USB INTERFACE PAGE 6 INTERFACE CONNECTOR TO TSW1400 PAGE 7

Transcription

1 POWER SUPPLY PGE US INTERFE PGE SM PGE THS PGE S/SH LMH PGE SM PGE PGES, & SM PGE THS PGE LMH PGE SM PGE INTERFE ONNETOR TO TSW PGE TI- Size ocument Number Rev RWN Y: JV SMITH -- LOK IGRM ENGINEER: Q IHON -- ate: Monday, May, Sheet of

2 J ONN JK PWR J MIN PWR RE +V J LK uf % V uf % V.uF % V +V +V R R V_IN nf R R U TPS VIN GTE N N VIN EN EN EFULT U MOE/T THERMP Q SQ TPS NOTE:.V.V F SW EF_ SW J + VIN uf V % R K K L.uH L.uH R K K F K MHz.uF LE GREEN +V R K R K R K pf F.uF R K uf.uf uf V F uf +V.uF nf uf nf TP V_.V RE uf TP V_.V RE uf V_.V V_.V uf JP V_.V SHUNT - JP V_.V SHUNT - +V +V JP JP.uF.uF.uF.uF U IN OUT IN OUT F/SNS NR EN PWRP TPSR U IN OUT IN OUT NR F/SNS EN PWRP TPSR R.K R K R K R.K.uF.uF JP.V_IN.V_IN SHUNT - JP.V_IN.V_IN SHUNT - EFULT NOTE:.V.V R K K R K K R K R K HRWRE RE OR, S MP I/F STNOFF LUM HEX - x /" PNHE SREW - x /" TP LK STNOFF LUM HEX - x /" PNHE SREW - x /" TP STNOFF LUM HEX - x /" PNHE SREW - x /" LK STNOFF LUM HEX - x /" PNHE SREW - x /" J LK J V RE J RE J VS RE J LK V V uf uf uf uf NOTES: ) = O NOT INSTLL TI- Size ocument Number Rev MIN POWER SUPPLY ate: Tuesday, May, Sheet of

3 R K JP P pf.uf.uf uf PLE YPSS PS PER SHEMTI ORER. pf LOSEST TO EVIE PIN. J IN_H-M M S J IN_H-P M S IN_M IN_P R R K SHUNT - R VINMM T RF TRNSFORMER XNL R.uF VINPP R. R..uF.uF VINM VINP N P VINM VINP VOM N PWRP N N U THS VSP VSP VSP N UNUSE OUTP U_PP R. VOUTM U_MM R. VSP UNUSE N N N U_P U_M.uF.uF INP INM SH SH TP LK TP INP LU R K R K R..uF TP VM LU uf.uf R K R K R VM SH, V JP EN SHUNT - R V U_PP V pf.uf uf J IN_H-P M S J IN_H-M M S TP LK IN_HP IN_HM TP INM LU R R R K T V T-T+ R R K IN_H_P.uF IN_H_M R. R. R..uF.uF SH, _P _M VM R R TP VM LU R _HP + P M _HM V.uF R K R PLE N T EVIE PIN..uF - R K Vs+ Vs- Vo- Vo+ U THS U_MM uf.uf R. R. V pf pf U_P.uF U_M uf.uf.uf INP SH INM SH TI- Size ocument Number Rev HNNELS & ate: Monday, May, Sheet of

4 V TP VM LU uf.uf V pf uf R R.uF K K pf.uf R pf VM.uF V SH, uf PLE YPSS PS PER SHEMTI ORER. pf LOSEST TO EVIE PIN. J IN_H-M M S IN_HM R IN_H_M.uF U_M R J IN_H-P M S IN_HP R IN_H_P R V TP TP INP LK LU T T-T+ R K.uF R K R. R. R..uF U_P R R UF_P IN+ R uf UF_M.uF pf V F+ IN+ U LMH OUT- V- VEN JP EN VM V+ V+ N OUT+ OUT- IN- F- V- N.uF OUT+ IN- pf.uf R. R. V uf UP UM.uF.uF INP INM SH SH SHUNT - R. R. R. R. R. R. SW SPI SEL S SPI _SO _SI _LK _S _SI _SO SPI TP TP VM LK LU R.K R.K R R K VM SH, J IN_H-P M S INM INP R T T-T+ R.uF INM INP TP INP LU R K.uF TP LK INM INMPP TP INPS LU R R R INMS INM INMP INPS SPI U LMH OM N OUT+ OUT-.uF uf uf OUTP OUTM PLE YPSS PS PER SHEMTI ORER. pf LOSEST TO EVIE PIN. INP INM SH SH R K _LK _S S INMS INM INP INPS N R.K S.uF J IN_H-M M S R R. R N PWRP V V OUTP OUTM V V pf.uf R. R. pf.uf.uf.uf TI- Size ocument Number Rev HNNELS & ate: Monday, May, Sheet of

5 INP IN_M NP INP NM INM INP IN_P INM IN_M IN_P NP NM INP NP NM INM INP IN_M IN_P NP NM INM INP IN_M IN_P IN_P IN_M VM SH, IN_P IN_M VM SH, IN_P IN_M VM SH, IN_P IN_M VM SH, INP SH INM SH INP SH INM SH INP SH INM SH INP SH INM SH Size ocument Number Rev ate: Sheet of SH TI- Monday, May, Size ocument Number Rev ate: Sheet of SH TI- Monday, May, Size ocument Number Rev ate: Sheet of SH TI- Monday, May, R L.uF L R R.uF.uF R.uF R..uF R L R. R R. R R.uF R. pf R pf.uf R.uF R L nh R. L.uH L nh R R. L.uH R R pf R L.uH R R.uF R L L.uH.uF R R. L nh R R.uF R R L nh R R R L nh L.uH L nh R. L nh L.uH pf R. pf R. L R R R. R R R R R L R. R. R R R. L nh R L R pf R L.uH L L R R pf.uf R R L nh L R.uF R R. R pf R R. R L R R. R L R R R. R. L R L L nh L.uH R.

6 SERIL INTERFE +V +V SJP US_PWR_EN SHUNT - uf U VIN VOUT ON/OFF YP LP- m.uf F MHz.uF R.K US PWR LE MER J VUS - + I R US_SUPER-MINI_ pf pf.uf U V USM USP VIO N RESET N OSI OSO RXF VOUT TXE R WR TEST PWREN FTRL R K US_SLK US_ST US_SEN US_SO SH SH SH SH TI- Size ocument Number Rev US INTERFE ate: Tuesday, May, Sheet of

7 LK_P LK_M LK_P LK_M FPG_ST SH FPG_SEN SH FPG_SLK SH TRIG_EN SH FPG_SO SH LKOUT_P LKOUT_M _P _M _P _M _P _M _P _M _P SH, _M SH, _P _M _P _M _P _M _M _P _M _P _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M _P _M LKOUT_P LKOUT_M _P SH, _M SH, _P SH, _M SH, _P SH, _M SH, Size ocument Number Rev ate: Sheet of INTERFE ONNETOR TI- Monday, May, Size ocument Number Rev ate: Sheet of INTERFE ONNETOR TI- Monday, May, Size ocument Number Rev ate: Sheet of INTERFE ONNETOR TI- Monday, May, R R PP _P J QTH---F---RT PP _P R J QTH---F---RT PP _M R PP _M

8 SH US_SLK R TP SLK WHT SLK SH SH FPG_SLK US_ST R R TP ST WHT ST NOTE: FOR S THE FOLLOWING PINS RE NO ONNET PINS: E, G, G, G SH FPG_ST SH US_SEN SH FPG_SEN R R R +.V SW RESET.uF TP SEN WHT TP LK R SEN +.V R K JP RESET R K SHUNT - RESET G G G G E G E SLK ST SEN RESET SNR TRIG_EN PN U S SOUT HIRES TRI_RY TP SOUT WHT R G R G HIRES TRI_RY US_SO FPG_SO SH SH JP HIRES SHUNT - +.V +.V R LE GREEN HIRES Q TEETG SH TRIG_EN +.V JP TRIG_EN JP SNR_EN SHUNT - SNR_EN TRIGEN JP TRI_RY SHUNT - R LE GREEN TRI_RY Q TEETG +.V SW TRIG_EN.uF R R K SHUNT - +.V JP PN SHUNT - PN TI- Size ocument Number Rev S ate: Tuesday, May, Sheet of

9 J LKIN M S SM_THVT_RE LOK_IN T T-WT+ LKINP LKINM.uF R R.uF SH SH SH SH SH SH SH SH IN_P IN_M IN_P IN_M IN_P IN_M IN_P IN_M LKIN_P LKIN_M U S INP INM INP INM INP INM INP INM LKINP LKINM VM VM VM VM NLOG T LOK.uF.uF.uF.uF VM VM VM VM SH, SH, SH, SH,.uF.uF SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH LKOUT_P SH LKOUT_M F F U S _P _M G G _P _M H H _P _M J J _P _M K K _P _M L L _P _M M M _P _M H H _P _M J J _P _M K K _P _M L L _P _M K J _P _M L L _P _M M M _P _M LVS T LOK _P F _M F _P G _M G _P H _M H _P J _M J _P K _M K _P L _M L _P M _M M _P H _M H _P J _M J _P K _M K _P L _M L _P J _M K _P L _M L _P M _M M M LKOUTP M M LKOUTP LKOUTM LKOUTM M _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH _P SH _M SH LKOUT_P SH LKOUT_M SH TI- Size ocument Number Rev NLOG & LVS T LOKS ate: Monday, May, Sheet of

10 +.V.V_IN F MHz E E E E E E F F F F F F U S VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS RVSS RVSS RVSS RVSS RVSS RVSS RVSS RVSS RVSS RVSS RVSS RVSS V V V V V V V V V V V V V V V V V V V V RV RV RV RV RV RV RV RV RV RV +.V E E E E +.V +.V F F H H H H J J K K.uF +.V +.V +.V.uF.uF.uF.uF.uF.uF.uF.uF.uF.uF.uF.uF.uF.uF.uF.uF.uF uf uf.uf uf uf.uf F.V_IN MHz F.V_IN MHz.uF.uF + uf V + uf V + uf V.uF.uF uf uf +.V.uF.uF.uF.uF.uF.uF TI- Size ocument Number Rev S POWER ate: Monday, May, Sheet of

11 IMPORTNT NOTIE FOR TI REFERENE ESIGNS Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers ( uyers ) who are developing systems that incorporate TI semiconductor products (also referred to herein as components ). uyer understands and agrees that uyer remains responsible for using its independent analysis, evaluation and judgment in designing uyer s systems and products. TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted any testing other than that specifically described in the published documentation for a particular reference design. TI may make corrections, enhancements, improvements and other changes to its reference designs. uyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify the reference design in the development of their end products. HOWEVER, NO OTHER LIENSE, EXPRESS OR IMPLIE, Y ESTOPPEL OR OTHERWISE TO NY OTHER TI INTELLETUL PROPERTY RIGHT, N NO LIENSE TO NY THIR PRTY TEHNOLOGY OR INTELLETUL PROPERTY RIGHT, IS GRNTE HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI REFERENE ESIGNS RE PROVIE "S IS". TI MKES NO WRRNTIES OR REPRESENTTIONS WITH REGR TO THE REFERENE ESIGNS OR USE OF THE REFERENE ESIGNS, EXPRESS, IMPLIE OR STTUTORY, INLUING URY OR OMPLETENESS. TI ISLIMS NY WRRNTY OF TITLE N NY IMPLIE WRRNTIES OF MERHNTILITY, FITNESS FOR PRTIULR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, N NON-INFRINGEMENT OF NY THIR PRTY INTELLETUL PROPERTY RIGHTS WITH REGR TO TI REFERENE ESIGNS OR USE THEREOF. TI SHLL NOT E LILE FOR N SHLL NOT EFEN OR INEMNIFY UYERS GINST NY THIR PRTY INFRINGEMENT LIM THT RELTES TO OR IS SE ON OMINTION OF OMPONENTS PROVIE IN TI REFERENE ESIGN. IN NO EVENT SHLL TI E LILE FOR NY TUL, SPEIL, INIENTL, ONSEQUENTIL OR INIRET MGES, HOWEVER USE, ON NY THEORY OF LIILITY N WHETHER OR NOT TI HS EEN VISE OF THE POSSIILITY OF SUH MGES, RISING IN NY WY OUT OF TI REFERENE ESIGNS OR UYER S USE OF TI REFERENE ESIGNS. TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JES, latest issue, and to discontinue any product or service per JES, latest issue. uyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. ll semiconductor products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI s terms and conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of uyers products. uyers are responsible for their products and applications using TI components. To minimize the risks associated with uyers products and applications, uyers should provide adequate design and operating safeguards. Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. uyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. uyer represents and agrees that it has all the necessary expertise to create and implement safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate remedial actions. uyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in uyer s safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in F lass III (or similar life-critical medical equipment) unless authorized officers of the parties have executed an agreement specifically governing such use. Only those TI components that TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. uyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at uyer's risk, and uyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS. Mailing ddress: Texas Instruments, Post Office ox, allas, Texas opyright, Texas Instruments Incorporated