B02CSP05BLC UNITED MICRO DEVICE INC. LOW CAPACITANCE FLIP CHIP, BI-DIRECTIONAL, TVS DIODE. and UB02CSP05BLC APPLICATIONS FEATURES

Transcription

1 U LOW PTN LP P, -RTONL, TVS O TURS S Protection > 25 kilovolts vailable in Voltages 5V 200 Watts Peak Pulse Power per Line (tp = 8/20µs) Low lamping Voltage idirectional onfiguration & Monolithic Structure Protects 1 Line LOW PTN LOW LK URRNT RoS ompliant in Lead-ree Versions Transient protection for data lines to (S): ir - 15kV, ontact - 8kV (T): 40-5/50ns omplies with the following stards: (S) ir-15kv, ontact-8kv (T) (5/50ns) (Surge) (8/20μs) PPLTONS ellular Phones Personal igital ssistant (P) Notebook omputers SMRT ards LTRL SMT & PN ONURTON Rev 05/10/10 1

2 PK / PNOUT RMS U ottom View Side View U 0402 SP PK ottom View Side View 0402 SP PK ORRN NORMTON Ordering Part Number Package umps Polarity SP ( 0402 Size ode) 4 i-irectional U SP ( 0402 Size ode) 0 i-irectional SP TP & RL SPTONS Ordering Part Number hip Size (in mm) Qty Per Reel Reel Size 0.99 x ,000 pcs/reel 7 nch U 0.99 x ,000 pcs/reel 7 nch Rev 05/10/10 2

3 LTRL RTRSTS U SOLUT MXMUM 25 Rating Symbol Value Units Peak Pulse Power (t p = 8/20µs) P pp 250 Watts Soldering Temperature T L 225 Operating Temperature T J -55 to +150 Storage Temperature T ST -55 to +150 ο ο ο LTRL RTRSTS Parameter Symbol onditions Minimum Typical Maximum Units Reverse St-Off Voltage Reverse reakdown Voltage Reverse Leakage urrent V RWM 5 V V R t = 1m 6 V R V RWM = 5V, T=25 ο lamping Voltage V PP = 1, t P = 8/20µs lamping Voltage V PP = 17, t P = 8/20µs Junction apacitance j V R = OV, f = 1Mz 10 µ 9.8 V 14.7 V 30 p Rev 05/10/10 3

4 TYPL RTRSTS U Rated Power % Of UR 1 POWR RTN URV Peak Pulse Power 8/20µs verage Power T L - Lead Temperature - ivision per 5 Volts UR 2 OVRSOOT & LMPN VOLT OR U / 02SP05L S Test Pulse - 25 kilovolt, 1/30ns (waveshape) P P P - Peak Pulse urrent - Watt s 10,000 1, UR 3 PK PULS POWR VS PULS TM 200W, 8/20µs Waveform P P - Peak Pulse urrent - % of P P t f UR 4 PULS WV ORM Peak Value PP e -t t d = t PP /2 TST WVORM PRMTRS t f = 8µs t d = 20µs ,000 10,000 t d - Pulse uration - µs t - Time - µs UR 5 TYPL LMPN VOLT VS PK PULS URRNT OR U/ 14 V - lamping Voltage - Volt s PP - Peak Pulse urrent - mps Rev 05/10/10 4

5 PPLTON NORMTON U PRNT RUT OR ROMMNTONS PRMTR VLU Pad Size on P Pad Shape Pad efinition Solder Mask Opening Solder Stencil Thickness Solder Stencil perture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective inish Tolerance - dge To orner all Solder all Side oplanarity Maximum well Time bove Liquidous (183 ) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask efined Pads 0.325mm Round 0.150mm 0.330mm Round No lean OSP(ntek u Plus 106) ±50µm ±20µm 60 Seconds 270 RQURMNTS Temperature: T P for Lead-ree (Sngu): T P for Tin-Lead: Preheat time temperature depends on solder paste flux activation temperature, component size, weight, surface area & plating. ROMMN NON-SOLR MSK N P LLUSTRTON Non-Solder Mask efined Pad 0.275mm. Solder Mask Opening 0.325mm. Solder Stencil Opening 0.330mm. T P Ramp-up - Ramp-down Temperature T L T SMX 155 T SMN 140 T S - Preheat t 25 to Peak seconds Ramp-up 15 seconds Solder Time seconds Ramp-down Rev 05/10/10 5

6 PK OUTLN & MNSONS U P K OUTLN TOP S PK MNSONS M MLLMTRS NS Metalized ie ontacts 0.46 NOM 0.86 NOM 0.99 ± NOM 0.35 NOM ± NOM NOM NOM ± NOM NOM ± NOM N NOTS: 1. ontrolling dimensions in inches. 2. ecimal tolerances for mounting pad outline:.xxx ± 0.05mm (± ). 3. Maximum chip size: 1.02 (0.040 ) by 0.51(0.020 ). MOUNTN P P SOLR ONTTS P MNSONS M MLLMTRS NS NOT: 1. Preferred: Using 0.1mm(0.004") Stencil. TP & RL ORNTTON SOLR PRNT MTR Single ie NOT: 1. Top view of tape. Metal contacts are face down in tape package. Rev 05/10/10 6

7 PK OUTLN & MNSONS U PK OUTLN TOP S PK MNSONS M MLLMTRS NS N 0.46 NOM 0.86 NOM 0.99 ± NOM 0.35 NOM ± NOM MX MN NOM NOM NOM ± NOM NOM ± NOM MX MN NOM NOTS: 1. ontrolling dimensions in inches. 2. ecimal tolerances for mounting pad outline:.xxx ± 0.05mm (± ). 3. Maximum chip size: 1.02 (0.040 ) by 0.51(0.020 ). P MNSONS MOUNTN P P SOLR SOLR UMP M MLLMTRS NS NOT: Preferred: Using 0.1mm(0.004") Stencil TP & RL ORNTTON SOLR PRNT MTR Single ie NOT: 1. Top view of tape. Metal contacts are face down in tape package. Rev 05/10/10 7