A Temporary Bonding and Debonding Technology for TSV Fabrication. Masahiro Yamamoto TEL 3DI Dept. ATS BU
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1 A Temporary Bonding and Debonding Technology for TSV Fabrication Masahiro Yamamoto TEL 3DI Dept. ATS BU
2 Contents About TEL Temporary Bonder Debonder Process Trends Bonder/Debonder System Outlook Summary M. Yamamoto / TEL 3DI Dept. /
3 Contents About TEL Temporary Bonder Debonder Process Trends Bonder/Debonder System Outlook Summary M. Yamamoto / TEL 3DI Dept. /
4 Core Business Activity Established: November 11, 1963 Employees: 11,355 (as of April 1, 2014) Electronic Components/ Computer Networks* Semiconductor Products Computer Networks Software Boards and General Electronic Components PV Production 1% Equipment** Business Sectors 16% 78% 5% Semiconductor Production Equipment Coater/Developer Plasma Etch System Thermal Processing System Single Wafer Deposition System Cleaning System Wafer Prober Others FPD Production Equipment FPD Coater/Developer FPD Plasma Etch/Ash System FY2014 Consolidated Net Sales: billion yen *Tokyo Electron Device Limited which operates Electronic Components and Computer Networks business had changed from a consolidated subsidiary to an equity method affiliate since Ap ril, **Tokyo Electron Limited had withdrawn from PV production equipment business as of the end of March (Maintaining support for delivered equipment.) M. Yamamoto / TEL 3DI Dept. /
5 Worldwide Presence (As of April 1, 2014) USA Albany Albuquerque Allen Austin Boise Billerica Chaska Fishkill Fremont Malta Manassas Phoenix Portland Salt Lake City Washington Sales/Field Service R&D/Manufacturing/Engineering Parts Centre Hermes-Epitek Sales & Field Service Europe <U.K.> Crawley <France> Grenoble <Germany> Dresden Wessling <Italy> Avezzano Catania Agrate Brianza <Ireland> Dublin Maynooth <Netherland> Nijmegen <Switzerland> Trübbach Neuchâtel <Israel> Kiryat Gat <Russia> Moscow Asia <Korea> <China> Bundang Ch Shanghai eonan CheoBeijing ngju Dalian Gumi Wuxi Hwaseong Kunshan Icheon <Singapore> Paju <Malaysia> <Taiwan> Kulim Hsin-chu Kuching Tainan Taichung Japan Tokyo Osaka Iwate Yamanashi Kumamoto Miyagi Sapporo etc. M. Yamamoto / TEL 3DI Dept. /
6 Worldwide Presence imec (Belgium) CEA-Leti (France) Korea TEL Technology Center, Korea U.S. TEL Technology Center, America SEMATECH (US) Albany NanoTech (US) Taiwan TEL Technology Center, Taiwan Japan Leading-edge Process Development Center TEL R&D base Consortium SEMATECH will end the development of 3DI. TEL will establish with IME in the bonder joint Lab. M. Yamamoto / TEL 3DI Dept. /
7 China Mainland Operations (As of Dec31, 2014) 北京 大连 西安 无锡 成都 武汉 昆山 上海 Head Office Branch 厦门 Manufacture 深圳 Service Site Parts Center 东电电子 ( 上海 ) 有限公司东电电子 ( 北京 ) 分公司东电电子 ( 无锡 ) 分公司东电电子 ( 西安 ) 分公司东电光电半导体设备 ( 昆山 ) 有限公司 M. Yamamoto / TEL 3DI Dept. /
8 Products and Services Semiconductor Production Equipment Coater/Developer Plasma Etch System (total dry etch) Thermal Processing System Single Wafer Deposition System Cleaning System Wafer Prober Source: Gartner, "Market Share: Semiconductor Manufacturing Equipment, Worldwide, March Calculation performed by Tokyo Electron. M. Yamamoto / TEL 3DI Dept. /
9 Competitors Source : VLSI Research (April 2014) M. Yamamoto / TEL 3DI Dept. /
10 ATS BU: Assembly and TEST System Business Unit ATS BU Business Domain Design Front End Process Mid End Process Back End Process -FEOL -BEOL -Wafer Level (TSV, Si IP, WLP) -FOWLP/PSP -FOWLP/PSP IDM Fabless Foundry OSAT Package ATSBU Target Area is Mid~Back End Process including Test M. Yamamoto / TEL 3DI Dept. /
11 TEL ATSBU Technology Offerings CLEAN TRACK LITHIUS Pro Patterning 3DI TSV Synapse Z Wafer de-bonder Synapse V Temp. wafer bonder WLP/Advanced PKG CLEAN TRACK LITHIUS Pro Patterning APOLLO Physical Vapor Deposition Precio nano Wafer Prober TEST WDF TM 12DP Dicing Frame Prober Tactras FAVIAS Deep Si etcher CELLESTA + Cleaning STRATUS Electro-Chemical Deposition Synapse S Fusion wafer bonder STRATUS Electro-Chemical Deposition ATS BU Products Comprehensive manufacturing solutions for 3DI/WLP/TEST Used Machines are also available (Blade) FWC Multi-cell Test System M. Yamamoto / TEL 3DI Dept. /
12 Contents About TEL Temporary Bonder Debonder Process Trends Bonder/Debonder System Outlook Summary M. Yamamoto / TEL 3DI Dept. /
13 Via Middle TSV Wafer Process - Via Middle Process - FEOL TSV Etch/Liner/ Metal /CMP Anneal CMP BEOL Temporary Bond Thinning Cu Reveal RDL Debond Target Application Thin wafer handling is key process for TSV 3D IC & TSV 2.5D Interposers Temporary wafer bonder Synapse TM V Mechanical wafer debonder Synapse TM Z Plus M. Yamamoto / TEL 3DI Dept. /
14 De Bond Glue Bond Temporary Bonder/Debonder - Key Process & Performance - Key Process Bonding Back Grinding CVD Litho Etching Debond Cleaning Key Performance Void Hole Burst Profile Error TTV DOF Profile Error Bonding Accuracy Edge Coverage Chipping Chipping Notch Detect Warpage Handling Handling Modulus Burn Stick Unsticking Unsticking Heat Resistance Chemical Resistance Debondability Cleaning Properties Unsticking Developing Debondability Cleaning Properties Debond Force Cleaning Performance M. Yamamoto / TEL 3DI Dept. /
15 Temporary Bonder / Debonder Trend Thin wafer handling method is changed by application trends. Mechanical debond method is selected for 3D TSV application Market Needs Debond Method Solvent Release Laser/UV Debond Feature Initial thin wafer handling method for power device and MEMS Wafer warpage issue Expensive Hole Glass Carrier Low Throughput <2wph Mainly 2.5D application Easy to remove carrier wafer Expensive good TTV glass wafer Wafer warpage issue Mechanical Debond Mainly 3D application Silicon carrier capable Good wafer warpage < 100um TEL focus mechanical debond method! M. Yamamoto / TEL 3DI Dept. /
16 TEL Thin Wafer Handling System Lineup Key words: Productivity, Reliability, High Performance Temporary wafer bonder Synapse TM V Mechanical wafer debonder Synapse TM Z Plus HVM R&D Key words: Low Cost, High Performance, Flexibility S/A Glue S/A S/A wafer bonder Coater/Baker Debonder/Cleaner M. Yamamoto / TEL 3DI Dept. /
17 Contents About TEL Temporary Bonder Debonder Process Trends Bonder/Debonder System Outlook Summary M. Yamamoto / TEL 3DI Dept. /
18 Room Temperature Temporary Bonder/Debonder System Concept Genuine tool designed for high volume manufacturing Enough 300mm fab automation and software experience Temporary Wafer Bonder Synapse TM V Temporary Wafer Bonder System Feature Supports entire temporary wafer bonding process from material coat to wafer bond Open platform for glue material <5% TTV for glue thickness Void less bonding quality High alignment accuracy <+/-30um Peel Off Wafer Debonder Synapse TM Z Plus Peel Off Wafer Debonder System Feature Supports entire wafer debonding process on tape from debonding to device wafer cleaning Open platform for room temperature debonding material Chipping less peel off debonding technology M. Yamamoto / TEL 3DI Dept. /
19 Temporary Bonding Process Tri Layer Wafer Bonding Carrier Wafer Glue Coat Bake Coater/Oven Bonding Device Wafer Protection Layer Coat Bake Release Layer Coat Bake Coater/Oven Coater/Oven Bonder Key Performance TTV Void less Edge Coverage Warpage Alignment Accuracy Backside/Bevel care M. Yamamoto / TEL 3DI Dept. /
20 Debonding Process Tri Layer Material Wafer Debonding Device wafer /w Carrier wafer Mechanical Debond Device wafer Cleaning Device wafer Debonder DF Cleaner Carrier wafer Key Performance Debond Capability Chipping/Crack Care Cleaning Capability M. Yamamoto / TEL 3DI Dept. /
21 Glue Consumption T/P [wph] TEL Room Temp Temporary Bonder/Debonder Development Target Expand adhesive choice for several application Enhance productivity for TSV HVM Optimize Throughput Double system T/P from current Optimize tool configuration Minimize tool overhead time Mature coating process and glue character Synapse V, Z Plus T/P Target x2 Current HVM Reduce Glue Consumption Half glue consumption Optimize coating recipe Design new coating nozzle Synapse V Glue Consumption Target x1/2 Current HVM *TEL internal Comparison M. Yamamoto / TEL 3DI Dept. /
22 Contents About TEL Temporary Bonder Debonder Process Trends Bonder/Debonder System Outlook Summary M. Yamamoto / TEL 3DI Dept. /
23 Summary In order to successfully handle TSV thin wafers during before di cing, temporary bonder and debonder are one of key process. TEL focus on mechanical debond method. In temporary bonding process, optimization of both material co ating and bonding are important. In mechanical debonding process, debonding force control is important. TEL can provide the best solution for HVM. M. Yamamoto / TEL 3DI Dept. /
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