UTXQ512 SRAM Frequently Asked Questions
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1 UTXQ512 SRAM Frequently Asked Questions Introduction: The UTXQ512 are high-performance CMOS asynchronous static RAMs organized as 512K words by 8 bits. The following are questions frequently asked regarding these devices. Detailed information on these devices can be found in the UTXQ512 Data Sheets. Questions and Answers: Question 1:) Answer 1:) Question 2:) Answer 2:) Question 3:) Answer 3:) Question 4:) Answer 4:) Question 5:) Answer 5:) Are the I/O of the 3.3V device compatible (interoperable) at 5V I/O? - 5V is not compatible with 3.3 (100ns) - 3V is not compatible with 5.0 (25ns) What are the die sizes for the 3.3V as the 5V? - 5V UT7Q mils x 430mils (100ns) - 32-lead ceramic flatpack - 3V UT8Q mils x 57mils (25ns) - 36-lead ceramic flatpack - 3V and 5V UT9Q mils x 57mils (25ns) - 36-lead ceramic flatpack Please provide the die size for the UT8Q512, 3.3V dice and the UT7Q512, 5.0V dice. 264mils x 572mils (see Figure 2 ) If you cannot immediately provide die maps, please at least describe where the bond pads are on the die, i.e. are they all at the top and bottom (along the short side only), or are there bond pads all around the die on all four sides. Bonding on all 4 sides (see Figures 1 and 2) QML-T Flow, what does this offer? QCOTS Flow (see the QML T Screening FAQs) 100% Aracor wafer screening 11/7/01 Page 1 of 5
2 Question 6:) Answer 6:) Question 7:) Answer 7:) Question 8:) Answer 8:) Question 9:) Answer 9:) Question 10:) Answer 10:) 2 test structures per wafer (100% wafers per lot) 2 wafer per lot mapped for assessment of intra wafer variability Sample Cobalt screening 5 samples per lot (90% probability with 90% confidence level) Structural analysis Contact/Via/Poly QML assembly (Group A, C, E, D3 and D4) SMD procurement vehicle Value added Wafer street cleaning, eliminates pealing metal and shorts Wafer Lot Assurance Radiation performance (SEE and Total Dose) Reliability assessment (Oxide integrity) Fit Rate target < 10 Do we get 100% visual inspection on the die? Yes, Visual per Aeroflex UTMC s QML Q (low magnification) Is the visual inspection performed Class A for Space. Yes, Visual per Aeroflex UTMC s QML Q (low magnification) Have all the die received 100% electrical probing? At room temperature, by die supplier At what temperature has the die been probed? Ambient and Hot? At room, by die supplier, not at hot Has SEM or Wafer Lot Acceptance been performed on the lot? Yes, per Aeroflex UTMC s QML T flow 11/7/01 Page 2 of 5
3 Question 11:) Will the die all come from the same lot? Answer 11:) Dependent on volume, all wafer lots will see the same screening. Question 12:) What is the address access time? Answer 12:) 25ns. The address access time for the UT7Q512 is 100ns and the address access time for the UT8Q512 and UT9Q512 is Question 13:) Answer 13:) What is the UT7Q flatpack test socket number and manufacturer s name? The socket is a Wells-CTI # ,.050 c/c, 5-Lead Quad Flatpack Socket. This is also the socket used for the UT8Q512 and UT9Q512. Question 14:) The data sheets for the QCOTS SRAMs (i.e. UT7Q512, UT8Q512, and UT9Q512) note two solutions for total dose radiation performance. The differences behind these two solutions are listed below. Answer 14:) The two solutions refer to the intrinsic total dose performance of the SRAM die and additional radiation performance provided by the patented Aeroflex UTMC shielded package. Solution #1 is gained through the intrinsic radiation hardness of the SRAM die without the necessity of shielding. Solution #2, radiation performance of up to 300 krads, is orbit dependent, but gained through the use shielding by an alloy of Copper and Tungsten. Question 15:) circuit? What does the use of shielding offer the designer and how does it enhance the radiation performance of the integrated Answer 15:) Shielded package technology improves the life cycle of spaceborne integrated circuits (ICs) by shielding them from the damaging effects of space radiation. A shielded package extends the on-orbit lifetime of ICs by a factor of three to five times in low earth orbits (LEO) and from eight to ten times in geosynchronous orbits (GEO). The Aeroflex UTMC shielded package offers reduced weight over other shielding technologies and was awarded a U.S. Patent in September Question 16:) 11/7/01 Page 3 of 5
4 Answer 16:) Whatis Aeroflex UTMC;s planfor higher bit density SRAM? We will be stacking and evaluating an 8M QCOTS SRAM. 11/7/01 Page 4 of 5
5 UTMC UT7Q512 Die DQ6 DQ7 CS A10 OE A11 A9 A8 A13 WE A17 DQ5 A18 A16 DQ4 DQ3 DQ2 DQ1 DQ0 ~250mils A0 A1 A2 A3 A4 A5 A6 A7 A12 A14 ~430mils Figure 1. UT7Q512 Die Dimensions and Approximate X-Y Coordinates UTMC UT8Q512 Die A11 A12 A13 A14 DQ5 DQ6 DQ7 DQ8 OE A16 A17 A18 A10 ~264mils A0 A1 A9 A8 A7 A6 A5 WE DQ4 DQ3 DQ2 DQ1 CS A4 A3 A2 ~572mils Figure 2. UT8Q512 and UT9Q512 Die Dimensions and Approximate X-Y Coordinates 11/7/01 Page 5 of 5
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