R. Ludwig and G. Bogdanov RF Circuit Design: Theory and Applications 2 nd edition. Figures for Chapter 6
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1 R. Ludwig and G. Bogdanov RF Circuit Design: Theory and Applications 2 nd edition Figures for Chapter 6 Free electron Conduction band Hole W g W C Forbidden Band or Bandgap W V Electron energy Hole Valence band (a) Planar representation of covalent bonds (b) Energy band levels Figure 6-1 Lattice structure and energy levels of silicon. (a) schematic planar crystal arrangement with thermal breakup of one valent bond resulting in a hole and a moving electron for T > 0 K. (b) equivalent energy band level representation whereby a hole is created in the valence band W V and an electron is produced in the conduction band W C. The energy gap between both bands is indicated by W g.
2 Table 6-1 Effective concentrations and effective mass values at T = 300 K Semiconductor m n */m 0 m p */m 0 N C, cm 3 N V, cm 3 n i, cm 3 licon () Germanium (Ge) Gallium Arsenide (GaAs)
3 10 2 Conductivity, Ω 1 cm Ge GaAs Temperature, ºC Figure 6-2 Conductivity of, Ge, GaAs in the range from 50 C to 250 C.
4 P B Conduction band Conduction band Conduction band W C W F W F W C W D W C Valence band W V Valence band W F W V Valence band (a) Intrinsic (b) n-type (c) p-type W A W V Figure 6-3 Lattice structure and energy band model for (a) intrinsic, (b) n-type, and (c) p-type semiconductors at no thermal energy. W D and W A are donor and acceptor energy levels.
5 Electric field Hole diffusion current p-type I F n-type Electron diffusion current Space charge x = 0 Space charge x Figure 6-4 Current flows in the pn-junction.
6 p-type n-type Space charge Space charge x = 0 d p d n (a) pn-junction with space charge extent x n, p p p = N A (majority carrier) n n = N D (majority carrier) n p < < p p d p d n p n < < n n (b) Acceptor and donor concentrations x (x) d p d n x qn A qn D (c) Polarity of charge density distribution E d p d n x E 0 = qn A d p /( r 0 ) (d) Electric field distribution Figure 6-5 The pn-junction with abrupt charge carrier transition in the absence of an externally applied voltage.
7 V(x) V diff d p d n x (e) Barrier voltage distribution Figure 6-5 The pn-junction with abrupt charge carrier transition in the absence of an externally applied voltage. (Continued)
8 p n p n Space charge distribution in the pn-junction E E x x Electric field distribution in the pn-junction V V V A V diff x d p d n d p d n Voltage distribution in the pn-junction (a) Reverse biasing (V A < 0) (b) Forward biasing (V A > 0) V A x Figure 6-6 directions. External voltage applied to the pn-junction in reverse and forward
9 7 6 Junction capacitance C, pf V diff Applied voltage V A, V 1 Figure 6-7 The pn-junction capacitance as a function of applied voltage.
10 I/I 0 7 p I V A n V A /V T Figure 6-8 Current-voltage behavior of pn-junction based on Shockley equation.
11 I W C W F W F W V V A Metal p-semiconductor (a) Energy band model (b) Voltage-current characteristic Figure 6-9 Metal electrode in contact with p-semiconductor.
12 Free electron energy level q W S W F W M W C W F W F W b qv d qv C W C W F W V W V Metal n-semiconductor x Metal n-semiconductor x (a) d s (b) Figure 6-10 Energy band diagram of Schottky contact, (a) before and (b) after contact.
13 Table 6-2 Work function potentials of some metals Material lver (Ag) Aluminum (Al) Gold (Au) Chromium (Cr) Molybdenum (Mo) Nickel (Ni) Palladium (Pd) Platinum (Pt) Titanium (Ti) Work Function Potential, V M 4.26 V 4.28 V 5.10 V 4.50 V 4.60 V 5.15 V 5.12 V 5.65 V 4.33 V
14 Metal contact Depletion region Metal contact O 2 O 2 C J R J n-type epitaxial layer n + -type substrate n n + R epi R sub R S C g Metal contact Metal contact Figure 6-11 Cross-sectional view of Schottky diode.
15 R J L S R S C J C g Figure 6-12 Circuit model of typical Schottky diode under forward bias.
16 Metal contact O 2 O 2 n-type epitaxial layer p-type ring n + -type substrate Metal contact Figure 6-13 Schottky diode with additional isolation ring suitable for very high frequency applications.
17 p + O 2 I = n p + I = n O 2 n + n + -type substrate (a) mplified structure of a PIN diode (b) Fabrication in mesa processing technology Figure 6-14 PIN diode construction.
18 Z G = Z 0 V G R J (V Q ) Z L = Z 0 (a) Forward bias Z G = Z 0 V G C J Z L = Z 0 (b) Reverse bias (isolation) Figure 6-15 PIN diode in series connection.
19 DC bias C B RFC C B RF in RF out PIN Diode RFC (a) Series connection of PIN diode DC bias C B RFC C B RF in RF out PIN Diode RFC C B (b) Shunt connection of PIN diode Figure 6-16 Attenuator circuit with biased PIN diode in series and shunt configurations.
20 Transducer loss, db V G Z G = Z 0 R J (V Q ) Z L = Z Junction resistance R J, Ω Figure 6-17 Transducer loss of series connected PIN diode under forward-bias condition. The diode behaves as a resistor.
21 70 Z G = Z 0 Transducer loss, db CJ = 0.1 pf 0.3 pf 0.6 pf 1.3 pf 2.5 pf V G C J Z L = Z MHz 100 MHz 1 GHz 10 GHz 100 GHz Frequency Figure 6-18 Transducer loss of series connected PIN diode under reverse-bias condition. The diode behaves as a capacitor.
22 0.20 Capacitance C V, pf R S C V (V Q ) C V0 = 0.2 pf, V diff = 0.5 V Biasing voltage V Q, V Figure 6-19 mplified electric circuit model and capacitance behavior of varactor diode.
23 R I V V A Varactor V out V A, I V V A I V t V out t V t Figure 6-20 Pulse generation with a varactor diode.
24 + + n + p I p + Hole + E W Impact Electron (a) Layer structure and electric field profile x + (b) Impact ionization Figure 6-21 IMPATT diode behavior.
25 V A π 2π 3π 4π T I ion I π 2π 3π 4π T π 2π 3π 4π T Figure 6-22 Applied voltage, ionization current, and total current of an IMPATT diode.
26 R L C L C ion L ion Figure 6-23 Electric circuit representation for the IMPATT diode.
27 W Cp W g n + W Vp p + W Fn W Cn V diff W Fp W g + W Vn d Figure 6-24 Tunnel diode and its band energy representation.
28 B E B E B E B E B E B p + p + p + p + p + p + p-base n + n + n + n + n + n-type collector C (a) Cross-sectional view of a multifinger bipolar junction transistor Base bonding pad n + emitter contacts Metallization p + base contacts p base well Emitter bonding pad (b) Top view of a multifinger bipolar junction transistor Figure 6-25 Interdigitated structure of high-frequency BJT.
29 Dielectric E n + n-gaalas C B B n + p-substrate n p + Figure 6-26 Cross-sectional view of a GaAs heterojunction bipolar transistor involving a GaAlAs-GaAs interface.
30 Electron recombination Hole recombination B Hole injection C electron collection electron diffusion electron injection n-type collector p-type base n-type emitter B I B V CB E E E (a) (b) (c) + C + I C V + CE V BE I E B C Figure 6-27 npn transistor: (a) structure with electrical charge flow under forward active mode of operation, (b) transistor symbol with voltage and current directions, and (c) diode model.
31 I C R C R B I B V V BE BB + V CE V CC (a) Biasing circuit for npn BJT in common-emitter configuration I B Load line 1/R B I C Load line 1/R C V BB /R B V CC /R C I B4 I B Q Q V BE Q point V BB (b) Input characteristic of transistor V BE I C Q Saturation Q V CE Q point Cutoff V CC I B3 I B2 I B1 (c) Output characteristic of transistor Increasing base current V CE Figure 6-28 Biasing and input, output characteristics of an npn BJT.
32 Table 6-3 BJT parameter nomenclature Parameter description Emitter (n-type) Base (p-type) Doping level E N D B N A Collector (n-type) C N D Minority carrier concentration in thermal equilibrium E p n0 2 E B = n i ND n p0 2 B C = n i NA p n0 = 2 C n i ND Majority carrier concentration in thermal equilibrium E n n0 B p p0 C n n0 Spatial extent d E d B d C
33 Forward-biased junction B Reverse-biased junction E n B p n n E p (0) p n (0) C I E C I C B p n 0 E p n0 n p0 x = d E x = 0 x = d B x = d B + d C x Figure 6-29 Minority carrier concentrations in forward active BJT.
34 Reverse-biased junction B Forward-biased junction n p B C n p (d B ) p n (d B ) n E C I E E p n 0 B n p0 C p n0 I C x = d E x = 0 x = d B x = d B + d C x Figure 6-30 Reverse active mode of BJT.
35 20 Transition frequency f T, GHz Collector current I C, ma Figure 6-31 Transition frequency as a function of collector current for the 17 GHz npn wideband transistor BFG403W (courtesy of NXP).
36 140 Current gain I C /I B T j = 100 C T j = 50 C T j = 0 C T j = 50 C T j = 150 C Collector current I C, ma Figure 6-32 Typical current gain β F as a function of collector current for various junction temperatures at a fixed V CE.
37 10 T j = 150 C Base current I B, ma T j = 100 C T j = 50 C T j = 0 C 2 T j = 50 C Base-emitter voltage V BE, V Figure 6-33 Typical base current as a function of base-emitter voltage for various junction temperatures at a fixed V CE.
38 Heat sink Emitter R thjs Ceramic cover Base P th R thjs T j R thcs Die R thcs T c R thha Power BJT R thha T h T a Collector T a Figure 6-34 Thermal equivalent circuit of BJT.
39 I C I Cmax P Vmax = V CEmax I Cmax SOAR V CElimit V CE Figure 6-35 Operating domain of BJT in active mode with breakdown mechanisms.
40 Insulator Source Gate Drain n + p-type substrate n + induced n-channel (a) Metal insulator semiconductor FET (MISFET) Source Gate Drain Insulator n n + p + n + p + substrate (b) Junction field effect transistor (JFET) Source Gate Drain n + n + n Semi-insulating layer Buffer layer (c) Metal semiconductor FET (MESFET) Figure 6-36 Construction of (a) MISFET, (b) JFET, and (c) MESFET. The shaded areas depict the space charge domains.
41 S + V GS Low V DS + G D S + V GS High V DS + G D n + y d S (y) n + d n + d S (y) n + L L (a) Operation in the linear region. (b) Operation in the saturation region. Figure 6-37 Functionality of MESFET for different drain-source voltages.
42 D I Dsat /I DSS 1 I D Linear Saturation V GS = 0 G V GS < 0 S S V GS / V T0 1 (a) Circuit symbol (b) Transfer characteristic (c) Output characteristic V DS Figure 6-38 Transfer and output characteristics of an n-channel MESFET.
43 7 Saturation drain current I Dsat, A Quadratic law approximation V T0 = 3.44 Exact formula Gate-source voltage V GS, V Figure 6-39 Drain current versus V GS computed using the exact and the approximate equations (6.86) and (6.87).
44 4 3.5 V DS = V DSsat I D = I Dsat (V DS ) V GS = 1 V Drain current I D, A = 0.03 = 0 V GS = 1.5 V V GS = 2 V 0.5 V GS = 2.5 V Drain-source voltage V DS, V Figure 6-40 Drain current as a function of applied drain-source voltage for different gate-source biasing conditions.
45 I D I Dmax I D1 1 V DS = V Dsat P max I D2 2 I D3 3 V DS3 V DS1 V DS2 V DSmax V DS Figure 6-41 MESFET. Typical maximum output characteristics and three operating points of
46 + + V GS V DS Inversion layer t ox S G D Gate oxide O 2 G D B n + n + S p-substrate B L (a) Depletion region G D S (b) Figure 6-42 Cross-sectional view of an n-channel MOS transistor: (a) physical construction, (b) symbols.
47 Source Gate Drain 0.1 µm 300 µm 1 µm n + n-gaalas GaAlAs n + GaAs Semi-insulating GaAs 2DEG 30 nm 10 nm d 0 x y Figure 6-43 Generic heterostructure of a depletion-mode HEMT.
48 Schottky contact W W H W F W GaAlAs W GaAs 2DEG W G W C d 0 (a) Energy band diagram x W F GaAlAs GaAs (b) Close-up view of conduction band Figure 6-44 Energy band diagram of GaAlAs-GaAs interface for an HEMT.
49 30 V GS = 0 V 25 Drain current I D, ma V GS = 0.25 V V GS = 0.5 V V GS = 0.75 V V GS = 1 V Drain-source voltage V DS, V Figure 6-45 Drain current in a GaAs HEMT.
50 Drain lead Source and heat-sink contact Chips Gate lead 5 mm (a) Bond wire MOS capacitor Drain metallization Source finger Drain finger Inductor Die Inductor MOS capacitor 1 mm Gate metallization Bond wire Gate finger 100 µm (b) (c) Figure 6-46 The internal structure of the LDMOS power transistor BLF4G at three levels of magnification: (a) overall package, (b) die interconnections, and (c) transistor die (courtesy of NXP).
51 Figure 6-47 The power transistor mounted on a demonstration board.
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