AOP606 Complementary Enhancement Mode Field Effect Transistor

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1 AOP66 Complementary Enhancement Mode Field Effect Transistor General Description The AOP66 uses advanced trench technology MOSFETs to provide excellent and low gate charge. The complementary MOSFETs may be used in inverter and other PWM applications. Standard Product AOP66 is Pb-free (meets ROHS & Sony 9 specifications). AOP66L is a Green Product ordering option. AOP66 and AOP66L are electrically identical. Features n-channel p-channel V DS (V) = 6V -6V I D = 7.9A (V GS =V) -6.A < mω (V GS =V) < 4mΩ (V GS = -V) < 3mΩ (V GS =4.V) < mω (V GS = -4.V) D D S G S G PDIP-8 D D D D G n-channel S G S p-channel Absolute Maximum Ratings T A = unless otherwise noted Parameter Symbol Max n-channel Max p-channel Units Drain-Source Voltage V DS 6-6 V Gate-Source Voltage V GS ± ± V Continuous Drain T A = Current A T A =7 C I D A Pulsed Drain Current B I DM 4-3 T A = P D Power Dissipation T A =7 C W Junction and Storage Temperature Range T J, T STG - to - to C Thermal Characteristics: n-channel and p-channel Parameter Maximum Junction-to-Ambient A t s Maximum Junction-to-Ambient A Steady-State Maximum Junction-to-Lead C Steady-State Maximum Junction-to-Ambient A t s Maximum Junction-to-Ambient A Steady-State Maximum Junction-to-Lead C Steady-State Symbol Device Typ Max Units n-ch 3 4 C/W R θja n-ch 66 8 C/W R θjl n-ch 3 C/W p-ch 3 4 C/W R θja p-ch 66 8 C/W R θjl p-ch 3 C/W

2 AOP66 N Channel Electrical Characteristics (T J = unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS BV DSS Drain-Source Breakdown Voltage I D =µa, V GS =V 6 V I DSS Zero Gate Voltage Drain Current V DS =48V, V GS =V T J = C µa I GSS Gate-Body leakage current V DS =V, V GS = ±V na V GS(th) Gate Threshold Voltage V DS =V GS I D =µa. 3 V I D(ON) On state drain current V GS =V, V DS =V 4 A V GS =V, I D =7.9A 7.8 Static Drain-Source On-Resistance T J = 3. 4 mω V GS =4.V, I D =7.A mω g FS Forward Transconductance V DS =V, I D =7.9A 3 S V SD Diode Forward Voltage I S =A,V GS =V.74 V I S Maximum Body-Diode Continuous Current 4 A DYNAMIC PARAMETERS C iss Input Capacitance 9 3 pf C oss Output Capacitance V GS =V, V DS =V, f=mhz pf C rss Reverse Transfer Capacitance 6 pf R g Gate resistance V GS =V, V DS =V, f=mhz.6.8 Ω SWITCHING PARAMETERS Q g (V) Total Gate Charge nc Q g (4.V) Total Gate Charge 4. 3 nc V GS =V, V DS =3V, I D =7.9A Q gs Gate Source Charge 6 nc Q gd Gate Drain Charge 4.4 nc t D(on) Turn-On DelayTime 7.4 ns t r Turn-On Rise Time V GS =V, V DS =3V, R L =3.9Ω,. ns t D(off) Turn-Off DelayTime R GEN =3Ω 8. ns t f Turn-Off Fall Time. ns t rr Body Diode Reverse Recovery Time I F =7.9A, di/dt=a/µs 34 4 ns Q rr Body Diode Reverse Recovery Charge I F =7.9A, di/dt=a/µs 46 nc A: The value of R θja is measured with the device mounted on in FR-4 board with oz. Copper, in a still air environment with T A =. The value in any given application depends on the user's specific board design. The current rating is based on the t s thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R θja is the sum of the thermal impedence from junction to lead R θjl and lead to ambient. D. The static characteristics in Figures to 6 are obtained using 8 µs pulses, duty cycle.% max. E. These tests are performed with the device mounted on in FR-4 board with oz. Copper, in a still air environment with T A =. The SOA curve provides a single pulse rating. Rev 3: Sept THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE.

3 AOP66 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: N-CHANNEL 4 V V 4V V DS =V I D (A) I D (A) 3.V V GS =3V 3 4 V DS (Volts) Fig : On-Region Characteristics V GS (Volts) Figure : Transfer Characteristics 4. (mω) 8 6 V GS =4.V V GS =V Normalized On-Resistance V GS =V I D =7.9A V GS =4.V I D =7.A 4 I D (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage Temperature ( C) Figure 4: On-Resistance vs. Junction Temperature.E+ I D =7.9A.E+ (mω) 4 3 I S (A).E-.E-.E-3.E V GS (Volts) Figure : On-Resistance vs. Gate-Source Voltage.E V SD (Volts) Figure 6: Body-Diode Characteristics

4 AOP66 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: N-CHANNEL V GS (Volts) V DS =V I D =7.9A Capacitance (pf) 3 3 C oss C rss C iss 3 4 Q g (nc) Figure 7: Gate-Charge Characteristics 3 V DS (Volts) Figure 8: Capacitance Characteristics I D (Amps)... limited T J(Max) = C T A =.s s s DC µs ms ms µs Power (W) 4 3 T J(Max) = C T A =.. V DS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note E)... Figure : Single Pulse Power Rating Junction-to- Ambient (Note E) Z θja Normalized Transient Thermal Resistance.. D=T on /T T J,PK =T A +P DM.Z θja.r θja R θja =4 C/W In descending order D=.,.3,.,.,.,., single pulse Single Pulse..... Figure : Normalized Maximum Transient Thermal Impedance P D T on T

5 AOP66 P-Channel Electrical Characteristics (T J = unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS BV DSS Drain-Source Breakdown Voltage I D =-µa, V GS =V -6 V I DSS Zero Gate Voltage Drain Current V DS =-48V, V GS =V - T J = C - µa I GSS Gate-Body leakage current V DS =V, V GS =±V ± na V GS(th) Gate Threshold Voltage V DS =V GS I D =-µa V I D(ON) On state drain current V GS =-V, V DS =-V -3 A V GS =-V, I D =-6.A 34 4 Static Drain-Source On-Resistance T J = 8 7 mω V GS =-4.V, I D =-.A 4 mω g FS Forward Transconductance V DS =-V, I D =-6.A 7.8 S V SD Diode Forward Voltage I S =-A,V GS =V V I S Maximum Body-Diode Continuous Current -3 A DYNAMIC PARAMETERS C iss Input Capacitance 47 9 pf C oss Output Capacitance V GS =V, V DS =-3V, f=mhz 79 pf C rss Reverse Transfer Capacitance pf R g Gate resistance V GS =V, V DS =V, f=mhz.9.3 Ω SWITCHING PARAMETERS Q g (V) Total Gate Charge (V) 4. nc Q g (4.V) Total Gate Charge (4.V).8 8 nc V GS =-V, V DS =-3V, I D =-6.A Q gs Gate Source Charge.8 nc Q gd Gate Drain Charge 9.6 nc t D(on) Turn-On DelayTime 9.8 ns t r Turn-On Rise Time V GS =-V, V DS =-3V, R L =4.7Ω, 6. ns t D(off) Turn-Off DelayTime R GEN =3Ω 44 ns t f Turn-Off Fall Time.7 ns t rr Body Diode Reverse Recovery Time I F =-6.A, di/dt=a/µs 3 4 ns Q rr Body Diode Reverse Recovery Charge I F =-6.A, di/dt=a/µs 4 nc A: The value of R θja is measured with the device mounted on in FR-4 board with oz. Copper, in a still air environment with T A =. The value in any in given application depends depends on the on the user's user's specific specific board board design. design. The The current current rating rating is based is based on the on the t s t s thermal thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R θja is the sum of the thermal impedence from junction to lead R θjl and lead to ambient. D. The static characteristics in Figures to 6,,4 are obtained using 8 µs pulses, duty cycle.% max. E. These tests are performed with the device mounted on in FR-4 board with oz. Copper, in a still air environment with T A =. The SOA curve provides a single pulse rating. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev: August

6 AOP66 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: P-CHANNEL 3 -V -4V -6V -3.V V DS =-V -I D (A) -3V V GS =-.V 3 4 -V DS (Volts) Fig : On-Region Characteristics -I D (A) V GS (Volts) Figure : Transfer Characteristics 4. (mω) 4 3 V GS =-4.V V GS =-V Normalized On-Resistance V GS =-V I D =-6.A V GS =-4.V I D =-.A 3 -I D (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage Temperature ( C) Figure 4: On-Resistance vs. Junction Temperature 9 8 I D =-6.A.E+.E+ (mω) V GS (Volts) Figure : On-Resistance vs. Gate-Source Voltage -I S (A).E-.E-.E-3.E-4.E-.E V SD (Volts) Figure 6: Body-Diode Characteristics

7 AOP66 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: P-CHANNEL -V GS (Volts) V DS =-3V I D =-6.A Capacitance (pf) 3 3 C oss C rss C iss 3 4 -Q g (nc) Figure 7: Gate-Charge Characteristics V DS (Volts) Figure 8: Capacitance Characteristics -I D (Amps).... T J(Max) = C, T A = limited s s.s DC µs ms ms. -V DS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note E) µs Power (W) 4 3 T J(Max) = C T A =... Figure : Single Pulse Power Rating Junction-to- Ambient (Note E) Z θja Normalized Transient Thermal Resistance.. D=T on /T T J,PK =T A +P DM.Z θja.r θja R θja =4 C/W Single Pulse In descending order D=.,.3,.,.,.,., single pulse..... Figure : Normalized Maximum Transient Thermal Impedance P D T on T

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