B06CSP05BLC UNITED MICRO DEVICE INC.

Transcription

1 LOW PTN LP P RRY TURS SD Protection > 25 kilovolts vailable in Voltages 5V 200 Watts Peak Pulse Power per Line (tp = 8/20µs) Low lamping Voltage Bidirectional onfiguration & Monolithic Structure Protects 3 to 5 Lines LOW PTN LOW LK URRNT RoS ompliant in Lead-ree Versions Transient protection for data lines to (SD): ir - 15kV, ontact - 8kV (T): 40-5/50ns omplies with the following stards: (SD) ir-15kv, ontact-8kv (T) (5/50ns) (Surge) (8/20μs) PPLTONS ellular Phones Personal Digital ssistant (PD) Notebook omputers SMRT ards LTRL SMT & PN ONURTON Rev 05/10/10 1

2 PK / PNOUT DRMS Bottom View Side View 0406 SP PK Bottom View Side View 0406 SP PK ORDRN NORMTON Ordering Part Number Package Bumps Polarity SP ( 0406 Size ode) 6 Bi-Directional SP ( 0406 Size ode) 0 Bi-Directional SP TP & RL SPTONS Ordering Part Number hip Size (in mm) Qty Per Reel Reel Size 0.99 x ,000 pcs/reel 7 nch 0.99 x ,000 pcs/reel 7 nch Rev 05/10/10 2

3 LTRL RTRSTS BSOLUT MXMUM RTN Rating Symbol Value Units Peak Pulse Power (t p = 8/20µs) P pp 250 Watts Soldering Temperature T L 225 Operating Temperature T J -55 to +150 Storage Temperature T ST -55 to +150 ο ο ο LTRL RTRSTS Parameter Symbol onditions Minimum Typical Maximum Units Reverse St-Off Voltage Reverse Breakdown Voltage Reverse Leakage urrent V RWM 5 V V BR t = 1m 6 V R V RWM = 5V, T=25 ο 10 µ lamping Voltage V PP = 1, t P = 8/20µs ny /O to round lamping Voltage V PP = 17, t P = 8/20µs ny /O to round 9.8 V 14.7 V Junction apacitance j V R = OV, f = 1Mz 30 p Rev 05/10/10 3

4 TYPL RTRSTS Rated Power % Of UR 1 POWR DRTN URV Peak Pulse Power 8/20µs verage Power T L - Lead Temperature - Division per 5 Volts UR 2 OVRSOOT & LMPN VOLT OR L SD Test Pulse - 25 kilovolt, 1/30ns (waveshape) P P P - Peak Pulse urrent - Watt s 10,000 1, UR 3 PK PULS POWR VS PULS TM 200W, 8/20µs Waveform P P - Peak Pulse urrent - % of P P t f UR 4 PULS WV ORM Peak Value PP e -t t d = t PP /2 TST WVORM PRMTRS t f = 8µs t d = 20µs ,000 10,000 t d - Pulse Duration - µs t - Time - µs UR 5 TYPL LMPN VOLT VS PK PULS URRNT OR U/ 14 V - lamping Voltage - Volt s PP - Peak Pulse urrent - mps Rev 05/10/10 4

5 PPLTON NORMTON PRNTD RUT BORD ROMMNDTONS PRMTR VLU Pad Size on PB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil perture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No lean Pad Protective inish OSP(ntek u Plus 106) Tolerance - dge To orner Ball ±50µm Solder Ball Side oplanarity ±20µm Maximum Dwell Time bove Liquidous (183 ) 60 Seconds Soldering Maximum Temperature 270 RQURMNTS Temperature: T P for Lead-ree (Sngu): T P for Tin-Lead: Preheat time temperature depends on solder paste flux activation temperature, component size, weight, surface area & plating. ROMMNDD NON-SOLDR MSK DND PD LLUSTRTON Non-Solder Mask Defined Pad 0.275mm D. Solder Mask Opening 0.325mm D. Solder Stencil Opening 0.330mm D. T P Ramp-up - Ramp-down Temperature T L T SMX 155 T SMN 140 T S - Preheat t 25 to Peak seconds Ramp-up 15 seconds Solder Time seconds Ramp-down Rev 05/10/10 5

6 PK OUTLN & DMNSONS PK OUTLN PK DMNSONS DM MLLMTRS NS 0.56 NOM NOM B 0.86 NOM NOM 0.99 ± ± TOP B SD 0.15 SQ 1.5 ± SQ ± NOM NOM MX MX MN MN NOM NOM ND NOTS: 1. ontrolling dimensions in inches. 2. Decimal tolerances for mounting pad outline:.xxx ± 0.05mm (± ). MOUNTN PD LYOUT - Option 1 PD DMNSONS D SOLDR BUMPS Dim Milimeteres nches D SQ SQ NOT: 1. Preferred: Using 0.1mm (0.004 ) stencil. TP & RL ORNTTON Triple Die SOLDR PRNT D. SOLDR PDS SOLDR MSK NOT: 1. Top view of tape. Solder bumps are face down in tape package. Rev 05/10/10 6

7 PK OUTLN & DMNSONS MOUNTN PD LYOUT - Option 2 PK DMNSONS OPPR ONTTS [0.23] D. DM MLLMTRS NS 0.15 SQ SQ D SOLDR BUMPS NOTS: 1. ontrolling dimensions in inches. 2. Decimal tolerances for mounting pad outline:.xxx ± 0.05mm (± ). 3. Using 0.1mm (0.004 ) stencil. SOLDR PRNT [0.36] D. SOLDR MSK Rev 05/10/10 7