3R3K SPECIFICATION FOR APPROVAL. Wound Chip Inductor. Ⅰ. Configuration and dimensions: Ⅲ. General specification: REF. : WL (Series) PROD.

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1 SPEIFIIO FOR PPROVL Ⅰ. onfiguration and dimensions: ME REV L PE 1/8 Marking Inductance code H F F E I I ( P Pattern ) 4. ± ± ± ±0.2 E 1.20 F H 1.60 Unit:m/m I 1. Ⅱ. escription: a. Ferrite drum core construction. b. Enamelled copper wire:h class c. Product weight: g(ref.) d. Moisture sensitivity Level 3 e. Products comply with RoHS' requirements Ⅲ. eneral specification: a. emp. rise :20 max. b. mbient temp.:100 max. c. Storage temp.: d. Operating temp.: (emp. rise included) e. erminal pull strength:1.5 kg min. f. Rated current:urrent cause inductance drop within 10% g. Resistance to solder heat:2.10 secs. h. Resistance to solvent:per MIL-S-202F MSU O., L. emperature ( ) Reflow profile Peak emp:2 max. Max time above 245 :20~sec max. Max time above 217 :60~1sec max. 200 ~2 verage Ramp-up Rate:3 /second max. emperature Rising rea Preheat rea Reflow rea Forced ooling rea 1 ~ 200 / 60 ~ 180sec 20~sec 60~1sec 6 / second max. Peak emperature: ime ( seconds )

2 WL K MSU O., L WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K WL K max ( Ω ) R SPEIFIIO FOR PPROVL WL R39M WL WL R9K WL R7K WL R2K WL R8K WL K WL K WL R6K WL K WL K WL K WL R7K WL R2K WL R56M WL R68M WL R82M WL R0K WL R8K WL R5K WL R2K WL R47M Inductance ( μh ) Ⅴ. ELERIL HRERISIS: WOU HIP IUOR WL R10M WL R27M WL R33M WL R22M WL R18M WL R15M WL R12M ME REF : est Freq. ( MHz ) min SRF ( MHz ) min. 300 USOMER : US P/ O.: max. I ( m ) 800 PE: 2/8

3 SPEIFIIO FOR PPROVL REF. : ME Ⅴ. urve: WL R10M REV L PE 3/8 WL R10M ( ) I() Freq(kHz) WL R0K 70.0 WL R0K ( ) I() Freq(kHz) WL K 70.0 WL K ( ) I() Freq(kHz) WL K 70.0 WL K ( ) I() Freq(kHz) MSU O., L.

4 SPEIFIIO FOR PPROVL ME REV L PE 4/8 Ⅵ-1. Packaging information: ( 1 ) onfiguration 2.0±0.5 over tape Embossed carrier End P:8 m/m 4 m/m arrier tape width : Start Leader 200 m/m min. omponents User direction of feed railer 0 m/m min. ( 2 ) imensions Unit:m/m Style ± ( 3 ) 'Y &.W. Pe package ode 'Y (pcs) Inner : Reel.W. (gw) Style 'Y (pcs) Outer : arton.w. (Kg) Size (cm) , x 39 x , x 39 x 22 H , x 39 x 22 MSU O., L.

5 SPEIFIIO FOR PPROVL ME REV L PE 5/8 Ⅵ-2. Packaging information: ( 1 ) onfiguration 2.0±0.5 over tape Embossed carrier End P:8 m/m 4 m/m arrier tape width : Start Leader 200 m/m min. ( 2 ) imensions omponents User direction of feed railer 0 m/m min. Unit:m/m Style ±0.8 13± ( 3 ) 'Y &.W. Pe package ode Inner : Reel Outer : arton 'Y (pcs).w. (gw) Style 'Y (pcs).w. (Kg) Size (cm) 2, , x 39 x 22 F 2, , x 39 x 22 I 2, , x 39 x 22 1, , x 39 x 22 MSU O., L.

6 SPEIFIIO FOR PPROVL ME Ⅵ-3. Packaging information: ( 1 ) onfiguration REV L PE 6/8 2.0±0.5 over tape Embossed carrier End P:8 m/m 4 m/m arrier tape width : Start Leader 200 m/m min. ( 2 ) imensions omponents User direction of feed railer 4 m/m min. Unit:m/m Style ±0.8 13± ( 3 ) 'Y &.W. Pe package ode Inner : Reel Outer : arton 'Y (pcs).w. (gw) Style 'Y (pcs).w. (Kg) Size (cm) E 2, , x 39 x 22 MSU O., L.

7 ME Ⅶ. Reliability test: SPEIFIIO FOR PPROVL REV. PE 7/8 Item Reference documents est ondition est Specification 1.High emperature Exposure MIL-S-202 Method emperature ycling JES iased Humidity est MIL-S-202 Method Operational Life JES External Visual 6.Physical imensions 7.Resistance to solvents JES & MIL-S-883 Method 2009 JES MIL-S-202 Method Vibration est MIL-S-202 Method Resistance o MIL-S-202 Method 210 Soldering Heat est & J-S Saturation urrent 11.Over load 12.emperature Rise urrent 13.Solderability est 14.Electrical haracteriazation JIS 6436 & User SPE. JIS 6436 & User SPE. JIS 6436 & User SPE. J-S-002 & JES MIL-S-202 Method 304 & User SPE. 1.emperature: 125±2 2.ime:96±2 hours. 1.emperature: - ~ umber of cycle:100 cycle 3.well time:30 minutes Inspect product constructions, marking and workmanship. Verify physical dimensions to the applicable product detail specification. Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.Frequency and mplitued : Hz, 1.5 mm. 2.irection:X, Y, Z 3.est duration:2 hours for each direction, 6 hours in total. 1.Highest temperature: 2±5. 2.ime(temp. 217 ):60~1 Second. 3.IR reflow times:3 times. 1.pplied rated current for 5 second. 2.Rated current 1.pplied one and half rated current for a period of 5 minutes. 2.Rated current 1.pplied rated current for 10 minutes. 2.emperature measure by digital surface thermometer. 3.Irms current 1.aking in pre-testing: 1±5 / 16Hours±30 min. 2.Peak temperature:2±5 3.ime(temp. 217 ):60~1 second. 4.IR reflow times:1 times. 1.Operating temperature:- ~125 2.Room temperature:25. more than. more than. more than. more than. 1.o pollution on the surface of products. 2.lear marking. 3.o crack. Per product specification standard 1.o body change in apperarance. 2.o marking blurred. 3.Inductance shall not change more than. more than. more than. Inductance shall not drop more than 10% max. o electrical or mechanical damage Surface temperature rise is less than 20 max. More than 95% soldering coverage min on terminations. more than. 15.Withstanding MIL-S-202 Method : 0 V (erminal to oating) 1.uring the test no breakdown. Voltage est & User SPE. 2.ime:1minutes 2.o mechanical or electrical damage. 16.Insulation voltage 100V applied between inductor 1.IR = 1000MΩ Min. Resistance MIL-S-202 Method 302 terminal and coating for 1 minute. 2.o mechanical or electrical damage. 17.rop 18.erminal Strength est 1.Products shall be mounted on SPE. pcb and dropped down from a heigh of 1m S-6354 & / rop total time:6 time (Every side ofsample drop 2 time) IE emperature:85±2 2.Humidity: 85% RH. 3.ime:96±2 Hours 1.emperature: 125 (emp. rise included) 2.ime:96±2 hours. 3.Rated current 1.pply push force to samples mounted on P. 2.Force of 1.8 kg for 60±1 seconds L 1. dhesion on P shall be enough. 2. Product appearance shall not break. 3. o electrical damage. fter test, inductors shall be no mechanical damage. MSU O., L.

8 SPEIFIIO FOR PPROVL ME REV M PE 8/8 Ⅸ. hange history: E/REV. ISRIPIO RW HEKE PPROVE ~F H hange the cover tape:heat seal/dhesive U 1. hange the resistance to solder heat: secs. 2. dd Electrical specifications at I 1. Modify the specification form 2. dd the current curve and curve Miz Hsieh ick hen ick hen J dd package code H K Modify the Reliability test L M dd package code I 1. Modify the Package weight 2. dd hange history and rawing number expression Miz Hsieh ick hen ick hen MSU O., L.