Digital Circuits Labs J. Stanley Warford

Transcription

1 Digital Circuits abs J. Stanley Warford This is the parts list for a set of six digital circuit labs for use in conjunction with the textbook Computer Systems, Jones and Bartlett earning. The labs refer to the fourth edition, but the references apply to the fifth edition as well. The labs and circuit designs are based on those from a UCA undergraduate course I took in the late 1970 s. I have modified the circuits and lab questions based on use with my own students over the years. Unfortunately, an exact attribution of the original labs is currently not possible, but I believe the original designs were due to Professors Bussel, Kinney, and/or Tseng. The switch and lamp labels correspond to those of the Digital/Analog Trainer Model K-550 manufactured by Elenco Electronics, Inc. owever, it possible to use any generic breadboard kit of the instructor s choosing. ab 1, Basic ogic Gates ab 2, Combinational ogic Circuits ab 3, Sequential Circuits: Flip-flops and Shift Registers ab 4, A Combinational-Sequential System ab 5, Variable Modulus Decade Counter With Display ab 6, Arithmetic ogic Unit Qty Part number Description Quad 2-Input NAND Gate Quad 2-Input NOR Gate ex Inverter Quad 2-Input AND Gate Quad 2-Input OR Gate BCD to 7-Segment Decoder/Driver Dual Master-Slave J-K Filp-Flop with Clear and Preset Bit Magnitude Comparator Quad 2-Input OR Gate Input Multiplexer Bit Serial In/Parallel Out Shift Register Bit BCD Decade Counter Bit Binary Counter Bit Arithmetic ogic Unit (AU) 1 MAN71A Common Anode 7-Segment Display

2 DM74S00 Quad 2-Input NAND Gate General Description This device contains four independent gates each of which performs the logic NAND function. Ordering Code: Order Number Package Number Package Description Devices also available in Tape and Reel. Specify by appending the suffix letter to the ordering code. August 1986 Revised March 2000 DM74S00M M14A 14-ead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, Narrow DM74S00SJ M14D 14-ead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide DM74S00N N14A 14-ead Plastic Dual-In-ine Package (PDIP), JEDEC MS-001, Wide DM74S00 Quad 2-Input NAND Gate Connection Diagram Function Table Y = AB Inputs Output A B Y = IG ogic evel = OW ogic evel 2000 Fairchild Semiconductor Corporation DS

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6 DM74S32 Quad 2-Input OR Gate General Description This device contains four independent gates each of which performs the logic OR function. Ordering Code: Order Number Package Number Package Description Devices also available in Tape and Reel. Specify by appending the suffix letter to the ordering code. June 1986 Revised March 2000 DM74S32M M14A 14-ead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, Narrow DM74S32SJ M14D 14-ead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide DM74S32N N14A 14-ead Plastic Dual-In-ine Package (PDIP), JEDEC MS-001, Wide DM74S32 Quad 2-Input OR Gate Connection Diagram Function Table Y = A + B Inputs Output A B Y = IG ogic evel = OW ogic evel 2000 Fairchild Semiconductor Corporation DS

7 DM74S47 BCD to 7-Segment Decoder/Driver with Open-Collector Outputs General Description The DM74S47 accepts four lines of BCD (8421) input data, generates their complements internally and decodes the data with seven AND/OR gates having open-collector outputs to drive indicator segments directly. Each segment output is guaranteed to sink 24 ma in the ON (OW) state and withstand 15V in the OFF (IG) state with a maximum leakage current of 250 µa. Auxiliary inputs provided blanking, lamp test and cascadable zero-suppression functions. Ordering Code: Features Open-collector outputs Drive indicator segments directly October 1988 Revised March 2000 Cascadable zero-suppression capability amp test input Order Number Package Number Package Description DM74S47M M16A 16-ead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, Narrow DM74S47N N16E 16-ead Plastic Dual-In-ine Package (PDIP), JEDEC MS-001, Wide Devices also available in Tape and Reel. Specify by appending the suffix letter to the ordering code. ogic Symbol V CC = Pin 16 GND = Pin 8 Connection Diagram Pin Descriptions DM74S47 BCD to 7-Segment Decoder/Driver with Open-Collector Outputs Pin Names Description A0 A3 BCD Inputs RBI Ripple Blanking Input (Active OW) T amp Test Input (Active OW) BI/RBO Blanking Input (Active OW) or Ripple Blanking Output (Active OW) a g Segment Outputs (Active OW) (Note 1) Note 1: OC Open Collector 2000 Fairchild Semiconductor Corporation DS

8 DM74S47 Truth Table Decimal Inputs Outputs or Note Function T RBI A3 A2 A1 A0 BI/RBO a b c d e f g 0 (Note 2) 1 (Note 2) BI (Note 3) RBI (Note 4) T (Note 5) Note 2: BI/RBO is wire-and logic serving as blanking input (BI) and/or ripple-blanking output (RBO). The blanking out (BI) must be open or held at a IG level when output functions 0 through 15 are desired, and ripple-blanking input (RBI) must be open or at a IG level if blanking or a decimal 0 is not desired. = input may be IG or OW. Note 3: When a OW level is applied to the blanking input (forced condition) all segment outputs go to a IG level regardless of the state of any other input condition. Note 4: When ripple-blanking input (RBI) and inputs A0, A1, A2 and A3 are OW level, with the lamp test input at IG level, all segment outputs go to a IG level and the ripple-blanking output (RBO) goes to a OW level (response condition). Note 5: When the blanking input/ripple-blanking output (BI/RBO) is OPEN or held at a IG level, and a OW level is applied to lamp test input, all segment outputs go to a OW level. Functional Description The DM74S47 decodes the input data in the pattern indicated in the Truth Table and the segment identification illustration. If the input data is decimal zero, a OW signal applied to the RBI blanks the display and causes a multidigit display. For example, by grounding the RBI of the highest order decoder and connecting its BI/RBO to RBI of the next lowest order decoder, etc., leading zeros will be suppressed. Similarly, by grounding RBI of the lowest order decoder and connecting its BI/RBO to RBI of the next highest order decoder, etc., trailing zeros will be suppressed. eading and trailing zeros can be suppressed simultaneously by using external gates, i.e.: by driving RBI of a intermediate decoder from an OR gate whose inputs are BI/RBO of the next highest and lowest order decoders. BI/ RBO also serves as an unconditional blanking input. The internal NAND gate that generates the RBO signal has a resistive pull-up, as opposed to a totem pole, and thus BI/ RBO can be forced OW by external means, using wiredcollector logic. A OW signal thus applied to BI/RBO turns off all segment outputs. This blanking feature can be used to control display intensity by varying the duty cycle of the blanking signal. A OW signal applied to T turns on all segment outputs, provided that BI/RBO is not forced OW. 2

9 ogic Diagram DM74S47 Numerical Designations Resultant Displays 3

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11 INTEGRATED CIRCUITS 74F85 4-bit magnitude comparator 1994 Sep 27 IC15 Data andbook

12 4-bit magnitude comparator 74F85 FEATURES igh-impedance NPN base inputs for reduced loading (20µA in igh and ow states) Magnitude comparison of any binary words Serial or parallel expansion without extra gating DESCRIPTION The 74F85 is a 4-bit magnitude comparator that can be expanded to almost any length. It compares two 4-bit binary, BCD, or other monotonic codes and presents the three possible magnitude results at the outputs. The 4-bit inputs are weighted (A0 A3) and (B0 B3) where A3 and B3 are the most significant bits. The operation of the 74F85 is described in the Function Table, showing all possible logic conditions. The upper part of the table describes the normal operation under all conditions that will occur in a single device or in a series expansion scheme. In the upper part of the table the three outputs are mutually exclusive. In the lower part of the table, the outputs reflect the feed-forward conditions that exist in the parallel expansion scheme. The expansion inputs I A>B, and I A=B and I A<B are the least significant bit positions. When used for series expansion, the A>B, A=B and A<B outputs of the lease significant word are connected to the corresponding I A>B, I A=B and I A<B inputs of the next higher stage. Stages can be added in this manner to any length, but a propagation delay penalty of about 15ns is added with each additional stage. For proper operation, the expansion inputs of the least significant word should be tied as follows: I A>B = ow, I A=B = igh, and I A<B = ow. PIN CONFIGURATION TYPE B3 I A<B I A=B I A>B A>B A=B A<B GND TYPICA PROPAGATION DEAY SF00075 V CC A3 B2 A2 A1 B1 A0 B0 TYPICA SUPPY CURRENT (TOTA) 74F85 7.0ns 40mA ORDERING INFORMATION DESCRIPTION COMMERCIA RANGE V CC = 5V ±10%, T amb = 0 C to +70 C PKG DWG # 16-pin plastic DIP N74F85N SOT pin plastic SO N74F85D SOT162-1 INPUT AND OUTPUT OADING AND FAN OUT TABE PINS DESCRIPTION 74F (U..) IG/OW OAD VAUE IG/OW A0 A3 Comparing inputs 1.0/ µA/20µA B0 B3 Comparing inputs 1.0/ µA/20µA I A<B, I A=B, I A>B Expansion inputs (active igh) 1.0/ µA/20µA A<B, A=B, A>B Data outputs (active igh) 50/33 1.0mA/20mA NOTE: One (1.0) FAST unit load is defined as: 20µA in the igh state and 0.6mA in the ow state. OGIC SYMBO IEC/IEEE SYMBO COMP 13 P V CC = Pin 16 GND = Pin 8 A0 A1 A2 A3 B0 B1 B2 B3 I A<B I A=B I A>B A>B A=B A<B SF < = > Q P<Q P=Q P>Q SF00077 September 27,

13 4-bit magnitude comparator 74F85 OGIC DIAGRAM A3 B A>B A2 B I A<B 2 I A=B 3 6 A=B I A>B 4 A1 B A<B A0 B V CC = Pin 16 GND = Pin 8 SF00078 FUNCTION TABE COMPARING INPUTS EPANSION INPUTS OUTPUTS A3,B3 A2,B2 A1,B1 A0,B0 I A>B I A<B I A=B A>B A<B A=B A3>B3 A3<B3 A3=B3 A2>B2 A3=B3 A2<B2 A3=B3 A2=B2 A1>B1 A3=B3 A2=B2 A1<B1 A3=B3 A2=B2 A1=B1 A0>B0 A3=B3 A2=B2 A1=B1 A0<B0 A3=B3 A2=B2 A1=B1 A0=B0 A3=B3 A2=B2 A1=B1 A0=B0 A3=B3 A2=B2 A1=B1 A0=B0 A3=B3 A2=B2 A1=B1 A0=B0 A3=B3 A2=B2 A1=B1 A0=B0 A3=B3 A2=B2 A1=B1 A0=B0 = igh voltage level = ow voltage level = Don t care September 27,

14 4-bit magnitude comparator 74F85 APPICATION INPUTS (SB) B23 A23 B22 A22 B21 A21 B20 A20 B19 A19 B18 A18 B17 A17 B16 A16 B15 A15 B14 A14 B3 A3 B2 A2 B1 A1 B0 A0 I A<B I A=B I A>B B3 A3 B2 A2 B1 A1 B0 A0 I A<B I A=B I A>B A<B A=B A>B A<B A=B A>B NC NC The parallel expansion scheme shown in Figure 1 demonstrates the most efficient general use of these comparators. The expansion inputs can be used as a fifth input bit position except on the least significant device, which must be connected as in the serial scheme. The expansion inputs used by labeling I A>B as an A input, I A<B as a B input and setting I A=B = ow. The 74F85 can be used as a 5-bit comparator only when the outputs are used to drive the (A0 A3) and (B0 B3) inputs of another 74F85 device. The parallel technique can be expanded to any number of bits as shown in Table 1. Table 1. WORD ENGT NUMBER OF PACKAGES TYPICA SPEEDS 74F 1 4 bits 1 12ns 5 24 bits ns bits ns B13 B3 B3 A13 A3 A3 B12 B2 B2 A12 B11 A2 B1 A<B A2 B1 A<B OUTPUTS A11 A1 A=B NC A1 A=B B10 B0 A>B B0 A>B A10 A0 A0 B9 A9 I A<B I A=B I A>B A<B A=B A>B B8 B3 A8 A3 B7 B2 A7 A2 B6 B1 A<B A6 A1 A=B NC B5 B0 A>B A5 A0 B4 A4 I A<B I A=B I A>B B3 B3 A3 A3 B2 B2 A2 A2 B1 B1 A<B A1 A1 A=B (SB) B0 B0 A>B A0 A0 I A<B I A=B I A>B SF00079 Figure 1. Comparison of Two 24-Bit Words September 27,

15 4-bit magnitude comparator 74F85 ABSOUTE MAIMUM RATINGS (Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range.) SYMBO PARAMETER RATING UNIT V CC Supply voltage 0.5 to +7.0 V V IN Input voltage 0.5 to +7.0 V I IN Input current 30 to +5 ma V OUT Voltage applied to output in igh output state 0.5 to V CC V I OUT Current applied to output in ow output state 40 ma T amb Operating free-air temperature range 0 to +70 C T stg Storage temperature range 65 to +150 C RECOMMENDED OPERATING CONDITIONS SYMBO PARAMETER IMITS MIN NOM MA UNIT V CC Supply voltage V V I igh-level input voltage 2.0 V V I ow-level input voltage 0.8 V I IK Input clamp current 18 ma I O igh-level output current 1 ma I O ow-level output current 20 ma T amb Operating free-air temperature range C DC EECTRICA CARACTERISTICS (Over recommended operating free-air temperature range unless otherwise noted.) IMITS SYMBO PARAMETER TEST CONDITIONS 1 MIN TYP 2 MA UNIT V O igh-level output voltage V CC = MIN, V I = MA ±10%V CC 2.5 V I = MIN, I O = MA ±5%V CC V V O ow-level output voltage V CC = MIN, V I = MA ±10%V CC V I = MIN, I O = MA ±5%V CC V V IK Input clamp voltage V CC = MIN, I I = I IK V I I Input current at maximum input voltage V CC = 0.0V, V I = 7.0V 100 µa I I igh-level input current V CC = MA, V I = 2.7V 20 µa I I ow-level input current V CC = MA, V I = 0.5V 20 µa I OS Short-circuit output current 3 V CC = MA ma I CC V IN = GND I CC Supply current (total) V CC = MA An = Bn = I I A=B = GND, ma CC I A>B = I A<B = V NOTES: 1. For conditions shown as MIN or MA, use the appropriate value specified under recommended operating conditions for the applicable type. 2. All typical values are at V CC = 5V, T amb = 25 C. 3. Not more than one output should be shorted at a time. For testing I OS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a igh output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, I OS tests should be performed last. September 27,

16 4-bit magnitude comparator 74F85 AC EECTRICA CARACTERISTICS SYMBO t P t P t P t P t P t P t P t P t P t P AC WAVEFORMS PARAMETER Propagation delay A or B to A<B, A>B Propagation delay A or B to A=B Propagation delay I A<B and I A=B to A>B Propagation delay I A=B to A=B Propagation delay I A>B and I A=B to A<B TEST CONDITION Waveform 1 3 logic levels Waveform 1 4 logic levels Waveform 1 1 logic level Waveform 1 2 logic levels Waveform 1 1 logic level IMITS V CC = +5.0V V CC = +5.0V ± 10% T amb = +25 C T amb = 0 C to +70 C UNIT C = 50pF, R = 500Ω C = 50pF, R = 500Ω MIN TYP MA MIN MA ns ns ns ns ns V IN V M V M t P t P V OUT V M V M Waveform 1. Propagation Delay Input to Output NOTE: For all waveforms, V M = 1.5V. SF00080 TEST CIRCUIT AND WAVEFORMS PUSE GENERATOR V IN V CC D.U.T. V OUT NEGATIVE PUSE 90% V M 10% t T ( t f ) t w t T ( t r ) 10% V M 90% AMP (V) 0V R T C R Test Circuit for Totem-Pole Outputs POSITIVE PUSE 10% 90% V M t T ( t r ) t w t T ( t f ) 90% V M 10% AMP (V) 0V DEFINITIONS: R = oad resistor; see AC EECTRICA CARACTERISTICS for value. C = oad capacitance includes jig and probe capacitance; see AC EECTRICA CARACTERISTICS for value. R T = Termination resistance should be equal to Z OUT of pulse generators. family 74F Input Pulse Definition INPUT PUSE REQUIREMENTS amplitude V M rep. rate t w t T t T 3.0V 1.5V 1Mz 500ns 2.5ns 2.5ns SF00006 September 27,

17 4-bit magnitude comparator 74F85 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT Sep 27 7

18 4-bit magnitude comparator 74F85 SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT Sep 27 8

19 4-bit magnitude comparator 74F85 NOTES 1994 Sep 27 9

20 4-bit magnitude comparator 74F85 Data sheet status Data sheet status Product status Definition [1] Objective specification Preliminary specification Product specification Development Qualification Production This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. imiting values definition imiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers ife support These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify for any damages resulting from such application. Right to make changes reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California Telephone Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Date of release: Document order number: yyyy mmm dd 10

21 DM7486 Quad 2-Input Exclusive-OR Gate General Description This device contains four independent gates each of which performs the logic exclusive-or function. Ordering Code: Order Number Package Number Package Description September 1986 Revised February 2000 DM7486N N14A 14-ead Plastic Dual-In-ine Package (PDIP), JEDEC MS-001, Wide Connection Diagram Function Table Inputs Y = A! B Output A B Y DM7486 Quad 2-Input Exclusive-OR Gate = IG ogic evel = OW ogic evel 2000 Fairchild Semiconductor Corporation DS

22 8-input multiplexer 74C/CT151 FEATURES True and complement outputs Multifunction capability Permits multiplexing from n lines to 1 line Non-inverting data path See the 251 for the 3-state version Output capability: standard I CC category: MSI GENERA DESCRIPTION The 74C/CT151 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TT (STT). They are specified in compliance with JEDEC standard no. 7A. QUICK REFERENCE DATA GND = 0 V; T amb = 25 C; t r = t f = 6 ns SYMBO PARAMETER CONDITIONS t P / t P propagation delay C = 15 pf; V CC = 5 V Notes 1. C PD is used to determine the dynamic power dissipation (P D in µw): P D = C PD V CC 2 f i + (C V CC 2 f o ) where: f i = input frequency in Mz f o = output frequency in Mz (C V CC 2 f o ) = sum of outputs C = output load capacitance in pf V CC = supply voltage in V 2. For C the condition is V I = GND to V CC For CT the condition is V I = GND to V CC 1.5 V C TYPICA CT I n to Y, Y ns S n to Y, Y ns E to Y ns E to Y ns C I input capacitance pf C PD power dissipation capacitance per package notes 1 and pf UNIT ORDERING INFORMATION See 74C/CT/CU/CMOS ogic Package Information. December

23 8-input multiplexer 74C/CT151 PIN DESCRIPTION PIN NO. SYMBO NAME AND FUNCTION 4, 3, 2, 1, 15, 14, 13, 12 I 0 to I 7 multiplexer inputs 5 Y multiplexer output 6 Y complementary multiplexer output 7 E enable input (active OW) 8 GND ground (0 V) 11, 10, 9 S 0, S 1, S 2 select inputs 16 V CC positive supply voltage Fig.1 Pin configuration. Fig.2 ogic symbol. Fig.3 IEC logic symbol. December

24 December input multiplexer 74C/CT151 FUNCTION TABE Notes 1. = IG voltage level = OW voltage level = don t care. INPUTS OUTPUTS E S 2 S 1 S 0 I 0 I 1 I 2 I 3 I 4 I 5 I 6 I 7 Y Y Fig.4 Functional diagram. Fig.5 ogic diagram.

25 DM Bit Serial In/Parallel Out Shift Registers General Description These 8-bit shift registers feature gated serial inputs and an asynchronous clear. A OW logic level at either serial input inhibits entry of the new data, and resets the first flipflop to the OW level at the next clock pulse, thus providing complete control over incoming data. A IG logic level on either input enables the other input, which will then determine the state of the first flip-flop. Data at the serial inputs may be changed while the clock is IG or OW, but only information meeting the setup and hold time requirements will be entered. Clocking occurs on the OW-to-IG level transition of the clock input. All inputs are diode-clamped to minimize transmission-line effects. Ordering Code: Features Gated (enable/disable) serial inputs Fully buffered clock and serial inputs Asynchronous clear Typical clock frequency 36 Mz Typical power dissipation 185 mw Order Number Package Number Package Description September 1986 Revised July 2001 DM74164 N14A 14-ead Plastic Dual-In-ine Package (PDIP), JEDEC MS-001, 0.300" Wide DM Bit Serial In/Parallel Out Shift Registers Connection Diagram Function Table Inputs Outputs Clear Clock A B Q A Q B Q Q A0 Q B0 Q 0 Q An Q Gn Q An Q Gn Q An Q Gn = IG evel (steady state) = OW evel (steady state) = Don t Care (any input, including transitions) = Transition from OW-to-IG level Q A0, Q B0, Q 0 = The level of Q A, Q B, or Q, respectively, before the indicated steady-state input conditions were established. Q An, Q Gn = The level of Q A or Q G before the most recent transition of the clock; indicates a one-bit shift Fairchild Semiconductor Corporation DS

26 DM74164 ogic Diagram Timing Diagram 2

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30 INTEGRATED CIRCUITS DATA SEET For a complete data sheet, please also download: The IC06 74C/CT/CU/CMOS ogic Family Specifications The IC06 74C/CT/CU/CMOS ogic Package Information The IC06 74C/CT/CU/CMOS ogic Package Outlines 74C/CT181 4-bit arithmetic logic unit Supersedes data of September 1993 File under Integrated Circuits, IC Jun 10

31 4-bit arithmetic logic unit 74C/CT181 FEATURES Full carry look-ahead for high-speed arithmetic operation on long words Provides 16 arithmetic operations: add, subtract, compare, double, plus 12 others Provides all 16 logic operations of two variables: ECUSIVE-OR, compare, AND, NAND, NOR, OR plus 10 other logic operations Output capability: I CC category: MSI GENERA DESCRIPTION standard, A=B open drain The 74C/CT181 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TT (STT). They are specified in compliance with JEDEC standard no. 7A. The 74C/CT181 are 4-bit high-speed parallel Arithmetic ogic Units (AU). Controlled by the four function select inputs (S 0 to S 3 ) and the mode control input (M), they can perform all the 16 possible logic operations or 16 different arithmetic operations on active IG or active OW operands (see function table). When the mode control input (M) is IG, all internal carries are inhibited and the device3 performs logic operations on the individual bits as listed. When M is OW, the carries are enabled and the 181 performs arithmetic operations on the two 4-bit words. The 181 incorporates full internal carry look-ahead and provides for either ripple carry between devices using the C n+4 output, or for carry look-ahead between packages using the carry propagation (P) and carry generate (G) signals. P and G are not affected by carry in. When speed requirements are not stringent, it can be used in a simple ripple carry mode by connecting the carry output (C n+4 ) signal to the carry input (C n ) of the next unit. For high-speed operation the device is used in conjunction with the 182 carry look-ahead circuit. One carry look-ahead package is required for each group of four 181 devices. Carry look-ahead can be provided at various levels and offers high-speed capability over extremely long word lengths. The comparator output (A=B) of the device goes IG when all four function outputs (F 0 to F 3 ) are IG and can be used to indicate logic equivalence over 4 bits when the unit is in the subtract mode. A=B is an open collector output and can be wired-and with other A=B outputs to give a comparison for more than 4 bits. The open drain output A=B should be used with an external pull-up resistor in order to establish a logic IG level. The A=B signal can also be used with the C n+4 signal to indicate A > B and A < B. The function table lists the arithmetic operations that are performed without a carry in. An incoming carry adds a one to each operation. Thus, select code generates A minus B minus 1 (2s complement notation) without a carry in and generates A minus B when a carry is applied. Because subtraction is actually performed by complementary addition (1s complement), a carry out means borrow; thus, a carry is generated when there is no under-flow and no carry is generated when there is underflow. As indicated, the 181 can be used with either active OW inputs producing active OW outputs or with active IG inputs producing active IG outputs. For either case the table lists the operations that are performed to the operands. ORDERING INFORMATION TYPE NUMBER 74C181N3; 74CT181N3 74C181N; 74CT181N 74C181D; 74CT181D PACKAGE NAME DESCRIPTION VERSION DIP24 plastic dual in-line package; 24 leads (300 mil) SOT222-1 DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT Jun 10 2

32 4-bit arithmetic logic unit 74C/CT181 QUICK REFERENCE DATA GND = 0 V; T amb = 25 C; t r =t f = 6 ns SYMBO PARAMETER CONDITIONS t P / t P propagation delay C = 15 pf; V CC =5V Notes 1. C PD is used to determine the dynamic power dissipation (P D in µw): P D =C PD V CC 2 f i + (C V CC 2 f o ) where: f i = input frequency in Mz f o = output frequency in Mz (C V CC 2 f o ) = sum of outputs C = output load capacitance in pf V CC = supply voltage in V 2. For C the condition is V I = GND to V CC For CT the condition is V I = GND to V CC 1.5 V C TYPICA CT A n or B n to A=B ns C n to C n ns C I input capacitance pf C PD power dissipation capacitance per package notes 1 and pf UNIT A B Fig.1 Pin configuration. Fig.2 ogic symbol. Fig.3 IEC logic symbol Jun 10 3

33 4-bit arithmetic logic unit 74C/CT181 PIN DESCRIPTION PIN NO. SYMBO NAME AND FUNCTION 1, 22, 20, 18 B 0 to B 3 operand inputs (active OW) 2, 23, 21, 19 A 0 to A 3 operand inputs (active OW) 6, 5, 4, 3 S 0 to S 3 select inputs 7 C n carry input 8 M mode control input 9, 10, 11, 13 F 0 to F 3 function outputs (active OW) 12 GND ground (0 V) 14 A=B comparator output 15 P carry propagate output (active OW) 16 C n+4 carry output 17 G carry generate output (active OW) 24 V CC positive supply voltage k, halfpage 2 A 0 F A 1 F A 2 F A 3 F B 0 C n+4 B 1 A=B B 2 G B 3 P 15 7 C n 6 S 0 5 S 1 4 S 2 3 S 3 8 M MBK219 Fig.4 Functional diagram. Fig.5 Active IG operands - active OW operands Jun 10 4

34 4-bit arithmetic logic unit 74C/CT181 FUNCTION TABES MODE SEECT INPUTS S 3 S 2 S 1 S 0 OGIC (M=) Notes to the function tables 1. Each bit is shifted to the next more significant position. 2. Arithmetic operations expressed in 2s complement notation. = IG voltage level = OW voltage level ACTIVE IG INPUTS AND OUTPUTS A A + B AB logical 0 AB B A B AB A+B A B B AB logical 1 A+B A+B A ARITMETIC (2) (M=; C n =) A A+B A+B minus 1 A plus AB (A + B) plus AB A minus B minus 1 AB minus 1 A plus AB A plus B (A + B) plus AB AB minus 1 A plus A (1) (A + B) plus A (A + B) plus A A minus 1 MODE SEECT INPUTS S 3 S 2 S 1 S 0 OGIC (M=) Notes to the function tables 1. Each bit is shifted to the next more significant position. 2. Arithmetic operations expressed in 2s complement notation. = IG voltage level = OW voltage level ACTIVE OW INPUTS AND OUTPUTS A AB A+B logical 1 A + B B A B A+B AB A B B A + B logical 0 AB AB A ARITMETIC (2) (M=; C n =) A minus 1 AB minus 1 AB minus 1 minus 1 A plus (A + B) AB plus (A + B) A minus B minus 1 A+B A plus (A + B) A plus B AB plus (A + B) A+B A plus A (1) AB plus A AB plus A A 1998 Jun 10 5

35 4-bit arithmetic logic unit 74C/CT181 Fig.6 ogic diagram Jun 10 6

36 4-bit arithmetic logic unit 74C/CT181 Table 1 SUM MODE TEST Function inputs S 0 =S 3 = V, M = S 1 =S 2 =0V PARAMETER INPUT UNDER TEST OTER INPUT, SAME BIT OTER DATA INPUTS OUTPUT UNDER Apply V Apply GND Apply V Apply GND TEST t P / t P A i B i none remaining A and B C n F i t P / t P B i A i none remaining A and B C n F i t P / t P A i B i none none remaining A and B, C n P t P / t P B i A i none none remaining A and B, C n P t P / t P A i none B i remaining B remaining A, C n G t P / t P B i none A i remaining B remaining A, C n G t P / t P A i none B i remaining B remaining A, C n C n+4 t P / t P B i none A i remaining B remaining A, C n C n+4 t P / t P C n none none all A all B any F or C n+4 Table 2 DIFFERENTIA MODE TEST Function inputs S 1 =S 2 = V, M = S 0 =S 3 =0V PARAMETER INPUT UNDER TEST OTER INPUT, SAME BIT OTER DATA INPUTS OUTPUT UNDER Apply V Apply GND Apply V Apply GND TEST t P / t P A i none B i remaining A remaining B, C n F i t P / t P B i A i none remaining A remaining B, C n F i t P / t P A i none B i none remaining A and B, C n P t P / t P B i A i none none remaining A and B, C n P t P / t P A i B i none none remaining A and B, C n G t P / t P B i none A i none remaining A and B, C n G t PZ / t PZ A i none B i remaining A remaining B, C n A=B t PZ / t PZ B i A i none remaining A remaining B, C n A=B t P / t P A i B i none none remaining A and B, C n C n+4 t P / t P B i none A i none remaining A and B, C n C n+4 t P / t P C n none none all A and B none any F or C n+4 Table 3 OGIC MODE TEST Function inputs M = S 1 =S 2 = V, S 0 =S 3 =0V PARAMETER INPUT UNDER TEST OTER INPUT, SAME BIT OTER DATA INPUTS OUTPUT UNDER Apply V Apply GND Apply V Apply GND TEST t P / t P A i B i none none remaining A and B, C n F i t P / t P B i A i none none remaining A and B, C n F i 1998 Jun 10 7

37 4-bit arithmetic logic unit 74C/CT181 RATINGS (for A=B output only) imiting values in accordance with the Absolute Maximum System (IEC 134) Voltage are referenced to GND (ground = 0 V) SYMBO PARAMETER MIN. MA. UNIT CONDITIONS V O DC output voltage V I OK DC output diode current 20 ma for V O < 0.5 V I O DC output source or sink current 25 ma for 0.5 V < V O DC CARACTERISTICS FOR 74C For the DC characteristics see 74C/CT/CU/CMOS ogic Family Specifications. Output capability: standard I CC category: MSI Voltages are referenced to GND (ground = 0 V) T amb ( C) TEST CONDITIONS SYMBO PARAMETER 74C to to +125 min. typ. max. min. max. min. max. UNIT V CC (V) V I OTER I OZ IG level output leakage current µa 2.0 to V I note 1 V O = 0 or 6 V Note to the DC characteristics 1. The maximum operating output voltage (V O(max) ) is V Jun 10 8

38 4-bit arithmetic logic unit 74C/CT181 AC CARACTERISTICS FOR 74C GND = 0 V; t r =t f = 6 ns; C = 50 pf SYMBO t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P PARAMETER propagation delay 55 C n to C n propagation delay 69 C n to F n propagation delay A n to G propagation delay B n to G propagation delay A n to G propagation delay B n to G propagation delay A n to P propagation delay B n to P propagation delay A n to P propagation delay B n to P T amb ( C) 74C to to +125 min. typ. max. min. max. min. max propagation delay 77 A i to F i propagation delay 85 B i to F i propagation delay 77 A i to F i propagation delay 83 B i to F i Jun UNIT V CC (V) ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 TEST CONDITIONS MODE sum diff sum diff sum sum diff diff sum sum diff diff sum sum diff diff OTER M=0V; Fig.9; Tables 1 and 2 M=0V; Fig.9; Tables 1 and 2 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table 1 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table 1 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table 2 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table 2 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table 1 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table 1 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table 2 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table 2 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table 1 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table 1 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table 2 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table 2

39 4-bit arithmetic logic unit 74C/CT181 SYMBO t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t PZ / t PZ t PZ / t PZ t P / t P t P / t P t P / t P t P / t P t T / t T PARAMETER propagation delay 74 A i to F i propagation delay 83 B i to F i propagation delay 80 A n to C n propagation delay 80 B n to C n propagation delay 77 A n to C n propagation delay 85 B n to C n propagation delay A n to A=B propagation delay B n to A=B Note to the AC characteristics propagation delay 83 A n to F n propagation delay 85 B n to F n propagation delay 77 A n to F n propagation delay 88 B n to F n output transition time For the open drain output (A=B) only t T is valid. T amb ( C) 74C to to +125 min. typ. max. min. max. min. max UNIT V CC (V) ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 ns 2.0 TEST CONDITIONS MODE logic logic sum sum diff diff diff diff sum sum diff diff OTER M = V; Fig.8; Table 3 M = V; Fig.8; Table 3 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.8; Table 1 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.8; Table 1 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.10; Table 2 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.10; Table 2 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.11; Table 2 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.11; Table 2 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table 1 M=S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table 1 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table 2 M=S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table 2 note ; Figs 7 and Jun 10 10

40 4-bit arithmetic logic unit 74C/CT181 DC CARACTERISTICS FOR 74CT For the DC characteristics see 74C/CT/CU/CMOS ogic Family Specifications. Output capability: standard I CC category: MSI Voltages are referenced to GND (ground = 0 V) SYMBO I OZ PARAMETER IG level output leakage current T amb ( C) 74CT to to +125 min. typ. max. min. max. min. max. UNIT V CC (V) µa 2.0 to TEST CONDITIONS V I OTER V I note 1 V O = 0 or 6 V Note to the DC characteristics 1. The maximum operating output voltage (V O(max) ) is V. Note to CT types The value of additional quiescent supply current ( I CC ) for a unit load of 1 is given in the family specifications. To determine I CC per input, multiply this value by the unit load coefficient shown in the table below. INPUT UNIT OAD COEFFICIENT C n, M 0.50 A n, B n 0.75 S n Jun 10 11

41 4-bit arithmetic logic unit 74C/CT181 AC CARACTERISTICS FOR 74CT GND = 0 V; t r =t f = 6 ns; C = 50 pf T amb ( C) TEST CONDITIONS SYMBO PARAMETER 74CT to to +125 min. typ. max. min. max. min. max. UNIT V CC (V) MODE OTER t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P propagation delay C n to C n+4 propagation delay C n to F n propagation delay A n to G propagation delay B n to G propagation delay A n to G propagation delay B n to G propagation delay A n to P propagation delay B n to P propagation delay A n to P propagation delay B n to P propagation delay A i to F i propagation delay B i to F i ns sum diff ns sum diff M=0V; Fig.9; Tables 1 and 2 M=0V; Fig.9; Tables 1 and ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table Jun 10 12

42 4-bit arithmetic logic unit 74C/CT181 T amb ( C) TEST CONDITIONS SYMBO PARAMETER 74CT to to +125 min. typ. max. min. max. min. max. UNIT V CC (V) MODE OTER t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t P / t P t PZ / t PZ t PZ / t PZ t P / t P t P / t P propagation delay A i to F i propagation delay B i to F i propagation delay A i to F i propagation delay B i to F i propagation delay A n to C n+4 propagation delay B n to C n+4 propagation delay A n to C n+4 propagation delay B n to C n+4 propagation delay A n to A=B propagation delay B n to A=B propagation delay A n to F n propagation delay B n to F n ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table ns logic M = V; Fig.8; Table ns logic M = V; Fig.8; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.8; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.8; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.10; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.10; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.11; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.11; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table ns sum M = S 1 =S 2 =0V; S 0 =S 3 = V; Fig.7; Table Jun 10 13

43 4-bit arithmetic logic unit 74C/CT181 T amb ( C) TEST CONDITIONS SYMBO PARAMETER 74CT to to +125 min. typ. max. min. max. min. max. UNIT V CC (V) MODE OTER t P / t P t P / t P t T / t T propagation delay A n to F n propagation delay A n to F n output transition time ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table ns diff M = S 0 =S 3 =0V; S 1 =S 2 = V; Fig.8; Table ns Figs 7 and 11; note 1 Note to the AC characteristics 1. For the open drain output (A=B) only t T is valid Jun 10 14

44 4-bit arithmetic logic unit 74C/CT181 AC WAVEFORMS Fig.7 Propagation delays for carry input to carry output, carry input to function outputs, operands to carry generate operands, propagation outputs and output transition lines. Fig.8 Propagation delays for operands to carry generate, propagate outputs and function outputs. Fig.9 Propagation delays for operands to carry output and function outputs. Fig.10 Propagation delays for operands to carry output. Note to AC waveforms (1) C: V M = 50%; V I = GND to V CC. CT: V M = 1.3 V; V I = GND to 3 V. APPICATION INFORMATION Fig.11 Waveforms showing the input (A i, B j ) to output (A=B) propagation delays and output transition time of the open drain output (A=B). A and B inputs and F outputs of 181 are not shown Fig.12 Application example showing 16-bit AU ripple-carry configuration Jun 10 15

45 4-bit arithmetic logic unit 74C/CT181 PACKAGE OUTINES DIP24: plastic dual in-line package; 24 leads (300 mil) SOT222-1 seating plane D A 2 A M E A 1 Z e b 1 w M c (e ) 1 24 b 13 M pin 1 index E mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT mm inches A max. A 1 A 2 (1) (1) min. max. b b 1 c D E e e 1 M E M w (1) Z max Note 1. Plastic or metal protrusions of 0.01 inches maximum per side are not included. OUTINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT222-1 MS-001AF Jun 10 16

46 4-bit arithmetic logic unit 74C/CT181 DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 seating plane D A 2 A M E A 1 Z 24 e b b 1 13 w M c (e ) 1 M pin 1 index E mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. A 1 A 2 (1) (1) min. max. b b 1 c D E e e 1 M E M w Z (1) max Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT G02 MO-015AD Jun 10 17

47 4-bit arithmetic logic unit 74C/CT181 SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A c y E v M A Z Q A 2 A 1 (A ) 3 A pin 1 index p θ 1 e b p 12 w M detail mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note A max A 1 A 2 A 3 b p c D (1) E (1) e (1) E p Q v w y Z Plastic or metal protrusions of 0.15 mm maximum per side are not included θ o 8 o OUTINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT E05 MS-013AD Jun 10 18

48 4-bit arithmetic logic unit 74C/CT181 SODERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. owever, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data andbook IC26; Integrated Circuit Packages (order code ). DIP SODERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max ). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SODERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFOW SODERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SODERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The longitudinal axis of the package footprint must be parallel to the solder flow. The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SODERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Jun 10 19

49 4-bit arithmetic logic unit 74C/CT181 DEFINITIONS Data sheet status Objective specification Preliminary specification imiting values This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. imiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. IFE SUPPORT APPICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale Jun 10 20

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