with LSTTL Compatible Inputs

Transcription

1 with STT Compatible Inputs The MC74HC259 is an 8 bit Addressable atch fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TT devices while maintaining CMOS low power dissipation. The HC259 is designed for general purpose storage applications in digital systems. The device has four modes of operation as shown in the mode selection table.. In the addressable latch mode, the data on Data In is written into the addressed latch. The addressed latch follows the data input with all non addressed latches remaining in their previous states. In the memory mode, all latches remain in their previous state and are unaffected by the Data or Address inputs. In the one of eight decoding or demultiplexing mode, the addressed output follows the state of Data In with all other outputs in the OW state. In the Reset mode, all outputs are OW and unaffected by the address and data inputs. When operating the HC259 as an addressable latch, changing more than one bit of the address could impose a transient wrong address. Therefore, this should only be done while in the memory mode. The MC74HC259 input structure provides protection when voltages up to 7 are applied, regardless of the supply voltage. This allows the MC74HC259 to be used to interface 5 circuits to 3 circuits. High Speed: t PD = 7.6 ns (Typ) at CC = 5 ow Power Dissipation: I CC = 2 µa (Max) at T A = 25 C High Noise Immunity: NIH = NI = 28% CC CMOS Compatible Outputs: OH > 0.8 CC ; O < Power Down Protection Provided on Inputs and Outputs Balanced Propagation Delays Pin and Function Compatible with Other Standard ogic Families atchup Performance Exceeds 300 ma ESD Performance: HBM > 2000 Figure 1. Pin Assignment SOIC 16 D SUFFIX CASE 751B TSSOP 16 DT SUFFIX CASE 948F SOIC EIAJ 16 M SUFFIX CASE 966 MARKING DIAGRAMS 16 9 HC259 AWYYWW A = Assembly ocation, W = Wafer ot Y, YY = Year W, WW = Work Week ORDERING INFORMATION Device Package Shipping MC74HC259D SOIC Units/Rail MC74HC259DR2 SOIC Units/Reel 1 HC259 AWYWW MC74HC259DT TSSOP Units/Rail MC74HC259DTR2 TSSOP Units/Reel MC74HC259M MC74HC259ME SOIC EIAJ 16 SOIC EIAJ 16 HC259 AYW 50 Units/Rail Units/Reel Semiconductor Components Industries, C, 2001 April, 2001 Rev. 2 1 Publication Order Number: MC74HC259/D

2 MC74HC259 Figure 2. ogic Diagram Figure 3. IEC ogic Symbol ATCH SEECTION TABE MODE SEECTION TABE Address Inputs C B A H H H H H H H H H H H H atch Addressed Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Enable Reset Mode H Addressable atch H H H Memory 8 ine Demultiplexer Reset 2

3 MC74HC259 Figure 4. Expanded ogic Diagram 3

4 MC74HC259 MAXIMUM RATINGS (Note 1.) Symbol Parameter alue Unit CC Positive DC Supply oltage 0.5 to +7.0 IN Digital Input oltage 0.5 to +7.0 OUT DC Output oltage 0.5 to CC +0.5 I IK Input Diode Current 20 ma I OK Output Diode Current 20 ma I OUT DC Output Current, per Pin 25 ma I CC DC Supply Current, CC and GND Pins 75 ma P D Power Dissipation in Still Air SOIC Package TSSOP mw T STG Storage Temperature Range 65 to +150 C ESD ESD Withstand oltage Human Body Model (Note 2.) Machine Model (Note 3.) Charged Device Model (Note 4.) >2000 >200 >2000 I ATCH UP atch Up Performance Above CC and Below GND at 125 C (Note 5.) 300 ma JA Thermal Resistance, Junction to Ambient SOIC Package TSSOP C/W 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22 A114 A 3. Tested to EIA/JESD22 A115 A 4. Tested to JESD22 C101 A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit CC DC Supply oltage 5.5 IN DC Input oltage OUT DC Output oltage 0 CC T A Operating Temperature Range, all Package Types C t r, t f Input Rise or Fall Time CC = CC = ns/ DEICE JUNCTION TEMPERATURE ERSUS TIME TO % BOND FAIURES Junction Temperature C Time, Hours Time, Years 80 1,032, , , , , , , Figure 5. Failure Rate vs. Time Junction Temperature 4

5 MC74HC259 DC CHARACTERISTICS (oltages Referenced to GND) CC T A = 25 C 55 C T A 125 C Symbol Parameter Condition () Min Typ Max Min Max Unit IH I OH O Minimum High evel Input oltage Maximum ow evel Input oltage Maximum High evel Output oltage Maximum ow evel Output oltage IN = IH or I I OH = 50 µa IN = IH or I I O = 4 ma I O = 8 ma IN = IH or I I O = 50 µa IN = IH or I I O = 4 ma I O = 8 ma to 5.5 to CCX CCX CCX CCX 0.3 I IN Input eakage Current IN = 5.5 or GND 0 to 5.5 ± ±1.0 µa I CC Maximum Quiescent Supply Current IN = CC or GND µa Î AC EECTRICA CHARACTERISTICS (Input t r = t f = ns) ÎÎ ÎÎ Î Î ÎÎ 55 C T A ÎÎ T A = 25 C ÎÎ T A 85 C 125 C Symbol ÎÎ Parameter Î Test Conditions Min Typ Max Min Max Min Max Î Unit t PH, Maximum t ÎÎ Propagation Delay, Î CC = 3.3 ± 0.3 C = 15pF Î C = 50pF ÎÎns PH Î Data to Output t Î (Figures 6 and 11) CC = 5.0 ± 0.5 C = 15pF Î Î C = 50pF ÎÎ ÎÎ t PH, Maximum t PH ÎÎ CC = 3.3 ± 0.3 C = 15pF Î Propagation Delay, C = 50pF ÎÎns ÎÎ Address Select to Output ÎÎ CC = 5.0 ± 0.5 C = 15pF (Figures 7 and 11) C = 50pF t PH, ÎÎ Maximum Î CC = 3.3 ± 0.3 C = 15pF t ÎÎ Propagation Delay, Î C = 50pF ÎÎ ÎÎ ns PH Enable to Output t Î (Figures 8 and 11) Î CC = 5.0 ± 0.5 C = 15pF Î ÎÎ C = 50pF t PH ÎÎ Maximum CC = 3.3 ± 0.3 C = 15pF Î Propagation Delay, Î C = 50pF ns Reset to Output t Î Î (Figures 9 and 11) CC = 5.0 ± 0.5 C = 15pFÎ ÎÎ C = 50pF Î Î C IN Maximum Input ÎÎ ÎÎ 10 pf Capacitance 25 C, CC = 5.0 C PD Power Dissipation Capacitance (Note 6.) 30 pf 6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD CC f in + I CC. C PD is used to determine the no load dynamic power consumption; P D = C PD 2 CC f in + I CC CC. 5

6 MC74HC259 TIMING REQUIREMENTS (Input t r = t f = ns) Î T A = 25 C T A = 85 CÎ T A = 125 CÎÎ Symbol Parameter ÎÎ Test Conditions Min Typ MaxÎÎ Min Max Min MaxÎÎ Unit t w Minimum Pulse Width, Reset or Enable ÎÎ CC = 3.3 ± Î 5.5 Î 5.5 ns (Figure 10) CC = 5.0 ± Î t su Minimum Setup Time, Address or Data to Enable CC = 3.3 ± 0.3 ns (Figure 10) ÎÎ CC = 5.0 ± 0.5 Î t Minimum Hold Time, Enable to Address or Data CC = 3.3 ± 0.3 Î h ns (Figure 8 or 9) ÎÎ CC = 5.0 ± 0.5 Î Î t r, t f Maximum Input, Rise and Fall Times ÎÎ CC = 3.3 ± 0.3ÎÎ Î 300 ÎÎns (Figure 6) CC = 5.0 ± 0.5ÎÎ Î ÎÎ Figure 6. Switching Waveform Figure 7. Switching Waveform Figure 8. Switching Waveform Figure 9. Switching Waveform *Includes all probe and jig capacitance Figure 10. Switching Waveform Figure 11. Test Circuit 6

7 MC74HC259 PACKAGE DIMENSIONS T G A D 16 P K B C SOIC 16 D SUFFIX CASE 751B 05 ISSUE J P 8 P M R X 45 J F TSSOP 16 DT SUFFIX CASE 948F 01 ISSUE O T PIN 1 IDENT. D 2X /2 C 16X K REF A G B U H N N J J1 F DETAI E DETAI E K K1 ÇÇÇ ÉÉ SECTION N N M W 7

8 MC74HC259 PACKAGE DIMENSIONS SOIC EIAJ 16 M SUFFIX CASE ISSUE O e Z D b E A H E A 1 IEW P M E Q 1 DETAI P c ON Semiconductor and are trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. PUBICATION ORDERING INFORMATION NORTH AMERICA iterature Fulfillment: iterature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada ONlit@hibbertco.com Fax Response ine: or Toll Free USA/Canada N. American Technical Support: Toll Free USA/Canada EUROPE: DC for ON Semiconductor European Support German Phone: (+1) (Mon Fri 2:30pm to 7:00pm CET) ONlit german@hibbertco.com French Phone: (+1) (Mon Fri 2:00pm to 7:00pm CET) ONlit french@hibbertco.com English Phone: (+1) (Mon Fri 12:00pm to 5:00pm GMT) ONlit@hibbertco.com EUROPEAN TO FREE ACCESS*: *Available from Germany, France, Italy, UK, Ireland CENTRA/SOUTH AMERICA: Spanish Phone: (Mon Fri 8:00am to 5:00pm MST) ONlit spanish@hibbertco.com Toll Free from Mexico: Dial for Access then Dial ASIA/PACIFIC: DC for ON Semiconductor Asia Support Phone: (Tue Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong & Singapore: ONlit asia@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center Nishi Gotanda, Shinagawa ku, Tokyo, Japan Phone: r14525@onsemi.com ON Semiconductor Website: For additional information, please contact your local Sales Representative. 8 MC74HC259/D