DATA SHEET. 74LVC109 Dual JK flip-flop with set and reset; positive-edge trigger INTEGRATED CIRCUITS

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1 INTEGRTED IRUITS DT SHEET Supersedes data of 1998 pr Mar 18

2 FETURES 5 V tolerant inputs for interfacing with 5 V logic Wide supply voltage range from 1.2 to 3.6 V MOS low power consumption Direct interface with TTL levels Inputs accept voltages up to 5.5 V omplies with JEDE standard no. 8-1 ESD protection: HBM EI/JESD exceeds 2000 V MM EI/JESD exceeds 200 V. Specified from 40 to +85 and 40 to DESRIPTION The is a high-performance, low-voltage, Si-gate MOS device, superior to most advanced MOS compatible TTL families. The is a dual positive edge triggered JK flip-flop featuring individual J and K inputs, clock (P) inputs, set (SD) and reset (RD) inputs and complementary Q and Q outputs. The set and reset are asynchronous active LOW inputs and operate independently of the clock input. The J and K inputs control the state changes of the flip-flops as described in the mode select function table. The J and K inputs must be stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation. The JK design allows operation as a D-type flip-flop by tying the J and K inputs together. Schmitt-trigger action in the clock input makes the circuit highly tolerant to slower clock rise and fall times. QUIK REFERENE DT GND = 0 V; T amb =25 ; t r =t f 2.5 ns. SYMBOL PRMETER ONDITIONS TYPIL UNIT t PHL /t PLH propagation delay np to nq L = 50 pf; R L = 500 Ω; V = 3.3 V 3.8 ns and np to nq propagation delay nsd to nq L = 50 pf; R L = 500 Ω; V = 3.3 V 3.2 ns and nrd to nq propagation delay nsd to nq L = 50 pf; R L = 500 Ω; V = 3.3 V 3.5 ns and nrd to nq f max maximum clock frequency L = 50 pf; R L = 500 Ω; V = 3.3 V 330 MHz I input capacitance 5.0 pf PD power dissipation capacitance per flip-flop notes 1 and 2 23 pf Notes 1. PD is used to determine the dynamic power dissipation (P D in µw). P D = PD V 2 f i N+Σ( L V 2 f o ) where: f i = input frequency in MHz; f o = output frequency in MHz; L = output load capacitance in pf; V = supply voltage in Volts; N = total load switching outputs; Σ( L V 2 f o ) = sum of the outputs. 2. The condition is V I = GND to V Mar 18 2

3 FUNTION TBLE See note 1. OPERTING MODES INPUT OUTPUT nsd nrd np nj nk nq nq synchronous set L H X X X H L synchronous reset H L X X X L H Undetermined L L X X X H H Toggle H H h l q q Load 0 (reset) H H l l L H Load 1 (set) H H h h H L Hold no change H H l h q q Note 1. H = HIGH voltage level; h = HIGH voltage level one set-up time prior to the LOW-to-HIGH P transition; L = LOW voltage level; l = LOW voltage level one set-up time prior to the LOW-to-HIGH P transition; q = lower case letters indicate the state of the referenced output one set-up time prior to the LOW-to-HIGH P transition; X = don t care; = LOW-to-HIGH P transition. ORDERING INFORMTION PKGE TYPE NUMBER TEMPERTURE RNGE PINS PKGE MTERIL ODE D 40 to SO16 plastic SOT109-1 DB 40 to SSOP16 plastic SOT338-1 PW 40 to TSSOP16 plastic SOT Mar 18 3

4 PINNING PIN SYMBOL DESRIPTION 1 1RD asynchronous reset input (active LOW) 2 1J synchronous input 3 1K synchronous input 4 1P clock input (LOW-to-HIGH; edge-triggered) 5 1SD asynchronous set input (active LOW) 6 1Q true flip-flop output 7 1Q complement flip-flop output 8 GND ground (0 V) 9 2Q complement flip-flop output 10 2Q true flip-flop output 11 2SD asynchronous set input (active LOW) 12 2P clock input (LOW-to-HIGH; edge-triggered) 13 2K synchronous input 14 2J synchronous input 15 2RD asynchronous reset input (active LOW) 16 V supply voltage handbook, halfpage 1RD 1J V 2RD handbook, halfpage 1SD SD 1K 1P 1SD 1Q 1Q GND J 2K 2P 2SD 2Q 2Q J 2J 1P 2P 1K K SD J Q 1Q 2Q P K FF 1Q Q 2Q RD 1RD 2RD 1 15 MN MN855 Fig.1 Pin configuration SO16 and (T)SSOP16. Fig.2 Logic symbol Mar 18 4

5 handbook, halfpage 5 1SD handbook, halfpage 5 S 2 1J K 1 R (a) S 1J 1 1K R (b) 10 9 MN J 1P J 1K 3 K RD 2SD 2J 2P 2K 13 K P J P SD RD SD RD FF1 Q 1Q Q FF2 1Q Q 2Q Q 2Q RD MN857 Fig.3 IE logic symbol. Fig.4 Functional diagram. handbook, full pagewidth Q K Q J S R P MN859 Fig.5 Logic diagram (one flip-flop) Mar 18 5

6 REOMMENDED OPERTING ONDITIONS SYMBOL PRMETER ONDITIONS MIN. MX. UNIT V supply voltage for maximum speed performance V for low-voltage applications V V I input voltage V V O output voltage 0 V V T amb ambient temperature in free air t r, t f input rise and fall times V = 1.2 to 2.7 V 0 20 ns/v V = 2.7 to 3.6 V 0 10 ns/v LIMITING VLUES In accordance with the bsolute Maximum Rating System (IE 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PRMETER ONDITIONS MIN. MX. UNIT V supply voltage V I IK input diode current V I <0 50 m V I input voltage note V I OK output diode current V O >V or V O <0 ±50 m V O output voltage note V V I O output source or sink current V O =0toV ±50 m I, I GND V or GND current ±100 m T stg storage temperature P tot power dissipation T amb = 40 to +125 ; note mw Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO16 packages: above 70 the value of P tot derates linearly with 8 mw/k. For (T)SSOP16 packages: above 60 the value of P tot derates linearly with 5.5 mw/k Mar 18 6

7 D HRTERISTIS t recommended operating conditions; voltages are referenced to GND (ground = 0 V). SYMBOL PRMETER T amb = 40 to 85 ; note 1 V IH HIGH-level input voltage V IL V OH V OL LOW-level input voltage HIGH-level output voltage LOW-level output voltage TEST ONDITIONS OTHER V (V) MIN. TYP. MX. UNIT 1.2 V V 2.7 to V 1.2 GND V 2.7 to V V I =V IH or V IL I O = 100 µ 2.7 to 3.6 V 0.2 V V I O = 12 m 2.7 V 0.5 V I O = 12 m 3.0 V 0.6 V I O = 24 m 3.0 V 0.8 V V I =V IH or V IL I O = 100 µ 2.7 to 3.6 GND 0.2 V I O = 12 m V I O = 24 m V I LI input leakage current V I = 5.5 V or GND 3.6 ±0.1 ±5 µ I I quiescent supply current additional quiescent supply current per input pin V I =V or GND; I O =0 V I =V 0.6 V; I O = µ 2.7 to µ 2004 Mar 18 7

8 SYMBOL T amb = 40 to 125 V IH HIGH-level input voltage V IL V OH V OL LOW-level input voltage HIGH-level output voltage LOW-level output voltage Note 1. ll typical values are measured at T amb = V V 2.7 to V 1.2 GND V 2.7 to V V I =V IH or V IL I O = 100 µ 2.7 to 3.6 V 0.3 V I O = 12 m 2.7 V 0.65 V I O = 12 m 3.0 V 0.75 V I O = 24 m 3.0 V 1.0 V V I =V IH or V IL I O = 100 µ 2.7 to V I O = 12 m V I O = 24 m V I LI input leakage current V I = 5.5 V or GND 3.6 ±20 µ I I PRMETER quiescent supply current additional quiescent supply current per input pin V I =V or GND; I O =0 V I =V 0.6 V; I O =0 TEST ONDITIONS OTHER V (V) MIN. TYP. MX. UNIT µ 2.7 to µ 2004 Mar 18 8

9 HRTERISTIS GND = 0 V; t r =t f 2.5 ns; L = 50 pf; R L = 500 Ω. SYMBOL PRMETER T amb = 40 to 85 ; note 1 t PHL /t PLH propagation delay np to nq and np to nq t PLH t PHL propagation delay nsd to nq and nrd to nq TEST ONDITIONS WVEFORMS V (V) MIN. TYP. MX. UNIT see Figs 6 and ns ns 3.0 to (2) 6.8 ns see Figs 7 and ns ns 3.0 to (2) 7.0 ns propagation delay nsd to nq and see Figs 7 and ns nrd to nq ns 3.0 to (2) 6.5 ns t W clock pulse width HIGH or LOW see Fig to ns set or reset pulse width HIGH or see Fig to ns LOW t rem removal time nsd, nrd to np see Fig to ns t su set-up time nj and nk to P see Fig to ns t h hold time nj and nk to np see Fig to ns f max maximum clock pulse frequency see Fig to MHz t sk(0) skew note to ns 2004 Mar 18 9

10 SYMBOL T amb = 40 to 125 t PHL /t PLH propagation delay np to nq and np to nq t PLH t PHL PRMETER propagation delay nsd to nq and nrd to nq TEST ONDITIONS WVEFORMS V (V) MIN. TYP. MX. UNIT see Figs 6 and ns 3.0 to ns see Figs 7 and ns 3.0 to ns propagation delay nsd to nq and see Figs 7 and ns nrd to nq 3.0 to ns t W clock pulse width HIGH or LOW see Fig to ns set or reset pulse width HIGH or see Fig to ns LOW t rem removal time nsd, nrd to np see Fig to ns t su set-up time nj and nk to P see Fig to ns t h hold time nj and nk to np see Fig to ns f max maximum clock pulse frequency see Fig to MHz t sk(0) skew note to ns Notes 1. ll typical values are measured at T amb = These typical values are measured at V = 3.3 V. 3. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design Mar 18 10

11 WVEFORMS handbook, full pagewidth V I nj, nk input V M GND t su t h 1/f max t su t h V I np input V M GND t W t PHL t PLH V OH nq output V M V OL V OH nq output V M V OL t PLH t PHL MN860 V M = 1.5 V at V 2.7 V. V M = 0.5V at V < 2.7 V. V OL and V OH are typical output voltage drop that occur with the output load. The shaded areas indicate when the input is permitted to change for predictable output performance. Fig.6 lock input (np) to output (nq and nq) propagation delays, the clock pulse width, the nj and nk to np set-up, the np to nj and nk hold times and the maximum clock pulse frequency Mar 18 11

12 handbook, full pagewidth V I np input V M GND t rem V I nsd input V M GND t W t W V I nrd input V M GND t PLH t PHL V OH nq output V M V OL V OH nq output V M V OL t PHL t PLH MN861 V M = 1.5 V at V 2.7 V. V M = 0.5V at V < 2.7 V. V OL and V OH are typical output voltage drop that occur with the output load. Fig.7 Set (nsd) and reset (nrd) input to output (nq and nq) propagation delays, the set and reset pulse widths and the nrd and nsd to np removal time Mar 18 12

13 V EXT V PULSE GENERTOR V I D.U.T. V O R L RT L R L mna616 V EXT V V I L R L t PLH /t PHL 1.2 V V 50 pf 500 Ω (1) open 2.7 V 2.7 V 50 pf 500 Ω open 3.0 to 3.6 V 2.7 V 50 pf 500 Ω open Note 1. The circuit performs better when R L = 1000 Ω. Definitions for test circuit: R L = Load resistor. L = Load capacitance including jig and probe capacitance. R T = Termination resistance should be equal to Z o of the pulse generator. Fig.8 Load circuitry for switching times Mar 18 13

14 PKGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E X c y H E v M Z 16 9 Q 2 1 ( ) 3 pin 1 index θ L p 1 8 L e b p w M detail X mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches max b p c D (1) E (1) e H (1) E L L p Q v w y Z Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included θ o 8 o OUTLINE VERSION REFERENES IE JEDE JEIT EUROPEN PROJETION ISSUE DTE SOT E07 MS Mar 18 14

15 SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 D E X c y H E v M Z 16 9 Q 2 1 ( ) 3 pin 1 index 1 8 L detail X L p θ e b p w M mm scale DIMENSIONS (mm are the original dimensions) UNIT b p c D (1) E (1) e H E L L p Q v w y Z(1) max. mm θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENES IE JEDE JEIT EUROPEN PROJETION ISSUE DTE SOT338-1 MO Mar 18 15

16 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 D E X c y H E v M Z 16 9 pin 1 index 2 1 Q ( ) 3 θ 1 8 e b p w M L detail X L p mm scale DIMENSIONS (mm are the original dimensions) UNIT b p c D (1) E (2) e H (1) E L L p Q v w y Z max. mm θ o 8 o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENES IE JEDE JEIT SOT403-1 MO-153 EUROPEN PROJETION ISSUE DTE Mar 18 16

17 DT SHEET STTUS LEVEL DT SHEET STTUS (1) PRODUT STTUS (2)(3) DEFINITION I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a ustomer Product/Process hange Notification (PN). Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the bsolute Maximum Rating System (IE 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the haracteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. pplication information pplications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISLIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production ), relevant changes will be communicated via a ustomer Product/Process hange Notification (PN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified Mar 18 17

18 a worldwide company ontact information For additional information please visit Fax: For sales offices addresses send to: Koninklijke Philips Electronics N.V S76 ll rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R20/04/pp18 Date of release: 2004 Mar 18 Document order number: