Lecture 6: 2D FET Electrostatics
|
|
- Naomi Lang
- 5 years ago
- Views:
Transcription
1 Lecture 6: 2D FET Electrostatics Lecture 6, High Speed Devices
2 Lecture 6: III-V FET DC I - MESFETs Reading Guide: Liu: (he mainly focuses on the single heterostructure FET) Jena: Lecture 6, High Speed Devices
3 Common Field Effect Transistors +V GS +V DS +V GS +V DS Insulator n ++ n ++ p Traditional Si-MOSFET +V GS +V DS Insulator/WB n ++ QW n ++ Wide Bandgap/insulator Quantum Well HEMT /SOI MOSFET/ Graphene FET +V GS +V DS n ++ Wide Bandgap n ++ Insulator/WB n ++ QW / Nanowire n ++ Small Bandgap (i/p - ) Insulator/WB Old School HEMT +V GS FinFET / Nanowire FET / Carbon Nanotube FET 3
4 2D Field Effect Transistors V GS t ox t w e ox QW, e s Wide Band Gap / Insulator Narrow Band Gap, Quantum Well Wide Band Gap / Insulator Typical Thickness: t ox 2-10 nm Thick enough to prevent tunneling from QW to the gate. Thin to prevent short channel effects. Typical Thickness: t w nm Ground We will demonstrate that the QW charge can be written as: Thick enough to keep surface roughness under control. (µ n ~ 1/L W6 ) Thin to prevent short channel effects. qn s = C G (V GS V T ) Lecture 6, High Speed Devices
5 2D Field Effect Transistors t ox t w QW V GS Gate potential y s : Surface potential E y s V OX On-state (V GS -V T ) C ox = ε oxε 0 t ox C q = q2 m πħ 2 y C c = ε sε 0 0.1t w Ground Potential drop over the QW. V GS below V T : Off V GS above V T : On qn s N 2D e q kt V GS V T 0 qn s = C G (V GS V T ) 1 = C G C ox C q C c Lecture 6, High Speed Devices
6 Quantum / Semiconductor Capacitance C q = q2 m πħ 2 Q = CV E F E F E 1 = qψ s d 2 dx 2 V(x) = qn s ε s ε 0 0 Quantum Well Charge: n s = N 2D F 0 η F qψ S On-state: E F -E 1 >>0 m πħ 2 (E F E 1 ) qn S q2 m πħ 2 ψ s = C q ψ s Quantum / Semiconductor capacitance: q(e F -E 1 ) needs to increase by qn s C q = ψ s. If the induced charge in the quantum well is small: E C remains ~ flat around the well V T =0V 6
7 Oxide Capacitance / qn s qv ox qψ s + V ox - C ox = ε oxε 0 t ox Q = CV E F Q=qn s qv GS Potential drop over the oxide: V ox = qn s C ox Total Potential drop: Total Gate Capacitance: V GS = V ox + ψ s = qn s C ox + qn s C q 1 = C G C ox C q = qn s C G qn s = C G (V GS ) V T =0V 7
8 Charge Centriod Capacitance There is charge qn s inside the quantum well ρ y qn s t w ε t W = 0 All charge inside the QW ε x = qn S ε s ε 0 (1 y t w ) ΔV x = qn S ε s ε 0 ( y2 2t w y) C c = ε oxε t w Q = CV Also gives C ox ε 0 + = qn S ε s ε 0 D 0 + = D(0 ) y This leads to a upward shift of E 1 From first order perturbation theory: t w ΔE Ψ 1 qv x Ψ 1 = q2 n s 2 sin 2 ε s ε 0 t w 0 yπ y 2 y dy = = t w 2t w ε 0 = qn S ε ox ε 0 V ox = ε 0 t ox = qn s t ox ε ox ε 0 ΔE = 2q 2 n s (?) t w 1 ε s ε π 2 To obtain the same n s : we need to add an extra Δψ s! Δψ s = qn s 1 C c V T =0V
9 n s : Above / Below V T V GS = V ox + ψ s + Δψ s V GS = qn S C ox + qn S C q + qn S C c 1 C G = 1 C ox + 1 C q + 1 C c Sub threshold: E F < E 1. n s becomes small. V ox 0V Δψ s 0V ψ S V GS y s On-state (V GS -V T ) C ox = ε oxε 0 t ox C q = q2 m πħ 2 C c = ε sε t w n s = N 2D F 0 η F N 2D e E F E 1 kt = N 2D e V GS kt Below V T exponentially decreasing n s The effect of C q and C C can be modeled as an effective thicker t ox. CG = ε oxε 0 t ox + Δt ox V T =0V 9
10 Ideal MOS : Threshold Voltage : V T Thermal Equlibrium φ m χ φ m χ E 1 qv T V T = φ m χ + E 1 q V T can be controlled through the choice of gate metal. Si-SiO 2 follow this model well. For III-V MOSFETs : interface defects complicates V T adjustment. 10
11 Ideal HEMT : Threshold Voltage : V T t b Wide bandgap semiconductor QW Schottky Barrier mainly set by the WG semiconductor: φ b DE c E 1 V T = φ b ΔE c + E 1 q An High Electron Mobility Transistor uses wide bandgap semiconductors instead of an oxide. Excellent quality of the quantum well! 11
12 HEMT : Threshold Voltage Adjustment t b QW d Doping N D φ 00 = qn D 2 t b δ 2 Positive (empty ) donors inside the barrier induces a band bending φ 00 φ b DE c E F,m E 1 V T = φ b ΔE C + E 1 q φ 00 This can be used to tune V T towards negative values. 12
13 2D MOSFET : Analytic / 1D Schrödinger/Possion Comparison n s = C G (V GS V T ) Numerical Model Analytic Model φ b = 5eV ΔE C = 4.7eV E 1 = 0.16 ev V T = 0.46 V t ox =5 nm t w =10 nm m * =0.023m 0 +The model accurately predicts n s (V GS ) above V T! -Not accurate below V T -Only using the EMA 13
14 2D MOSFET : Analytic / 1D Schrödinger/Possion Comparison Analytic model below V T Analytic Model (above V T ) Numerical Model Model below V T n s = N 2D e V GS V T kt We get two very simple, physically correct and easy to use models accurate below and above V T. t ox =5 nm t w =10 nm m * =0.023m 0 14
15 Single Heterostructure HEMT n(y) causes band bending! E C E C Approximately Triangular Quantum Well Thermal Equlibrium 15
16 Single Heterostructure HEMT Triangular Well: E n depends strongly on the charge in well. E 2 e i,2 qns e V ~ qe i, 2x s Electric field at interface Potential variation at interface E 1 E 1 is only strongly defined for a finite value of n s E n 2 h 8 2m * 3 qe 2 i,2 2/3 n 1 4 2/ ( qn s / e ) s 2/3 (In (ev)) This contributes a C C type capacitance n s DkT ln 1 exp E f k n 1 kt 2/3 s This contributes a C q type capacitance 16
17 Single Heterostructure HEMT φ 00 ε i = qn s ε s E c E F V T = φ b ΔE c q C G = ε rε 0 t b + Δt b + E f0 q φ 00 n s = C G (V GS V T ) E f0 and Dt b is from a numerical fit taking C q and C c into account. For GaAs: Dt b ~ 74Å. Single Heterstructure HEMT Triangular Quantum Well due to electrons in the NG semiconductor Doping in the barrier can be used to tune V T Typically smaller C c (which is not good!) as compared with a QW FET. 17
Lecture 3: Transistor as an thermonic switch
Lecture 3: Transistor as an thermonic switch 2016-01-21 Lecture 3, High Speed Devices 2016 1 Lecture 3: Transistors as an thermionic switch Reading Guide: 54-57 in Jena Transistor metrics Reservoir equilibrium
More informationLecture 8: Ballistic FET I-V
Lecture 8: Ballistic FET I-V 1 Lecture 1: Ballistic FETs Jena: 61-70 Diffusive Field Effect Transistor Source Gate L g >> l Drain Source V GS Gate Drain I D Mean free path much shorter than channel length
More informationScaling Issues in Planar FET: Dual Gate FET and FinFETs
Scaling Issues in Planar FET: Dual Gate FET and FinFETs Lecture 12 Dr. Amr Bayoumi Fall 2014 Advanced Devices (EC760) Arab Academy for Science and Technology - Cairo 1 Outline Scaling Issues for Planar
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 23, 2018 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2018 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 2017 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2017 Khanna Lecture Outline! Semiconductor Physics " Band gaps "
More informationTypical example of the FET: MEtal Semiconductor FET (MESFET)
Typical example of the FET: MEtal Semiconductor FET (MESFET) Conducting channel (RED) is made of highly doped material. The electron concentration in the channel n = the donor impurity concentration N
More information! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 3, 018 MOS Transistor Theory, MOS Model Lecture Outline! CMOS Process Enhancements! Semiconductor Physics " Band gaps " Field Effects!
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 29, 2019 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2019 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor
More informationLecture 12: MOS Capacitors, transistors. Context
Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those
More informationEE 560 MOS TRANSISTOR THEORY
1 EE 560 MOS TRANSISTOR THEORY PART 1 TWO TERMINAL MOS STRUCTURE V G (GATE VOLTAGE) 2 GATE OXIDE SiO 2 SUBSTRATE p-type doped Si (N A = 10 15 to 10 16 cm -3 ) t ox V B (SUBSTRATE VOLTAGE) EQUILIBRIUM:
More informationECE-305: Fall 2017 MOS Capacitors and Transistors
ECE-305: Fall 2017 MOS Capacitors and Transistors Pierret, Semiconductor Device Fundamentals (SDF) Chapters 15+16 (pp. 525-530, 563-599) Professor Peter Bermel Electrical and Computer Engineering Purdue
More informationLecture 1 Nanoscale MOSFETs. Course Structure Basic Concepts (1-38)
Lecture 1 Nanoscale MOSFETs Course Structure Basic Concepts (1-38) 1 Course Layout 7.5 ECTS 7 Lectures 7 Excercises Written exam (t.b.d) Textbook: Nanoscale Transistors: Device Physics, Modeling and Simulation
More informationSection 12: Intro to Devices
Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals Bond Model of Electrons and Holes Si Si Si Si Si Si Si Si Si Silicon
More information! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 9, 019 MOS Transistor Theory, MOS Model Lecture Outline CMOS Process Enhancements Semiconductor Physics Band gaps Field Effects
More informationEECS130 Integrated Circuit Devices
EECS130 Integrated Circuit Devices Professor Ali Javey 10/02/2007 MS Junctions, Lecture 2 MOS Cap, Lecture 1 Reading: finish chapter14, start chapter16 Announcements Professor Javey will hold his OH at
More informationSection 12: Intro to Devices
Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si
More informationMOS Capacitors ECE 2204
MOS apacitors EE 2204 Some lasses of Field Effect Transistors Metal-Oxide-Semiconductor Field Effect Transistor MOSFET, which will be the type that we will study in this course. Metal-Semiconductor Field
More informationGaN based transistors
GaN based transistors S FP FP dielectric G SiO 2 Al x Ga 1-x N barrier i-gan Buffer i-sic D Transistors "The Transistor was probably the most important invention of the 20th Century The American Institute
More informationLecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOSFET N-Type, P-Type. Semiconductor Physics.
ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 217 MOS Transistor Theory, MOS Model Lecture Outline! Semiconductor Physics " Band gaps " Field Effects! MOS Physics " Cutoff
More informationUNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 130 Professor Ali Javey Fall 2006 Midterm 2 Name: SID: Closed book. Two sheets of notes are
More informationMOS Capacitor MOSFET Devices. MOSFET s. INEL Solid State Electronics. Manuel Toledo Quiñones. ECE Dept. UPRM.
INEL 6055 - Solid State Electronics ECE Dept. UPRM 20th March 2006 Definitions MOS Capacitor Isolated Metal, SiO 2, Si Threshold Voltage qφ m metal d vacuum level SiO qχ 2 E g /2 qφ F E C E i E F E v qφ
More informationLecture 2. Introduction to semiconductors Structures and characteristics in semiconductors
Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Literature Glen F. Knoll, Radiation
More informationElectrical Characteristics of MOS Devices
Electrical Characteristics of MOS Devices The MOS Capacitor Voltage components Accumulation, Depletion, Inversion Modes Effect of channel bias and substrate bias Effect of gate oide charges Threshold-voltage
More informationECE-305: Fall 2017 Metal Oxide Semiconductor Devices
C-305: Fall 2017 Metal Oxide Semiconductor Devices Pierret, Semiconductor Device Fundamentals (SDF) Chapters 15+16 (pp. 525-530, 563-599) Professor Peter Bermel lectrical and Computer ngineering Purdue
More informationFinal Examination EE 130 December 16, 1997 Time allotted: 180 minutes
Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes Problem 1: Semiconductor Fundamentals [30 points] A uniformly doped silicon sample of length 100µm and cross-sectional area 100µm 2
More informationMENA9510 characterization course: Capacitance-voltage (CV) measurements
MENA9510 characterization course: Capacitance-voltage (CV) measurements 30.10.2017 Halvard Haug Outline Overview of interesting sample structures Ohmic and schottky contacts Why C-V for solar cells? The
More informationSurfaces, Interfaces, and Layered Devices
Surfaces, Interfaces, and Layered Devices Building blocks for nanodevices! W. Pauli: God made solids, but surfaces were the work of Devil. Surfaces and Interfaces 1 Interface between a crystal and vacuum
More informationErik Lind
High-Speed Devices, 2011 Erik Lind (Erik.Lind@ftf.lth.se) Course consists of: 30 h Lectures (H322, and Fys B check schedule) 8h Excercises 2x2h+4h Lab Excercises (2 Computer simulations, 4 RF measurment
More informationJFET/MESFET. JFET: small gate current (reverse leakage of the gate-to-channel junction) More gate leakage than MOSFET, less than bipolar.
JFET/MESFET JFET: small gate current (reverse leakage of the gate-to-channel junction) More gate leakage than MOSFET, less than bipolar. JFET has higher transconductance than the MOSFET. Used in low-noise,
More informationMOS CAPACITOR AND MOSFET
EE336 Semiconductor Devices 1 MOS CAPACITOR AND MOSFET Dr. Mohammed M. Farag Ideal MOS Capacitor Semiconductor Devices Physics and Technology Chapter 5 EE336 Semiconductor Devices 2 MOS Capacitor Structure
More informationLecture 20: Semiconductor Structures Kittel Ch 17, p , extra material in the class notes
Lecture 20: Semiconductor Structures Kittel Ch 17, p 494-503, 507-511 + extra material in the class notes MOS Structure Layer Structure metal Oxide insulator Semiconductor Semiconductor Large-gap Semiconductor
More informationHow a single defect can affect silicon nano-devices. Ted Thorbeck
How a single defect can affect silicon nano-devices Ted Thorbeck tedt@nist.gov The Big Idea As MOS-FETs continue to shrink, single atomic scale defects are beginning to affect device performance Gate Source
More informationECE 305: Fall MOSFET Energy Bands
ECE 305: Fall 2016 MOSFET Energy Bands Professor Peter Bermel Electrical and Computer Engineering Purdue University, West Lafayette, IN USA pbermel@purdue.edu Pierret, Semiconductor Device Fundamentals
More information8. Schottky contacts / JFETs
Technische Universität Graz Institute of Solid State Physics 8. Schottky contacts / JFETs Nov. 21, 2018 Technische Universität Graz Institute of Solid State Physics metal - semiconductor contacts Photoelectric
More informationLecture 22 Field-Effect Devices: The MOS Capacitor
Lecture 22 Field-Effect Devices: The MOS Capacitor F. Cerrina Electrical and Computer Engineering University of Wisconsin Madison Click here for link to F.C. homepage Spring 1999 0 Madison, 1999-II Topics
More informationLecture 29 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 20, 2007
6.720J/3.43J - Integrated Microelectronic Devices - Spring 2007 Lecture 29-1 Lecture 29 - The Long Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 20, 2007 Contents: 1. Non-ideal and second-order
More informationThe Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002
igital Integrated Circuits A esign Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The evices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction
More informationNanoscience and Molecular Engineering (ChemE 498A) Semiconductor Nano Devices
Reading: The first two readings cover the questions to bands and quasi-electrons/holes. See also problem 4. General Questions: 1. What is the main difference between a metal and a semiconductor or insulator,
More informationExtensive reading materials on reserve, including
Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si
More informationPart 4: Heterojunctions - MOS Devices. MOSFET Current Voltage Characteristics
MOS Device Uses: Part 4: Heterojunctions - MOS Devices MOSCAP capacitor: storing charge, charge-coupled device (CCD), etc. MOSFET transistor: switch, current amplifier, dynamic random access memory (DRAM-volatile),
More informationECE 340 Lecture 39 : MOS Capacitor II
ECE 340 Lecture 39 : MOS Capacitor II Class Outline: Effects of Real Surfaces Threshold Voltage MOS Capacitance-Voltage Analysis Things you should know when you leave Key Questions What are the effects
More informationSemiconductor Devices. C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5
Semiconductor Devices C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5 Global leader in environmental and industrial measurement Wednesday 3.2. afternoon Tour around facilities & lecture
More informationSchottky diodes. JFETs - MESFETs - MODFETs
Technische Universität Graz Institute of Solid State Physics Schottky diodes JFETs - MESFETs - MODFETs Quasi Fermi level When the charge carriers are not in equilibrium the Fermi energy can be different
More informationDigital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices.
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The July 30, 2002 1 Goal of this chapter Present intuitive understanding of device operation Introduction
More informationClass 05: Device Physics II
Topics: 1. Introduction 2. NFET Model and Cross Section with Parasitics 3. NFET as a Capacitor 4. Capacitance vs. Voltage Curves 5. NFET as a Capacitor - Band Diagrams at V=0 6. NFET as a Capacitor - Accumulation
More informationECE 497 JS Lecture - 12 Device Technologies
ECE 497 JS Lecture - 12 Device Technologies Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 NMOS Transistor 2 ρ Source channel charge density
More informationLecture 04 Review of MOSFET
ECE 541/ME 541 Microelectronic Fabrication Techniques Lecture 04 Review of MOSFET Zheng Yang (ERF 3017, email: yangzhen@uic.edu) What is a Transistor? A Switch! An MOS Transistor V GS V T V GS S Ron D
More informationLecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor
Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics t ti Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE105 Fall 2007
More informationTheory of Electrical Characterization of Semiconductors
Theory of Electrical Characterization of Semiconductors P. Stallinga Universidade do Algarve U.C.E.H. A.D.E.E.C. OptoElectronics SELOA Summer School May 2000, Bologna (It) Overview Devices: bulk Schottky
More informationMSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University
MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University Practice Final Exam 1 Read the questions carefully Label all figures
More informationFIELD-EFFECT TRANSISTORS
FIEL-EFFECT TRANSISTORS 1 Semiconductor review 2 The MOS capacitor 2 The enhancement-type N-MOS transistor 3 I-V characteristics of enhancement MOSFETS 4 The output characteristic of the MOSFET in saturation
More informationESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Lec 6: September 14, 2015 MOS Model You are Here: Transistor Edition! Previously: simple models (0 and 1 st order) " Comfortable
More informationCMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor
CMPEN 411 VLSI Digital Circuits Lecture 03: MOS Transistor Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN 411 L03 S.1
More informationLecture 2. Introduction to semiconductors Structures and characteristics in semiconductors
Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Literature Glen F. Knoll, Radiation
More informationCHAPTER 5 EFFECT OF GATE ELECTRODE WORK FUNCTION VARIATION ON DC AND AC PARAMETERS IN CONVENTIONAL AND JUNCTIONLESS FINFETS
98 CHAPTER 5 EFFECT OF GATE ELECTRODE WORK FUNCTION VARIATION ON DC AND AC PARAMETERS IN CONVENTIONAL AND JUNCTIONLESS FINFETS In this chapter, the effect of gate electrode work function variation on DC
More informationSECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University
NAME: PUID: SECTION: Circle one: Alam Lundstrom ECE 305 Exam 5 SOLUTIONS: April 18, 2016 M A Alam and MS Lundstrom Purdue University This is a closed book exam You may use a calculator and the formula
More informationLecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure
Lecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure Outline 1. Introduction to MOS structure 2. Electrostatics of MOS in thermal equilibrium 3. Electrostatics of MOS with
More informationQuantum-size effects in sub-10 nm fin width InGaAs finfets
Quantum-size effects in sub-10 nm fin width InGaAs finfets Alon Vardi, Xin Zhao, and Jesús A. del Alamo Microsystems Technology Laboratories, MIT December 9, 2015 Sponsors: DTRA NSF (E3S STC) Northrop
More informationSemiconductor Physics Problems 2015
Semiconductor Physics Problems 2015 Page and figure numbers refer to Semiconductor Devices Physics and Technology, 3rd edition, by SM Sze and M-K Lee 1. The purest semiconductor crystals it is possible
More informationAvalanche breakdown. Impact ionization causes an avalanche of current. Occurs at low doping
Avalanche breakdown Impact ionization causes an avalanche of current Occurs at low doping Zener tunneling Electrons tunnel from valence band to conduction band Occurs at high doping Tunneling wave decays
More informationR. Ludwig and G. Bogdanov RF Circuit Design: Theory and Applications 2 nd edition. Figures for Chapter 6
R. Ludwig and G. Bogdanov RF Circuit Design: Theory and Applications 2 nd edition Figures for Chapter 6 Free electron Conduction band Hole W g W C Forbidden Band or Bandgap W V Electron energy Hole Valence
More informationAppendix 1: List of symbols
Appendix 1: List of symbols Symbol Description MKS Units a Acceleration m/s 2 a 0 Bohr radius m A Area m 2 A* Richardson constant m/s A C Collector area m 2 A E Emitter area m 2 b Bimolecular recombination
More informationApplication II: The Ballistic Field-E ect Transistor
Chapter 1 Application II: The Ballistic Field-E ect Transistor 1.1 Introduction In this chapter, we apply the formalism we have developed for charge currents to understand the output characteristics of
More informationMetal-oxide-semiconductor field effect transistors (2 lectures)
Metal-ide-semiconductor field effect transistors ( lectures) MOS physics (brief in book) Current-voltage characteristics - pinch-off / channel length modulation - weak inversion - velocity saturation -
More informationMOSFET: Introduction
E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major
More informationSpring Semester 2012 Final Exam
Spring Semester 2012 Final Exam Note: Show your work, underline results, and always show units. Official exam time: 2.0 hours; an extension of at least 1.0 hour will be granted to anyone. Materials parameters
More informationSurfaces, Interfaces, and Layered Devices
Surfaces, Interfaces, and Layered Devices Building blocks for nanodevices! W. Pauli: God made solids, but surfaces were the work of Devil. Surfaces and Interfaces 1 Role of surface effects in mesoscopic
More informationLecture 11: MOS Transistor
Lecture 11: MOS Transistor Prof. Niknejad Lecture Outline Review: MOS Capacitors Regions MOS Capacitors (3.8 3.9) CV Curve Threshold Voltage MOS Transistors (4.1 4.3): Overview Cross-section and layout
More informationSemiconductor Integrated Process Design (MS 635)
Semiconductor Integrated Process Design (MS 635) Instructor: Prof. Keon Jae Lee - Office: 응용공학동 #4306, Tel: #3343 - Email: keonlee@kaist.ac.kr Lecture: (Tu, Th), 1:00-2:15 #2425 Office hour: Tues & Thur
More informationan introduction to Semiconductor Devices
an introduction to Semiconductor Devices Donald A. Neamen Chapter 6 Fundamentals of the Metal-Oxide-Semiconductor Field-Effect Transistor Introduction: Chapter 6 1. MOSFET Structure 2. MOS Capacitor -
More informationThis article has been accepted and published on J-STAGE in advance of copyediting. Content is final as presented.
This article has been accepted and published on J-STAGE in advance of copyediting. Content is final as presented. References IEICE Electronics Express, Vol.* No.*,*-* Effects of Gamma-ray radiation on
More informationLecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor
Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE15 Spring 28 Lecture
More informationTechnology Development for InGaAs/InP-channel MOSFETs
MRS Spring Symposium, Tutorial: Advanced CMOS Substrates, Devices, Reliability, and Characterization, April 13, 2009, San Francisco Technology Development for InGaAs/InP-channel MOSFETs Mark Rodwell University
More informationECE 305 Exam 5 SOLUTIONS: Spring 2015 April 17, 2015 Mark Lundstrom Purdue University
NAME: PUID: : ECE 305 Exam 5 SOLUTIONS: April 17, 2015 Mark Lundstrom Purdue University This is a closed book exam. You may use a calculator and the formula sheet at the end of this exam. Following the
More informationCMOS Scaling. Two motivations to scale down. Faster transistors, both digital and analog. To pack more functionality per area. Lower the cost!
Two motivations to scale down CMOS Scaling Faster transistors, both digital and analog To pack more functionality per area. Lower the cost! (which makes (some) physical sense) Scale all dimensions and
More informationThe Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction
More informationECE606: Solid State Devices Lecture 23 MOSFET I-V Characteristics MOSFET non-idealities
ECE66: Solid State evices Lecture 3 MOSFET I- Characteristics MOSFET non-idealities Gerhard Klimeck gekco@purdue.edu Outline 1) Square law/ simplified bulk charge theory ) elocity saturation in simplified
More informationP. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions
P. R. Nelson 1 ECE418 - VLSI Midterm Exam Solutions 1. (8 points) Draw the cross-section view for A-A. The cross-section view is as shown below.. ( points) Can you tell which of the metal1 regions is the
More informationProblem 9.20 Threshold bias for an n-channel MOSFET: In the text we used a criterion that the inversion of the MOSFET channel occurs when V s = ;2 F w
Prof. Jasprit Singh Fall 2001 EECS 320 Homework 11 The nals for this course are set for Friday December 14, 6:30 8:30 pm and Friday Dec. 21, 10:30 am 12:30 pm. Please choose one of these times and inform
More informationElectrostatics of Nanowire Transistors
Electrostatics of Nanowire Transistors Jing Guo, Jing Wang, Eric Polizzi, Supriyo Datta and Mark Lundstrom School of Electrical and Computer Engineering Purdue University, West Lafayette, IN, 47907 ABSTRACTS
More informationLong-channel MOSFET IV Corrections
Long-channel MOSFET IV orrections Three MITs of the Day The body ect and its influence on long-channel V th. Long-channel subthreshold conduction and control (subthreshold slope S) Scattering components
More informationMOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA
MOS Transistors Prof. Krishna Saraswat Department of Electrical Engineering S Stanford, CA 94305 saraswat@stanford.edu 1 1930: Patent on the Field-Effect Transistor! Julius Lilienfeld filed a patent describing
More informationElectrical Characteristics of Multilayer MoS 2 FET s
Electrical Characteristics of Multilayer MoS 2 FET s with MoS 2 /Graphene Hetero-Junction Contacts Joon Young Kwak,* Jeonghyun Hwang, Brian Calderon, Hussain Alsalman, Nini Munoz, Brian Schutter, and Michael
More information1 Name: Student number: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND. Fall :00-11:00
1 Name: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND Final Exam Physics 3000 December 11, 2012 Fall 2012 9:00-11:00 INSTRUCTIONS: 1. Answer all seven (7) questions.
More informationELEC 4700 Assignment #2
ELEC 4700 Assignment #2 Question 1 (Kasop 4.2) Molecular Orbitals and Atomic Orbitals Consider a linear chain of four identical atoms representing a hypothetical molecule. Suppose that each atomic wavefunction
More informationLecture 12: MOSFET Devices
Lecture 12: MOSFET Devices Gu-Yeon Wei Division of Engineering and Applied Sciences Harvard University guyeon@eecs.harvard.edu Wei 1 Overview Reading S&S: Chapter 5.1~5.4 Supplemental Reading Background
More informationMetal-Semiconductor Interfaces. Metal-Semiconductor contact. Schottky Barrier/Diode. Ohmic Contacts MESFET. UMass Lowell Sanjeev Manohar
Metal-Semiconductor Interface Metal-Semiconductor contact Schottky Barrier/iode Ohmic Contact MESFET UMa Lowell 10.5 - Sanjeev evice Building Block UMa Lowell 10.5 - Sanjeev UMa Lowell 10.5 - Sanjeev Energy
More information! Previously: simple models (0 and 1 st order) " Comfortable with basic functions and circuits. ! This week and next (4 lectures)
ESE370: CircuitLevel Modeling, Design, and Optimization for Digital Systems Lec 6: September 14, 2015 MOS Model You are Here: Transistor Edition! Previously: simple models (0 and 1 st order) " Comfortable
More informationMOSFET Physics: The Long Channel Approximation
MOSFET Physics: The ong Channel Approximation A basic n-channel MOSFET (Figure 1) consists of two heavily-doped n-type regions, the Source and Drain, that comprise the main terminals of the device. The
More informationLecture 7 PN Junction and MOS Electrostatics(IV) Metal Oxide Semiconductor Structure (contd.)
Lecture 7 PN Junction and MOS Electrostatics(IV) Metal Oxide Semiconductor Structure (contd.) Outline 1. Overview of MOS electrostatics under bias 2. Depletion regime 3. Flatband 4. Accumulation regime
More informationSupporting information
Supporting information Design, Modeling and Fabrication of CVD Grown MoS 2 Circuits with E-Mode FETs for Large-Area Electronics Lili Yu 1*, Dina El-Damak 1*, Ujwal Radhakrishna 1, Xi Ling 1, Ahmad Zubair
More informationSolid State Device Fundamentals
Solid State Device Fundamentals ENS 345 Lecture Course by Alexander M. Zaitsev alexander.zaitsev@csi.cuny.edu Tel: 718 982 2812 Office 4N101b 1 Outline - Goals of the course. What is electronic device?
More informationQuantum Phenomena & Nanotechnology (4B5)
Quantum Phenomena & Nanotechnology (4B5) The 2-dimensional electron gas (2DEG), Resonant Tunneling diodes, Hot electron transistors Lecture 11 In this lecture, we are going to look at 2-dimensional electron
More informationESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Lec 6: September 18, 2017 MOS Model You are Here: Transistor Edition! Previously: simple models (0 and 1 st order) " Comfortable
More informationImpact of oxide thickness on gate capacitance Modelling and comparative analysis of GaN-based MOSHEMTs
PRAMANA c Indian Academy of Sciences Vol. 85, No. 6 journal of December 2015 physics pp. 1221 1232 Impact of oxide thickness on gate capacitance Modelling and comparative analysis of GaN-based MOSHEMTs
More informationCME 300 Properties of Materials. ANSWERS: Homework 9 November 26, As atoms approach each other in the solid state the quantized energy states:
CME 300 Properties of Materials ANSWERS: Homework 9 November 26, 2011 As atoms approach each other in the solid state the quantized energy states: are split. This splitting is associated with the wave
More informationSimple Theory of the Ballistic Nanotransistor
Simple Theory of the Ballistic Nanotransistor Mark Lundstrom Purdue University Network for Computational Nanoechnology outline I) Traditional MOS theory II) A bottom-up approach III) The ballistic nanotransistor
More informationElectrostatic Single-walled Carbon Nanotube (CNT) Field Effect Transistor Device Modeling
Electrostatic Single-walled Carbon Nanotube (CNT) Field Effect Transistor Device Modeling Henok Abebe The Service USC Viterbi School of Engineering Information Sciences Institute Collaborator Ellis Cumberbatch
More informationInvestigation of the band gap widening effect in thin silicon double gate MOSFETs
Investigation of the band gap widening effect in thin silicon double gate MOSFETs Master thesis September 12, 2006 Report number: 068.030/2006 Author J.L.P.J. van der Steen Supervisors dr. ir. R.J.E. Hueting
More information(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e)
(a) (b) Supplementary Figure 1. (a) An AFM image of the device after the formation of the contact electrodes and the top gate dielectric Al 2 O 3. (b) A line scan performed along the white dashed line
More information