = LOW voltage level one set-up time prior to the LOW-to-HIGH transition Z = High impedance OFF-state = LOW to HIGH clock transition L H Z Z SV00340 LOGIC IAGRAM FF1 FF2 FF3 FF4 FF5 FF6 FF7 FF8 OE SV Mar 12 3

4 RECOMMENE OPERATING CONITIONS SYMBOL PARAMETER CONITIONS MIN LIMITS V CC C supply voltage (for max. speed performance) V V CC C supply voltage (for low-voltage applications) V V I C input voltage range V V I/O C input voltage range for I/Os 0 V CC V V O C output voltage range 0 V CC V T amb Operating free-air temperature range C t r, t f Input rise and fall times V CC = 1.2 to 2.7V V CC = 2.7 to 3.6V ABSOLUTE MAXIMUM RATINGS 1 In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GN (ground = 0V). SYMBOL PARAMETER CONITIONS RATING UNIT V CC C supply voltage 0.5 to +6.5 V I IK C input diode current V I 0 50 ma V I C input voltage Note to +5.5 V V I/O C input voltage range for I/Os 0.5 to V CC +0.5 V I OK C output diode current V O V CC or V O 0 50 ma V OUT C output voltage Note to V CC +0.5 V I OUT C output source or sink current V O = 0 to V CC 50 ma I GN, I CC C V CC or GN current 100 ma T stg Storage temperature range 60 to +150 C Power dissipation per package P TOT plastic mini-pack (SO) above +70 C derate linearly with 8 mw/k 500 mw plastic shrink mini-pack (SSOP and TSSOP) above +60 C derate linearly with 5.5 mw/k 500 NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 0 0 MAX UNIT ns/v 1997 Mar 12 4

5 C ELECTRICAL CHARACTERISTICS Over recommended operating conditions. Voltages are referenced to GN (ground = 0V). LIMITS SYMBOL PARAMETER TEST CONITIONS Temp = -40 C to +85 C UNIT MIN TYP 1 MAX V IH V IL HIGH level Input voltage LOW level Input voltage V CC = 1.2V V CC = 2.7 to 3.6V V CC 2.0 V V CC = 1.2V GN V CC = 2.7 to 3.6V 0.8 V V CC = 2.7V; V I = V IH or V IL ; I O = 12mA V CC 0.5 V OH HIGH level output voltage V CC = 3.0V; V I = V IH or V IL ; I O = 100µA V CC 0.2 V CC V V CC = 3.0V; V I = V IH or V IL; I O = 12mA V CC 0.6 V CC = 3.0V; V I = V IH or V IL; I O = 24mA V CC 1.0 V CC = 2.7V; V I = V IH or V IL ; I O = 12mA 0.40 V OL LOW level output voltage V CC = 3.0V; V I = V IH or V IL ; I O = 100µA GN 0.20 V V CC = 3.0V; V I = V IH or V IL; I O = 24mA 0.55 I I Input leakage current V CC =36V; 3.6V; V I = 5.5V 5V or GN Not for I/O pins µa I IHZ /I ILZ Input current for common I/O pins V CC = 3.6V; V I = V CC or GN µa I OZ 3-State output OFF-state current V CC = 3.6V; V I = V IH or V IL ; V O = V CC or GN µa I CC uiescent supply current V CC = 3.6V; V I = V CC or GN; I O = µa I CC Additional quiescent supply current per input pin NOTE: 1. All typical values are at V CC = 3.3V and T amb = 25 C. AC CHARACTERISTICS GN = 0 V; t r = t f 2.5 ns; C L = 50 pf V CC = 2.7V to 3.6V; V I = V CC 0.6V; I O = µa LIMITS SYMBOL PARAMETER WAVEFORM V CC = 3.3V ±0.3V V CC = 2.7V V CC = 1.2V UNIT t PHL /t PLH t PZH /t PZL t PHZ /t PLZ t W t su t h Propagation delay to n 3-State output enable time OE to n 3-State output disable time OE to n Clock pulse width HIGH or LOW Set-up time n to Hold time n to MIN TYP 1 MAX MIN MAX TYP Figures 1, ns Figures 2, ns Figures 2, ns Figure ns Figure ns Figure ns f max Maximum clock pulse frequency Figure MHz NOTE: 1. These typical values are at V CC = 3.3V and T amb = 25 C Mar 12 5

6 AC WAVEFORMS = 1.5V at V CC 2.7V = 0.5V * V CC at V CC 2.7V V OL and V OH are the typical output voltage drop that occur with the output load. V X = V OL + 0.3V at V CC 2.7V V X = V OL + 0.1V CC at V CC < 2.7V V Y = V OH 0.3V at V CC 2.7V V Y = V OH 0.1V CC at V CC < 2.7V 1/f max V I V I INPUT (1) INPUT GN V OH n OUTPUT t PHL t W t PLH GN t su V I n INPUT GN ÎÎÎÎ ÎÎÎÎ t su t h t h ÎÎÎÎÎ Î ÎÎÎÎÎÎÎ V OL V OH SV00708 n OUTPUT Figure 1. Clock () to output (n) propagation delays, the clock pulse width, output transition times and the maximum clock pulse frequency V OL NOTE: the shaded areas indicate when the input is permitted to change for predictable output performance. SV00345 V 1 Figure 3. ata set-up and hold times for the n input to the input OE INPUT TEST CIRCUIT GN V CC OUTPUT LOW-to-OFF OFF-to-LOW V OL t PLZ V X t PZL PULSE GENERATOR V I V CC.U.T. V O S 1 500Ω 2 V CC Open GN t PHZ t PZH R T C L 50pF 500Ω V OH OUTPUT HIGH-to-OFF OFF-to-HIGH GN outputs enabled V Y outputs disabled Figure 2. 3-State enable and disable times outputs enabled SV00344 Test S 1 V CC V I t PLH /t PHL Open 2.7V V CC t PLZ /t PZL 2 V CC 2.7V 3.6V 2.7V t PHZ /t PZH GN Figure 4. Load circuitry for switching times SY Mar 12 6

7 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT Mar 12 7

8 SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT Mar 12 8

9 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT Mar 12 9

10 EFINITIONS ata Sheet Identification Product Status efinition Objective Specification Preliminary Specification Product Specification Formative or in esign Preproduction Product Full Production This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California Telephone Copyright Philips Electronics North America Corporation 1997 All rights reserved. Printed in U.S.A Mar 12 10