STPS1045B. Power Schottky rectifier. Description. Features

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1 Power Schottky rectifier Datasheet production data Description High voltage Schottky rectifier suited for switch mode power supply and other power converters. Packaged in DPAK, this device is intended for use in high frequency circuitries where low switching losses is required. Table 1. Device summary Symbol Value I F(AV) 10 A V RRM 45 V T j 175 C V F(typ) 0.50 V Features Very small conduction losses Extremely fast switching Low thermal resistance Negligible switching losses Low forward voltage drop Low capacitance Avalanche specification ECOPACK 2 compliant component for DPAK on demand November 2014 DocID6085 Rev 7 1/8 This is information on a product in full production. 8

2 Characteristics STPS1045B 1 Characteristics Table 2. Absolute ratings (limiting values, at 25 C unless otherwise stated) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 45 V I F(RMS) / pin Forward rms current 7 A I F(AV) Average forward current, square wave T c = 150 C, δ = A I FSM Surge non repetitive forward current t p = 10 ms sinusoidal 75 A P ARM Repetitive peak avalanche power t p = 10 μs, T j = 125 C 285 W T stg Storage temperature range -65 to C T j Maximum operating junction temperature (1) 175 C 1. dptot 1 < dtj Rth(j-a) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Parameter Value Unit R th(j-c) Junction to case 3 C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) V F (2) Reverse leakage current Forward voltage drop T j = 25 C 100 μa V R = V RRM T j = 125 C 7 15 ma T j = 25 C 0.63 I F = 10 A T j = 125 C T j = 25 C 0.84 I F = 20 A T j = 125 C V 1. Pulse test: t p = 5 ms, δ < 2% 2. Pulse test: t p = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x I F(AV) I F 2 (RMS) 2/8 DocID6085 Rev 7

3 Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) P F(AV) (W) δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ = I F(AV) (A) R th(j-a) =Rth(j-c) R th(j-a) =15 C/W 3 2 T 1 I F(AV) (A) 0 δ=tp/t tp R th(j-a) =70 C/W 4 2 T amb( C) Figure 3. Normalized avalanche power derating versus pulse duration at T j = 125 C Figure 4. Relative variation of thermal impedance junction to case versus pulse duration 1 P ARM(tp) P (10 µs) ARM 1.0 Z th(j-c) /Rth(j-c) δ = t p(µs) δ = 0.2 T δ = Single pulse t p(s) δ=tp/t tp 0.0 1E-4 1E-3 1E-2 1E-1 1E+0 1E+5 1E+4 1E+3 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) I (µa) R T j=150 C T j=125 C T j=100 C Figure 6. Junction capacitance versus reverse voltage applied (typical values) C(pF) F=1MHz V OSC=30mVRMS T j=25 C 1E+2 1E+1 T j=75 C T j=50 C T j=25 C 200 1E+0 V R(V) 1E V (V) R DocID6085 Rev 7 3/8

4 Characteristics STPS1045B Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus copper surface under tab I FM(A) T j=125 C (maximum values) 100 Rth(j-a)( C/W) Epoxy printed circuit board, copper thickness: 35 µm 10.0 T j=125 C (typical values) T j=25 C (maximum values) 40 V FM(V) S(Cu)(cm 2 ) /8 DocID6085 Rev 7

5 Package Information 2 Package Information Epoxy meets UL94,V0 Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Figure 9. DPAK dimension definitions E b4 c2 A E1 L2 Thermal pad H R D D1 D L4 e e1 b A1 c R A2 L 0.25 L1 V2 Gauge plane Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID6085 Rev 7 5/8

6 Package Information STPS1045B Ref. Table 5. DPAK dimension values Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A A A b b c c D D E E e H L L L V Figure 10. DPAK footprint dimensions (in mm) 6/8 DocID6085 Rev 7

7 Ordering information 3 Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS1045B S Tube DPAK 0.30 g STPS1045B-TR S Tape and reel 4 Revision history Table 7. Document revision history Date Revision Changes Jul B Last issue 21-Apr IPAK package removed 03-Nov DPAK foot print dimensions updated. 01-Jul Updated Figure 8 Updated ECOPACK statement. 04-Nov Updated DPAK package information, Table 2 and Figure 3. Removed P ARM (T j = 25 C). DocID6085 Rev 7 7/8

8 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved 8/8 DocID6085 Rev 7

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