STTH8R06. Turbo 2 ultrafast high voltage rectifier. Description. Features

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1 Turbo 2 ultrafast high voltage rectifier Description Datasheet - production data The STTH8R06, which uses ST Turbo V technology, is specially suited as boost diode in continuous mode power factor corrections and hard switching conditions. Table 1. Device summary Symbol Value I F(AV) 8 A V RRM 600 V I RM (typ) 5.5 A T j (max) 175 C V F (typ) 1.4 V t rr (max) 25 ns Features Ultrafast switching Low reverse recovery current Low thermal resistance Reduces switching losses Package insulation voltage: TO-220AC Ins: 2500 V RMS sine TO-220FPAC: 2000 V RMS sine April 2015 DocID7688 Rev 8 1/ This is information on a product in full production.

2 Characteristics STTH8R06 1 Characteristics Table 2. Absolute ratings (limiting values at 25 C unless otherwise specified) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 600 V I F(RMS) I F(AV) Forward current rms Average forward current δ = 0.5, square wave TO-220AC / TO-220FPAC / D 2 PAK 30 TO-220AC ins. 24 TO-220AC / D 2 PAK T c = 130 C TO-220FPAC T c = 85 C TO-220AC ins. T c = 100 C A 8 A I FSM Surge non repetitive forward current t p = 10 ms sinusoidal 80 A T stg Storage temperature range -65 to C T j Maximum operating junction temperature 175 C Table 3. Thermal resistance Symbol Parameter Value (max) Unit TO-220AC / D 2 PAK 2.2 R th(j-c) Junction to case TO-220FPAC 4.6 C/W TO-220AC ins. 3.8 Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R Reverse leakage current T j = 25 C 30 V R = V RRM T j = 125 C µa V F Forward voltage drop T j = 25 C 2.9 I F = 8 A T j = 125 C V To evaluate the conduction losses use the following equation: P = 1. x I F(AV) I F 2 (RMS) 2/ DocID7688 Rev 8

3 Characteristics Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I F = 0.5 A, I rr = 0.25 A, I R =1 A 25 t rr Reverse recovery time T j = 25 C I F = 1 A, ns di F /dt = -50 A/µs, 45 V R = 30 V I RM Reverse recovery current A S factor Softness factor T j = 125 C I F = 8 A, V R = 400 V, di F /dt = -200 A/µs 0.3 Q rr Reverse recovery charges 150 nc t fr Forward recovery time I F = 8 A, 150 ns V FP Forward recovery voltage T j = 25 C di F /dt = 64 A/µs V FR = 1.1 x V Fmax 5 V Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current P(W) δ = δ = δ = 0.2 δ = 0.5 δ = 1 T I F(AV) (A) δ=tp/t tp I FM(A) T j=125 C (maximum values) T j=125 C (typical values) V FM(V) T j= 25 C (maximum values) DocID7688 Rev 8 3/

4 Characteristics STTH8R06 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Z th(j-c) /Rth(j-c) Single pulse TO-220FPAC insulated t (s) p δ=tp/t 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 T tp Figure 5. Peak reverse recovery current versus di F /dt (typical values) Figure 6. [Reverse recovery time versus di F /dt (typical values) I RM(A) V R=400V T j=125 C I F=0.25 x IF(AV) I F=0.5 x IF(AV) I=I F F(AV) di /dt(a/µs) F I F=2 x IF(AV) t (ns) rr I F=2 x IF(AV) I=I F F(AV) di /dt(a/µs) F I F=0.5 x IF(AV) V R=400V T j=125 C Figure 7. Reverse recovery charges versus di F /dt (typical values) Figure 8. Softness factor versus di F /dt (typical values) Q RR (nc) V R = 400V T j = 125 C I F = 2 x I F(AV) I F = I F(AV) I F = 0.5 x I F(AV) I F = 0.25 x I F(AV) I F = 0.1 x I F(AV) di F /dt(a/µs) S factor IF 2 x IF(AV) V R=400V T j=125 C di /dt(a/µs) F / DocID7688 Rev 8

5 Characteristics Figure 9. Relative variations of dynamic parameters versus junction temperature Figure 10. Transient peak forward voltage versus di F /dt (typical values) T ( C) j IRM QRR S factor I=I F F(AV) V R=400V Reference: T j=125 C V FP(V) I=I F F(AV) T j=125 C di /dt(a/µs) F Figure 11. Forward recovery time versus di F /dt (typical values) Figure 12. Junction capacitance versus reverse voltage applied (typical values) t (ns) fr I=I F F(AV) V FR=1.1 x VF max. T j=125 C 100 C(pF) F=1MHz V OSC=30mVRMS T j=25 C di /dt(a/µs) F V (V) R Figure 13. Thermal resistance junction to ambient versus copper surface under tab DocID7688 Rev 8 5/

6 Package information STTH8R06 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque values: 0.55 N m (TO-220FPAC, TO-220AC, TO-220AC ins.) Maximum torque values: 0.7 N m (TO-220FPAC, TO-220AC, TO-220AC ins.) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. 2.1 TO-220AC package information Figure 14. TO-220AC package outline H2 A Ø I C L5 L7 L6 L2 F1 L9 D L4 F M E G 6/ DocID7688 Rev 8

7 Package information Ref. Table 6. TO-220AC dimension values Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A C D E F F G H L2.40 typ typ. L L L L L M 2.6 typ typ. Diam. I DocID7688 Rev 8 7/

8 Package information STTH8R TO-220FPAC package information Figure 15. TO-220FPAC package outline H A B Dia L6 L2 L7 L3 F1 D L4 G1 F E G 8/ DocID7688 Rev 8

9 Package information Ref. Table 7. TO-220FPAC dimension values Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A B D E F F G G H L2 Typ Typ. L L L L Dia DocID7688 Rev 8 9/

10 Package information STTH8R TO-220AC package information Figure. TO-220AC insulated package outline B C Ø I b2 L F A I4 a1 c2 l2 a2 e b1 M c1 10/ DocID7688 Rev 8

11 Package information Table 8. TO-220AC insulated dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A a a B b b C c c e F ØI I L l M DocID7688 Rev 8 11/

12 Package information STTH8R D²PAK package information Figure 17. D 2 PAK package outline 12/ DocID7688 Rev 8

13 Package information Ref. Table 9. D 2 PAK package mechanical data Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A A b b c c D D D E E E e e H J L L L R 0.40 typ. 0.0 typ. V DocID7688 Rev 8 13/

14 Package information STTH8R06 Figure 18. D 2 PAK footprint (dimensions in mm) 14/ DocID7688 Rev 8

15 Ordering information 3 Ordering information Table 10. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH8R06D STTH8R06D TO-220AC 1.90 g 50 Tube STTH8R06G-TR STTH8R06G D 2 PAK 1.38 g 1000 Tape and reel STTH8R06FP STTH8R06FP TO-220FPAC 1.90 g 50 Tube STTH8R06DIRG STTH8R06DI TO-220AC Ins g 50 Tube 4 Revision history Table 11. Document revision history Date Revision Changes May First issue January D 2 PAK and I 2 PAK packages added 18-Oct TO-220AC Insulated package added 05-Dec D 2 PAK foot print correction 10-Aug Apr Reformatted to current standard. Added package insulation voltage data on page 1. Changed order code STTH8R06DI to STTH8R06DIRG. Reformatted to current standards. Corrected label for right hand curve in Figure 2 from T j = 125 C to T j = 25 C. Updated torque value recommendations and added ECOPACK statement in Section 2: Package information. Corrected order code in Table Oct Updated Figure Apr Removed I²PAK package information. Updated D²PAK package information and reformatted to current standard. DocID7688 Rev 8 15/

16 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved / DocID7688 Rev 8

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