An Alternative to Error Correction for SRAM-Like PUFs
|
|
- Damian Newton
- 6 years ago
- Views:
Transcription
1 An Alternative to Error Correction for SRAM-Like PUFs Maximilian Hofer and Christoph Boehm Institute of Electronics, Graz University of Technology Abstract. We propose a new technique called stable-puf-marking as an alternative to error correction to get reproducible (i.e. stable) outputs from physical unclonable functions (PUF). The concept is based on e influence of e mismatch on e stability of e PUF-cells output. To use is fact, cells providing a high mismatch between eir crucial transistors are selected to substantially lower e error rate. To verify e concept, a statistical view to is approach is given. Furermore, an SRAM-like PUF implementation is suggested at puts e approach into practice. Keywords: Physical Unclonable Functions, SRAM, Pre-Selection. Introduction Due to e widespread use of Smart Cards and radio frequency identification (RFID) devices, e demand for secure identification/auentication and oer cryptographic applications is continuously increasing. For is purpose a fingerprint of a chip can be useful. Physical unclonable functions (PUFs) provide such an output. In 200, Pappu et al. introduced e concept of PUFs []. In is approach a unique output is produced by evaluating e interference pattern of a transparent optical medium. Unfortunately, due to e way of pattern extraction, Pappu s approach turns out to be quite expensive. In [2,3], Gassend et al. introduce physical unclonable functions in silicon. The concept utilizes manufacturing process variation to distinguish between different implementations of e same integrated circuit (IC). This is done by measuring e frequency of self-oscillating loop circuits. These frequencies differ slightly between e realizations. However, e chip area is large and e current consumption is high. Anoer approach is to use e initial values of SRAM cells. [4,5] shows at ere exist SRAM chips which deliver e same start-up value again and again which is e crucial property of a PUF. The best of em deliver an error rate of less an 3 %. So it seems at SRAM-like structures are feasible as dedicated PUF-cells [6]. One way to deal wi errors in e PUFs responses is to use error-correction codes (ECC) [7]. Here, redundace is added by storing parity bits during an initialization phase. These bits can be used afterwards to reconstruct e reference S. Mangard and F.-X. Standaert (Eds.): CHES 200, LNCS 6225, pp , 200. c International Association for Cryptologic Research 200
2 336 M. Hofer and C. Boehm value. Unfortunately, efficient decoding is difficult. If e error rate is high, e runtime increases strongly [8,9]. Oer meods use statistical data of e fuzziness [0] (i.e. e degree of instability) of e PUF responses. In [0], Maes et. al. read out e response several times to collect data about e stability of e different PUF-cells. An advantage of is Soft Decision Data Helper Algorim is at e number of PUF-cells can be reduced up to 58.4 %. A drawback is at e initialization phase needs a higher number of runs (e.g. 64 in [0]). In is work we propose an alternative meod to deal wi unstable PUFcells. The time needed for e read-out phase is reduced due to e fact at furer post-processing of e PUF response becomes less complex or even needless depending on e application. The remainder of e paper is organized as follows. Section 2 describes e idea behind e concept. In Section 3 a statistical analysis is given. Section 4 provides an approach to an implementation in silicon. Finally, section 5 concludes e paper. In e appendix some additional calculations and tables are given. 2 Idea Figure shows a CMOS SRAM-cell at can be used as a PUF-cell. A whole PUF consists of an application dependent number of such cells. We assume at e design and e layout of at PUF-cell are optimized in such a way at e PMOS transistors match and e NMOS transistors mismatch. In an SRAM PUF, e output which is defined by e state of OUT after power-up, mainly depends on e reshold voltage (V ) mismatch. Assuming identical initial potentials at OUT and OUT, e mismatch of e NMOS transistors lead to a difference between i and i 2 in e two branches of e SRAM cell. If i 2 is higher an i,epotentialatout will move towards V SS,epotentialatOUT will move towards V DD.Ifi 2 is lower an i, e cell behaves e oer way round. This behavior at OUT and OUT should be an intrinsic property of e cell and should not change over time. If e mismatch is too small, e cell result will be unstable due to noise, temperature shifts, and oer shifts in e working point, e.g. caused by changes in V DD. The idea is to select only e stable cells (i.e. ose cells providing a high mismatch) to generate e PUF output. Before e PUF is used for e first time, during an initialization phase e stable PUF-cells are detected. These cells are marked. All e oer PUF-cells are not used any longer. From now on, only stable PUF-cells generate a stable response. This gives rise to e question of how to select e stable bits. An intuitive approach is to measure e results of a PUF-cell repeatedly and chose only ose cells which always provide e same output. For various reasons is is not practicable. First of all, additional measurements must be done to get useful The mismatch s variance of e transistors can be controlled over e transistor area: Smaller area leads to higher mismatch. This means at e analog designer can influence e variance but not e individual value of e mismatch which defines e PUF-cell output.
3 An Alternative to Error Correction for SRAM-Like PUFs 337 Fig.. Common SRAM-cell statistical data and us is not feasible for an initial production test flow where measurement time has proportional impact on e product costs. Anoer problem is at ere are cells which show temperature depending behavior. So e initial measurements would have to be done over e whole temperature range. Furermore, e influence of aging changes e mismatch behavior [5] and could cause additional errors after some time. Anoer approach to find unstable PUF-cells is to use e fact at stable cells decide faster [6]. To detect e fast flipping cells, e decision time has to be measured. In figure 2 is concept is illustrated. After a certain time t useful e Fig. 2. Measurement of decision time (UF:useful,NUF: not useful) cells above an upper reshold or under a lower reshold are marked as useful. All oer cells which lie between e two resholds are marked as not useful. Unfortunately, simulations show at e decision time strongly depends on e temperature. Therefore during e initialization phase a constant temperature is necessary to allow e use of an absolute time t useful. Anoer solution to is problem could be to measure e time spans needed to reach a reshold value. The fastest cells are used. Since it may happen at e fastest cells of a chip are still not fast enough to meet e above requirements a stable behavior can not be expected in all cases.
4 338 M. Hofer and C. Boehm Fig. 3. The mismatch is divided in ree classes: The useful PUF-cells wi positive mismatch (UF +), e useful PUF-cells wi negative mismatch(uf ) and e not useful PUFs (NUF) The approach we propose in is paper is based on e selection of cells which provide a mismatch at exceeds a certain reshold. In e case of e shown SRAM-PUF, e mismatch of e NMOS transistors must be above such a reshold. In figure 3, e mismatch ΔV of two transistors is depicted schematically. Here, is distribution is assumed to be Gaussian. A positive and a negative reshold value (ΔV + and ΔV,wi ΔV + = ΔV ) are defined, which is necessary to divide e PUF-cells into ree classes: e useful PUF-cells wi positive mismatch (UF + ), e useful PUF-cells wi negative mismatch (UF ) and e not useful PUF-cells (NUF). In figure 3, e ree sections are depicted. In e middle section, e mismatch is too small to provide a stable behavior. These bits are marked as NUF. The mismatch of e oer bits is big enough to provide a stable output. Thus, e reshold value must be chosen correctly to reach an acceptable error rate. The larger e reshold value, e smaller e number of PUF-cells at are marked as stable and e smaller e error rate. Thus, to be able to provide e required number of useful cells, e number of initial PUF-cells has to be adapted to e chosen reshold value. For is reason, e reshold value is a trade-off between e ratio of e useful PUF-cells and all PUF-cells and e error rate. One meod to measure ΔV is to use a common analog to digital converter (ADC). In figure 4 a block diagram is shown. The disadvantage of is approach is e size of e ADC caused by e requirements on it. In order to get a balanced output, e ADC must have a small offset. Furermore e ADC has to be fast and e result should not depend on e noise of e circuit. The proposed concept to classify e cells into UF and NUF is to add a systematical V offset to e circuit (see figure 7): Two measurements per PUFcell are needed. During e first measurement we add a negative offset. Thus e reshold is set to V. During e second measurement we move e reshold to V +. This is illustrated in figure 3 denoted by e two arrows. The classification can be done as follows: If e mismatch of e transistors exceeds e
5 An Alternative to Error Correction for SRAM-Like PUFs 339 Fig. 4. Measurement of e mismatch using an ADC reshold, e PUF-cell will provide e same output for bo measurements and us e cell is marked as useful. If e mismatch is too small, e output OUT of e cell will differ for e two measurements. The cell is marked as not useful. Problems will occur if e reshold value is chosen too big. In such a case, only a few or even no cells are marked as useful which can lead to severe problems. On e oer hand, if e reshold is chosen too small, disturbances like noise will lead to output errors and make e whole pre-selection process useless. 3 Modeling and Statistical Aspects To analyze e performance of is approach, Monte Carlo simulations are not feasiblesinceeerrorrateafterepre-selection process (i.e. after e useful- PUF-marking) should be so small at e number of simulation runs to determine e error probability would exceed a tolerable number. So we prefer an analytic meod to estimate e performance of e pre-selection process: For all furer analyses we assume at e distribution of e V mismatch as well as e distribution of e disturbances (noise, temperature-dependent errors, etc.) is Gaussian [,2,3,4]. To determine e effect of e pre-selection process, we need e probability density function (PDF) f(x) and its integral, e cumulative distribution function (CDF) F (x) of a Gaussian: f(x) =φ μ, (x) = 2π e 2( x μ () F (x) =Φ μ, (x) = x e 2( x μ dx, (2) 2π where μ is e mean and e variance of e Gaussian. If ere is no disturbance at e PUF-cell, e cell output will be e same whenever e PUF is read-out. In is case e output would be zero for all PUFcells having a negative ΔV and one for all cells wi positive ΔV (see figure 5a). If ere are disturbances due to noise, temperature, etc., it may happen at if e mismatch is sufficiently small or e disturbance sufficiently large, e decision is defined by is disturbance. That effect can be seen in figure 5b where Φ 2 shows e mean output depending on ΔV taking e distribution of e
6 340 M. Hofer and C. Boehm (a) (b) (c) (d) (e) (f) Fig. 5. (a) Ideal distributions Φ Φ 4.(b) Real distributions Φ Φ 4.(c)Usefulpositive PUF-cells(UF+). (d) Useful negative PUF-cells(UF-). (e) PUF-cells which occur in UF + and UF. (f) Useful PUF-cells(UF) and not-useful PUF-cells(NUF). disturbance into account. At ΔV = 0 e mean output equals 0.5. The same curve but biased wi e reshold ΔV and ΔV + depict Φ 4 and Φ 3. φ is e distribution of e mismatch. After selecting e useful PUF-cells, e error rate can be decreased significantly. Figures 5c and 5d show e product of Φ 3 and φ, and e product of ( Φ 4 )andφ respectively. These curves depict e distribution of being selected as useful including disturbances, e distribution of e V mismatch and a certain V offset. Hence e figures represent e number of selected PUF-cells. Figure 5e shows ose cells at are selected twice, i.e. at are declared to be useful for bo offsets. To get correct results ese double-selections have to be compensated for in e analysis. Figure 5f shows e distributions of selected and not selected cells. Since 2 = 3 = 4 =, μ = μ 2 =0,andμ 3 = μ 4 can be assumed, we get e following equation for e number of useful PUF cells α (see appendix):
7 An Alternative to Error Correction for SRAM-Like PUFs 34 α = 2π μ [ ( ) V 2 ( ) V 2 μ dv + 2 ( ) V 2 μ dv + ( ) V 2 μ dv 2 2π ] dv (3) The error rate e at ΔV can be derived using e following equation (see appendix): e(δv )=φ Φ 2 φ Φ 2 Φ 4 φ Φ 2 Φ 3 Φ 4 +φ Φ 3 φ Φ 3 +φ Φ 3 Φ 4 Φ 2 φ Φ 3 Φ 4, (4) where all φ i and Φ i are evaluated at ΔV. Example. The standard deviation of ΔV is 30 mv, e standard deviation of φ 2,3,4 equals 6.6 mv. This coresponds to an error-rate of 5%. 2 In figure 6 e error rate and e ratio of useful PUF-cells α are shown in a diagram. It can be seen at selecting for example e best 50 % can decrease e error rate significantly. A table of different examples is shown in appendix B. 4 Implementation Different circuits are possible to implement e approach described above. One of em is presented. To understand e circuit we consider an ordinary SRAMcell depicted in figure 7. We assume at P and P 2 match. Hence, e decision depends on e mismatch of e reshold voltage of N and N 2 denoted ΔV. To mark e cells as introduced in section 2, we have to add an additional voltage source at e gate of one of e NMOS transistors to provide e bias we need for e reshold (see figure 7a). Since e implementation of such a circuit is difficult, e preferred way is to use its Norton equivalent - a current source - in parallel to one of e NMOS transistors (see figure 7b). From figure 8, e equivalence of e two circuits can be seen. The characteristics of two different diode-loaded MOSFETS are shown. For e same V GS and different reshold voltages, e amount of current rough e transistors will be different. Thus, additional current at one of e branches of e SRAM-cell acts as a mismatch of V. The circuit depicted in figure 9 is a practical implementation of e approach. During e first phase N 7 is switched-off. N 3, N 4 and P, P 2 are building a SRAM similar circuit. N 2 acts as a current limiter for is circuit. The circuit is designed, at e mismatch between P and P 2 is small and should not affect e result. Due to e fact at e transistors N 3 and N 4 are diode loaded, e 2 We meassured an error-rate of 4% in a dedicated PUF-cell in e temperature range from 0 80 C. So is is a raer pessimistic value.
8 342 M. Hofer and C. Boehm (a) (b) Fig. 6. a) Error rate e. (b) Ratio of useful PUF-cells α against μ 3,4. circuit does not flip as fast as e SRAM depicted in figure. During e second phase, N 7 is switched-on and e circuit flips completely to one direction. The bias transistors which are used for e PUF-cell selection (P 3 and P 4 )areused during e first phase and switched-off during e second phase (P 7 and P 8 are switched-on; P 5 and P 6 are switched-off). If we want to add a fictive negative offset voltage at e transistor N 4, P 8 is opened and P 6 is closed. Thus, e transistor P 4 is in parallel wi transistor P 2. A higher current passes N 4. The same can be done on e right branch (P 7, P 5, P 3 and N 3 ). The tru table for e control of e transistors P 5, P 6, P 7,and P 8 is shown in table. A furer improvement of is circuit can be achieved by separating e mismatching transistors N 3 and N 4 from e evaluation circuit consisting of e transistors N 5 to N 7 and P to P 8. Additionally, two transistors are required to connect each cell to e evaluation circuit. So, one PUF-cell consists of only five
9 An Alternative to Error Correction for SRAM-Like PUFs 343 (a) (b) Fig. 7. (a) SRAM-cell wi additional voltage source at e gate of N ; (b) SRAM-cell wi additional current source at e drain of N. Fig. 8. Characteristics of two MOSFETS having different V transistors as depicted in figure 0. The cells can be selected sequentially and evaluated using e same evaluation circuit (i.e. sense amplifier). Thus, e area of one PUF-cell is scaled-down to about e size of a common SRAM-cell. For e particular topology at is about 00F 2 ( minimum featured size ). In such a circuit it could happen at e mismatch of e evaluation circuit influences e decision. Due to is fact, cells using e same evaluation circuit could tend to output e same value. To reduce e influence of an asymmetric sense amplifier, e number of PUF-cells which use e same evaluation logic should be chosen carefully. The whole structure diagram of e system is depicted in figure. There are two modes: One for e initialization phase and anoer one for e nominal operation. The addresses of e useful cells are stored in a non-volatile memory (NVM). During e initialization phase is memory is filled wi data: The outputs of e single PUF-cells after adding bo bias currents are compared. If e output stays constant for bo bias values, e address of e PUF-cell is written
10 344 M. Hofer and C. Boehm Fig. 9. Implementation example of an SRAM-like PUF wi pre-selection transistors P 3 and P 4 Table. Control of e transistors P 5, P 6, P 7, P 8 for adding e current bias to e circuit function n p init p ninit p init n ninit n no reshold p reshold n reshold Fig. 0. PUF-cells wi shared sense amplifier into e NVM. The address of e NVM is incremented and e next PUF-cell is tested. This is done until e necessary number of outputs is reached. If not enough useful cells are provided an error occurs and e PUF must be considered to be defect. This indicates at e mismatch between e transistors is too small or at e ratio of required PUF-cells and available PUF-cells is too high. Possible solutions to is problem are to increase e number of PUF-cells or to reduce e upper and lower reshold values ΔV and ΔV +. During e nominal mode, e PUF-cells stored in e NVM are read-out.
11 An Alternative to Error Correction for SRAM-Like PUFs Conclusion Fig.. Structure diagram wi initialization logic In is paper we introduced a pre-selection process for SRAM-like PUFs which can be implemented wi little effort. We demonstrated at error-rates of 0E-6 are achievable. Due to e smaller error rate, using e marking procedure makes post-processing less complex or even unnecessary depending on e application. Hence, e area of e digital part of e circuit can be reduced. Furermore, e smaller error rate leads to less power consumption and faster read-out. The additional effort caused by e initialization phase is small since e whole process can be done at one temperature and only two read-out cycles are necessary to separate e stable and e unstable PUF-cells. References. Pappu, R., Recht, R., Taylor, J., Gershenfeld, N.: Physical one-way function. Science 297(5589), (2002) 2. Gassend, B., Clarke, D., van Dijk, M., Devadas, S.: Silicon physical random functions. In: CCS 02: Proceedings of e 9 ACM conference on Computer and communications. security, pp (2002) 3. Blaise, G., Daihyun, L., Dwaine, C., van Dijk, M., Srinivas, D.: Identification and a2entication of integrated circuits. Concurrency Computation: Pract. Exper. 6, (2004) 4. Guajardo, J., Kumar, S.S., Schrijen, G.-J., Tuyls, P.: FPGA Intrinsic PUFs and Their Use for IP Protection. In: Paillier, P., Verbauwhede, I. (eds.) CHES LNCS, vol. 4727, pp Springer, Heidelberg (2007) 5. Boehm, C., Hofer, M.: Using SRAMs as Physical Unclonable Functions. In: Proceedings of e 7 Austrian Workshop on Microelectronics - Austrochip, pp (2009) 6. Ying, S., Holleman, J., Otis, B.P.: A Digital.6 pj/bit Chip Identification Circuit Using Process Variations. IEEE Journal of Solid-State Circuits 43(), (2008) 7. Dodis, Y.: Fuzzy Extractors: How to Generate Strong Keys from Biometrics and Oer Noisy Data. In: Naor, M. (ed.) EUROCRYPT LNCS, vol. 455, pp Springer, Heidelberg (2007) 8. Hong, J., Vitterli, M.: Simple Algorims for BCH Decoding. IEEE Transactions of Communications 43, (995)
12 346 M. Hofer and C. Boehm 9. Boesch, C., Guajardo, J., Sadeghi, A.R., Shokrollahi, J., Tuyls, P.: Efficient Helper Data Key Extractor on FPGAs. In: Oswald, E., Rohatgi, P. (eds.) CHES LNCS, vol. 554, pp Springer, Heidelberg (2008) 0. Maes, R., Tuyls, P., Verbauwhede, I.: Low-Overhead Implementation of a Soft Decision Helper Data Algorim for SRAM PUFs. In: Clavier, C., Gaj, K. (eds.) CHES LNCS, vol. 5747, pp Springer, Heidelberg (2009). Pelgrom, M., Duinmaijer, A., Welbers, A.: Matching Properties of MOS- Transistors. IEEE Journal of Solid-State Circuits 24, (989) 2. Pelgrom, M.J.M., Tuinhout, H.P., Vertregt, M.: Transistor matching in analog CMOS applications. In: International Electron Devices Meeting, IEDM 98 Technical Digest., pp (998) 3. Mizuno, T., Okumtura, J., Toriumi, A.: Experimental study of reshold voltage fluctuation due to statistical variation of channel dopant number in MOSFET s. IEEE Transactions on Electron Devices 4, (994) 4. Tsividis, Y.: The MOS Transistor. Oxford University Pres, New York (999) A Calculations Ratio of Useful PUF-Cells α: Partial probability of occurrence of selected PUF cells depending on ΔV (see figure 7(c) and 7(d)): 3 UF + = φ Φ 3 (5) UF = φ ( Φ 4 ) (6) Probability of occurrence PUF-cells being selected twice depending on ΔV (see figure 7(e)): UF + UF = φ Φ 3 ( Φ 4 ) (7) Total probability of occurrence depending on ΔV : UF = UF + + UF 2(UF + UF )= = φ [Φ 3 +( Φ 4 ) 2Φ 3 ( Φ 4 )] = = φ [ Φ 4 Φ 3 +2Φ 3 Φ 4 ] (8) From UF e ratio of useful PUF-cells α can be determined: α = = 3 2π UF dv = ( ) e V μ 2 2 [ 2π 4 2π μ V 3 2π μ μ The results of is section depend on e reshold values V + andv.
13 4 2π = 2π 3 An Alternative to Error Correction for SRAM-Like PUFs 347 ( ) V 2 ] μ 4 4 dv dv = [ ( ) ( ) V μ 2 V e V 2 μ dv + 4 μ μ 4 4 ] 3 4 2π μ 3 3 dv (9) In general we can assume at 2 = 3 = 4 =, μ = μ2 = 0, and μ 3 = μ 4. Then α becomes: α = 2π μ [ ( ) V 2 ( ) V 2 μ dv + 2 ( ) V 2 μ dv + ( ) V 2 μ dv 2 2π ] dv (0) Ratio of Not-Useful PUF-Cells β: To verify e result of α, eratioβ of not selected PUF-cells is determined as well: β = NUF dv () NUF = φ [( Φ 3 )( ( Φ 4 )+Φ 3 ( Φ 4 ))] = φ [( Φ 3 )(Φ 4 )+Φ 3 ( Φ 4 ))] = φ [Φ 4 Φ 4 Φ 3 + Φ 3 Φ 4 Φ 3 ))] = φ [Φ 4 + Φ 3 2Φ 4 Φ 3 ))] (2) β = + 4 2π 4 2π ( e V μ 2 2π [ 3 2π μ 4 4 μ V 3 2π ] dv = μ μ 3 3
14 348 M. Hofer and C. Boehm [ = ( ) V μ 2 V 2π μ 4 4 μ 4 4 ] π μ μ 3 3 dv (3) In general we can assume at 2 = 3 = 4 =, μ = μ2 = 0, and μ 3 = μ 4. Thus, β becomes: β = 2π [ ( ) + e V 2 μ ] ( ) V 2 μ dv 2 ( ) V 2 μ dv + ( ) V 2 μ dv dv (4) Check: =α + β Estimation of e Error Rate e: An error occurs, if one of e PUF-cells which were marked useful provides e wrong output. Like e total ratio of selected PUFs, e total error e(δv ) is e sum of e two partial errors e (ΔV )and e + (ΔV ). The following errors are evaluated at a certain e(δv ): e (ΔV )= α Φ 2[UF (UF + UF )] = = α Φ 2[φ ( Φ 4 ) φ Φ 3 ( Φ 4 )] (5) e + (ΔV )= α ( Φ 2)[UF + (UF + UF )] = = α ( Φ 2)[φ Φ 3 φ Φ 3 ( Φ 4 )], (6) where α is a normalization factor. e(δv )=e + (ΔV )+e (ΔV )= = α ( Φ 2)[φ Φ 3 φ Φ 3 ( Φ 4 )] + + α Φ 2[φ ( Φ 4 ) φ Φ 3 ( Φ 4 )] = = α {[φ Φ 2 φ Φ 2 Φ 4 φ Φ 2 Φ 3 + φ Φ 2 Φ 3 Φ 4 ]+
15 An Alternative to Error Correction for SRAM-Like PUFs 349 +[φ Φ 3 φ Φ 3 ( Φ 4 )] Φ 2 φ Φ 3 + Φ 2 φ Φ 3 ( Φ 4 )} = = α {φ Φ 2 φ Φ 2 Φ 4 φ Φ 2 Φ 3 Φ 4 + φ Φ 3 φ Φ 3 + φ Φ 3 Φ 4 Φ 2 φ Φ 3 + Φ 2 φ Φ 3 Φ 2 φ Φ 3 Φ 4 } (7) Table 2. Examples for e error rate e and e ratio of useful PUF-cells α. *The number in e brackets shows e BER wiout any pre-selection. num 2, 3, 4 μ 3 = μ 4 α e 30 mv mv( 0.7%*) 5mV E mv mv( 0.7%*) 0 mv e mv 2mV(.5%*) 0 mv E mv 2mV(.5%*0 mv e mv 5mV( 4%*) 0 mv mv 5mV( 4%*0 mv E mv 5mV( 4%*) 40 mv E-9 Table 3. Numeric examples of e error rate e and e ratio of useful PUF-cells α in dependence of μ 3,4( = 30mV, 2,3,4 = 6, 6 mv ). Wiout any pre-selection (μ 3,4 = 0mV) we get an error-rate of about 5%. μ 3,4(mV) e α μ 3,4(mV) e α E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E E
16 350 M. Hofer and C. Boehm To get e error e over all e(δv ), e(δv ) has to be integrated over all ΔV : e = e(δv ) dδv (8) B Numerical Examples Table 2 shows some numeric examples for α and e. The number of useful PUFcells depends mainly on e ratio μ 3,4. The main factors for e error are 2,3,4 and μ 3,4. influences e error rate only marginally. Table 3 shows e in dependence of μ 3,4.
EECS240 Spring Lecture 21: Matching. Elad Alon Dept. of EECS. V i+ V i-
EECS40 Spring 010 Lecture 1: Matching Elad Alon Dept. of EECS Offset V i+ V i- To achieve zero offset, comparator devices must be perfectly matched to each other How well-matched can the devices be made?
More informationE40M. Binary Numbers. M. Horowitz, J. Plummer, R. Howe 1
E40M Binary Numbers M. Horowitz, J. Plummer, R. Howe 1 Reading Chapter 5 in the reader A&L 5.6 M. Horowitz, J. Plummer, R. Howe 2 Useless Box Lab Project #2 Adding a computer to the Useless Box alows us
More informationExtracting Secret Keys from Integrated Circuits
Extracting Secret Keys from Integrated Circuits Daihyun Lim April 5, 005 Abstract Modern cryptographic protocols are based on the premise that only authorized participants can obtain secret keys and access
More informationEECS150 - Digital Design Lecture 26 - Faults and Error Correction. Types of Faults in Digital Designs
EECS150 - Digital Design Lecture 26 - Faults and Error Correction April 25, 2013 John Wawrzynek 1 Types of Faults in Digital Designs Design Bugs (function, timing, power draw) detected and corrected at
More informationAn Accurate Probabilistic Reliability Model for Silicon PUFs
An Accurate Probabilistic Reliability Model for Silicon PUFs Roel Maes Intrinsic-ID, Eindhoven, the Netherlands roel.maes@intrinsic-id.com Abstract. The power of an accurate model for describing a physical
More informationAlgebraic Security Analysis of Key Generation with Physical Unclonable Functions
Algebraic Security Analysis of Key Generation with Physical Unclonable Functions Matthias Hiller 1, Michael Pehl 1, Gerhard Kramer 2 and Georg Sigl 1,3 1 Chair of Security in Information Technology 2 Chair
More informationTopics. Dynamic CMOS Sequential Design Memory and Control. John A. Chandy Dept. of Electrical and Computer Engineering University of Connecticut
Topics Dynamic CMOS Sequential Design Memory and Control Dynamic CMOS In static circuits at every point in time (except when switching) the output is connected to either GND or V DD via a low resistance
More informationPhysically Unclonable Functions
Physically Unclonable Functions Rajat Subhra Chakraborty Associate Professor Department of Computer Science and Engineering IIT Kharagpur E-mail: rschakraborty@cse.iitkgp.ernet.in ISEA Workshop IIT Kharagpur,
More informationA Trustworthy Key Generation Prototype Based on DDR3 PUF for Wireless Sensor Networks
Sensors 2014, 14, 11542-11556; doi:10.3390/s140711542 Article OPEN ACCESS sensors ISSN 1424-8220 www.mdpi.com/journal/sensors A Trustworthy Key Generation Prototype Based on DDR3 PUF for Wireless Sensor
More informationHELPER-LESS PHYSICALLY UNCLONABLE FUNCTIONS AND CHIP AUTHENTICATION. Riccardo Bernardini and Roberto Rinaldo
2014 IEEE International Conference on Acoustic, Speech and Signal Processing (ICASSP) HELPER-LESS PHYSICALLY UNCLONABLE FUNCTIONS AND CHIP AUTHENTICATION Riccardo Bernardini and Roberto Rinaldo DIEGM University
More informationLecture 12 Digital Circuits (II) MOS INVERTER CIRCUITS
Lecture 12 Digital Circuits (II) MOS INVERTER CIRCUITS Outline NMOS inverter with resistor pull-up The inverter NMOS inverter with current-source pull-up Complementary MOS (CMOS) inverter Static analysis
More informationCMOS Inverter. Performance Scaling
Announcements Exam #2 regrade requests due today. Homework #8 due today. Final Exam: Th June 12, 8:30 10:20am, CMU 120 (extension to 11:20am requested). Grades available for viewing via Catalyst. CMOS
More informationDigital Integrated Circuits A Design Perspective. Semiconductor. Memories. Memories
Digital Integrated Circuits A Design Perspective Semiconductor Chapter Overview Memory Classification Memory Architectures The Memory Core Periphery Reliability Case Studies Semiconductor Memory Classification
More informationImpact of parametric mismatch and fluctuations on performance and yield of deep-submicron CMOS technologies. Philips Research, The Netherlands
Impact of parametric mismatch and fluctuations on performance and yield of deep-submicron CMOS technologies Hans Tuinhout, The Netherlands motivation: from deep submicron digital ULSI parametric spread
More informationMicroelectronics Part 1: Main CMOS circuits design rules
GBM8320 Dispositifs Médicaux telligents Microelectronics Part 1: Main CMOS circuits design rules Mohamad Sawan et al. Laboratoire de neurotechnologies Polystim! http://www.cours.polymtl.ca/gbm8320/! med-amine.miled@polymtl.ca!
More informationChapter 2 Process Variability. Overview. 2.1 Sources and Types of Variations
Chapter 2 Process Variability Overview Parameter variability has always been an issue in integrated circuits. However, comparing with the size of devices, it is relatively increasing with technology evolution,
More informationF14 Memory Circuits. Lars Ohlsson
Lars Ohlsson 2018-10-18 F14 Memory Circuits Outline Combinatorial vs. sequential logic circuits Analogue multivibrator circuits Noise in digital circuits CMOS latch CMOS SR flip flop 6T SRAM cell 1T DRAM
More informationDesign for Manufacturability and Power Estimation. Physical issues verification (DSM)
Design for Manufacturability and Power Estimation Lecture 25 Alessandra Nardi Thanks to Prof. Jan Rabaey and Prof. K. Keutzer Physical issues verification (DSM) Interconnects Signal Integrity P/G integrity
More informationEE 330 Lecture 3. Basic Concepts. Feature Sizes, Manufacturing Costs, and Yield
EE 330 Lecture 3 Basic Concepts Feature Sizes, Manufacturing Costs, and Yield Review from Last Time Analog Flow VLSI Design Flow Summary System Description Circuit Design (Schematic) SPICE Simulation Simulation
More informationLecture 13 MOSFET as an amplifier with an introduction to MOSFET small-signal model and small-signal schematics. Lena Peterson
Lecture 13 MOSFET as an amplifier with an introduction to MOSFET small-signal model and small-signal schematics Lena Peterson 2015-10-13 Outline (1) Why is the CMOS inverter gain not infinite? Large-signal
More informationLecture 23: Negative Resistance Osc, Differential Osc, and VCOs
EECS 142 Lecture 23: Negative Resistance Osc, Differential Osc, and VCOs Prof. Ali M. Niknejad University of California, Berkeley Copyright c 2005 by Ali M. Niknejad A. M. Niknejad University of California,
More informationSemiconductor Memories
Semiconductor References: Adapted from: Digital Integrated Circuits: A Design Perspective, J. Rabaey UCB Principles of CMOS VLSI Design: A Systems Perspective, 2nd Ed., N. H. E. Weste and K. Eshraghian
More informationEE 230 Lecture 20. Nonlinear Op Amp Applications. The Comparator Nonlinear Analysis Methods
EE 230 Lecture 20 Nonlinear Op Amp Applications The Comparator Nonlinear Analysis Methods Quiz 14 What is the major purpose of compensation when designing an operatinal amplifier? And the number is? 1
More informationVariable-Length Bit Mapping and Error-Correcting Codes for Higher-Order Alphabet PUFs
Variable-Length Bit Mapping and Error-Correcting Codes for Higher-Order Alphabet PUFs Vincent Immler 1, Matthias Hiller 1, Qinzhi Liu 1,2, Andreas Lenz 3, and Antonia Wachter-Zeh 3 1 Fraunhofer Institute
More informationSecure Key Generation from Biased PUFs
Secure Key Generation from Biased PUFs Roel Maes 1, Vincent van der Leest 1, Erik van der Sluis 1, and Frans Willems 2 1 Intrinsic-ID, Eindhoven, Netherlands {roel.maes, vincent.van.der.leest, erik.van.der.sluis}@intrinsic-id.com
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 23: April 13, 2017 Variation; I/O Circuits, Inductive Noise Lecture Outline! Design Quality " Variation! Packaging! Variation and Testing!
More informationDigital Electronics Part II - Circuits
Digital Electronics Part - Circuits Dr.. J. Wassell Gates from Transistors ntroduction Logic circuits are non-linear, consequently we will introduce a graphical technique for analysing such circuits The
More informationEE 330 Lecture 3. Basic Concepts. Feature Sizes, Manufacturing Costs, and Yield
EE 330 Lecture 3 Basic Concepts Feature Sizes, Manufacturing Costs, and Yield Review from Last Time Analog Flow VLSI Design Flow Summary System Description Circuit Design (Schematic) SPICE Simulation Simulation
More informationChapter 10 Feedback. PART C: Stability and Compensation
1 Chapter 10 Feedback PART C: Stability and Compensation Example: Non-inverting Amplifier We are analyzing the two circuits (nmos diff pair or pmos diff pair) to realize this symbol: either of the circuits
More informationDPA-Resistance without routing constraints?
Introduction Attack strategy Experimental results Conclusion Introduction Attack strategy Experimental results Conclusion Outline DPA-Resistance without routing constraints? A cautionary note about MDPL
More informationLecture 11: MOS Transistor
Lecture 11: MOS Transistor Prof. Niknejad Lecture Outline Review: MOS Capacitors Regions MOS Capacitors (3.8 3.9) CV Curve Threshold Voltage MOS Transistors (4.1 4.3): Overview Cross-section and layout
More informationEECS150 - Digital Design Lecture 26 Faults and Error Correction. Recap
EECS150 - Digital Design Lecture 26 Faults and Error Correction Nov. 26, 2013 Prof. Ronald Fearing Electrical Engineering and Computer Sciences University of California, Berkeley (slides courtesy of Prof.
More informationDigital Integrated Circuits A Design Perspective
Semiconductor Memories Adapted from Chapter 12 of Digital Integrated Circuits A Design Perspective Jan M. Rabaey et al. Copyright 2003 Prentice Hall/Pearson Outline Memory Classification Memory Architectures
More informationS No. Questions Bloom s Taxonomy Level UNIT-I
GROUP-A (SHORT ANSWER QUESTIONS) S No. Questions Bloom s UNIT-I 1 Define oxidation & Classify different types of oxidation Remember 1 2 Explain about Ion implantation Understand 1 3 Describe lithography
More informationECE 342 Electronic Circuits. 3. MOS Transistors
ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to
More information! Charge Leakage/Charge Sharing. " Domino Logic Design Considerations. ! Logic Comparisons. ! Memory. " Classification. " ROM Memories.
ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 9: March 9, 8 Memory Overview, Memory Core Cells Today! Charge Leakage/ " Domino Logic Design Considerations! Logic Comparisons! Memory " Classification
More informationFloating Point Representation and Digital Logic. Lecture 11 CS301
Floating Point Representation and Digital Logic Lecture 11 CS301 Administrative Daily Review of today s lecture w Due tomorrow (10/4) at 8am Lab #3 due Friday (9/7) 1:29pm HW #5 assigned w Due Monday 10/8
More information4.4 The MOSFET as an Amp and Switch
10/31/004 section 4_4 The MSFET as an Amp and Switch blank 1/1 44 The MSFET as an Amp and Switch Reading Assignment: pp 70-80 Now we know how an enhancement MSFET works! Q: A: 1 H: The MSFET as an Amp
More informationEntropy Extraction in Metastability-based TRNG
Entropy Extraction in Metastability-based TRNG Vikram B. Suresh Dept. of Electrical & Computer Engineering University of Massachusetts Amherst, USA vsuresh@ecs.umass.edu Wayne P. Burleson Dept. of Electrical
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 18: March 27, 2018 Dynamic Logic, Charge Injection Lecture Outline! Sequential MOS Logic " D-Latch " Timing Constraints! Dynamic Logic " Domino
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 19: March 29, 2018 Memory Overview, Memory Core Cells Today! Charge Leakage/Charge Sharing " Domino Logic Design Considerations! Logic Comparisons!
More informationTHE INVERTER. Inverter
THE INVERTER DIGITAL GATES Fundamental Parameters Functionality Reliability, Robustness Area Performance» Speed (delay)» Power Consumption» Energy Noise in Digital Integrated Circuits v(t) V DD i(t) (a)
More informationChapter 2 Fault Modeling
Chapter 2 Fault Modeling Jin-Fu Li Advanced Reliable Systems (ARES) Lab. Department of Electrical Engineering National Central University Jungli, Taiwan Outline Why Model Faults? Fault Models (Faults)
More informationWhere Does Power Go in CMOS?
Power Dissipation Where Does Power Go in CMOS? Dynamic Power Consumption Charging and Discharging Capacitors Short Circuit Currents Short Circuit Path between Supply Rails during Switching Leakage Leaking
More informationMOS Transistor Properties Review
MOS Transistor Properties Review 1 VLSI Chip Manufacturing Process Photolithography: transfer of mask patterns to the chip Diffusion or ion implantation: selective doping of Si substrate Oxidation: SiO
More informationSingle Event Effects: SRAM
Scuola Nazionale di Legnaro 29/3/2007 Single Event Effects: SRAM Alessandro Paccagnella Dipartimento di Ingegneria dell Informazione Università di Padova alessandro.paccagnella@unipd.it OUTLINE Introduction
More informationSemiconductor Memory Classification
Semiconductor Memory Classification Read-Write Memory Non-Volatile Read-Write Memory Read-Only Memory Random Access Non-Random Access EPROM E 2 PROM Mask-Programmed Programmable (PROM) SRAM FIFO FLASH
More informationTrapdoor Computational Fuzzy Extractors
1 Trapdoor Computational Fuzzy Extractors Charles Herder, Ling Ren, Marten van Dijk, Meng-Day (Mandel) Yu, Srinivas Devadas cherder@mit.edu, renling@mit.edu, vandijk@engr.uconn.edu, myu@verayo.com, devadas@mit.edu
More informationCMOS Transistors, Gates, and Wires
CMOS Transistors, Gates, and Wires Should the hardware abstraction layers make today s lecture irrelevant? pplication R P C W / R W C W / 6.375 Complex Digital Systems Christopher atten February 5, 006
More informationPreviously. ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Variation Types. Fabrication
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Previously Understand how to model transistor behavior Given that we know its parameters V dd, V th, t OX, C OX, W, L, N A Day
More informationMagnetic core memory (1951) cm 2 ( bit)
Magnetic core memory (1951) 16 16 cm 2 (128 128 bit) Semiconductor Memory Classification Read-Write Memory Non-Volatile Read-Write Memory Read-Only Memory Random Access Non-Random Access EPROM E 2 PROM
More informationRELIABLE BIOMETRIC AUTHENTICATION WITH PRIVACY PROTECTION
RELIABLE BIOMETRIC AUTHENTICATION WITH PRIVACY PROTECTION E. VERBITSKIY, P. TUYLS, D. DENTENEER, J.P. LINNARTZ PHILIPS RESEARCH LABORATORIES PROF. HOLSTLAAN 4, AA 5656 EINDHOVEN, THE NETHERLANDS {EVGENY.VERBITSKIY,PIM.TUYLS,DEE.DENTENEER,J.P.LINNARTZ@PHILIPS.COM}
More informationFuture trends in radiation hard electronics
Future trends in radiation hard electronics F. Faccio CERN, Geneva, Switzerland Outline Radiation effects in CMOS technologies Deep submicron CMOS for radiation environments What is the future going to
More informationAn Analytical Approach to Efficient Circuit Variability Analysis. in Scaled CMOS Design. Samatha Gummalla
An Analytical Approach to Efficient Circuit Variability Analysis in Scaled CMOS Design by Samatha Gummalla A Thesis Presented in Partial Fulfillment of the Requirements for the Degree Master of Science
More informationRESP: A Robust Physical Unclonable Function Retrofitted into Embedded SRAM Array
RESP: A Robust Physical Unclonable Function Retrofitted into Embedded SRAM Array Yu Zheng, Maryam S. Hashemian and Swarup Bhunia Case Western Reserve University, Department of EECS, Cleveland, Ohio, 44106
More informationIntroduction and Background
Analog CMOS Integrated Circuit Design Introduction and Background Dr. Jawdat Abu-Taha Department of Electrical and Computer Engineering Islamic University of Gaza jtaha@iugaza.edu.ps 1 Marking Assignments
More informationCMOS Inverter (static view)
Review: Design Abstraction Levels SYSTEM CMOS Inverter (static view) + MODULE GATE [Adapted from Chapter 5. 5.3 CIRCUIT of G DEVICE Rabaey s Digital Integrated Circuits,, J. Rabaey et al.] S D Review:
More informationGMU, ECE 680 Physical VLSI Design 1
ECE680: Physical VLSI Design Chapter VIII Semiconductor Memory (chapter 12 in textbook) 1 Chapter Overview Memory Classification Memory Architectures The Memory Core Periphery Reliability Case Studies
More informationEVALUATION OF PHYSICAL UNCLONABLE FUNCTIONS
EVALUATION OF PHYSICAL UNCLONABLE FUNCTIONS ECE 646 PROJECT PRESENTATION DEC 11, 2012 YAMINI RAVISHANKAR PHYSICAL UNCLONABLE FUNCTIONS A challenge-response mechanism in which the mapping between a challenge
More informationReducing power in using different technologies using FSM architecture
Reducing power in using different technologies using FSM architecture Himani Mitta l, Dinesh Chandra 2, Sampath Kumar 3,2,3 J.S.S.Academy of Technical Education,NOIDA,U.P,INDIA himanimit@yahoo.co.in, dinesshc@gmail.com,
More informationVLSI Design I. Defect Mechanisms and Fault Models
VLSI Design I Defect Mechanisms and Fault Models He s dead Jim... Overview Defects Fault models Goal: You know the difference between design and fabrication defects. You know sources of defects and you
More informationEE 466/586 VLSI Design. Partha Pande School of EECS Washington State University
EE 466/586 VLSI Design Partha Pande School of EECS Washington State University pande@eecs.wsu.edu Lecture 8 Power Dissipation in CMOS Gates Power in CMOS gates Dynamic Power Capacitance switching Crowbar
More informationMXPUF: Secure PUF Design against State-of-the-art Modeling Attacks
MXPUF: Secure PUF Design against State-of-the-art Modeling Attacks Phuong Ha Nguyen 1, Durga Prasad Sahoo 2, Chenglu Jin 1, Kaleel Mahmood 1, and Marten van Dijk 1 1 University of Connecticut, USA, 2 Robert
More informationAnalysis of flip flop design using nanoelectronic single electron transistor
Int. J. Nanoelectronics and Materials 10 (2017) 21-28 Analysis of flip flop design using nanoelectronic single electron transistor S.Rajasekaran*, G.Sundari Faculty of Electronics Engineering, Sathyabama
More informationFault Injection Modeling Attacks on 65nm Arbiter and RO Sum PUFs via Environmental Changes
Fault Injection Modeling Attacks on 65nm Arbiter and RO Sum PUFs via Environmental Changes Jeroen Delvaux and Ingrid Verbauwhede ESAT/SCD-COSIC and iminds, KU Leuven Kasteelpark Arenberg, B-3 Leuven-Heverlee,
More informationSemiconductor Memories
Introduction Classification of Memory Devices "Combinational Logic" Read Write Memories Non Volatile RWM Read Only Memory Random Access Non-Random Access Static RAM FIFO Dynamic RAM LIFO Shift Register
More informationEE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region
EE105 Fall 014 Microelectronic Devices and Circuits Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel
More informationLecture 12: MOS Capacitors, transistors. Context
Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those
More informationMeasurement and Modeling of MOS Transistor Current Mismatch in Analog IC s
Measurement and Modeling of MOS Transistor Current Mismatch in Analog IC s Eric Felt Amit Narayan Alberto Sangiovanni-Vincentelli Department of Electrical Engineering and Computer Sciences University of
More informationFrom Statistics to Circuits: Foundations for Future Physical Unclonable Functions
From Statistics to Circuits: Foundations for Future Physical Unclonable Functions Inyoung Kim, Abhranil Maiti, Leyla Nazhandali, Patrick Schaumont, Vignesh Vivekraja, and Huaiye Zhang 1 Introduction Identity
More informationA Formal Foundation for the Security Features of Physical Functions
2011 IEEE Symposium on Security and Privacy A Formal Foundation for the Security Features of Physical Functions Frederik Armknecht, Roel Maes, Ahmad-Reza Sadeghi, François-Xavier Standaert, and Christian
More informationPiecewise Curvature-Corrected Bandgap Reference in 90 nm CMOS
IJSTE - International Journal of Science Technology & Engineering Volume 1 Issue 2 August 2014 ISSN(online) : 2349-784X Piecewise Curvature-Corrected Bandgap Reference in 90 nm CMOS P R Pournima M.Tech
More informationNanoscale CMOS Design Issues
Nanoscale CMOS Design Issues Jaydeep P. Kulkarni Assistant Professor, ECE Department The University of Texas at Austin jaydeep@austin.utexas.edu Fall, 2017, VLSI-1 Class Transistor I-V Review Agenda Non-ideal
More informationEvaluation of Non-Quasi-Static Effects during SEU in Deep-Submicron MOS Devices and Circuits
Evaluation of Non-Quasi-Static Effects during SEU in Deep-Submicron MOS s and Circuits Palkesh Jain Texas Instruments, Banglore, India palkesh@ti.com D. V. Kumar, J. M. Vasi, and M. B. Patil Department
More informationChapter 13 Small-Signal Modeling and Linear Amplification
Chapter 13 Small-Signal Modeling and Linear Amplification Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 1/4/12 Chap 13-1 Chapter Goals Understanding of concepts related to: Transistors
More informationUniqueness Enhancement of PUF Responses Based on the Locations of Random Outputting RS Latches
Uniqueness Enhancement of PUF Responses Based on the Locations of Random Outputting RS Latches Dai Yamamoto 1, Kazuo Sakiyama 2, Mitsugu Iwamoto 2, Kazuo Ohta 2, Takao Ochiai 1, Masahiko Takenaka 1 and
More informationEE 435. Lecture 23. Common Mode Feedback Data Converters
EE 435 Lecture 3 Common Mode Feedback Data Converters Review from last lecture Offset Voltage Distribution Pdf of zero-mean Gaussian distribution f(x) -kσ kσ x Percent between: ±σ 68.3% ±σ 95.5% ±3σ 99.73%
More informationAdministrative Stuff
EE141- Spring 2004 Digital Integrated Circuits Lecture 30 PERSPECTIVES 1 Administrative Stuff Homework 10 posted just for practice. No need to turn in (hw 9 due today). Normal office hours next week. HKN
More informationFig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B)
1 Introduction to Transistor-Level Logic Circuits 1 By Prawat Nagvajara At the transistor level of logic circuits, transistors operate as switches with the logic variables controlling the open or closed
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 23: April 17, 2018 I/O Circuits, Inductive Noise, CLK Generation Lecture Outline! Packaging! Variation and Testing! I/O Circuits! Inductive
More informationLecture 12 Circuits numériques (II)
Lecture 12 Circuits numériques (II) Circuits inverseurs MOS Outline NMOS inverter with resistor pull-up The inverter NMOS inverter with current-source pull-up Complementary MOS (CMOS) inverter Static analysis
More informationECE Branch GATE Paper The order of the differential equation + + = is (A) 1 (B) 2
Question 1 Question 20 carry one mark each. 1. The order of the differential equation + + = is (A) 1 (B) 2 (C) 3 (D) 4 2. The Fourier series of a real periodic function has only P. Cosine terms if it is
More informationLecture 14 - Digital Circuits (III) CMOS. April 1, 2003
6.12 - Microelectronic Devices and Circuits - Spring 23 Lecture 14-1 Lecture 14 - Digital Circuits (III) CMOS April 1, 23 Contents: 1. Complementary MOS (CMOS) inverter: introduction 2. CMOS inverter:
More informationEE141Microelettronica. CMOS Logic
Microelettronica CMOS Logic CMOS logic Power consumption in CMOS logic gates Where Does Power Go in CMOS? Dynamic Power Consumption Charging and Discharging Capacitors Short Circuit Currents Short Circuit
More informationECE520 VLSI Design. Lecture 23: SRAM & DRAM Memories. Payman Zarkesh-Ha
ECE520 VLSI Design Lecture 23: SRAM & DRAM Memories Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Wednesday 2:00-3:00PM or by appointment E-mail: pzarkesh@unm.edu Slide: 1 Review of Last Lecture
More informationMOSFET: Introduction
E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major
More informationLecture 6 Power Zhuo Feng. Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 2010
EE4800 CMOS Digital IC Design & Analysis Lecture 6 Power Zhuo Feng 6.1 Outline Power and Energy Dynamic Power Static Power 6.2 Power and Energy Power is drawn from a voltage source attached to the V DD
More informationECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN
ECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN CMOS PROCESS CHARACTERIZATION VISHAL SAXENA VSAXENA@UIDAHO.EDU Vishal Saxena DESIGN PARAMETERS Analog circuit designers care about: Open-loop Gain: g m r o
More informationVLSI Design and Simulation
VLSI Design and Simulation CMOS Inverters Topics Inverter VTC Noise Margin Static Load Inverters CMOS Inverter First-Order DC Analysis R p V OL = 0 V OH = R n =0 = CMOS Inverter: Transient Response R p
More informationESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals
University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals ESE570, Spring 2018 Final Monday, Apr 0 5 Problems with point weightings shown.
More informationChoice of V t and Gate Doping Type
Choice of V t and Gate Doping Type To make circuit design easier, it is routine to set V t at a small positive value, e.g., 0.4 V, so that, at V g = 0, the transistor does not have an inversion layer and
More informationNovel Strong PUF based on Nonlinearity of MOSFET Subthreshold Operation
Novel trong PUF based on Nonlinearity of MOFET ubthreshold Operation Mukund Kalyanaraman and Michael Orshansky Department of Electrical and Computer Engineering The University of Texas at Austin email:{mukundkm,orshansky}@utexas.edu
More informationEECS 312: Digital Integrated Circuits Midterm Exam 2 December 2010
Signature: EECS 312: Digital Integrated Circuits Midterm Exam 2 December 2010 obert Dick Show your work. Derivations are required for credit; end results are insufficient. Closed book. No electronic mental
More informationAuthor : Fabrice BERNARD-GRANGER September 18 th, 2014
Author : September 18 th, 2014 Spintronic Introduction Spintronic Design Flow and Compact Modelling Process Variation and Design Impact Semiconductor Devices Characterisation Seminar 2 Spintronic Introduction
More informationTowards a Unified Security Model for Physically Unclonable Functions
Towards a Unified Security Model for Physically Unclonable Functions Frederik Armknecht 1, Daisuke Moriyama 2, and Ahmad-Reza Sadeghi 3 and Moti Yung 4 1 University of Mannheim, Germany 2 NICT, Japan 3
More informationElectrical modeling of the photoelectric effect induced by a pulsed laser applied to an SRAM cell
Electrical modeling of the photoelectric effect induced by a pulsed laser applied to an SRAM cell A. Sarafianos, C. Roscian, Jean-Max Dutertre, M. Lisart, A. Tria To cite this version: A. Sarafianos, C.
More informationSimple and accurate modeling of the 3D structural variations in FinFETs
Simple and accurate modeling of the 3D structural variations in FinFETs Donghu Kim Electrical Engineering Program Graduate school of UNIST 2013 Simple and accurate modeling of the 3D structural variations
More informationECE321 Electronics I
ECE321 Electronics I Lecture 1: Introduction to Digital Electronics Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Tuesday 2:00-3:00PM or by appointment E-mail: payman@ece.unm.edu Slide: 1 Textbook
More informationDigitally Assisted A/D Conversion- Trading off Analog Precision for Computing Power
Digitally Assisted A/D Conversion- Trading off Analog Precision for Computing Power UCB IC-Seminar November 25, 2002 Boris Murmann Prof. Bernhard E. Boser Outline Motivation Research Overview Analog Errors
More informationSemiconductor Memories
!"#"$%&'()$*#+%$*,' -"+./"$0 1'!*0"#)'2*+03*.$"4* Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic Semiconductor Memories December 20, 2002 !"#$%&'()*&'*+&, Memory Classification Memory Architectures
More information