Accelerated Neutral Atom Beam Processing of Ultra-thin Membranes to Enhance EUV Transmittance. February 22, 2015

Size: px
Start display at page:

Download "Accelerated Neutral Atom Beam Processing of Ultra-thin Membranes to Enhance EUV Transmittance. February 22, 2015"

Transcription

1 Accelerated Neutral Atom Beam Processing of Ultra-thin Membranes to Enhance EUV Transmittance February 22,

2 Participation / Contacts Exogenesis Corporation, ANAB Technology Sean Kirkpatrick, Son Chau, Richard Svrluga Norcada Inc., MEMS / Membrane Technology Hooman Hosseinkhannazer, Yuebin Ning, Graham McKinnon International Sematech, Pellicle Investigation David Balachandran, Frank Goodwin Lawrence Berkeley National Lab, EUV Testing Eric Gullikson, Patrick Naulleau 2

3 Investigation Road Map Norcada, Inc. silicon membrane fabrication Lawrence Berkeley National National Lab Lab EUV Testing Exogenesis ANAB Processing 3

4 Norcada Membrane Technology Norcada is a MEMS and nanotechnology manufacturer in Edmonton, Canada Norcada offers ultrathin membranes for a variety of applications in industrial and scientific fields: o Poly and single crystal Silicon membranes o Silicon Nitride membranes o Polymeric membranes o Multilayer membranes with semiconductor materials and polymeric layers o Thin film semi-holey or holey features o Dual thickness membranes 4

5 Norcada Membrane Technology Norcada membranes are made in a variety of specifications: o Rib supports and silicon mesh structures o Encapsulated and protected ultrathin films o Membranes lateral size: 2µm to 100mm o Membrane thickness: 5nm to 20µm o Circular, polygonal and square membranes 5

6 Norcada Membrane Technology Norcada has the capacity to deliver thousands of devices per year All products are manufactured and packaged in cleanroom 6

7 Accelerated Neutral Atom Beam Technology (ANAB) High Intensity Flux Low Energy Particles ( ev) Electrically Neutral Surface Penetration < 3 nm 7

8 Accelerated Neutral Atom Beam Generation 1. Expansion of gas through a supersonic nozzle creates gas clusters Ar a few hundred to several thousand Ar atoms bound by weak interatomic forces 2/22/2015

9 Accelerated Neutral Atom Beam Generation 2. Clusters are ionized by electron impact and accelerated through HV + Individual atoms of an ionized 1000 atom cluster have 30 ev/atom after 30 kv acceleration 2/22/2015

10 Accelerated Neutral Atom Beam Generation 3. Collision of an accelerated cluster ion with an un-accelerated gas atom makes the cluster thermodynamically unstable + 2/22/2015

11 Accelerated Neutral Atom Beam Generation 4. An unstable cluster must release atom bonds in order to regain stability + + atoms released from a cluster continue to travel with the same speed and direction they had as part of the cluster 2/22/2015

12 Accelerated Neutral Atom Beam Generation + charged species neutral atoms deflector field 5. An electrostatic field is used to deflect residual charged species from the beam 2/22/2015

13 Accelerated Neutral Atom Beam Generation 6. Accelerated neutral atoms continue to transport as an intense collimated beam accelerated neutral atoms have energies controllable from 10 to 100 ev 2/22/2015

14 Accelerated Neutral Atom Beam (ANAB) Effects highly uniform sputtering and etching atomic level smoothing removal of nanoscale asperities amorphization to depths of 2 3 nm ultra-shallow doping surface composition modification deposition of ultra-thin films 2/22/2015

15 Atomic level smoothing EUV Lithography mask blank substrate After Accelerated Neutral Atom Beam Exogenesis process Ra nm Rz nm Ra nm Rz nm 15

16 Ultra shallow doping 1-3nm 16

17 Surface Modification of Copper With ANAB Carbon Doping for Enhanced Oxidation Resistance ANAB ANAB Control Control Oxidation accelerated on hot plate at ~300deg C in Atmosphere 17

18 Can ANAB Technology Improve Pellicle Membrane Material Performance At 13.5nm? Would ANAB processing to reduce thickness of ultra-thin membranes improve EUV (13.5 nm) transparency? Would ANAB processing to smooth membrane surfaces and remove surface asperities improve EUV transparency? Would ANAB processing to implant impurities into / onto surfaces of substrate materials severely diminish EUV transparency? 18

19 Lawrence Berkeley National Lab Reflectometry and Scattering Beamline (ALS 6.3.2) Beamline Specifications Wavelength precision: 0.007% Wavelength uncertainty: 0.013% Reflectance precision: 0.08% Reflectance uncertainty: 0.08% Spectral purity: 99.98% Dynamic range: Reflectance (%) PTB CXRO Precision Reflectometer µm 150 µm beam size 1 µm positioning precision Angular precision 0.01 deg Wavelength (nm) 6 degrees of freedom Sample size up to 265 mm LG156 2/22/2015

20 Would ANAB processing to reduce membrane thickness improve EUV Transparency? Single crystal silicon membrane thinned from 100nm to 25nm %T at 13.5nm increased from 82.2% to 90.5% Polycrystalline silicon membrane thinned from 50nm to 25nm %T at 13.5nm increased from 90.9% to 94.4% 20

21 Would ANAB processing to smooth membrane surfaces improve EUV transparency? Control 100nm: %T at 13.5nm = 82.1% ANAB 1 side 50 nm: %T at 13.5nm = 85.8% ANAB 2 side X 25 nm: %T at 13.5nm = 87.0% 21

22 Would addition of ANAB impurities into/onto membrane surfaces reduce EUV transparency? Polysilicon membrane 50nm thick: %T at 13.5nm = 90.9% ANAB 1 side reduced to 25nm thick: %T at 13.5nm = 94.4% ANAB 1 side + 25nm ANAB Carbon: %T at 13.5nm = 90.2% 22

23 ANAB / Pellicle Membrane Investigation Summary Controlled thinning of membrane materials via ANAB processing can improve EUV transparency. Smoothing of membrane materials with ANAB can improve EUV transparency. Addition of ANAB impurities may provide enhanced performance to membrane materials without sacrificing EUV transparency. THANK YOU 23

Accelerated Neutral Atom Beam (ANAB)

Accelerated Neutral Atom Beam (ANAB) Accelerated Neutral Atom Beam (ANAB) Development and Commercialization July 2015 1 Technological Progression Sometimes it is necessary to develop a completely new tool or enabling technology to meet future

More information

LECTURE 5 SUMMARY OF KEY IDEAS

LECTURE 5 SUMMARY OF KEY IDEAS LECTURE 5 SUMMARY OF KEY IDEAS Etching is a processing step following lithography: it transfers a circuit image from the photoresist to materials form which devices are made or to hard masking or sacrificial

More information

SURFACE PROCESSING WITH HIGH-ENERGY GAS CLUSTER ION BEAMS

SURFACE PROCESSING WITH HIGH-ENERGY GAS CLUSTER ION BEAMS SURFACE PROCESSING WITH HIGH-ENERGY GAS CLUSTER ION BEAMS Toshio Seki and Jiro Matsuo, Quantum Science and Engineering Center, Kyoto University, Gokasyo, Uji, Kyoto 611-0011, Japan Abstract Gas cluster

More information

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD Chapter 4 DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD 4.1 INTRODUCTION Sputter deposition process is another old technique being used in modern semiconductor industries. Sputtering

More information

High Accuracy EUV Reflectometry and Scattering at the Advanced Light Source

High Accuracy EUV Reflectometry and Scattering at the Advanced Light Source High Accuracy EUV Reflectometry and Scattering at the Advanced Light Source Eric Gullikson Lawrence Berkeley National Laboratory 1 Reflectometry and Scattering Beamline (ALS 6.3.2) Commissioned Fall 1994

More information

Enhanced High Aspect Ratio Etch Performance With ANAB Technology. Keywords: High Aspect Ratio, Etch, Neutral Particles, Neutral Beam I.

Enhanced High Aspect Ratio Etch Performance With ANAB Technology. Keywords: High Aspect Ratio, Etch, Neutral Particles, Neutral Beam I. Enhanced High Aspect Ratio Etch Performance With ANAB Technology. Keywords: High Aspect Ratio, Etch, Neutral Particles, Neutral Beam I. INTRODUCTION As device density increases according to Moore s law,

More information

EUREKA: A new Industry EUV Research Center at LBNL

EUREKA: A new Industry EUV Research Center at LBNL EUREKA: A new Industry EUV Research Center at LBNL Patrick Naulleau Center for X-ray Optics Lawrence Berkeley National Laboratory Berkeley Lab MSD Materials Sciences Division 1 Operating model Core operational

More information

Fabrication Technology, Part I

Fabrication Technology, Part I EEL5225: Principles of MEMS Transducers (Fall 2004) Fabrication Technology, Part I Agenda: Microfabrication Overview Basic semiconductor devices Materials Key processes Oxidation Thin-film Deposition Reading:

More information

Plasma Deposition (Overview) Lecture 1

Plasma Deposition (Overview) Lecture 1 Plasma Deposition (Overview) Lecture 1 Material Processes Plasma Processing Plasma-assisted Deposition Implantation Surface Modification Development of Plasma-based processing Microelectronics needs (fabrication

More information

MSN551 LITHOGRAPHY II

MSN551 LITHOGRAPHY II MSN551 Introduction to Micro and Nano Fabrication LITHOGRAPHY II E-Beam, Focused Ion Beam and Soft Lithography Why need electron beam lithography? Smaller features are required By electronics industry:

More information

Lecture 0: Introduction

Lecture 0: Introduction Lecture 0: Introduction Introduction q Integrated circuits: many transistors on one chip q Very Large Scale Integration (VLSI): bucketloads! q Complementary Metal Oxide Semiconductor Fast, cheap, low power

More information

CLUSTER SIZE DEPENDENCE OF SPUTTERING YIELD BY CLUSTER ION BEAM IRRADIATION

CLUSTER SIZE DEPENDENCE OF SPUTTERING YIELD BY CLUSTER ION BEAM IRRADIATION CLUSTER SIZE DEPENDENCE OF SPUTTERING YIELD BY CLUSTER ION BEAM IRRADIATION T. Seki 1,2), T. Murase 1), J. Matsuo 1) 1) Quantum Science and Engineering Center, Kyoto University 2) Collaborative Research

More information

High-Precision Evaluation of Ultra-Shallow Impurity Profiles by Secondary Ion Mass Spectrometry

High-Precision Evaluation of Ultra-Shallow Impurity Profiles by Secondary Ion Mass Spectrometry High-Precision Evaluation of Ultra-Shallow Impurity Profiles by Secondary Ion Mass Spectrometry Yoko Tada Kunihiro Suzuki Yuji Kataoka (Manuscript received December 28, 2009) As complementary metal oxide

More information

Introduction to Photolithography

Introduction to Photolithography http://www.ichaus.de/news/72 Introduction to Photolithography Photolithography The following slides present an outline of the process by which integrated circuits are made, of which photolithography is

More information

Self-study problems and questions Processing and Device Technology, FFF110/FYSD13

Self-study problems and questions Processing and Device Technology, FFF110/FYSD13 Self-study problems and questions Processing and Device Technology, FFF110/FYSD13 Version 2016_01 In addition to the problems discussed at the seminars and at the lectures, you can use this set of problems

More information

Ion Implantation. alternative to diffusion for the introduction of dopants essentially a physical process, rather than chemical advantages:

Ion Implantation. alternative to diffusion for the introduction of dopants essentially a physical process, rather than chemical advantages: Ion Implantation alternative to diffusion for the introduction of dopants essentially a physical process, rather than chemical advantages: mass separation allows wide varies of dopants dose control: diffusion

More information

TMT4320 Nanomaterials November 10 th, Thin films by physical/chemical methods (From chapter 24 and 25)

TMT4320 Nanomaterials November 10 th, Thin films by physical/chemical methods (From chapter 24 and 25) 1 TMT4320 Nanomaterials November 10 th, 2015 Thin films by physical/chemical methods (From chapter 24 and 25) 2 Thin films by physical/chemical methods Vapor-phase growth (compared to liquid-phase growth)

More information

Section 12: Intro to Devices

Section 12: Intro to Devices Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals Bond Model of Electrons and Holes Si Si Si Si Si Si Si Si Si Silicon

More information

MICRO AND NANOPROCESSING TECHNOLOGIES

MICRO AND NANOPROCESSING TECHNOLOGIES LECTURE 5 MICRO AND NANOPROCESSING TECHNOLOGIES Introduction Ion lithography X-ray lithography Soft lithography E-beam lithography Concepts and processes Lithography systems Masks and resists Chapt.9.

More information

Nova 600 NanoLab Dual beam Focused Ion Beam IITKanpur

Nova 600 NanoLab Dual beam Focused Ion Beam IITKanpur Nova 600 NanoLab Dual beam Focused Ion Beam system @ IITKanpur Dual Beam Nova 600 Nano Lab From FEI company (Dual Beam = SEM + FIB) SEM: The Electron Beam for SEM Field Emission Electron Gun Energy : 500

More information

Section 12: Intro to Devices

Section 12: Intro to Devices Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si

More information

Lab1. Resolution and Throughput of Ion Beam Lithography.

Lab1. Resolution and Throughput of Ion Beam Lithography. 1 ENS/PHY463 Lab1. Resolution and Throughput of Ion Beam Lithography. (SRIM 2008/2013 computer simulation) Objective The objective of this laboratory work is to evaluate the exposure depth, resolution,

More information

Table of Content. Mechanical Removing Techniques. Ultrasonic Machining (USM) Sputtering and Focused Ion Beam Milling (FIB)

Table of Content. Mechanical Removing Techniques. Ultrasonic Machining (USM) Sputtering and Focused Ion Beam Milling (FIB) Table of Content Mechanical Removing Techniques Ultrasonic Machining (USM) Sputtering and Focused Ion Beam Milling (FIB) Ultrasonic Machining In ultrasonic machining (USM), also called ultrasonic grinding,

More information

Processing of Semiconducting Materials Prof. Pallab Banerji Department of Metallurgy and Material Science Indian Institute of Technology, Kharagpur

Processing of Semiconducting Materials Prof. Pallab Banerji Department of Metallurgy and Material Science Indian Institute of Technology, Kharagpur Processing of Semiconducting Materials Prof. Pallab Banerji Department of Metallurgy and Material Science Indian Institute of Technology, Kharagpur Lecture - 9 Diffusion and Ion Implantation III In my

More information

EUV and Soft X-Ray Optics

EUV and Soft X-Ray Optics EUV and Soft X-Ray Optics David Attwood University of California, Berkeley Cheiron School September 2011 SPring-8 1 The short wavelength region of the electromagnetic spectrum n = 1 δ + iβ δ, β

More information

Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics. MEMS Overview

Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics. MEMS Overview Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics MicroOptoElectroMechanical Systems (MOEMS) Grating Light Valves Corner Cube Reflector (CCR) MEMS Light Modulator Optical Switch Micromirrors

More information

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4 Issued: Wednesday, Mar. 5, 2014 PROBLEM SET #4 Due (at 9 a.m.): Tuesday Mar. 18, 2014, in the EE C247B HW box near 125 Cory. 1. Suppose you would like to fabricate the suspended cross beam structure below

More information

Nanostructures Fabrication Methods

Nanostructures Fabrication Methods Nanostructures Fabrication Methods bottom-up methods ( atom by atom ) In the bottom-up approach, atoms, molecules and even nanoparticles themselves can be used as the building blocks for the creation of

More information

Evaluation of Mo/Si multilayer for EUVL mask blank

Evaluation of Mo/Si multilayer for EUVL mask blank Evaluation of Mo/Si multilayer for mask blank H. Yamanashi, T. Ogawa, H. Hoko, B. T. Lee, E. Hoshino, M. Takahashi, N. Hirano, A. Chiba, H. Oizumi, I. Nishiyama, and S. Okazaki Association of Super-Advanced

More information

Kavli Workshop for Journalists. June 13th, CNF Cleanroom Activities

Kavli Workshop for Journalists. June 13th, CNF Cleanroom Activities Kavli Workshop for Journalists June 13th, 2007 CNF Cleanroom Activities Seeing nm-sized Objects with an SEM Lab experience: Scanning Electron Microscopy Equipment: Zeiss Supra 55VP Scanning electron microscopes

More information

Secondary ion mass spectrometry (SIMS)

Secondary ion mass spectrometry (SIMS) Secondary ion mass spectrometry (SIMS) ELEC-L3211 Postgraduate Course in Micro and Nanosciences Department of Micro and Nanosciences Personal motivation and experience on SIMS Offers the possibility to

More information

Gaetano L Episcopo. Scanning Electron Microscopy Focus Ion Beam and. Pulsed Plasma Deposition

Gaetano L Episcopo. Scanning Electron Microscopy Focus Ion Beam and. Pulsed Plasma Deposition Gaetano L Episcopo Scanning Electron Microscopy Focus Ion Beam and Pulsed Plasma Deposition Hystorical background Scientific discoveries 1897: J. Thomson discovers the electron. 1924: L. de Broglie propose

More information

Y. C. Lee. Micro-Scale Engineering I Microelectromechanical Systems (MEMS)

Y. C. Lee. Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee Department of Mechanical Engineering University of Colorado Boulder, CO 80309-0427 leeyc@colorado.edu January 15, 2014 1 Contents

More information

4FNJDPOEVDUPS 'BCSJDBUJPO &UDI

4FNJDPOEVDUPS 'BCSJDBUJPO &UDI 2010.5.4 1 Major Fabrication Steps in CMOS Process Flow UV light oxygen Silicon dioxide Silicon substrate Oxidation (Field oxide) photoresist Photoresist Coating Mask exposed photoresist Mask-Wafer Exposed

More information

EE 5211 Analog Integrated Circuit Design. Hua Tang Fall 2012

EE 5211 Analog Integrated Circuit Design. Hua Tang Fall 2012 EE 5211 Analog Integrated Circuit Design Hua Tang Fall 2012 Today s topic: 1. Introduction to Analog IC 2. IC Manufacturing (Chapter 2) Introduction What is Integrated Circuit (IC) vs discrete circuits?

More information

Figure 1: Graphene release, transfer and stacking processes. The graphene stacking began with CVD

Figure 1: Graphene release, transfer and stacking processes. The graphene stacking began with CVD Supplementary figure 1 Graphene Growth and Transfer Graphene PMMA FeCl 3 DI water Copper foil CVD growth Back side etch PMMA coating Copper etch in 0.25M FeCl 3 DI water rinse 1 st transfer DI water 1:10

More information

Accelerated ions. ion doping

Accelerated ions. ion doping 30 5. Simulation of Ion Doping of Semiconductors 5.1. Objectives - To give students hand-on experience of numerical simulation of ion doping used for fabrication of semiconductor planar devices. - To familiarize

More information

Changing the Dopant Concentration. Diffusion Doping Ion Implantation

Changing the Dopant Concentration. Diffusion Doping Ion Implantation Changing the Dopant Concentration Diffusion Doping Ion Implantation Step 11 The photoresist is removed with solvent leaving a ridge of polysilicon (the transistor's gate), which rises above the silicon

More information

Ternary blend polymer solar cells with enhanced power conversion efficiency

Ternary blend polymer solar cells with enhanced power conversion efficiency Ternary blend polymer solar cells with enhanced power conversion efficiency Luyao Lu 1, Tao Xu 1, Wei Chen 2,3, Erik S. Landry 2,3, Luping Yu 1 * 1. Department of Chemistry and The James Franck Institute,

More information

Metal Deposition. Filament Evaporation E-beam Evaporation Sputter Deposition

Metal Deposition. Filament Evaporation E-beam Evaporation Sputter Deposition Metal Deposition Filament Evaporation E-beam Evaporation Sputter Deposition 1 Filament evaporation metals are raised to their melting point by resistive heating under vacuum metal pellets are placed on

More information

Monitoring EUV Reticle Molecular Contamination on ASML s Alpha Demo Tool

Monitoring EUV Reticle Molecular Contamination on ASML s Alpha Demo Tool Monitoring EUV Reticle Molecular Contamination on ASML s Alpha Demo Tool Uzodinma Okoroanyanwu, 1 Aiqin Jiang, 2 Kornelia Dittmar, 3 Torsten Fahr, 3 Thomas Laursen, 2 Obert Wood, 1 Kevin Cummings, 2 Christian

More information

Lecture 150 Basic IC Processes (10/10/01) Page ECE Analog Integrated Circuits and Systems P.E. Allen

Lecture 150 Basic IC Processes (10/10/01) Page ECE Analog Integrated Circuits and Systems P.E. Allen Lecture 150 Basic IC Processes (10/10/01) Page 1501 LECTURE 150 BASIC IC PROCESSES (READING: TextSec. 2.2) INTRODUCTION Objective The objective of this presentation is: 1.) Introduce the fabrication of

More information

Techniques for directly measuring the absorbance of photoresists at EUV wavelengths

Techniques for directly measuring the absorbance of photoresists at EUV wavelengths Techniques for directly measuring the absorbance of photoresists at EUV wavelengths Manish Chandhok, a Heidi Cao, a Wang Yueh, a Eric Gullikson, b Robert Brainard, c Stewart Robertson c a Intel Corporation,

More information

Measurement of EUV scattering from Mo/Si multilayer mirrors

Measurement of EUV scattering from Mo/Si multilayer mirrors Measurement of EUV scattering from Mo/Si multilayer mirrors N. Kandaka, T. Kobayashi, T. Komiya, M. Shiraishi, T. Oshino and K. Murakami Nikon Corp. 3 rd EUVL Symposium Nov. 2-4 2004 (Miyazaki, JAPAN)

More information

IC Fabrication Technology

IC Fabrication Technology IC Fabrication Technology * History: 1958-59: J. Kilby, Texas Instruments and R. Noyce, Fairchild * Key Idea: batch fabrication of electronic circuits n entire circuit, say 10 7 transistors and 5 levels

More information

Electrical Resistance

Electrical Resistance Electrical Resistance I + V _ W Material with resistivity ρ t L Resistance R V I = L ρ Wt (Unit: ohms) where ρ is the electrical resistivity 1 Adding parts/billion to parts/thousand of dopants to pure

More information

3.1 Introduction to Semiconductors. Y. Baghzouz ECE Department UNLV

3.1 Introduction to Semiconductors. Y. Baghzouz ECE Department UNLV 3.1 Introduction to Semiconductors Y. Baghzouz ECE Department UNLV Introduction In this lecture, we will cover the basic aspects of semiconductor materials, and the physical mechanisms which are at the

More information

EUV and Soft X-Ray Optics

EUV and Soft X-Ray Optics EUV and Soft X-Ray Optics David Attwood University of California, Berkeley and Advanced Light Source, LBNL Cheiron School October 2010 SPring-8 1 The short wavelength region of the electromagnetic spectrum

More information

Applications of ion beams in materials science

Applications of ion beams in materials science Applications of ion beams in materials science J. Gyulai Research Institute for Technical Physics and Materials Science (MFA), Hung. Acad. Sci., Budapest Types of processing technologies Top-down - waste

More information

SCI. Scientific Computing International. Scientific Computing International. FilmTek. Raising Thin Film Metrology Performance to a New Level

SCI. Scientific Computing International. Scientific Computing International. FilmTek. Raising Thin Film Metrology Performance to a New Level FilmTek Raising Thin Film Metrology Performance to a New Level 1 Through Silicon Via (TSV) Metrology FilmTek TM TM TSV TSV Metrology Advantages Measure high aspect ratio TSV structures (up to 30:1) Measure

More information

an introduction to Semiconductor Devices

an introduction to Semiconductor Devices an introduction to Semiconductor Devices Donald A. Neamen Chapter 6 Fundamentals of the Metal-Oxide-Semiconductor Field-Effect Transistor Introduction: Chapter 6 1. MOSFET Structure 2. MOS Capacitor -

More information

PHI 5000 Versaprobe-II Focus X-ray Photo-electron Spectroscopy

PHI 5000 Versaprobe-II Focus X-ray Photo-electron Spectroscopy PHI 5000 Versaprobe-II Focus X-ray Photo-electron Spectroscopy The very basic theory of XPS XPS theroy Surface Analysis Ultra High Vacuum (UHV) XPS Theory XPS = X-ray Photo-electron Spectroscopy X-ray

More information

Secondaryionmassspectrometry

Secondaryionmassspectrometry Secondaryionmassspectrometry (SIMS) 1 Incident Ion Techniques for Surface Composition Analysis Mass spectrometric technique 1. Ionization -Electron ionization (EI) -Chemical ionization (CI) -Field ionization

More information

Supplementary Figure S1. AFM characterizations and topographical defects of h- BN films on silica substrates. (a) (c) show the AFM height

Supplementary Figure S1. AFM characterizations and topographical defects of h- BN films on silica substrates. (a) (c) show the AFM height Supplementary Figure S1. AFM characterizations and topographical defects of h- BN films on silica substrates. (a) (c) show the AFM height topographies of h-bn film in a size of ~1.5µm 1.5µm, 30µm 30µm

More information

Overview of EUV Lithography and EUV Optics Contamination

Overview of EUV Lithography and EUV Optics Contamination Accelerating the next technology revolution Overview of EUV Lithography and EUV Optics Contamination Andrea Wüest NIST Contamination WS Gaithersburg, MD June 2, 2009 Copyright 2008 SEMATECH, Inc. SEMATECH,

More information

EECS C245 ME C218 Midterm Exam

EECS C245 ME C218 Midterm Exam University of California at Berkeley College of Engineering EECS C245 ME C218 Midterm Eam Fall 2003 Prof. Roger T. Howe October 15, 2003 Dr. Thara Srinivasan Guidelines Your name: SOLUTIONS Circle your

More information

A semiconductor is an almost insulating material, in which by contamination (doping) positive or negative charge carriers can be introduced.

A semiconductor is an almost insulating material, in which by contamination (doping) positive or negative charge carriers can be introduced. Semiconductor A semiconductor is an almost insulating material, in which by contamination (doping) positive or negative charge carriers can be introduced. Page 2 Semiconductor materials Page 3 Energy levels

More information

Supplementary Figure 1 Detailed illustration on the fabrication process of templatestripped

Supplementary Figure 1 Detailed illustration on the fabrication process of templatestripped Supplementary Figure 1 Detailed illustration on the fabrication process of templatestripped gold substrate. (a) Spin coating of hydrogen silsesquioxane (HSQ) resist onto the silicon substrate with a thickness

More information

Extensive reading materials on reserve, including

Extensive reading materials on reserve, including Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si

More information

Technology Solution. Principles of Sheath Technology and Low Maintenance Ionizers. The Operation of Corona Ionizers. The Creation of White Fuzzballs

Technology Solution. Principles of Sheath Technology and Low Maintenance Ionizers. The Operation of Corona Ionizers. The Creation of White Fuzzballs Technology Solution Principles of Sheath Technology and Low Maintenance Ionizers The Operation of Corona Ionizers Corona ionizers operate by disassembling air atoms into ions through the use of an intense,

More information

MICROCHIP MANUFACTURING by S. Wolf

MICROCHIP MANUFACTURING by S. Wolf by S. Wolf Chapter 15 ALUMINUM THIN-FILMS and SPUTTER-DEPOSITION 2004 by LATTICE PRESS CHAPTER 15 - CONTENTS Aluminum Thin-Films Sputter-Deposition Process Steps Physics of Sputter-Deposition Magnetron-Sputtering

More information

Plasma Etching: Atomic Scale Surface Fidelity and 2D Materials

Plasma Etching: Atomic Scale Surface Fidelity and 2D Materials 1 Plasma Etching: Atomic Scale Surface Fidelity and 2D Materials Thorsten Lill, Keren J. Kanarik, Samantha Tan, Meihua Shen, Alex Yoon, Eric Hudson, Yang Pan, Jeffrey Marks, Vahid Vahedi, Richard A. Gottscho

More information

EE143 LAB. Professor N Cheung, U.C. Berkeley

EE143 LAB. Professor N Cheung, U.C. Berkeley EE143 LAB 1 1 EE143 Equipment in Cory 218 2 Guidelines for Process Integration * A sequence of Additive and Subtractive steps with lateral patterning Processing Steps Si wafer Watch out for materials compatibility

More information

FEASIBILITY OF IN SITU TXRF

FEASIBILITY OF IN SITU TXRF FEASIBILITY OF IN SITU TXRF A. ngh 1, P. Goldenzweig 2, K. Baur 1, S. Brennan 1, and P. Pianetta 1 1. Stanford Synchrotron Radiation Laboratory, Stanford, CA 94309, US 2. Binghamton University, New York,

More information

Foundations of MEMS. Chang Liu. McCormick School of Engineering and Applied Science Northwestern University. International Edition Contributions by

Foundations of MEMS. Chang Liu. McCormick School of Engineering and Applied Science Northwestern University. International Edition Contributions by Foundations of MEMS Second Edition Chang Liu McCormick School of Engineering and Applied Science Northwestern University International Edition Contributions by Vaishali B. Mungurwadi B. V. Bhoomaraddi

More information

Chapter 8 Ion Implantation

Chapter 8 Ion Implantation Chapter 8 Ion Implantation 2006/5/23 1 Wafer Process Flow Materials IC Fab Metalization CMP Dielectric deposition Test Wafers Masks Thermal Processes Implant PR strip Etch PR strip Packaging Photolithography

More information

Current development status of Shin-Etsu EUV pellicle

Current development status of Shin-Etsu EUV pellicle Current development status of Shin-Etsu EUV pellicle Advanced Functional Materials Research Center 1 Why Pellicle for EUV Lithography? Extensive studies on particle addition during reticle transfer have

More information

Electrons are shared in covalent bonds between atoms of Si. A bound electron has the lowest energy state.

Electrons are shared in covalent bonds between atoms of Si. A bound electron has the lowest energy state. Photovoltaics Basic Steps the generation of light-generated carriers; the collection of the light-generated carriers to generate a current; the generation of a large voltage across the solar cell; and

More information

EE 527 MICROFABRICATION. Lecture 25 Tai-Chang Chen University of Washington

EE 527 MICROFABRICATION. Lecture 25 Tai-Chang Chen University of Washington EE 527 MICROFABRICATION Lecture 25 Tai-Chang Chen University of Washington ION MILLING SYSTEM Kaufmann source Use e-beam to strike plasma A magnetic field applied to increase ion density Drawback Low etch

More information

SUPPLEMENTARY MATERIALS FOR PHONON TRANSMISSION COEFFICIENTS AT SOLID INTERFACES

SUPPLEMENTARY MATERIALS FOR PHONON TRANSMISSION COEFFICIENTS AT SOLID INTERFACES 148 A p p e n d i x D SUPPLEMENTARY MATERIALS FOR PHONON TRANSMISSION COEFFICIENTS AT SOLID INTERFACES D.1 Overview The supplementary information contains additional information on our computational approach

More information

Etching: Basic Terminology

Etching: Basic Terminology Lecture 7 Etching Etching: Basic Terminology Introduction : Etching of thin films and sometimes the silicon substrate are very common process steps. Usually selectivity, and directionality are the first

More information

Ion Implant Part 1. Saroj Kumar Patra, TFE4180 Semiconductor Manufacturing Technology. Norwegian University of Science and Technology ( NTNU )

Ion Implant Part 1. Saroj Kumar Patra, TFE4180 Semiconductor Manufacturing Technology. Norwegian University of Science and Technology ( NTNU ) 1 Ion Implant Part 1 Chapter 17: Semiconductor Manufacturing Technology by M. Quirk & J. Serda Spring Semester 2014 Saroj Kumar Patra,, Norwegian University of Science and Technology ( NTNU ) 2 Objectives

More information

Review of Semiconductor Fundamentals

Review of Semiconductor Fundamentals ECE 541/ME 541 Microelectronic Fabrication Techniques Review of Semiconductor Fundamentals Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Page 1 Semiconductor A semiconductor is an almost insulating material,

More information

DQN Positive Photoresist

DQN Positive Photoresist UNIVESITY OF CALIFONIA, BEKELEY BEKELEY DAVIS IVINE LOS ANGELES IVESIDE SAN DIEGO SAN FANCISCO SANTA BABAA SANTA CUZ DEPATMENT OF BIOENGINEEING 94720-1762 BioE 121 Midterm #1 Solutions BEKELEY, CALIFONIA

More information

FRAUNHOFER IISB STRUCTURE SIMULATION

FRAUNHOFER IISB STRUCTURE SIMULATION FRAUNHOFER IISB STRUCTURE SIMULATION Eberhard Bär eberhard.baer@iisb.fraunhofer.de Page 1 FRAUNHOFER IISB STRUCTURE SIMULATION Overview SiO 2 etching in a C 2 F 6 plasma Ga ion beam sputter etching Ionized

More information

Energetic particles and their detection in situ (particle detectors) Part II. George Gloeckler

Energetic particles and their detection in situ (particle detectors) Part II. George Gloeckler Energetic particles and their detection in situ (particle detectors) Part II George Gloeckler University of Michigan, Ann Arbor, MI University of Maryland, College Park, MD Simple particle detectors Gas-filled

More information

Design and Fabrication of a Micro-size Thermionic Ionization/Flame Ionization Detector for Gas Phase Chemical Analytes

Design and Fabrication of a Micro-size Thermionic Ionization/Flame Ionization Detector for Gas Phase Chemical Analytes Design and Fabrication of a Micro-size Thermionic Ionization/Flame Ionization Detector for Gas Phase Chemical Analytes Polysilicon air-bridge filament heater with integrated electrodes Robert Manley 22

More information

Direct-Write Deposition Utilizing a Focused Electron Beam

Direct-Write Deposition Utilizing a Focused Electron Beam Direct-Write Deposition Utilizing a Focused Electron Beam M. Fischer, J. Gottsbachner, S. Müller, W. Brezna, and H.D. Wanzenboeck Institute of Solid State Electronics, Vienna University of Technology,

More information

Superconducting Single-photon Detectors

Superconducting Single-photon Detectors : Quantum Cryptography Superconducting Single-photon Detectors Hiroyuki Shibata Abstract This article describes the fabrication and properties of a single-photon detector made of a superconducting NbN

More information

Measurement of the Complex Index of Refraction for UO x in the Extreme Ultraviolet

Measurement of the Complex Index of Refraction for UO x in the Extreme Ultraviolet Measurement of the Complex Index of Refraction for UO x in the Extreme Ultraviolet Heidi Dumais Department of Physics and Astronomy, Brigham Young University Abstract - The reflectance and transmittance

More information

Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software

Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software V. Mounika Reddy 1, G.V.Sunil Kumar 2 1,2 Department of Electronics and Instrumentation Engineering, Sree

More information

Lecture 1. OUTLINE Basic Semiconductor Physics. Reading: Chapter 2.1. Semiconductors Intrinsic (undoped) silicon Doping Carrier concentrations

Lecture 1. OUTLINE Basic Semiconductor Physics. Reading: Chapter 2.1. Semiconductors Intrinsic (undoped) silicon Doping Carrier concentrations Lecture 1 OUTLINE Basic Semiconductor Physics Semiconductors Intrinsic (undoped) silicon Doping Carrier concentrations Reading: Chapter 2.1 EE105 Fall 2007 Lecture 1, Slide 1 What is a Semiconductor? Low

More information

Lab 3. Ion Implantation

Lab 3. Ion Implantation 1 Lab 3. Ion Implantation (SRIM 2008/2013 computer simulation) 1. Objectives - To give students hand-on experience of numerical simulation of ion doping used for fabrication of semiconductor nanodevices.

More information

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4 Issued: Wednesday, March 4, 2016 PROBLEM SET #4 Due: Monday, March 14, 2016, 8:00 a.m. in the EE C247B homework box near 125 Cory. 1. This problem considers bending of a simple cantilever and several methods

More information

Controlling Graphene Ultrafast Hot Carrier Response from Metal-like. to Semiconductor-like by Electrostatic Gating

Controlling Graphene Ultrafast Hot Carrier Response from Metal-like. to Semiconductor-like by Electrostatic Gating Controlling Graphene Ultrafast Hot Carrier Response from Metal-like to Semiconductor-like by Electrostatic Gating S.-F. Shi, 1,2* T.-T. Tang, 1 B. Zeng, 1 L. Ju, 1 Q. Zhou, 1 A. Zettl, 1,2,3 F. Wang 1,2,3

More information

Dielectric Meta-Reflectarray for Broadband Linear Polarization Conversion and Optical Vortex Generation

Dielectric Meta-Reflectarray for Broadband Linear Polarization Conversion and Optical Vortex Generation Supporting Information Dielectric Meta-Reflectarray for Broadband Linear Polarization Conversion and Optical Vortex Generation Yuanmu Yang, Wenyi Wang, Parikshit Moitra, Ivan I. Kravchenko, Dayrl P. Briggs,

More information

Plasma-Surface Interactions in Patterning High-k k Dielectric Materials

Plasma-Surface Interactions in Patterning High-k k Dielectric Materials Plasma-Surface Interactions in Patterning High-k k Dielectric Materials October 11, 4 Feature Level Compensation and Control Seminar Jane P. Chang Department of Chemical Engineering University of California,

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION Topological insulator nanostructures for near-infrared transparent flexible electrodes Hailin Peng 1*, Wenhui Dang 1, Jie Cao 1, Yulin Chen 2,3, Di Wu 1, Wenshan Zheng 1, Hui Li 1, Zhi-Xun Shen 3,4, Zhongfan

More information

EE 143 MICROFABRICATION TECHNOLOGY FALL 2014 C. Nguyen PROBLEM SET #7. Due: Friday, Oct. 24, 2014, 8:00 a.m. in the EE 143 homework box near 140 Cory

EE 143 MICROFABRICATION TECHNOLOGY FALL 2014 C. Nguyen PROBLEM SET #7. Due: Friday, Oct. 24, 2014, 8:00 a.m. in the EE 143 homework box near 140 Cory Issued: Tuesday, Oct. 14, 2014 PROBLEM SET #7 Due: Friday, Oct. 24, 2014, 8:00 a.m. in the EE 143 homework box near 140 Cory Electroplating 1. Suppose you want to fabricate MEMS clamped-clamped beam structures

More information

Semiconductor Detectors

Semiconductor Detectors Semiconductor Detectors Summary of Last Lecture Band structure in Solids: Conduction band Conduction band thermal conductivity: E g > 5 ev Valence band Insulator Charge carrier in conductor: e - Charge

More information

CVD: General considerations.

CVD: General considerations. CVD: General considerations. PVD: Move material from bulk to thin film form. Limited primarily to metals or simple materials. Limited by thermal stability/vapor pressure considerations. Typically requires

More information

Nano fabrication by e-beam lithographie

Nano fabrication by e-beam lithographie Introduction to nanooptics, Summer Term 2012, Abbe School of Photonics, FSU Jena, Prof. Thomas Pertsch Nano fabrication by e-beam lithographie Lecture 14 1 Electron Beam Lithography - EBL Introduction

More information

Thin Wafer Handling Challenges and Emerging Solutions

Thin Wafer Handling Challenges and Emerging Solutions 1 Thin Wafer Handling Challenges and Emerging Solutions Dr. Shari Farrens, Mr. Pete Bisson, Mr. Sumant Sood and Mr. James Hermanowski SUSS MicroTec, 228 Suss Drive, Waterbury Center, VT 05655, USA 2 Thin

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION In the format provided by the authors and unedited. DOI: 10.1038/NPHOTON.2016.254 Measurement of non-monotonic Casimir forces between silicon nanostructures Supplementary information L. Tang 1, M. Wang

More information

PB I FEL Gas-Monitor Detectors for FEL Online Photon Beam Diagnostics BESSY

PB I FEL Gas-Monitor Detectors for FEL Online Photon Beam Diagnostics BESSY FEL 2004 Gas-Monitor Detectors for FEL Online Photon Beam Diagnostics M. Richter S.V. Bobashev, J. Feldhaus A. Gottwald, U. Hahn A.A. Sorokin, K. Tiedtke BESSY PTB s Radiometry Laboratory at BESSY II 1

More information

Lecture 30: Kinetics of Epitaxial Growth: Surface Diffusion and

Lecture 30: Kinetics of Epitaxial Growth: Surface Diffusion and Lecture 30: Kinetics of Epitaxial Growth: Surface Diffusion and Nucleation Today s topics Understanding the basics of epitaxial techniques used for surface growth of crystalline structures (films, or layers).

More information

Technology for Micro- and Nanostructures Micro- and Nanotechnology

Technology for Micro- and Nanostructures Micro- and Nanotechnology Lecture 10: Deposition Technology for Micro- and Nanostructures Micro- and Nanotechnology Peter Unger mailto: peter.unger @ uni-ulm.de Institute of Optoelectronics University of Ulm http://www.uni-ulm.de/opto

More information

PHI Model 06-C60 Sputter Ion Gun

PHI Model 06-C60 Sputter Ion Gun PHI Model 6-C6 Sputter Ion Gun Introduction: Physical Electronics introduced the model 6-C6 C 6 sputter ion gun and its unique capabilities for surface cleaning and depth profiling of soft materials (figure

More information

OPTICAL ANALYSIS OF ZnO THIN FILMS USING SPECTROSCOPIC ELLIPSOMETRY AND REFLECTOMETRY.

OPTICAL ANALYSIS OF ZnO THIN FILMS USING SPECTROSCOPIC ELLIPSOMETRY AND REFLECTOMETRY. OPTICAL ANALYSIS OF ZnO THIN FILMS USING SPECTROSCOPIC ELLIPSOMETRY AND REFLECTOMETRY Katarína Bombarová 1, Juraj Chlpík 1,2, Soňa Flickyngerová 3, Ivan Novotný 3, Július Cirák 1 1 Institute of Nuclear

More information

HANDBOOK OF ION BEAM PROCESSING TECHNOLOGY

HANDBOOK OF ION BEAM PROCESSING TECHNOLOGY HANDBOOK OF ION BEAM PROCESSING TECHNOLOGY Principles, Deposition, Film Modification and Synthesis Edited by Jerome J. Cuomo and Stephen M. Rossnagel IBM Thomas J. Watson Research Center Yorktown Heights,

More information