V CE I C (T C =100 C) V CE(sat) (T C =25 C) 1.55V. Symbol V GE I C. 20 A 10 Forward Current T C =100 C 5 I FM. t SC P D T L.
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1 AOTFB6D 6V, A Alpha IGBT TM with Diode General Description The Alpha IGBT TM line of products offers best-in-class performance in conduction and switching losses, with robust short circuit capability. They are designed for ease of paralleling, minimal gate spike under high dv/dt conditions and resistance to oscillations. The copackaged soft diode is optimized to minimize losses in motor control applications. Product Summary V CE I C (T C = C) 6V A V CE(sat) (T C =).V Top View TO-22F C AOTFB6D G C E G E Absolute Maximum Ratings T A = unless otherwise noted Parameter Symbol AOTFB6D Collector-Emitter Voltage 6 Gate-Emitter Voltage Continuous Collector Current A T C = T C = C Pulsed Collector Current, Limited by T Jmax Diode Pulsed Current, Limited by T Jmax Note A:I C limited by package limitation V CE V GE I C I CM Turn off SOA, V CE 6V, Limited by T Jmax I LM 2 A Continuous Diode T C = I F A Forward Current T C = C Short circuit withstanding time V GE = V, V CE V, Delay between short circuits.s, T C = Power Dissipation T C = T C = C I FM t SC P D R θ JC.8 Units V ±2 V Junction and Storage Temperature Range Maximum lead temperature for soldering T J, T STG - to C purpose, /8" from case for seconds Thermal Characteristics T L 3 C Parameter Maximum Junction-to-Ambient Maximum IGBT Junction-to-Case Symbol R θ JA R θ JC AOTFB6D 6 Units C/W C/W Maximum Diode Junction-to-Case C/W 2 2 µs A A A W Rev.3.: Jan 2 Page of 9
2 AOTFB6D Electrical Characteristics (T J = unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS BV CES Collector-Emitter Breakdown Voltage I C =ma, V GE =V, T J = V V CE(sat) V F T J = -..8 T J = T J = C T J = T J = T J = C V GE(th) Gate-Emitter Threshold Voltage V CE =V GE, I C =ma V I CES T J = - - T J = - - T J = C - - I GES Gate-Emitter Leakage Current V CE =V, V GE =±2V - - ± na g FS C ies C oes C res Q g Q ge Q gc Gate to Collector Charge Short circuit collector current, Max. I C(SC) short circuits, Delay between V GE =V, V CE =V, R G =6Ω short circuits.s R g Gate Resistance V GE =V, V CE =V, f=mhz SWITCHING PARAMETERS, (Load Iductive, T J =) t D(on) t r Collector-Emitter Saturation Voltage Forward Transconductance DYNAMIC PARAMETERS Input Capacitance t D(off) t f E on E off E total t rr t D(on) t r t D(off) t f E on E off E total t rr Q rr I rm Diode Forward Voltage Zero Gate Voltage Collector Current Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate to Emitter Charge V GE =V, V CE =8V, I C =A Turn-On DelayTime Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Turn-On Energy Turn-Off Energy Total Switching Energy V GE =V, I C =A V GE =V, I C =A V CE =6V, V GE =V V CE =2V, I C =A V GE =V, V CE =2V, f=mhz T J = V GE =V, V CE =V, I C =A, R G =6Ω, Parasitic Ιnductance=nH Diode Reverse Recovery Time T J = Q rr Diode Reverse Recovery Charge I F =A,dI/dt=2A/µs,V CE =V I rm Diode Peak Reverse Recovery Current SWITCHING PARAMETERS, (Load Iductive, T J = C) Turn-On DelayTime Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Turn-On Energy Turn-Off Energy Total Switching Energy Diode Reverse Recovery Time Diode Reverse Recovery Charge Diode Peak Reverse Recovery Current T J = C V GE =V, V CE =V, I C =A, R G =6Ω, Parasitic Inductance=nH T J = C I F =A,dI/dt=2A/µs,V CE =V V V µa S pf pf pf nc nc nc A Ω ns - - ns ns ns -. - mj -. - mj mj ns µc -. - A - - ns ns ns ns mj mj mj ns -. - µc A THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev.3.: Jan 2 Page 2 of 9
3 AOTFB6D V 7V V 3V V 7V V 3V V GE = 7V V 9V V GE =7V V 9V Fig : Output Characteristic (T j = ) Fig 2: Output Characteristic (T j = C ) 2 V CE =2V - C 3 - C 3 C C I F (A) V GE (V) Fig 3: Transfer Characteristic V F (V) Fig : Diode Characteristic I C =A 2 V CE(sat) (V) 2 I C =A I C =2.A Time (µs) Current(A) Temperature ( C) Fig : Collector-Emitter Saturation Voltage vs. Junction Temperature V GE (V) Fig 6: V GE vs. Short Circuit Time (V CE =V,T C = ) Rev.3.: Jan 2 Page 3 of 9
4 AOTFB6D 2 V CE =8V I C =A C ies V GE (V) Capacitance (pf) C oes C res Q g (nc) Fig 7: Gate-Charge Characteristics Fig 8: Capacitance Characteristic I c (A), Fig : Reverse Bias SOA (T j = C,V GE =V) Power Disspation(W) 2 Current rating T CASE ( C) Fig : Power Disspation as a Function of Case T CASE ( C) Fig 2: Current De-rating Rev.3.: Jan 2 Page of 9
5 AOTFB6D Switching Time (ns) Td(off) Tf Td(on) Tr, Switching Time (ns), Td(off) Tf Td(on) Tr R g (Ω) Figure 3: Switching Time vs. I C (T j = C,V GE =V,V CE =V,R g =6Ω) Figure : Switching Time vs. R g (T j = C,V GE =V,V CE =V,I C =A) Td(off) Tf Td(on) Tr 8 Switching Time (ns) V GE(TH) (V) T J ( C) Figure : Switching Time vs.t j ( V GE =V,V CE =V,I C =A,R g =6Ω) T J ( C) Figure 6: V GE(TH) vs. T j Rev.3.: Jan 2 Page of 9
6 AOTFB6D E,SwitchIng Energy (mj) Eoff Eon Etotal Switching Energy (mj) Eoff Eon Etotal R g (Ω) Figure 7: Switching Loss vs. I C (T j = C,V GE =V,V CE =V,R g =6Ω) Figure 8: Switching Loss vs. R g (T j = C,V GE =V,V CE =V,I C =A) Switching Energy (mj) Eoff Eon Etotal Switching Energ y (mj) Eoff Eon Etotal T J ( C) Figure 9: Switching Loss vs. T j (V GE =V,V CE =V,I C =A,R g =6Ω) Figure 2: Switching Loss vs. V CE (T j = C,V GE =V,I C =A,R g =6Ω) Rev.3.: Jan 2 Page 6 of 9
7 AOTFB6D.E- 2.2 A I CE(S) (A).E-.E-6 V CE =6V V SD (V).7.2 A A IF=A 3V.E-7 V CE =V.7.E Temperature ( C ) Fig 2: Diode Reverse Leakage Current vs. Junction Temperature Temperature ( C ) Fig 22: Diode Forward voltage vs. Junction Temperature C 2 2 Q rr (nc) 3 2 C Q rr I rm I F (A) Fig 23: Diode Reverse Recovery Charge and Peak Current vs. Conduction Current (V GE =V,V CE =V, di/dt=2a/µs) 2 I rm (A) T rr (ns) 2 C C T rr I S (A) Fig 2: Diode Reverse Recovery Time and Softness Factor vs. Conduction Current (V GE =V,V CE =V, di/dt=2a/µs) S S C 6 6 Q rr (nc) 3 2 C Q rr I rm 3 2 I rm (A) T rr (ns) 2 8 C C T rr S 2 S di/dt (A/µS) Fig 2: Diode Reverse Recovery Charge and Peak Current vs. di/dt (V GE =V,V CE =V,I F =A) di/dt (A/µS) Fig 26: Diode Reverse Recovery Time and Softness Factor vs. di/dt (V GE =V,V CE =V,I F =A) Rev.3.: Jan 2 Page 7 of 9
8 AOTFB6D Z θjc Normalized Transient Thermal Resistance.. D=T on /T T J,PK =T C +P DM.Z θjc.r θjc R θjc = C/W In descending order D=.,.3,.,.,.2,., single pulse P D T on T Single Pulse. E-6 E-.... Pulse Width (s) Figure 27: Normalized Maximum Transient Thermal Impedance for IGBT Z θjc Normalized Transient Thermal Resistance.. D=T on /T T J,PK =T C +P DM.Z θjc.r θjc R θjc = C/W Single Pulse In descending order D=.,.3,.,.,.2,., single pulse P D T on T. E-.... Pulse Width (s) Figure 28: Normalized Maximum Transient Thermal Impedance for Diode Rev.3.: Jan 2 Page 8 of 9
9 AOTFB6D Rev.3.: Jan 2 Page 9 of 9
V CE I C (T C =100 C) V CE(sat) (T C =25 C) 1.55V. Symbol V GE I C I CM I LM I F I FM. t SC P D T L. R θ JA
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