B11ND BS1100N-D1. Suppresser Features. ThyristorSurge. Exterior. Package (top. view) Schematic Symbol. Part SMB-F

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1 Features xcellent capability of absorbing transient surge Quick response to surge voltage(ns Level) liminates overvoltage caused by fast rising transients Moisture sensitivity level: level 1 Weight:87mg Non degenerative Uni-directional xterior Order ode: SM-F pplication Information Package (top view) SLI Specification` 1 11N gency pprovals Schematic Symbol Icon escription ompliance with 2011/65/U ompliance withi : Part Number and lectrical Parameterr Part Number IRM@RM (PIN1-2) S IS(PIN1-2) T@ IT(PIN1-2) μ m F@IF(P PIN2-1) IH(PIN1-2) O 2 (PIN1-2) m m pf MIN bsolute maximum ratings measured at T= 25º RH = 45%-75% % (unless otherwise noted) ). 1 s is measured at 100K/S. 2 Off-state apacitance is measured at =2, RM MS=1,f=1MHz. 1/5

2 Part Numbering System S N 1 (1) (2) (3) (4) (5) (1)encent Semiconductor Surge rrester (2)Off-state oltage,e.g.:1100= =110 (3) Package :SM-F (4) Rating Surge oltage:800(8/20μs) (5)Polarity: Uni-directional Mark Order ode: N1 6U2G 42L N1: Part Number 1308:ugust,2013 -I urve Parameters efinition + I RM Peak Off-state oltage IRM Off-stateurrent S IS IH Switching oltage Switching urrent Holding urrent - S RM T IF F IRM + T IT On-state oltage On-state urrent ` I H IS IT O Off-state apacitance -I Surge Ratings urrent Waveform 8/20μs oltage Waveform 1.2/50μs Ipp 800 -Peak pulse current rating(i PP )is repetitive and guaranteed for the life of the product; -encentonly makes the test for encentwill not takeany obligation for these parameters, so before applyingour parts, please make sure to theparameters listed in the above table. verify Thermal onsiderations Physical haracteristics symbol Parameter alue Unit Lead Material opper lloy T TJ Operating Junction Temperature Range -40 to +150 ody Material UL recognized epoxy meeting flaability classification 94-0 T TS Storage Temperature Range -60 to +150 Terminal Finish 100% Matte-Tin Plated 2/5

3 Order ode: Typical haracteristics 3/5

4 nvironmental haracteristics Order ode: Testing Items Technical Sstandards High Temperature Reverse ias Test High Temperature Life Test High-low Temperature ycle Test High Temperature &High Humidity Test Pressure ooker Test Resistance of Soldering Heat HST(highly accelerated stress test) Temperature: 150±3,ias=80% Time:168H-1000H %RM Temperature: 150 Time:168H-1000H Temperature:From -40 to125 well time:30min, cycles Temperature: 85,Humidity:85% Test time:168h-1000h Temperature: 121, 2atm. Humidity:100% Test time:24h to 168H Temperature: 260±5 Time of dip soldering:10s, 3times Temperature: 130±2 Humidity:85% ias=80%rm Time:96H Note: The above testing items can be specified by customers by contacting encent service Product imensions 5.4± ± ± ± ± ± ± ±0.012 ottom view F 0.8± ± ± ±0.002 F G G 2± ±0.012 Side view Recoended Soldering Pad /5

5 Reflow Profile Order ode: Reflow ondition Pb-Free ssembly Temperature Min Pre Heat Temperature Max Time(Min to Max) secs. verage ramp up rate(liquidustemp( ) to peak) TS(max) to TL - Ramp-up Rate - Temperature (T L ) Reflow (Liquidus) 3 / /sec.max. 3 / /sec.max Temperature (T L ) secs. Temperature T P T S(max) T S(min) Ramp-up Preheat T P ritical Zone TL to TP Ramp-down Peak Temp (T P ) +(260+0/-5 ) T S Time within 5 of actual Peak Temp (T P ) Ramp-down Rate 8 15secs. 6 / /sec.max. 25 time to peak temperature Time Time 25 to peak Temp (T P ) 8 min. Max. o not exceed +260 Package Reel Information 3.65+/ / / / d 1.5+/ / / / / / / / F 5.65+/ / P 8.0+/ / P0 4.0+/ / P1 2.0+/ / W 12.0+/ / W / / Outline Reel (pcs) Per arton (pcs) Reel iameters () L arton Size() W H Taping 3,000 24, /5