Very low conduction losses Low forward voltage drop Low thermal resistance High specified avalanche capability High integration ECOPACK 2 compliant

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Datasheet 100 V, 30 A power Schottky rectifier Features Very low conduction losses Low forward voltage drop Low thermal resistance High specified avalanche capability High integration ECOPACK 2

1 Datasheet 100 V, 30 A power Schottky rectifier Features Very low conduction losses Low forward voltage drop Low thermal resistance High specified avalanche capability High integration ECOPACK 2 compliant Applications Switching diode SMPS DC/DC converter LED lighting Desktop power supply Description he is a power Schottky rectifier optimized for switch mode power supply and high frequency DC to DC converters. Product status link Packaged in PowerFLA, this device is intended to be used in adaptors requiring good efficiency at both low and high load. Its low profile was especially designed to be used in applications with space-saving constraints. PowerFLA M is a trademark of SMicroelectronics. Product summary Symbol I F(AV) V RRM Value 30 A 100 V (max.) 150 C V F (typ.) 0.66 V DS Rev 6 - February 2019 For further information contact your local SMicroelectronics sales office.

2 Characteristics 1 Characteristics able 1. Absolute Ratings (limiting values at 25 C, unless otherwise specified, anode terminals short circuited) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 100 V I F(RMS) Forward rms current 45 A I F(AV) Average forward current, δ = 0.5, square wave C = 90 C 30 A I FSM Surge non repetitive forward current t p = 10 ms sinusoidal 200 A P ARM Repetitive peak avalanche power t p = 10 µs, = 125 C 1080 W stg Storage temperature range -65 to +175 C Maximum operating unction temperature (1) 150 C 1. (dp tot /d ) < (1/R th(-a) ) condition to avoid thermal runaway for a diode on its own heatsink. able 2. hermal resistance parameters Symbol Parameter Max. value Unit R th(-c) Junction to case 2.5 C/W For more information, please refer to the following application note : AN5046 : Printed circuit board assembly recommendations for SMicroelectronics PowerFLA packages able 3. Static electrical characteristics (anode terminals short circuited) Symbol Parameter est conditions Min. yp. Max. Unit I R (1) Reverse leakage current = 25 C µa V R = V RRM = 125 C ma V F (1) Forward voltage drop = 25 C I F = 15 A = 125 C = 25 C 0.96 I F = 30 A = 125 C V 1. Pulse test: t p = 380 µs, δ < 2% o evaluate the conduction losses, use the following equation: P = 0.65 x I F(AV) x I 2 F (RMS) For more information, please refer to the following application notes related to the power losses : AN604: Calculation of conduction losses in a power rectifier AN4021: Calculation of reverse losses on a power diode DS Rev 6 page 2/9

3 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) P F(AV) (W) δ = 0.5 δ = 1 I F(AV) (A) R th(-a) = R th(-c) δ = 0.05 δ = 0.1 δ = 0.2 I F(AV) (A) δ = t p / t p δ = t p / t p amb( C) Figure 3. Normalized avalanche power derating versus pulse duration ( = 125 C) P ARM(tp) P (10 µs) ARM t p(µs) Figure 4. Relative variation of thermal impedance unction to case versus pulse duration Z th(-c) / R th(-c) Single pulse t p(s) E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 DS Rev 6 page 3/9

4 Characteristics (curves) Figure 5. Reverse leakage current versus reverse voltage applied (typical values) Figure 6. Junction capacitance versus reverse voltage applied (typical values) 1.E+02 1.E+01 I (ma) R = 150 C = 125 C C(pF) F = 1 MHz V osc = 30 mv = 25 C RMS 1.E+00 = 100 C 1.E-01 = 75 C = 50 C E-02 = 25 C V R(V) 1.E V (V) R Figure 7. Forward voltage drop versus forward current Figure 8. hermal resistance unction to ambient versus copper surface under tab I ( A) F = 125 C (Maximum values) = 125 C (ypical values) = 25 C (Maxim um values) 5 V F(V) R th(-a) ( C/W) 150 PowerFlat _5X6 125 epoxy printed board FR4, e Cu = 35 µm S Cu (cm²) DS Rev 6 page 4/9

5 Package information 2 Package information In order to meet environmental requirements, S offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an S trademark. 2.1 PowerFLA 5x6 package information Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 9. PowerFLA 5x6 package outline (non-contractual) Bottom view Side view op view DS Rev 6 page 5/9

6 PowerFLA 5x6 package information able 4. PowerFLA 5x6 mechanical data Dimensions Ref Millimeters Inches (for reference only) Min. yp. Max. Min. yp. Max. A A b c D D e E E L K L Figure 10. PowerFLA 5x6 recommended footprint (dimensions are in mm) DS Rev 6 page 6/9

7 Ordering information 3 Ordering information able 5. Ordering information Order code Marking Package Weight Base qty. Delivery mode -R PS30M 100 PowerFLA 5x g 3000 ape and reel DS Rev 6 page 7/9

8 Revision history able 6. Document revision history Date Version Changes 06-Nov First issue. 30-Jul Replace Power QFN with PowerFLA. 15-Jan Add reference E in able May Jun Feb Update all package illustrations. Updated base quantity and marking in able 6. Updated terminal identification in captions of able 2 and able 4. Added Figure 14. Removed figure 5, figure 6 and figure 12. Updated able 1. Absolute Ratings (limiting values at 25 C, unless otherwise specified, anode terminals short circuited). Minor text changes to improve readability. Updated Section Cover image, Figure 9. PowerFLA 5x6 package outline (non-contractual) and able 4. PowerFLA 5x6 mechanical data. DS Rev 6 page 8/9

9 IMPORAN NOICE PLEASE READ CAREFULLY SMicroelectronics NV and its subsidiaries ( S ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to S products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on S products before placing orders. S products are sold pursuant to S s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of S products and S assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by S herein. Resale of S products with provisions different from the information set forth herein shall void any warranty granted by S for such product. S and the S logo are trademarks of S. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document SMicroelectronics All rights reserved DS Rev 6 page 9/9

STPS2H V power Schottky rectifier. Datasheet. Features. Description. Negligible switching losses

STPS2H V power Schottky rectifier. Datasheet. Features. Description. Negligible switching losses Datasheet 100 V power Schottky rectifier Features A Negligible switching losses A High junction temperature capability Low leakage current K SMA K SMB Good trade-off between leakage current and forward