Mesoscopic Fluctuations of Conductance in a Depleted Built-in Channel of a MOSFET

Size: px
Start display at page:

Download "Mesoscopic Fluctuations of Conductance in a Depleted Built-in Channel of a MOSFET"

Transcription

1 ISSN , Semiconductors, 2006, Vol. 40, No. 9, pp Pleiades Publishing, Inc., Original Russian Text B.A. Aronzon, A.S. Vedeneev, A.A. Panferov, V.V. Ryl kov, 2006, published in Fizika i Tekhnika Poluprovodnikov, 2006, Vol. 40, No. 9, pp SEMICONDUCTOR STRUCTURES, INTERFACES, AND SURFACES Mesoscopic Fluctuations of Conductance in a Depleted Built-in Channel of a MOSFET B. A. Aronzon a, A. S. Vedeneev b, A. A. Panferov a, and V. V. Ryl kov a,b^ a Kurchatov Institute Russian Research Center, Moscow, Russia b Institute of Radio Engineering and Electronics, Russian Academy of Sciences, Fryazino, Moscow oblast, Russia ^ rylkov@imp.kiae.ru Received January 11, 2006; accepted for publication January 24, 2006 Abstract Mesoscopic fluctuations of the off-diagonal component R xy of the resistance tensor have been observed in macroscopic Si-MOS structures with a built-in p-channel at T = 77 K under the conditions in which the channel is depleted of free holes. It was found that the fluctuations δr xy are related to transition from the 3D conduction by free holes to 2D-percolation in the fluctuation potential of ionized impurities of the p-doped surface layer depleted due to the field effect. From the analysis of data on δr xy, the correlation length L c of the percolation cluster, which describes the spatial scale of electrical nonuniformity in the structure, is obtained as a function of the gate potential V g. The dependence of L c on V g is well described in terms of the concepts of nonlinear screening of the fluctuation potential by holes and of the percolation nature of the hole transport for L c varying from ~10 nm to ~1 µm. PACS numbers: Qv, b DOI: /S INTRODUCTION Mesoscopic phenomena are inherent to disordered electronic systems of finite size [1]. Considering the problems of electron transport, these phenomena are usually observed in samples of size less than, or on the order of, the scale of resistance self-averaging. In systems with metallic conduction, the phase coherence length of the electron wave function usually stands for this scale [2]. In media with percolation conduction, noncoherent mesoscopic effects can appear [3]. In this case, the specific scale of self-averaging (the electrical inhomogeneity) is determined by the correlation length L c of the percolation cluster [3, 4], and the related phenomena are usually observed when the object size is comparable with this scale. Most of experiments on studies of noncoherent mesoscopic phenomena were performed in the hopping conduction mode in structures of small length, L < L c [5 7]. The conductance of these structures is defined by percolation paths with anomalously low resistance, which, however, do not form an infinite cluster, so at L L c they do not contribute to the electrical conductance of a structure [3]. As shown in [8], noncoherent mesoscopic phenomena can be observed also in macroscopic objects with dimensions considerably exceeding L c. For example, they were found in studies of fluctuations of the offdiagonal component R xy of the resistance tensor of quasi-2d objects in the hopping conduction mode [8]. The mechanism of these fluctuations is related to the fact that, even if the configuration of the transverse (Hall) probes is not asymmetric with respect to longitudinal current, a potential difference appears between these probes (~E x L c, where E x is the electric field along the sample) owing to the inhomogeneity of a percolation cluster over the scale ~L c. In turn, this leads to R xy fluctuations of amplitude ~R xx (L c /L), where R xx is the longitudinal resistance [8], in the conditions when a percolation cluster is rearranged upon a change in the external conditions (the transverse electric field, longitudinal voltage, temperature, etc.). The mesoscopic fluctuations of R xy differ from the fluctuations of the longitudinal resistance R xx [3] in that they are determined by conducting chains forming an infinite cluster; therefore, their analysis opens the way for direct experimental estimation of an important parameter of the percolation system, namely, the correlation length L c [8]. Earlier, we observed similar noncoherent mesoscopic phenomena in systems with hopping conductivity. These are Si MIS (metal insulator semiconductor) transistor structures at liquid-helium temperature, in which the cluster rearrangement was stimulated by varying the gate voltage or longitudinal field [8, 9], and also Fe/SiO 2 nanocomposites, in which the current paths randomly changed under the action of a magnetic field and/or temperature in conditions of a thermally induced metal insulator transition [10, 11]. In this paper, we show that mesoscopic fluctuations of R xy are typical also of disordered systems, in which the electronic transport is affected by free carriers under 1055

2 1056 ARONZON et al. G xx, kω M SiO 2 10 p-si n-si µ the conditions of a strong fluctuation potential. As model samples, transistor Si-MOS (metal oxide semiconductor) structures with the built-in p-channel were chosen, in which the fluctuation potential varies at a depleting potential V g of the gate contact via electron screening of ionized acceptors (sources of the fluctuation potential [12]) and owing to a change in their concentration upon a partial freeze-out of impurities. As a result, a considerable rearrangement of a percolation cluster and related fluctuations of R xy are expected in the studied field-effect mode. 2. RESULTS AND DISCUSSION Transistor Si-MOS structures with a built-in p-channel of L = 150 µm length and W = 50 µm width were produced in the double-cross configuration by planar technology on (100) n-si substrates with the donor concentration N d cm 3 [13]. The Si:B doped surface layer (the built-in channel) of thickness D 0.5 µm was formed by ion implantation of boron and insulated from the p + -polysilicon gate contact by thermal oxide of d = 62 nm in thickness. The acceptor concentration determined from the room-temperature Hall effect measurements was N a cm 3. The diagonal (R xx ) and off-diagonal (R xy ) components of the resistance tensor were studied as functions of V g at a constant longitudinal voltage ( 0.1 V) in the liquid-nitrogen temperature range. Figure 1 shows the dependence of conductance G = 1/R xx of the structure on V g at T = 77 K temperature. The increasing of G at V g < 0 (to be more precise, at V g < V FB, where V FB 0 is the flat-band voltage) is related to E a E v V g > V 2D V FB V 2D Fig. 1. The diagonal component of the conduction tensor G xx as a function of the gate voltage at T = 77 K temperature. Inset: the band diagram of a Si-MOS structure with a built-in p-channel. µ, E a, and E v are the energy positions of the Fermi level, acceptor levels, and the valence band top, respectively. the formation of a hole conduction channel at the Si SiO 2 interface in the accumulation mode; and the decreasing of G at positive V g is related to depletion of the Si:B layer of free holes. In the depletion mode, at V g > 0, the thickness of the depleted layer increases as the gate bias increases, so the conducting channel, which is bounded on the other side by the p n junction, is pinched. As a result, a quasi-2d channel is formed at the boundary of the doped p-layer (see the inset in Fig. 1). In this situation, the doping impurity is completely ionized on both sides of the quasi-2d channel, and the free hole density in the channel decreases as V g increases. It is worth noting that a similar situation occurs in channel depletion in a GaAs FET with the Schottky barrier [12]. As shown in [12], in this case, the behavior of the low-frequency capacitance can be satisfactorily described by the generation of a fluctuation potential under conditions of its nonlinear screening by carriers in the quasi-2d channel. In our case, the transition to conduction along the quasi-2d channel is manifested by a change in the G(V g ) behavior after some threshold value V g = V 2D is reached as the gate voltage increases. At V g < V 2D 8 V, the decreasing of conductance follows a power law, whereas at V g V 2D, the decreasing of conductance with the rise of V g becomes exponential. From the physical point of view, this transition (the transition to conduction along the quasi-2d channel) is due to the fact that the thickness of the conducting channel becomes comparable with the correlation length L c of the percolation cluster. 1 In this case, the fluctuation potential strongly distorts the conduction along the quasi-2d channel by forming pinchedoff regions at the potential maxima, which cannot be bypassed via the third dimension. In this situation, the conductance will be determined by thermal activation of carriers to the percolation level via saddle regions of the fluctuation potential, which accounts for the transition to exponential dependence of G(V g ). The gate voltage corresponding to complete pinching-off of the conduction channel is V g = V t 10 V. Figure 2 shows R xy and the ratio R xy /R xx (upper inset) as functions of the gate voltage. In the range of small depleting voltages, V g < V 2D 8 V, R xy is constant and small (the ratio α = R xy /R xx ), which is indicative of the in-plane uniformity of the channel and the virtually symmetrical arrangement of the transverse potential probes on the sample. In contrast, on passing from the 3D to quasi-2d mode of the hole transport (V g V 2D ), R xy exhibits regular fluctuations, which become more pronounced as V g increases. Following [8], we assume that fluctuations of R xy have mesoscopic origin and are related to reconstruc- 1 It is in this sense that we use the term quasi-2d conduction channel, by analogy with the term 2D-film, used in the description of the longitudinal transport in layers with hopping conductivity with the layers thickness less than L c [4].

3 MESOSCOPIC FLUCTUATIONS OF CONDUCTANCE 1057 R xy, kω R xy /R xx ln(r xx, kω) /T, K Fig. 2. The off-diagonal component of the resistance tensor R xy of a Si-MOS structure as a function of the gate voltage at T = 77 K temperature. Upper inset: the ratio R xy /R xx as a function of the gate voltage. Lower inset: temperature dependence of the sample resistance in the range where fluctuations are observed (V g = 9.6 V). tion of the percolation cluster under the action of the field effect. Indeed, if the fluctuation potential is generated by ionized impurities in the depleted Si:B layer and nonlinearly screened by quasi-2d holes with the density p s, the amplitude of the fluctuation potential can be represented as [14, 15]: N s δϕ = A---- e2 (1) ε p s ( D) A ---- e , ε p s ( D+ d) where N s is the concentration of ionized impurities, reduced to the surface; e, the elementary charge; ε, the dielectric constant of Si; and A, the coefficient on the order of unity. If sources of the fluctuation potential lie between the gate and 2D-channel, A = (2π) 1/2 [14]. It is noteworthy that in this situation, as the density of 2D carriers decreases, the amplitude of the fluctuation potential tends to a constant value δϕ g, which is defined by screening of large-scale fluctuations by the metallic gate of the structure [14]: δϕ g = 4πN s ( 1 ln2) e (2) ε In the structures under study, with the concentration of implanted impurity N a cm 3 N d cm 3, sources of the fluctuation potential are N s mainly situated between the gate and quasi-2d hole channel, so in the estimation of the fluctuation potential amplitude we use the results from [14]. The value of N s at V g V 2D we find by considering the structure capacitance C as a series connection of the insulator capacitance C d and the capacitance of the depletion layer in the semiconductor C s = 2C sd, where C sd κ/4πd is the differential capacitance of the depletion layer. At V g = V t 10 V, we obtain N s = 2C d C sd V t /e(c d + 2C sd ) cm 2. According to (2), this value corresponds to δϕ 29 mev, which significantly exceeds the thermal energy kt. The obtained δϕ is in agreement with the activation energy of conductance (~30 mev) in the range where fluctuations of R xy are observed (see the lower inset in Fig. 2). In this situation, it seems natural to expect that the charge transport is performed by thermally activated holes via saddle regions of the fluctuation potential, which have an exponentially wide, to the extent of variation of the exponent δϕ/kt > 1, scatter of the local resistance [4, 14]. Accordingly, the conduction in the system becomes percolative, with the correlation length of the percolation cluster given by [4, 16]: L c a δϕ kt ν a δϕ = kt (3)

4 1058 ARONZON et al. L c, µm L c, µm Fig. 3. The dependence of L R xy /R xx α on the gate voltage at T = 77 K, which reflects the behavior of the correlation length L c of the percolation cluster. Arrows indicate several local maxima of the dependence. The solid line 1 shows the correlation length L cp (V g ) in the nonlinear screening mode, calculated using Eqs. (1), (3), and (4). The horizontal line 2 is the maximum (calculated) value of the correlation length L cg, related to screening of the fluctuation potential by the gate of structure. Inset: points, the dependence of L c on the gate voltage, obtained by averaging over the regions of local maxima of the L R xy /R xx α values; solid line, the calculated L c (V g ) curve. Here, ν is the critical index in the percolation theory (we set ν = 1 as an average between 2D (ν = 1.33) and 3D (ν = 0.83) situations) and a is the characteristic spatial scale of the random potential, which in our case coincides with the screening length of the fluctuation 1/2 potential [14, 15]. At p s > N s /D, a = N s /Dp 2 s. (4) In the opposite case, when the fluctuation potential is screened by the gate of the structure [14], a = 21 ( ln2)d. (5) According to (1), (3), and (4), we must know, in order to calculate the L c (V g ) = L cp (V g ) dependence corresponding to nonlinear screening of the fluctuation potential, the dependence of hole density in the channel, p s, on the gate potential, which can be found from the data on the field effect (Fig. 1) by the method described in [17]. In the range V 2D < V g < V t, the p s (V g ) dependence is determined by the relation p s C d C sd (V t V g )/e(c d + C sd ). Substituting this p s and the value N s = 2C d C sd V t /e(c d + 2C sd ) cm 2 (V t = 10 V) into (1) and (4) and using Eq. (3), we obtain the L cp (V g ) dependence shown in Fig. 3. This dependence diverges at V g V t, and for p s < N s /D the 1/2 screening length of the fluctuation potential is deter- 2 1 mined by the distance from the gate of the structure. As follows from (2), (3), and (5), in this case L c (V g ) = L cg (V g ) = const (the horizontal line in Fig. 3), and at V g 9.7 V the correlation length L c (V g ) tends to the constant value L c = L cg 1.3 µm. Now we analyze the behavior of the correlation length of a percolation cluster L c on the gate potential V g based on the data obtained in the measurements of fluctuations of the off-diagonal component of the resistance tensor R xy. Fluctuations of R xy were studied earlier in Si-MOS transistor structures [8] in the hopping conductivity mode, in the conditions when the cluster correlation length L c remained unchanged at the cluster reconstruction. It was shown that L c ( ) a L , δr xy 2R xx (6) where (δr xy ) a is the characteristic amplitude of a fluctuation, determined from the difference between the minimum and maximum values of R xy. In the conditions under study, the reconstruction of a cluster leads to a strong variation of L c (Fig. 3), so in the experimental estimation of the correlation length we analyze the envelope of the δr xy /R xx ratio magnitude, using Eq. (6). Figure 3 shows the dependence of L R xy /R xx α on V g, which clearly demonstrates local maxima (some of these are marked by arrows). Averaging L R xy /R xx α over these regions, we find the dependence L c (V g ), represented by points in the inset in Fig. 3. The same inset shows the calculated L c (V g ) dependence obtained from the interpolation relation L c (V g ) = L cp L cg /(L cp + L cg ). As can be seen, this dependence well describes the experimental L c (V g ) curve, which was found from the analysis of fluctuations of the off-diagonal component of the resistance tensor R xy for L c varying in the range from ~10 nm to ~1 µm. 3. CONCLUSIONS In conclusion, it may be said that the presented results can be used as a method for experimental study of the spatial scale of electrical inhomogeneities in a wide class of 2D objects in which the conduction channel is formed in the threshold manner. ACKNOWLEDGMENTS The study was supported by the International Science & Technology Center (grant no. 2503). REFERENCES 1. Y. Imry, Introduction to Mesoscopic Physics (Oxford Univ. Press, Oxford, 1997; Fizmatlit, Moscow, 2002). 2. B. L. Al tshuler and B. Z. Spivak, Pis ma Zh. Éksp. Teor. Fiz. 42, 363 (1985) [JETP Lett. 42, 447 (1985)]; B. L. Al tshuler and D. E. Khmel nitskiœ, Pis ma Zh.

5 MESOSCOPIC FLUCTUATIONS OF CONDUCTANCE 1059 Éksp. Teor. Fiz. 42, 291 (1985) [JETP Lett. 42, 359 (1985)]. 3. M. É. Raœkh and I. M. Ruzin, Pis ma Zh. Éksp. Teor. Fiz. 43, 437 (1986) [JETP Lett. 43, 562 (1986)]. 4. B. I. Shklovskiœ and A. L. Éfros, Electronic Properties of Doped Semiconductors (Nauka, Moscow, 1979; Springer, New York, 1984). 5. A. O. Orlov, M. É. Raœkh, I. M. Ruzin, and A. K. Savchenko, Zh. Éksp. Teor. Fiz. 96, 2172 (1989) [Sov. Phys. JETP 69, 1229 (1989)]. 6. A. I. Yakimov, N. P. Stepina, and A. V. Dvurechenskiœ, Zh. Éksp. Teor. Fiz. 102, 1882 (1992) [Sov. Phys. JETP 75, 1013 (1992)]. 7. B. I. Belevtsev, E. Yu. Belyaev, and E. Yu. Kopeœchenko, Fiz. Nizk. Temp. 22, 1070 (1996) [Low Temp. Phys. 22, 817 (1996)]. 8. B. A. Aronzon, A. S. Vedeneev, and V. V. Ryl kov, Fiz. Tekh. Poluprovodn. (St. Petersburg) 31, 648 (1997) [Semiconductors 31, 551 (1997)]; B. A. Aronzon, V. V. Rylkov, A. S. Vedeneev, and J. Leotin, Physica A (Amsterdam) 241, 259 (1997). 9. B. A. Aronzon, D. Yu. Kovalev, and V. V. Ryl kov, Fiz. Tekh. Poluprovodn. (St. Petersburg) 39, 844 (2005) [Semiconductors 39, 811 (2005)]. 10. V. V. Ryl kov, B. A. Aronzon, A. B. Davydov, et al., Zh. Éksp. Teor. Fiz. 121, 908 (2002) [JETP 94, 779 (2002)]. 11. B. Raquet, M. Goiran, N. Negre, et al., Phys. Rev. B 62, (2000). 12. A. O. Orlov, A. K. Savchenko, and B. I. Shklovskiœ, Fiz. Tekh. Poluprovodn. (Leningrad) 23, 1334 (1989) [Sov. Phys. Semicond. 23, 830 (1989)]. 13. S. Manzini and A. Modelly, J. Appl. Phys. 65, 2361 (1989); A. S. Vedeneev, A. G. Gaivoronskii, A. G. Zhdan, et al., Appl. Phys. Lett. 64, 2566 (1994). 14. V. A. Gergel and R. A. Suris, Zh. Éksp. Teor. Fiz. 75, 191 (1978) [Sov. Phys. JETP 48, 95 (1978)]. 15. B. I. Shklovskiœ and A. L. Éfros, Pis ma Zh. Éksp. Teor. Fiz. 44, 520 (1986) [JETP Lett. 44, 669 (1986)]. 16. B. I. Shklovskiœ, Fiz. Tekh. Poluprovodn. (Leningrad) 13, 93 (1979) [Sov. Phys. Semicond. 13, 53 (1979)]. 17. A. S. Vedeneev, V. A. Gergel, A. G. Zhdan, and V. E. Sizov, Pis ma Zh. Éksp. Teor. Fiz. 58, 368 (1993) [JETP Lett. 58, 375 (1993)]. Translated by D. Mashovets

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION Collapse of superconductivity in a hybrid tin graphene Josephson junction array by Zheng Han et al. SUPPLEMENTARY INFORMATION 1. Determination of the electronic mobility of graphene. 1.a extraction from

More information

Classification of Solids

Classification of Solids Classification of Solids Classification by conductivity, which is related to the band structure: (Filled bands are shown dark; D(E) = Density of states) Class Electron Density Density of States D(E) Examples

More information

Lecture 12: MOS Capacitors, transistors. Context

Lecture 12: MOS Capacitors, transistors. Context Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those

More information

Excess 1/f noise in systems with an exponentially wide spectrum of resistances and dual universality of the percolation-like noise exponent

Excess 1/f noise in systems with an exponentially wide spectrum of resistances and dual universality of the percolation-like noise exponent Excess 1/f noise in systems with an exponentially wide spectrum of resistances and dual universality of the percolation-like noise exponent A. A. Snarski a) Ukrainian National Technical University KPI,

More information

arxiv: v1 [cond-mat.dis-nn] 31 Aug 2011

arxiv: v1 [cond-mat.dis-nn] 31 Aug 2011 Suppression of the virtual Anderson transition in a narrow impurity band of doped quantum well structures. N.V. Agrinskaya, V.I. Kozub, and D.S. Poloskin Ioffe Physical-Technical Institute of the Russian

More information

Semiconductor Physics fall 2012 problems

Semiconductor Physics fall 2012 problems Semiconductor Physics fall 2012 problems 1. An n-type sample of silicon has a uniform density N D = 10 16 atoms cm -3 of arsenic, and a p-type silicon sample has N A = 10 15 atoms cm -3 of boron. For each

More information

Section 12: Intro to Devices

Section 12: Intro to Devices Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals Bond Model of Electrons and Holes Si Si Si Si Si Si Si Si Si Silicon

More information

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes Problem 1: Semiconductor Fundamentals [30 points] A uniformly doped silicon sample of length 100µm and cross-sectional area 100µm 2

More information

Semiconductor Physics Problems 2015

Semiconductor Physics Problems 2015 Semiconductor Physics Problems 2015 Page and figure numbers refer to Semiconductor Devices Physics and Technology, 3rd edition, by SM Sze and M-K Lee 1. The purest semiconductor crystals it is possible

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 29, 2019 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2019 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor

More information

MOS CAPACITOR AND MOSFET

MOS CAPACITOR AND MOSFET EE336 Semiconductor Devices 1 MOS CAPACITOR AND MOSFET Dr. Mohammed M. Farag Ideal MOS Capacitor Semiconductor Devices Physics and Technology Chapter 5 EE336 Semiconductor Devices 2 MOS Capacitor Structure

More information

EE 560 MOS TRANSISTOR THEORY

EE 560 MOS TRANSISTOR THEORY 1 EE 560 MOS TRANSISTOR THEORY PART 1 TWO TERMINAL MOS STRUCTURE V G (GATE VOLTAGE) 2 GATE OXIDE SiO 2 SUBSTRATE p-type doped Si (N A = 10 15 to 10 16 cm -3 ) t ox V B (SUBSTRATE VOLTAGE) EQUILIBRIUM:

More information

1 Name: Student number: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND. Fall :00-11:00

1 Name: Student number: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND. Fall :00-11:00 1 Name: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND Final Exam Physics 3000 December 11, 2012 Fall 2012 9:00-11:00 INSTRUCTIONS: 1. Answer all seven (7) questions.

More information

ECE 340 Lecture 39 : MOS Capacitor II

ECE 340 Lecture 39 : MOS Capacitor II ECE 340 Lecture 39 : MOS Capacitor II Class Outline: Effects of Real Surfaces Threshold Voltage MOS Capacitance-Voltage Analysis Things you should know when you leave Key Questions What are the effects

More information

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor CMPEN 411 VLSI Digital Circuits Lecture 03: MOS Transistor Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN 411 L03 S.1

More information

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006 UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 130 Professor Ali Javey Fall 2006 Midterm 2 Name: SID: Closed book. Two sheets of notes are

More information

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Literature Glen F. Knoll, Radiation

More information

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE15 Spring 28 Lecture

More information

Section 12: Intro to Devices

Section 12: Intro to Devices Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 23, 2018 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2018 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor

More information

Lecture 04 Review of MOSFET

Lecture 04 Review of MOSFET ECE 541/ME 541 Microelectronic Fabrication Techniques Lecture 04 Review of MOSFET Zheng Yang (ERF 3017, email: yangzhen@uic.edu) What is a Transistor? A Switch! An MOS Transistor V GS V T V GS S Ron D

More information

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics t ti Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE105 Fall 2007

More information

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors. Fabrication of semiconductor sensor

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors. Fabrication of semiconductor sensor Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Fabrication of semiconductor sensor

More information

MOS Capacitor MOSFET Devices. MOSFET s. INEL Solid State Electronics. Manuel Toledo Quiñones. ECE Dept. UPRM.

MOS Capacitor MOSFET Devices. MOSFET s. INEL Solid State Electronics. Manuel Toledo Quiñones. ECE Dept. UPRM. INEL 6055 - Solid State Electronics ECE Dept. UPRM 20th March 2006 Definitions MOS Capacitor Isolated Metal, SiO 2, Si Threshold Voltage qφ m metal d vacuum level SiO qχ 2 E g /2 qφ F E C E i E F E v qφ

More information

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

! CMOS Process Enhancements. ! Semiconductor Physics.  Band gaps.  Field Effects. ! MOS Physics.  Cut-off.  Depletion. ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 9, 019 MOS Transistor Theory, MOS Model Lecture Outline CMOS Process Enhancements Semiconductor Physics Band gaps Field Effects

More information

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor Triode Working FET Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor The characteristics of energy bands as a function of applied voltage. Surface inversion. The expression for the

More information

Electrical Characteristics of MOS Devices

Electrical Characteristics of MOS Devices Electrical Characteristics of MOS Devices The MOS Capacitor Voltage components Accumulation, Depletion, Inversion Modes Effect of channel bias and substrate bias Effect of gate oide charges Threshold-voltage

More information

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors ECE 342 Electronic Circuits Lecture 6 MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2

More information

(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e)

(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e) (a) (b) Supplementary Figure 1. (a) An AFM image of the device after the formation of the contact electrodes and the top gate dielectric Al 2 O 3. (b) A line scan performed along the white dashed line

More information

FIELD-EFFECT TRANSISTORS

FIELD-EFFECT TRANSISTORS FIEL-EFFECT TRANSISTORS 1 Semiconductor review 2 The MOS capacitor 2 The enhancement-type N-MOS transistor 3 I-V characteristics of enhancement MOSFETS 4 The output characteristic of the MOSFET in saturation

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 2017 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2017 Khanna Lecture Outline! Semiconductor Physics " Band gaps "

More information

GaN based transistors

GaN based transistors GaN based transistors S FP FP dielectric G SiO 2 Al x Ga 1-x N barrier i-gan Buffer i-sic D Transistors "The Transistor was probably the most important invention of the 20th Century The American Institute

More information

an introduction to Semiconductor Devices

an introduction to Semiconductor Devices an introduction to Semiconductor Devices Donald A. Neamen Chapter 6 Fundamentals of the Metal-Oxide-Semiconductor Field-Effect Transistor Introduction: Chapter 6 1. MOSFET Structure 2. MOS Capacitor -

More information

MOSFET: Introduction

MOSFET: Introduction E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major

More information

MENA9510 characterization course: Capacitance-voltage (CV) measurements

MENA9510 characterization course: Capacitance-voltage (CV) measurements MENA9510 characterization course: Capacitance-voltage (CV) measurements 30.10.2017 Halvard Haug Outline Overview of interesting sample structures Ohmic and schottky contacts Why C-V for solar cells? The

More information

Lecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure

Lecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure Lecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure Outline 1. Introduction to MOS structure 2. Electrostatics of MOS in thermal equilibrium 3. Electrostatics of MOS with

More information

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

! CMOS Process Enhancements. ! Semiconductor Physics.  Band gaps.  Field Effects. ! MOS Physics.  Cut-off.  Depletion. ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 3, 018 MOS Transistor Theory, MOS Model Lecture Outline! CMOS Process Enhancements! Semiconductor Physics " Band gaps " Field Effects!

More information

EECS130 Integrated Circuit Devices

EECS130 Integrated Circuit Devices EECS130 Integrated Circuit Devices Professor Ali Javey 10/02/2007 MS Junctions, Lecture 2 MOS Cap, Lecture 1 Reading: finish chapter14, start chapter16 Announcements Professor Javey will hold his OH at

More information

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 igital Integrated Circuits A esign Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The evices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

8.1 Drift diffusion model

8.1 Drift diffusion model 8.1 Drift diffusion model Advanced theory 1 Basic Semiconductor Equations The fundamentals of semiconductor physic are well described by tools of quantum mechanic. This point of view gives us a model of

More information

Extensive reading materials on reserve, including

Extensive reading materials on reserve, including Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si

More information

Surfaces, Interfaces, and Layered Devices

Surfaces, Interfaces, and Layered Devices Surfaces, Interfaces, and Layered Devices Building blocks for nanodevices! W. Pauli: God made solids, but surfaces were the work of Devil. Surfaces and Interfaces 1 Interface between a crystal and vacuum

More information

Semiconductor Physics fall 2012 problems

Semiconductor Physics fall 2012 problems Semiconductor Physics fall 2012 problems 1. An n-type sample of silicon has a uniform density N D = 10 16 atoms cm -3 of arsenic, and a p-type silicon sample has N A = 10 15 atoms cm -3 of boron. For each

More information

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Literature Glen F. Knoll, Radiation

More information

Spring Semester 2012 Final Exam

Spring Semester 2012 Final Exam Spring Semester 2012 Final Exam Note: Show your work, underline results, and always show units. Official exam time: 2.0 hours; an extension of at least 1.0 hour will be granted to anyone. Materials parameters

More information

Current mechanisms Exam January 27, 2012

Current mechanisms Exam January 27, 2012 Current mechanisms Exam January 27, 2012 There are four mechanisms that typically cause currents to flow: thermionic emission, diffusion, drift, and tunneling. Explain briefly which kind of current mechanisms

More information

Semiconductor Detectors are Ionization Chambers. Detection volume with electric field Energy deposited positive and negative charge pairs

Semiconductor Detectors are Ionization Chambers. Detection volume with electric field Energy deposited positive and negative charge pairs 1 V. Semiconductor Detectors V.1. Principles Semiconductor Detectors are Ionization Chambers Detection volume with electric field Energy deposited positive and negative charge pairs Charges move in field

More information

Content. MIS Capacitor. Accumulation Depletion Inversion MOS CAPACITOR. A Cantoni Digital Switching

Content. MIS Capacitor. Accumulation Depletion Inversion MOS CAPACITOR. A Cantoni Digital Switching Content MIS Capacitor Accumulation Depletion Inversion MOS CAPACITOR 1 MIS Capacitor Metal Oxide C ox p-si C s Components of a capacitance model for the MIS structure 2 MIS Capacitor- Accumulation ρ( x)

More information

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOSFET N-Type, P-Type. Semiconductor Physics.

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOSFET N-Type, P-Type. Semiconductor Physics. ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 217 MOS Transistor Theory, MOS Model Lecture Outline! Semiconductor Physics " Band gaps " Field Effects! MOS Physics " Cutoff

More information

SECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University

SECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University NAME: PUID: SECTION: Circle one: Alam Lundstrom ECE 305 Exam 5 SOLUTIONS: April 18, 2016 M A Alam and MS Lundstrom Purdue University This is a closed book exam You may use a calculator and the formula

More information

Scaling Analysis of the Magnetic Field Tuned Quantum Transition in Superconducting Amorphous In O Films 1

Scaling Analysis of the Magnetic Field Tuned Quantum Transition in Superconducting Amorphous In O Films 1 JETP Letters, Vol., No. 4, 2, pp. 4. From Pis ma v Zhurnal Éksperimental noœ i Teoreticheskoœ Fiziki, Vol., No. 4, 2, pp. 2 2. Original English Text Copyright 2 by Gantmakher, Golubkov, Dolgopolov, Tsydynzhapov,

More information

Isotope effect in the thermal conductivity of germanium single crystals

Isotope effect in the thermal conductivity of germanium single crystals Isotope effect in the thermal conductivity of germanium single crystals V. I. Ozhogin, A. V. Inyushkin, A. N. Taldenkov, A. V. Tikhomirov, and G. É. Popov Institute of Molecular Physics, Kurchatov Institute,

More information

Lecture 6: 2D FET Electrostatics

Lecture 6: 2D FET Electrostatics Lecture 6: 2D FET Electrostatics 2016-02-01 Lecture 6, High Speed Devices 2014 1 Lecture 6: III-V FET DC I - MESFETs Reading Guide: Liu: 323-337 (he mainly focuses on the single heterostructure FET) Jena:

More information

Fluctuations of the surface potential in metal-insulator-conductor structures

Fluctuations of the surface potential in metal-insulator-conductor structures 1970 (Eng. Transl., Halsted Press, New York, 1972). p. 10. 8 ~ F.. Zharkov and D. A. Zaikin, Fiz. Nizk. Temp. 4, 586 'OG. F. Zharkov and Yu. K. Al'tudov, Zh. Eksp. Teor. Fiz. 74, (1978)[Sov. J. Low. Temp.

More information

Effects of Antimony Near SiO 2 /SiC Interfaces

Effects of Antimony Near SiO 2 /SiC Interfaces Effects of Antimony Near SiO 2 /SiC Interfaces P.M. Mooney, A.F. Basile, and Zenan Jiang Simon Fraser University, Burnaby, BC, V5A1S6, Canada and Yongju Zheng, Tamara Isaacs-Smith Smith, Aaron Modic, and

More information

Electrical Characteristics of Multilayer MoS 2 FET s

Electrical Characteristics of Multilayer MoS 2 FET s Electrical Characteristics of Multilayer MoS 2 FET s with MoS 2 /Graphene Hetero-Junction Contacts Joon Young Kwak,* Jeonghyun Hwang, Brian Calderon, Hussain Alsalman, Nini Munoz, Brian Schutter, and Michael

More information

EXTRINSIC SEMICONDUCTOR

EXTRINSIC SEMICONDUCTOR EXTRINSIC SEMICONDUCTOR EXTRINSIC SEMICONDUCTOR A semiconductor in which the impurity atoms are added by doping process is called Extrinsic semiconductor. The addition of impurities increases the carrier

More information

Appendix 1: List of symbols

Appendix 1: List of symbols Appendix 1: List of symbols Symbol Description MKS Units a Acceleration m/s 2 a 0 Bohr radius m A Area m 2 A* Richardson constant m/s A C Collector area m 2 A E Emitter area m 2 b Bimolecular recombination

More information

Physics of Semiconductors

Physics of Semiconductors Physics of Semiconductors 13 th 2016.7.11 Shingo Katsumoto Department of Physics and Institute for Solid State Physics University of Tokyo Outline today Laughlin s justification Spintronics Two current

More information

SOLID-STATE SPECTROSCOPY

SOLID-STATE SPECTROSCOPY Optics and Spectroscopy Vol. 98 No. 3 005 pp. 383390. Translated from Optika i Spektroskopiya Vol. 98 No. 3 005 pp. 46433. Original Russian Tet Copyright 005 by Moskovskiœ. SOLID-STATE SPECTROSCOPY Transmission

More information

MOS Capacitors ECE 2204

MOS Capacitors ECE 2204 MOS apacitors EE 2204 Some lasses of Field Effect Transistors Metal-Oxide-Semiconductor Field Effect Transistor MOSFET, which will be the type that we will study in this course. Metal-Semiconductor Field

More information

Effective masses in semiconductors

Effective masses in semiconductors Effective masses in semiconductors The effective mass is defined as: In a solid, the electron (hole) effective mass represents how electrons move in an applied field. The effective mass reflects the inverse

More information

ECE-305: Fall 2017 Metal Oxide Semiconductor Devices

ECE-305: Fall 2017 Metal Oxide Semiconductor Devices C-305: Fall 2017 Metal Oxide Semiconductor Devices Pierret, Semiconductor Device Fundamentals (SDF) Chapters 15+16 (pp. 525-530, 563-599) Professor Peter Bermel lectrical and Computer ngineering Purdue

More information

Operation and Modeling of. The MOS Transistor. Second Edition. Yannis Tsividis Columbia University. New York Oxford OXFORD UNIVERSITY PRESS

Operation and Modeling of. The MOS Transistor. Second Edition. Yannis Tsividis Columbia University. New York Oxford OXFORD UNIVERSITY PRESS Operation and Modeling of The MOS Transistor Second Edition Yannis Tsividis Columbia University New York Oxford OXFORD UNIVERSITY PRESS CONTENTS Chapter 1 l.l 1.2 1.3 1.4 1.5 1.6 1.7 Chapter 2 2.1 2.2

More information

Surfaces, Interfaces, and Layered Devices

Surfaces, Interfaces, and Layered Devices Surfaces, Interfaces, and Layered Devices Building blocks for nanodevices! W. Pauli: God made solids, but surfaces were the work of Devil. Surfaces and Interfaces 1 Role of surface effects in mesoscopic

More information

Chapter 4 Field-Effect Transistors

Chapter 4 Field-Effect Transistors Chapter 4 Field-Effect Transistors Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 5/5/11 Chap 4-1 Chapter Goals Describe operation of MOSFETs. Define FET characteristics in operation

More information

Defense Technical Information Center Compilation Part Notice

Defense Technical Information Center Compilation Part Notice UNCLASSIFIED Defense Technical Information Center Compilation Part Notice ADP012791 TITLE: Delta-Doping of GaAs by Sn DISTRIBUTION: Approved for public release, distribution unlimited Availability: Hard

More information

Scaling Issues in Planar FET: Dual Gate FET and FinFETs

Scaling Issues in Planar FET: Dual Gate FET and FinFETs Scaling Issues in Planar FET: Dual Gate FET and FinFETs Lecture 12 Dr. Amr Bayoumi Fall 2014 Advanced Devices (EC760) Arab Academy for Science and Technology - Cairo 1 Outline Scaling Issues for Planar

More information

Metal-oxide-semiconductor field effect transistors (2 lectures)

Metal-oxide-semiconductor field effect transistors (2 lectures) Metal-ide-semiconductor field effect transistors ( lectures) MOS physics (brief in book) Current-voltage characteristics - pinch-off / channel length modulation - weak inversion - velocity saturation -

More information

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Refinement. Last Time. No Field. Body Contact

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Refinement. Last Time. No Field. Body Contact ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 10: September 6, 01 MOS Transistor Basics Today MOS Transistor Topology Threshold Operating Regions Resistive Saturation

More information

Review of Semiconductor Fundamentals

Review of Semiconductor Fundamentals ECE 541/ME 541 Microelectronic Fabrication Techniques Review of Semiconductor Fundamentals Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Page 1 Semiconductor A semiconductor is an almost insulating material,

More information

Schottky diodes. JFETs - MESFETs - MODFETs

Schottky diodes. JFETs - MESFETs - MODFETs Technische Universität Graz Institute of Solid State Physics Schottky diodes JFETs - MESFETs - MODFETs Quasi Fermi level When the charge carriers are not in equilibrium the Fermi energy can be different

More information

Ordering of Nanostructures in a Si/Ge 0.3 Si 0.7 /Ge System during Molecular Beam Epitaxy

Ordering of Nanostructures in a Si/Ge 0.3 Si 0.7 /Ge System during Molecular Beam Epitaxy Semiconductors, Vol. 36, No. 11, 22, pp. 1294 1298. Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 36, No. 11, 22, pp. 1379 1383. Original Russian Text Copyright 22 by Cirlin, Egorov, Sokolov,

More information

n N D n p = n i p N A

n N D n p = n i p N A Summary of electron and hole concentration in semiconductors Intrinsic semiconductor: E G n kt i = pi = N e 2 0 Donor-doped semiconductor: n N D where N D is the concentration of donor impurity Acceptor-doped

More information

Nonlinear screening and percolation transition in 2D electron liquid. Michael Fogler

Nonlinear screening and percolation transition in 2D electron liquid. Michael Fogler Dresden 005 Nonlinear screening and percolation transition in D electron liquid Michael Fogler UC San Diego, USA Support: A.P. Sloan Foundation; C. & W. Hellman Fund Tunable D electron systems MOSFET Heterostructure

More information

Supporting Information

Supporting Information Supporting Information Monolithically Integrated Flexible Black Phosphorus Complementary Inverter Circuits Yuanda Liu, and Kah-Wee Ang* Department of Electrical and Computer Engineering National University

More information

FM AFM Crossover in Vanadium Oxide Nanomaterials

FM AFM Crossover in Vanadium Oxide Nanomaterials ISSN 0021-3640, JETP Letters, 2010, Vol. 91, No. 1, pp. 11 15. Pleiades Publishing, Inc., 2010. Original Russian Text S.V. Demishev, A.L. Chernobrovkin, V.V. Glushkov, A.V. Grigorieva, E.A. Goodilin, N.E.

More information

Theory of Electrical Characterization of Semiconductors

Theory of Electrical Characterization of Semiconductors Theory of Electrical Characterization of Semiconductors P. Stallinga Universidade do Algarve U.C.E.H. A.D.E.E.C. OptoElectronics SELOA Summer School May 2000, Bologna (It) Overview Devices: bulk Schottky

More information

Typical example of the FET: MEtal Semiconductor FET (MESFET)

Typical example of the FET: MEtal Semiconductor FET (MESFET) Typical example of the FET: MEtal Semiconductor FET (MESFET) Conducting channel (RED) is made of highly doped material. The electron concentration in the channel n = the donor impurity concentration N

More information

PHYSICAL REVIEW B, VOLUME 65,

PHYSICAL REVIEW B, VOLUME 65, PHYSICAL REVIEW B, VOLUME 65, 165319 Model of Schottky junction admittance taking into account incomplete impurity ionization and large-signal effects Andrei V. Los* and Michael S. Mazzola Mississippi

More information

MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University

MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University Practice Final Exam 1 Read the questions carefully Label all figures

More information

PN Junction

PN Junction P Junction 2017-05-04 Definition Power Electronics = semiconductor switches are used Analogue amplifier = high power loss 250 200 u x 150 100 u Udc i 50 0 0 50 100 150 200 250 300 350 400 i,u dc i,u u

More information

Supplementary Materials for

Supplementary Materials for advances.sciencemag.org/cgi/content/full/3/4/e1602726/dc1 Supplementary Materials for Selective control of electron and hole tunneling in 2D assembly This PDF file includes: Dongil Chu, Young Hee Lee,

More information

During such a time interval, the MOS is said to be in "deep depletion" and the only charge present in the semiconductor is the depletion charge.

During such a time interval, the MOS is said to be in deep depletion and the only charge present in the semiconductor is the depletion charge. Q1 (a) If we apply a positive (negative) voltage step to a p-type (n-type) MOS capacitor, which is sufficient to generate an inversion layer at equilibrium, there is a time interval, after the step, when

More information

CHAPTER 5 EFFECT OF GATE ELECTRODE WORK FUNCTION VARIATION ON DC AND AC PARAMETERS IN CONVENTIONAL AND JUNCTIONLESS FINFETS

CHAPTER 5 EFFECT OF GATE ELECTRODE WORK FUNCTION VARIATION ON DC AND AC PARAMETERS IN CONVENTIONAL AND JUNCTIONLESS FINFETS 98 CHAPTER 5 EFFECT OF GATE ELECTRODE WORK FUNCTION VARIATION ON DC AND AC PARAMETERS IN CONVENTIONAL AND JUNCTIONLESS FINFETS In this chapter, the effect of gate electrode work function variation on DC

More information

3. Two-dimensional systems

3. Two-dimensional systems 3. Two-dimensional systems Image from IBM-Almaden 1 Introduction Type I: natural layered structures, e.g., graphite (with C nanostructures) Type II: artificial structures, heterojunctions Great technological

More information

The Intrinsic Silicon

The Intrinsic Silicon The Intrinsic ilicon Thermally generated electrons and holes Carrier concentration p i =n i ni=1.45x10 10 cm-3 @ room temp Generally: n i = 3.1X10 16 T 3/2 e -1.21/2KT cm -3 T= temperature in K o (egrees

More information

Semiconductor Devices. C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5

Semiconductor Devices. C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5 Semiconductor Devices C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5 Global leader in environmental and industrial measurement Wednesday 3.2. afternoon Tour around facilities & lecture

More information

Optimization of the Dielectric Constant of a Blocking Dielectric in the Nonvolatile Memory Based on Silicon Nitride

Optimization of the Dielectric Constant of a Blocking Dielectric in the Nonvolatile Memory Based on Silicon Nitride ISSN 8756-699, Optoelectronics, Instrumentation and Data Processing, 9, Vol. 45, No. 4, pp. 48 5. c Allerton Press, Inc., 9. Original Russian Text c Y. N. Novikov, V. A. Gritsenko, K. A. Nasyrov, 9, published

More information

8. Schottky contacts / JFETs

8. Schottky contacts / JFETs Technische Universität Graz Institute of Solid State Physics 8. Schottky contacts / JFETs Nov. 21, 2018 Technische Universität Graz Institute of Solid State Physics metal - semiconductor contacts Photoelectric

More information

single-electron electron tunneling (SET)

single-electron electron tunneling (SET) single-electron electron tunneling (SET) classical dots (SET islands): level spacing is NOT important; only the charging energy (=classical effect, many electrons on the island) quantum dots: : level spacing

More information

Quantum Interference and Decoherence in Hexagonal Antidot Lattices

Quantum Interference and Decoherence in Hexagonal Antidot Lattices Quantum Interference and Decoherence in Hexagonal Antidot Lattices Yasuhiro Iye, Masaaki Ueki, Akira Endo and Shingo Katsumoto Institute for Solid State Physics, University of Tokyo, -1- Kashiwanoha, Kashiwa,

More information

n i exp E g 2kT lnn i E g 2kT

n i exp E g 2kT lnn i E g 2kT HOMEWORK #10 12.19 For intrinsic semiconductors, the intrinsic carrier concentration n i depends on temperature as follows: n i exp E g 2kT (28.35a) or taking natural logarithms, lnn i E g 2kT (12.35b)

More information

Lecture 5: CMOS Transistor Theory

Lecture 5: CMOS Transistor Theory Lecture 5: CMOS Transistor Theory Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline q q q q q q q Introduction MOS Capacitor nmos I-V Characteristics

More information

The Three terminal MOS structure. Semiconductor Devices: Operation and Modeling 115

The Three terminal MOS structure. Semiconductor Devices: Operation and Modeling 115 The Three terminal MOS structure 115 Introduction MOS transistor two terminal MOS with another two opposite terminal (back to back of inversion layer). Theses two new terminal make the current flow if

More information

ECE 342 Electronic Circuits. 3. MOS Transistors

ECE 342 Electronic Circuits. 3. MOS Transistors ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to

More information

Scanning probe studies of the electrical activity at interfaces formed by silicon wafer direct bonding

Scanning probe studies of the electrical activity at interfaces formed by silicon wafer direct bonding phys. stat. sol. (c) 4, No. 8, 893 897 (007) / DOI 10.100/pssc.00675481 Scanning probe studies of the electrical activity at interfaces formed by silicon wafer direct bonding M. Ratzke *, 1,, O. Vyvenko

More information

1. The MOS Transistor. Electrical Conduction in Solids

1. The MOS Transistor. Electrical Conduction in Solids Electrical Conduction in Solids!The band diagram describes the energy levels for electron in solids.!the lower filled band is named Valence Band.!The upper vacant band is named conduction band.!the distance

More information

Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination

Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination The Metal-Semiconductor Junction: Review Energy band diagram of the metal and the semiconductor before (a)

More information

Avalanche breakdown. Impact ionization causes an avalanche of current. Occurs at low doping

Avalanche breakdown. Impact ionization causes an avalanche of current. Occurs at low doping Avalanche breakdown Impact ionization causes an avalanche of current Occurs at low doping Zener tunneling Electrons tunnel from valence band to conduction band Occurs at high doping Tunneling wave decays

More information