SP3022 Series 0.35pF 20kV Bidirectional Discrete TVS
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1 Series 0.35pF 20kV Bidirectional iscrete TVS RoHS Pb GREEN escription The includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ES). These robust diodes can safely absorb repetitive ES strikes up to the maximum level specified in the IEC international standard (±20kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ES protection for data lines when AC signals are present and the low loading capacitance makes it ideal for protecting high speed data lines such as HMI,USB2.0, USB3.0 and esata. Pinout Features 0201 Flipchip SO882 (AEC-Q101 qualified) RoHS compliant and leadfree ES protection of ±20kV contact discharge, ±30kV air discharge, (IEC ) EFT, IEC , 40A (5/50ns) Lightning protection, IEC nd edition, 3A (t p =8/20µs) Low capacitance of V R =0V (TYP) Low leakage current of 100nA at 5.3V (MAX) Space efficient 0201 and 0402 footprint Extremely low dynamic resistance (0.7Ω TYP) AEC-Q101 qualified (SO882 package) Functional Block iagram Applications USB 3.0/USB 2.0/MHL MIPI Camera and isplay HMI 2.0, isplayport 1.3, esata Set Top Boxes, Game Consoles Smart Phones External Storage Ultrabooks, Notebooks Tablets, ereaders Automotive Electronics Additional Information atasheet Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
2 Absolute Maximum Ratings Thermal Information Symbol Parameter Value Units P PK Peak Pulse Power (t P =8/20µs) 20 W I PP Peak Current (t p =8/20μs) 3.0 A T OP Operating Temperature -40 to 125 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP =25ºC) Parameter Rating Units Storage Temperature Range -55 to 150 C Maximum Junction Temperature 150 C Maximum Lead Temperature (Soldering 20-40s) 260 C SP3021 Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM 5.3 V Reverse Breakdown Voltage V BR 1 R =1mA V Reverse Leakage Current I LEAK V R =5.3V < na Clamp Voltage 1 V C I PP =1A, t p =8/20µs, Fwd 12.0 V ynamic Resistance 2 R YN TLP, tp=100ns, I/O to GN 0.7 Ω ES Withstand Voltage 1 V ES IEC (Contact) ±20 kv IEC (Air) ±30 kv iode Capacitance 1 C Reverse Bias=0V pf Note: 1 Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Pulse Waveform Transmission Line Pulsing(TLP) Plot Percent of I PP 110% 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% Time (μs) TLP Current (A) TLP Voltage (V)
3 Temperature TVS iode Arrays (SPA iodes) Clamping Voltage vs I PP Capacitance vs. Reverse Bias Clamp Voltage (VC) Capacitance (pf) Peak Pulse Current-I PP (A) Bias Voltage (V) Soldering Parameters Reflow Condition Pre Heat Pb Free assembly - Temperature Min (T s(min) ) 150 C - Temperature Max (T s(max) ) 200 C - Time (min to max) (t s ) secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3 C/second max T S(max) to T L - Ramp-up Rate 3 C/second max - Temperature (T L ) (Liquidus) 217 C Reflow - Temperature (t L ) seconds Peak Temperature (T P ) /-5 C Time within 5 C of actual peak Temperature (t p ) seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P ) 8 minutes Max. o not exceed 260 C T P T L T S(max) T S(min) 25 t S Preheat Ramp-up time to peak temperature Product Characteristics of 0201 Flipchip Lead Plating Lead Material Lead Coplanarity Substrate material Body Material Sn Copper 6µm(max) t P t L Ramp-down Time Critical Zone TL to TP Product Characteristics of SO882 Lead Plating Pre-Plated Frame or Matte Tin Lead Material Copper Alloy Lead Coplanarity inches (0.102mm) Substrate material Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. imensions include solder plating. 3. imensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VI
4 Ordering Information Part Number Package Marking Min. Order Qty. Packaging Option P0/P1 Packaging Specification -01WTG 0201 Flipchip Tape & Reel 8mm tape/7 reel 4mm/2mm EIA RS ETG SO Tape & Reel 8mm tape/7 reel 4mm/2mm EIA RS-481 Part Numbering System Part Marking System SP x T G TVS iode Arrays (SPA iodes) G= Green T= Tape & Reel Series -01WTG -01ETG Number of Channels Package W: 0201 Flipchip E: SO882 Package imensions 0201 Flipchip A 0201 Flipchip B F 0.30 Symbol Millimeters Inches Min Typ Max Min Typ Max E A B C C *Sizes in mm E F G Recommended Solder Pad Footprint G Package imensions SO882 Package SO882 Symbol JEEC Millimeters MO-236 Inches Min Typ Max Min Typ Max A B C E F Recommended Soldering Pad Layout
5 Embossed Carrier Tape & Reel Specification 0201 Flipchip P1 P0 W T P2 1 E F Symbol Millimeters A /-0.03 B /-0.03 ø ø / E 1.75+/-0.10 F 3.50+/-0.05 K /-0.03 P /-0.10 P.00+/-0.05 P /-0.05 W T 0.23+/-0.02 A0 K0 B0 Embossed Carrier Tape & Reel Specification SO882 Symbol Millimeters A / B / K / F 3.50+/-0.05 P.00+/-0.10 W Notes : 1. All dimensions are in millimeters
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Technical Data Sheet Feature RoHS compliant. Chip LED package. Wide viewing angle 130 o. Colorless clear resin. Wavelength: 605nm Brightness: 9 to 18 mcd at 2mA Inner reflector and white package. Useable
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