ECE 451 Transmission Lines & Packaging
|
|
- Joshua Simpson
- 6 years ago
- Views:
Transcription
1 Transmission Lines & Packaging Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois 1
2 Radio Spectrum Bands The use of letters to designate bands has long ago been declared obsolete. Nevertheless, people seem to continue to use them and add more letters as users move up the microwave spectrum. The original definitions had very specific non-overlapping definitions (not counting subband definitions). Modern usage seems to associate the bands with waveguide ranges. P MHz L GHz S GHz C GHz X GHz Ku GHz K GHz Ka GHz Q GHz V GHz E GHz W GHz F GHz D GHz G GHz Y GHz J GHz 2
3 Coaxial Connectors Source: Allied Electronics, Inc. 3
4 Coaxial Connectors B A C C A B Type A B C SMA
5 Coaxial Transmission Line μ ε a b TEM Mode of Propagation L = μ ln b a C = 2πε ln(b/a) 5
6 Coaxial Air Lines μ ε a b Infinite Conductivity Zo = μ/ ε ln / 2π ( b a) Finite Conductivity ( 1/ a+ 1/ b) μ/ ε Zo = ln ( b/ a) j 2π 4 π fμσ ln( b/ a) ( ) 6
7 Coaxial Connector Standards μ ε a b Connector Frequency Range 14 mm DC GHz GPC-7 DC - 18 GHz Type N DC - 18 GHz 3.5 mm DC - 33 GHz 2.92 mm DC - 40 GHz 2.4 mm DC - 50 GHz 1.85 mm DC - 65 GHz 1.0 mm DC GHz 7
8 Microstrip ε Z o w/h < h h = ln ( εr + 1) w w Z o w/h > π w ln(4) ln( eπ /16) εr 1 = ε 2h π 2π ε r r εr + 1 πe w + ln ln πε + + r 2 2h 8
9 Dual-in-Line (DIP) Package -Mounted on PWB in pin-through-hole (PTH) configuration - Chip occupies less than 20% of total space - Lead frame with large inductance 9
10 Stacked Wire Bonds 10
11 Package Types DIP QFP CSP Flip Chip Top View (showing chip topackage connection) Plane View (showing package to board connection) Chip Size (mm mm) Chip Perimeter (mm) Number of I/Os Chip Pad Pitch (μm) Package Size (in in) Lead Pitch (mils) Chip Area (mm 2 ) Feature Size (μm) Gates/Chip 30K 300K 2M 10M Max Frequency (MHz) Power Dissipation (W) Chip Pow Dens (W/cm 2 ) Pack Pow Dens (W/cm 2 ) Supply Voltage (V) Supply Current (A)
12 Ball Bonding for Flip Chip 12
13 Flip Chip Pin Grid Array (FC-PGA) Bumped Die Package Body Pins 13
14 Crosstalk Noise Signal Integrity Crosstalk Dispersion Attenuation Reflection Distortion Loss Delta I Noise Ground Bounce Radiation Drive Line Sense Line Drive Line 14
15 TEM PROPAGATION I L + V C - Δz z Z 1 Z o β Z 2 V s 15
16 I Telegrapher s Equations L + V C - Δz V = L z I = C z I t V t L: Inductance per unit length. C: Capacitance per unit length. 16
17 Crosstalk noise depends on termination 50 Ω line 1 line 2 50 Ω 50 Ω line 1 line 2 line 1 line 2 line 1 line 2 17
18 Crosstalk depends on signal rise time 50 Ω line 1 line 2 50 Ω t r = 1 ns t r = 7 ns line 1 line 2 line 1 line 2 18
19 Crosstalk depends on signal rise time 50 Ω line 1 line 2 t r = 1 ns t r = 7 ns line 1 line 2 line 1 line 2 19
20 Coupled Transmission Lines w s h ε r V 1 V 2 I 1 C m I 2 C s C s L m 20
21 Telegraphers Equations for Coupled Transmission Lines Maxwellian Form V = L I + L I z t t V = L I + L I z t t I = C V + C V z t t I = C V + C V z t t
22 Telegraphers Equations for Coupled Transmission Lines Physical form V = L I + L I z t t s m V = L I + L I z t t m s I V V V = C + C C z t t t s m m I V V V = C + C + C z t t t m m s 22
23 Relations Between Physical and Maxwellian Parameters (symmetric lines) L 11 = L 22 = L s L 12 = L 21 = L m C 11 = C 22 = C s +C m C 12 = C 21 = - C m 23
24 V z ( L L ) e = I z ( C C ) e = Even Mode I t e I t V e : Even mode voltage e Add voltage and current equations V e = 1 ( 2 V 1 + V 2) I e : Even mode current I e = 1 ( 2 I 1 + I 2) Z e = v e = L 11 + L 12 C 11 + C 12 = L s + L m C s 1 (L 11 + L 12 )(C 11 + C 12 ) = 1 (L s + L m )C s Impedance velocity 24
25 Odd Mode V z Id = z C C ( L L ) d = ( ) I t I t V d : Odd mode voltage I d : Odd mode current d d Subtract voltage and current equations V = 1 V V 2 I ( ) d 1 2 = 1 2 I I ( ) d 1 2 L L L L s m Z d = = C11 C12 Cs + 2Cm 1 1 v d = = ( L L )( C C ) ( L L )( C 2 C ) s m s + m Impedance velocity 25
26 Mode Excitation EVEN +1-1 ODD 26
27 PHYSICAL SIGNIFICANCE OF EVEN- AND ODD-MODE IMPEDANCES *Z e and Z d are the wave resistance seen by the even and odd mode travelling signals respectively. * The impedance of each line is no longer described by a single characteristic impedance; instead, we have V 1 = Z 11 I 1 + Z 12 I 2 V 2 = Z 21 I 1 + Z 22 I 2 27
28 Definitions Even-Mode Impedance:Z e Impedance seen by wave propagating through the coupledline system when excitation is symmetric (1, 1). Odd-Mode Impedance:Z d Impedance seen by wave propagating through the coupledline system when excitation is anti-symmetric (1, -1). Common-Mode Impedance:Z c = 0.5Z e Impedance seen by a pair of line and a common return by a common signal. Differential Impedance:Z diff = 2Z d Impedance seen across a pair of lines by differential mode signal. 28
29 EVEN AND ODD-MODE IMPEDANCES Z 11, Z 22 : Self Impedances Z 12, Z 21 : Mutual Impedances For symmetrical lines, Z 11 = Z 22 and Z 12 = Z 21 29
30 EXAMPLE (Microstrip) ε r = 4.3 Z s = 56.4 Ω ε r = 4.3 Z e = 68.1 Ω Z 11 = 54.4 Ω Single Line Dielectric height = 6 mils Width = 8 mils Coupled Lines Height = 6 mils Width = 8 mils Spacing = 12 mils Z d = 40.8 Ω Z 12 = 13.6 Ω 30
31 Even Mode I Z g V 1 f IT line 1 Z g + line 2 step V b V T generator - I 2 reference plane tied to ground coaxial line I tdr ae(,0) t ad(,0) t ae(,0) t ad(,0) t = + Ze Z + d Ze Z d V = a (,0) t a (,0) t tdr e d a(,0) d t = 0 V I tdr tdr Z = 2 e Z = 2( e 1+ ρe ) Z 1 ρ e g v = e 2l τ e 31
32 Z g step generator Odd Mode I V 1 f I T line 1 Z g + V line 2 V T b - I2 reference plane floating coaxial line tdr e d [ e d ] V = a (t,0)+a (t,0)- a (t,0)-a (t,0) = Vf + Vb ae( t,0) ad( t,0) I tdr = + Ze Z d ae(,0) t ad(,0) t I tdr =- Ze Z d Z a e (t,0) =0, V tdr I tdr =2Z d d 1 1+ ρ d 2l = Zg, v d = 2 1 ρd τ d 32
33 EXTRACT INDUCTANCE AND CAPACITANCE COEFFICIENTS 1 Ze L s = + 2 ve C s = 1 Z v e e Z v d d 1 Ze L m = - 2 ve Z v d d C m = - Z v Z v 2 e e d d Z d < Z s < Ze 33
34 Measured even-mode impedance Z e ( Ω ) Even-Mode Impedance h=3 mils h=5 mils h=7 mils h=10 mils h=14 mils h=21 mils Spacing (mils) 34
35 Measured odd-mode impedance Odd-Mode Impedance h=3 mils h=5 mils h=7 mils h=10 mils h=14 mils h=21 mils Z d ( Ω ) Spacing (mils) 35
36 Measured even-mode velocity v e (m/ns) Even-Mode velocity h=3 mils h=5 mils h=7 mils h=10 mils h=14 mils h=21 mils Spacing (mils) 36
37 Measured odd-mode velocity Odd-Mode Velocity h=3 mils h=5 mils h=7 mils h=10 mils h=14 mils h=21 mils v d (m/ns) Spacing (mils) 37
38 Measured mutual inductance Mutual Inductance h=3 mils h=5 mils h=7 mils h=10 mils h=14 mils h=21 mils L m (nh/m) Spacing (mils) 38
39 Measured mutual capacitance Mutual Capacitance h=3 mils h=5 mils h=7 mils h=10 mils h=14 mils h=21 mils C m (pf/m) Spacing (mils) 39
40 Even & Odd Mode Impedances 110 Typical Even & Odd Mode Impedances 100 Zeven Zodd Zeven, Zodd (Ohms) Distance (mils) 40
41 Modal Velocities in Stripline and Microstrip Microstrip : Inhomogeneous structure, odd and even-mode velocities must have different values. Stripline : Homogeneous configuration, odd and even-mode velocities have approximately the same values. 41
42 Microstrip vs Stripline 50 Ω 50 Ω Microstrip (h =8 mils) w = 8 mils ε r = 4.32 L s = 377 nh/m C s = 82 pf/m L m = 131 nh/m C m = 23 pf/m v e = m/ns v d = m/ns Stripline (h =16 mils) w = 8 mils ε r = 4.32 L s = 466 nh/m C s = 86 pf/m L m = 109 nh/m C m = 26 pf/m v e = m/ns v d = m/ns 42
43 Microstrip vs Stripline 50 Ω 50 Ω Probe Sense line response at near end C C 0.4 microstrip 0.3 stripline Volts Volts
44 General Solution for Voltages Z s1 Z s2 line 1 line 2 Z L1 Z L2 jω z jωz jωz jωz + + ve ve vd vd V1( z) = Ae e + Be e + Ade + Bde even odd jω z jωz jωz jωz + + ve ve vd vd V2( z) = Ae e + Be e Ade Bde even odd 44
45 Z s1 Z s2 General Solution for Currents line 1 line 2 Z L1 Z L2 jωz jωz jωz jωz 1 + v 1 + e ve vd vd I1( z) = Ae e Be e + Ade Bde Ze Zd even odd jωz jωz jωz jωz 1 + v 1 + e ve vd vd I2( z) = Ae e Be e Ade Bde Ze Zd even odd 45
46 Coupling of Modes (asymmetric load) Z s1 Z L1 line 1 line 2 Z s2 ZL2 even even even odd odd even odd odd even even odd odd even odd First reflection Second reflection 46
47 Coupling of Modes (symmetric load) Z s Z s line 1 line 2 Z L ZL even even even odd odd odd First reflection Second reflection 47
48 1 Drive Line at Near End 0.2 Sense Line at Near End Volts Volts Time (ns) Time (ns) 48
49 Three Line Microstrip V1 I1 I2 I = L11 + L12 + L13 z t t t 3 I1 V1 V2 V = C11 + C12 + C13 z t t t 3 V2 I1 I2 I = L21 + L22 + L23 z t t t 3 I2 V1 V2 V = C21 + C22 + C23 z t t t 3 V I I I = L + L + L z t t t I V V V = C + C + C z t t t
50 Three Line Alpha Mode Subtract (1c) from (1a) and (2c) from (2a), we get Vα I = ( L11 L13) z t Iα V = ( C11 C13) z t This defines the Alpha mode with: α α and Vα = V1 V Iα = I1 I3 3 The wave impedance of that mode is: Z α = L C L C and the velocity is u α = 1 ( L L )( C C )
51 Three Line Modal Decomposition In order to determine the next mode, assume that V = V + βv + V β I = I + β I + I β Vβ I I I = z t t t ( L βl L ) ( L βl L ) ( L βl L ) I β V V V = z t t t ( C βc C ) ( C βc C ) ( C βc C ) By reciprocity L 32 = L 23, L 21 = L 12, L 13 = L 31 By symmetry, L 12 = L 23 Also by approximation, L 22 L 11, L 11 +L 13 L 11 51
52 Three Line Modal Decomposition Vβ I I3 I = ( L + βl + L ) + + ( 2L + βl ) z t t t In order to balance the right-hand side into I β, we need to have ( + β ) = β ( + β + ) β ( + β ) 2L L I L L L I L L I L = β L or β =± 2 Therefore the other two modes are defined as The Beta mode with 52
53 The Beta mode with Three Line Beta Mode Vβ = V + 2V + V I = I + β 2I + I The characteristic impedance of the Beta mode is: Z β = L + 2L + L C + 2C + C and propagation velocity of the Beta mode is 1 u = β ( L11 2L12 L13 )( C11 2C12 C13 ) 53
54 Three Line Delta Mode The Delta mode is defined such that V = V δ 2V + V I = I δ 2I + I The characteristic impedance of the Delta mode is Z δ = L 2L + L C 2C + C The propagation velocity of the Delta mode is: 1 u = δ + + ( L11 2L12 L13 )( C11 2C12 C13 ) 54
55 Symmetric 3 Line Microstrip In summary: we have 3 modes for the 3-line system E = Alpha mode Beta mode* Delta mode* *neglecting coupling between nonadjacent lines 55
56 Coplanar Waveguide ε r = LnH ( / m) = C( pf/ m) = E = H =
57 Coplanar Waveguide ε r = 4.3 Z m ( Ω ) = Z c ( Ω ) = vp ( m/ ns) =
58 Coplanar Waveguide S' W S W S' h ε r Kk ( ) : Complete Elliptic Integral of the first kind S k = 30 π K'( k) S + 2W Zocp = (ohm) ε ( ) r + 1 Kk K'( k) = K( k') 2 k' = (1 k ) 2 1/2 v cp 2 = εr + 1 1/2 c 58
59 Coplanar Strips W S W h ε r Z ocs = 120 π K'( k) (ohm) ε 1 Kk ( ) r
60 Qualitative Comparison Characteristic Microstrip Coplanar Wguide Coplanar strips ε eff * ~6.5 ~5 ~5 Power handling High Medium Medium Radiation loss Low Medium Medium Unloaded Q High Medium Low or High Dispersion Small Medium Medium Mounting (shunt) Hard Easy Easy Mounting (series) Easy Easy Easy * Assuming ε r =10 and h=0.025 inch 60
61 3-Line Matching Network Extend matching network synthesis to multiconductor transmission line (MTL) systems, specifically coupled microstrip Characterize MTL systems by their normal mode parameters Mode configurations Propagation constants Characteristic impedance matrices 61
62 Longitudinal Immittance Matrix Functions (LIMFs) Given terminations, the immittance matrices are expressed as input longitudinal functions looking toward the load S Y m,c m,c in,out, Γ,, Z m,c in,out m,c in,out 62
63 Calibration Methods 1st order calibration: 6 distinct TRL calibrations were required to deembed the fan-in and fan-out sections 2nd order calibration: 1 multimode TRL calibration required to deembed all fan-ins and fan-outs Multiconductor transmission line matching network device under test 63
64 Bias Networks and Multiline/Multimode TRL Self-biasing for DC power done using air bridges Regulator circuit may be built on board with surface mount/chip components Calibration must include all modes and allow for the 6- port discontinuity S- parameter measurement Proposed calibration fixture for transistor amplifier device discontinuity with self-biasing network 64
65 3-line Transistor Amplifier The general amplifier structure with generic matching networks Note that a transistor seating hole may be present for convenience, but is not necessary Photograph of a three-line transistor amplifier autobiased w/o matching networks 65
66 Transistor Amplifier Matching Matching pf chip cap pf chip cap. Gains GHz m=5.14 / um= GHz m=6.54 / um= 0.32 S-parameter comparison between unmatched and matched three-line amplifier. Dotted line - unmatched; dashed line - matched. Design frequency: 3.1 GHz. 66
67 V Transmission Line w signal strip h dielectric α ground 2p 67
68 V Line Characteristic Impedance 250 CHARACTERISTIC IMPEDANCE Zo (ohms) º 37.5º 45º 52.5º 60º Microstrip w/h Calculated values of the characteristic impedance for a single-line v-strip structure as a function of width-to-height ratio w/h. The relative dielectric constant is εr =
69 V Line Effective Permittivity º 37.5º EFFECTIVE PERMITTIVITY º 52.5º Effective Relative Dielectric Constant º Microstrip w/h Calculated values of the effective relative dielectric constant for a single-line v-strip structure as a function of width-to-height ratio w/h. The relative dielectric constant is εr =
70 Three Line V Transmission Line y signal strip w s 2p h ground surface dielectric x Region 1 Region 2 Region 3 Region 4 Region 5 Region 6 70
71 V Line and Microstrip Microstrip C (pf/m) = L (nh/m) = V-line C (pf/m) = L (nh/m) = y w s signal strip 2p h ground surface dielectric x Region 1 Region 2 Region 3 Region 4 Region 5 Region 6 Comparison of the inductance and capacitance matrices between a three-line v-line and microstrip structures. The parameters are p/h = 0.8 mils, w/h = 0.6 and ε r =
72 V Line: Coupling Coefficients 350 Mutual Inductance 40 Mutual Capacitance L m (nh/m) V-line microstrip C m (pf/m) V-line microstrip s/h s/h Plot of mutual inductance (top) and mutual capacitance (bottom) versus spacing-to-height ratio for v-line and microstrip configurations. The parameters are w/h = 0.24, εr =
73 V Line vs Microstrip: Coupling Coefficients Coupling Coefficient V-line microstrip K v s/h Plot of the coupling coefficient versus spacing-to-height ratio for v-line and microstrip configurations. The parameters are w/h = 0.24, εr =
74 Advantages of V Line ground reference signal strip w signal strip dielectric substrate h dielectric α ground ground reference 2p Propagation Function Advantages of V Line * Higher bandwidth microstrip V-60 V-30 * Lower crosstalk * Better transition Linear Attenuation Frequency (GHz) 74
75 V Line vs Microstrip: Insertion Loss 0 Insertion Loss 20*log10* S Vline Microstrip Frequency (GHz) 75
ECE 497 JS Lecture -07 Planar Transmission Lines
ECE 497 JS Lecture -07 Planar Transmission Lines Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 Microstrip ε Z o w/h < 3.3 2 119.9 h h =
More informationECE 598 JS Lecture 06 Multiconductors
ECE 598 JS Lecture 06 Multiconductors Spring 2012 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 TELGRAPHER S EQUATION FOR N COUPLED TRANSMISSION LINES
More informationECE 546 Lecture 07 Multiconductors
ECE 546 Lecture 07 Multiconductors Spring 2018 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 546 Jose Schutt Aine 1 TELGRAPHER S EQUATION FOR N COUPLED
More informationECE 451 Advanced Microwave Measurements. TL Characterization
ECE 451 Advanced Microwave Measurements TL Characterization Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 451 Jose Schutt-Aine 1 Maxwell s Equations
More informationECE 497 JS Lecture -03 Transmission Lines
ECE 497 JS Lecture -03 Transmission Lines Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 MAXWELL S EQUATIONS B E = t Faraday s Law of Induction
More informationAccounting for High Frequency Transmission Line Loss Effects in HFSS. Andrew Byers Tektronix
Accounting for High Frequency Transmission Line Loss Effects in HFSS Andrew Byers Tektronix Transmission Line Refresher γ = α + j β = (R + jωl) * (G + jωc) Zo = Zr + j Zi = (R + jωl) / (G + jωc) Transmission
More informationTC 412 Microwave Communications. Lecture 6 Transmission lines problems and microstrip lines
TC 412 Microwave Communications Lecture 6 Transmission lines problems and microstrip lines RS 1 Review Input impedance for finite length line Quarter wavelength line Half wavelength line Smith chart A
More informationECEN689: Special Topics in High-Speed Links Circuits and Systems Spring 2012
ECEN689: Special Topics in High-Speed Links Circuits and Systems Spring 0 Lecture : Channel Components, Wires, & Transmission Lines Sam Palermo Analog & Mixed-Signal Center Texas A&M University Announcements
More informationECEN720: High-Speed Links Circuits and Systems Spring 2017
ECEN70: High-Speed Links Circuits and Systems Spring 07 Lecture : Channel Components, Wires, & Transmission Lines Sam Palermo Analog & Mixed-Signal Center Texas A&M University Announcements Lab Lab begins
More informationECE 546 Lecture 13 Scattering Parameters
ECE 546 Lecture 3 Scattering Parameters Spring 08 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 546 Jose Schutt Aine Transfer Function Representation
More informationNon-Sinusoidal Waves on (Mostly Lossless)Transmission Lines
Non-Sinusoidal Waves on (Mostly Lossless)Transmission Lines Don Estreich Salazar 21C Adjunct Professor Engineering Science October 212 https://www.iol.unh.edu/services/testing/sas/tools.php 1 Outline of
More informationTransmission Lines. Author: Michael Leddige
Transmission Lines Author: Michael Leddige 1 Contents PCB Transmission line structures Equivalent Circuits and Key Parameters Lossless Transmission Line Analysis Driving Reflections Systems Reactive Elements
More informationECE 497 JS Lecture - 18 Noise in Digital Circuits
ECE 497 JS Lecture - 18 Noise in Digital Circuits Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 Announcements Thursday April 15 th Speaker:
More informationAnnouncements. EE141- Fall 2002 Lecture 25. Interconnect Effects I/O, Power Distribution
- Fall 2002 Lecture 25 Interconnect Effects I/O, Power Distribution Announcements Homework 9 due next Tuesday Hardware lab this week Project phase 2 due in two weeks 1 Today s Lecture Impact of interconnects»
More informationTopic 5: Transmission Lines
Topic 5: Transmission Lines Profs. Javier Ramos & Eduardo Morgado Academic year.13-.14 Concepts in this Chapter Mathematical Propagation Model for a guided transmission line Primary Parameters Secondary
More informationECE 497 JS Lecture - 13 Projects
ECE 497 JS Lecture - 13 Projects Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 ECE 497 JS - Projects All projects should be accompanied
More informationECE 497 JS Lecture - 18 Impact of Scaling
ECE 497 JS Lecture - 18 Impact of Scaling Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 Announcements Thursday April 8 th Speaker: Prof.
More informationDifferential Impedance finally made simple
Slide - Differential Impedance finally made simple Eric Bogatin President Bogatin Enterprises 93-393-305 eric@bogent.com Slide -2 Overview What s impedance Differential Impedance: a simple perspective
More informationLecture 23. Dealing with Interconnect. Impact of Interconnect Parasitics
Lecture 23 Dealing with Interconnect Impact of Interconnect Parasitics Reduce Reliability Affect Performance Classes of Parasitics Capacitive Resistive Inductive 1 INTERCONNECT Dealing with Capacitance
More informationANTENNAS and MICROWAVES ENGINEERING (650427)
Philadelphia University Faculty of Engineering Communication and Electronics Engineering ANTENNAS and MICROWAVES ENGINEERING (65427) Part 2 Dr. Omar R Daoud 1 General Considerations It is a two-port network
More informationINTRODUCTION TO TRANSMISSION LINES DR. FARID FARAHMAND FALL 2012
INTRODUCTION TO TRANSMISSION LINES DR. FARID FARAHMAND FALL 2012 http://www.empowermentresources.com/stop_cointelpro/electromagnetic_warfare.htm RF Design In RF circuits RF energy has to be transported
More informationTransmission Line Basics II - Class 6
Transmission Line Basics II - Class 6 Prerequisite Reading assignment: CH2 Acknowledgements: Intel Bus Boot Camp: Michael Leddige Agenda 2 The Transmission Line Concept Transmission line equivalent circuits
More informationECE414/514 Electronics Packaging Spring 2012 Lecture 6 Electrical D: Transmission lines (Crosstalk) Lecture topics
ECE414/514 Electronics Packaging Spring 2012 Lecture 6 Electrical D: Transmission lines (Crosstalk) James E. Morris Dept of Electrical & Computer Engineering Portland State University 1 Lecture topics
More informationTransmission Line Basics
Transmission Line Basics Prof. Tzong-Lin Wu NTUEE 1 Outlines Transmission Lines in Planar structure. Key Parameters for Transmission Lines. Transmission Line Equations. Analysis Approach for Z and T d
More informationLecture 12. Microwave Networks and Scattering Parameters
Lecture Microwave Networs and cattering Parameters Optional Reading: teer ection 6.3 to 6.6 Pozar ection 4.3 ElecEng4FJ4 LECTURE : MICROWAE NETWORK AND -PARAMETER Microwave Networs: oltages and Currents
More informationLecture 21: Packaging, Power, & Clock
Lecture 21: Packaging, Power, & Clock Outline Packaging Power Distribution Clock Distribution 2 Packages Package functions Electrical connection of signals and power from chip to board Little delay or
More informationA Novel Tunable Dual-Band Bandstop Filter (DBBSF) Using BST Capacitors and Tuning Diode
Progress In Electromagnetics Research C, Vol. 67, 59 69, 2016 A Novel Tunable Dual-Band Bandstop Filter (DBBSF) Using BST Capacitors and Tuning Diode Hassan Aldeeb and Thottam S. Kalkur * Abstract A novel
More informationKimmo Silvonen, Transmission lines, ver
Kimmo Silvonen, Transmission lines, ver. 13.10.2008 1 1 Basic Theory The increasing operating and clock frequencies require transmission line theory to be considered more and more often! 1.1 Some practical
More informationEELE 3332 Electromagnetic II Chapter 11. Transmission Lines. Islamic University of Gaza Electrical Engineering Department Dr.
EEE 333 Electromagnetic II Chapter 11 Transmission ines Islamic University of Gaza Electrical Engineering Department Dr. Talal Skaik 1 1 11.1 Introduction Wave propagation in unbounded media is used in
More informationSCSI Connector and Cable Modeling from TDR Measurements
SCSI Connector and Cable Modeling from TDR Measurements Dima Smolyansky TDA Systems, Inc. http://www.tdasystems.com Presented at SCSI Signal Modeling Study Group Rochester, MN, December 1, 1999 Outline
More informationKH600. 1GHz, Differential Input/Output Amplifier. Features. Description. Applications. Typical Application
KH 1GHz, Differential Input/Output Amplifier www.cadeka.com Features DC - 1GHz bandwidth Fixed 1dB (V/V) gain 1Ω (differential) inputs and outputs -7/-dBc nd/3rd HD at MHz ma output current 9V pp into
More informationBoundary and Excitation Training February 2003
Boundary and Excitation Training February 2003 1 Why are They Critical? For most practical problems, the solution to Maxwell s equations requires a rigorous matrix approach such as the Finite Element Method
More informationand Ee = E ; 0 they are separated by a dielectric material having u = io-s S/m, µ, = µ, 0
602 CHAPTER 11 TRANSMISSION LINES 11.10 Two identical pulses each of magnitude 12 V and width 2 µs are incident at t = 0 on a lossless transmission line of length 400 m terminated with a load. If the two
More informationExperiment 06 - Extraction of Transmission Line Parameters
ECE 451 Automated Microwave Measurements Laboratory Experiment 06 - Extraction of Transmission Line Parameters 1 Introduction With the increase in both speed and complexity of mordern circuits, modeling
More informationTECHNICAL REPORT: CVEL Maximum Radiated Emission Calculator: I/O Coupling Algorithm. Chentian Zhu and Dr. Todd Hubing. Clemson University
TECHNICAL REPORT: CVEL-13-045 Maximum Radiated Emission Calculator: I/O Coupling Algorithm Chentian Zhu and Dr. Todd Hubing Clemson University August 4, 013 Table of Contents Abstract... 3 1. Introduction...
More informationMicrowave Network Analysis
Prof. Dr. Mohammad Tariqul Islam titareq@gmail.my tariqul@ukm.edu.my Microwave Network Analysis 1 Text Book D.M. Pozar, Microwave engineering, 3 rd edition, 2005 by John-Wiley & Sons. Fawwaz T. ILABY,
More informationSRAM System Design Guidelines
Introduction This application note examines some of the important system design considerations an engineer should keep in mind when designing with Cypress SRAMs. It is important to note that while they
More informationA UNEQUAL COUPLED-LINE WILKINSON POWER DI- VIDER FOR ARBITRARY TERMINATED IMPEDANCES
Progress In Electromagnetics Research, Vol. 117, 181 194, 211 A UNEQUAL COUPLED-LINE WILKINSON POWER DI- VIDER FOR ARBITRARY TERMINATED IMPEDANCES Y. Wu * and Y. Liu School of Electronic Engineering, Beijing
More informationPO3B20A. High Bandwidth Potato Chip
FEATURES: Patented technology High signal -3db passing bandwidth at 1.6GHz Near-Zero propagation delay CC = 1.65 to 3.6 Ultra-Low Quiescent Power: 0.1 A typical Ideally suited for low power applications
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 24: April 19, 2018 Crosstalk and Wiring, Transmission Lines Lecture Outline! Crosstalk! Repeaters in Wiring! Transmission Lines " Where transmission
More information! Crosstalk. ! Repeaters in Wiring. ! Transmission Lines. " Where transmission lines arise? " Lossless Transmission Line.
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 24: April 19, 2018 Crosstalk and Wiring, Transmission Lines Lecture Outline! Crosstalk! Repeaters in Wiring! Transmission Lines " Where transmission
More informationSurface Mount Chip Capacitors
Features High '' Factor at high frequencies High RF power capabilities Low High self resonant frequencies Excellent stability across temperature range Small size High Frequency Measurement and Performance
More informationElectrical Package Design TKK 2009 Lecture 2
Electrical Package Design TKK 2009 Lecture 2 James E. Morris Dept of Electrical & Computer Engineering Portland State University i Electrical Package Design Lecture topics A: Introduction CMOS; R, L, &
More informationEquivalent Circuit Model Extraction for Interconnects in 3D ICs
Equivalent Circuit Model Extraction for Interconnects in 3D ICs A. Ege Engin Assistant Professor, Department of ECE, San Diego State University Email: aengin@mail.sdsu.edu ASP-DAC, Jan. 23, 213 Outline
More informationGHz 6-Bit Digital Phase Shifter
180 90 45 22.5 11.25 5.625 ASL 2004P7 3.1 3.5 GHz 6-Bit Digital Phase Shifter Features Functional Diagram Frequency Range: 3.1 to 3.5 GHz RMS Error < 2 deg. 5 db Insertion Loss TTL Control Inputs 0.5-um
More informationSpectral Domain Analysis of Open Planar Transmission Lines
Mikrotalasna revija Novembar 4. Spectral Domain Analysis of Open Planar Transmission Lines Ján Zehentner, Jan Mrkvica, Jan Macháč Abstract The paper presents a new code calculating the basic characteristics
More informationTASK A. TRANSMISSION LINE AND DISCONTINUITIES
TASK A. TRANSMISSION LINE AND DISCONTINUITIES Task A. Transmission Line and Discontinuities... 1 A.I. TEM Transmission Line... A.I.1. Circuit Representation of a Uniform Transmission Line... A.I.. Time
More informationTopics to be Covered. capacitance inductance transmission lines
Topics to be Covered Circuit Elements Switching Characteristics Power Dissipation Conductor Sizes Charge Sharing Design Margins Yield resistance capacitance inductance transmission lines Resistance of
More informationName. Section. Short Answer Questions. 1. (20 Pts) 2. (10 Pts) 3. (5 Pts) 4. (10 Pts) 5. (10 Pts) Regular Questions. 6. (25 Pts) 7.
Name Section Short Answer Questions 1. (20 Pts) 2. (10 Pts) 3. (5 Pts). (10 Pts) 5. (10 Pts) Regular Questions 6. (25 Pts) 7. (20 Pts) Notes: 1. Please read over all questions before you begin your work.
More informationLecture 2 - Transmission Line Theory
Lecture 2 - Transmission Line Theory Microwave Active Circuit Analysis and Design Clive Poole and Izzat Darwazeh Academic Press Inc. Poole-Darwazeh 2015 Lecture 2 - Transmission Line Theory Slide1 of 54
More informationECE 6340 Fall Homework 2. Please do the following problems (you may do the others for practice if you wish): Probs. 1, 2, 3, 4, 5, 6, 7, 10, 12
ECE 634 Fall 16 Homework Please do the following problems (you may do the others for practice if you wish: Probs. 1,, 3, 4, 5, 6, 7, 1, 1 1 Consider two parallel infinite wires in free space each carrying
More informationTransient Response of Transmission Lines and TDR/TDT
Transient Response of Transmission Lines and TDR/TDT Tzong-Lin Wu, Ph.D. EMC Lab. Department of Electrical Engineering National Sun Yat-sen University Outlines Why do we learn the transient response of
More informationFREQUENTLY ASKED QUESTIONS RF & MICROWAVE PRODUCTS
FREQUENTLY ASKED QUESTIONS RF & MICROWAVE PRODUCTS WHAT IS RF? RF stands for Radio Frequency, which has a frequency range of 30KHz - 300GHz. RF capacitors help tune antenna to the correct frequency. The
More informationSTUB BASED EQUIVALENT CIRCUIT MODELS FOR EVEN/ODD MODE DUAL CRLH UNIT CELLS. Faculty of Engineering, Ain Shams University, Cairo, Egypt
Progress In Electromagnetics Research M, Vol. 3, 95 9, 3 STUB BASED EQUIVALENT CIRCUIT MODELS FOR EVEN/ODD MODE DUAL CRLH UNIT CELLS Amr M. E. Safwat, *, Amr A. Ibrahim, Mohamed A. Othman, Marwah Shafee,
More informationX2Y Technology. X2Y Comparative Decoupling Performance in 4 Layer PCBs
X2Y Technology X2Y Comparative Decoupling Performance in 4 Layer PCBs Four / Six Layer PCB Decoupling Challenges Cost and area are always major factors. Decoupling performance is determined by the transfer
More informationECE 546 Lecture 11 MOS Amplifiers
ECE 546 Lecture MOS Amplifiers Spring 208 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 546 Jose Schutt Aine Amplifiers Definitions Used to increase
More informationAnsoft HFSS 3D Boundary Manager Sources
Lumped Gap Defining s Voltage and Current When you select Source, you may choose from the following source types: Incident wave Voltage drop Current Magnetic bias These sources are available only for driven
More informationPO3B14A. Description. Truth Table. High Bandwidth Potato Chip V CC N.C. EN EN S 1 A 3 B 3 B 2 A 2 A 1 B 1 Y A Y B GND
www.potatosemi.com FEATURES: Patented technology High signal -3db passing bandwidth at 1.2GHz Near-Zero propagation delay VCC = 1.65V to 3.6V Ultra-Low Quiescent Power: 0.1 A typical Ideally suited for
More informationMutual Inductance. The field lines flow from a + charge to a - change
Capacitors Mutual Inductance Since electrical charges do exist, electric field lines have a starting point and an ending point. For example, if you have a + and a - change, the field lines would look something
More informationOmar M. Ramahi University of Waterloo Waterloo, Ontario, Canada
Omar M. Ramahi University of Waterloo Waterloo, Ontario, Canada Traditional Material!! Electromagnetic Wave ε, μ r r The only properties an electromagnetic wave sees: 1. Electric permittivity, ε 2. Magnetic
More informationTechnique for the electric and magnetic parameter measurement of powdered materials
Computational Methods and Experimental Measurements XIV 41 Technique for the electric and magnetic parameter measurement of powdered materials R. Kubacki,. Nowosielski & R. Przesmycki Faculty of Electronics,
More informationDESIGN AND OPTIMIZATION OF EQUAL SPLIT BROADBAND MICROSTRIP WILKINSON POWER DI- VIDER USING ENHANCED PARTICLE SWARM OPTI- MIZATION ALGORITHM
Progress In Electromagnetics Research, Vol. 118, 321 334, 2011 DESIGN AND OPTIMIZATION OF EQUAL SPLIT BROADBAND MICROSTRIP WILKINSON POWER DI- VIDER USING ENHANCED PARTICLE SWARM OPTI- MIZATION ALGORITHM
More informationEE141-Spring 2007 Digital Integrated Circuits. Administrative Stuff. Last Lecture. Wires. Interconnect Impact on Chip. The Wire
EE141-Spring 2007 Digital Integrated Circuits ecture 10 Administrative Stuff No ab this week Midterm 1 on Tu! HW5 to be posted by next Friday Due Fr. March 2 5pm Introduction to wires 1 2 ast ecture ast
More informationDISCRETE SEMICONDUCTORS DATA SHEET. BLF145 HF power MOS transistor
DISCRETE SEMICONDUCTORS DATA SHEET September 1992 FEATURES High power gain Low noise figure Good thermal stability Withstands full load mismatch. DESCRIPTION Silicon N-channel enhancement mode vertical
More informationX2Y Capacitors for FPGA Decoupling
Summary Introduction FPGA Decoupling X2Y capacitors provide advantages to FPGA decoupling applications unmatched by any other devices in the market. High performance, low-voltage FPGAs demand low impedance
More informationGeneral Purpose Transistors
General Purpose Transistors NPN and PNP Silicon These transistors are designed for general purpose amplifier applications. They are housed in the SOT 33/SC which is designed for low power surface mount
More informationBroadband transmission line models for analysis of serial data channel interconnects
PCB Design Conference East, Durham NC, October 23, 2007 Broadband transmission line models for analysis of serial data channel interconnects Y. O. Shlepnev, Simberian, Inc. shlepnev@simberian.com Simberian:
More informationThe Wire. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Wire July 30, 2002 1 The Wire transmitters receivers schematics physical 2 Interconnect Impact on
More informationModeling of Overhead Power Lines for Broadband PLC Applications.
Modeling of Overhead Power Lines for Broadband PLC Applications. T. A. Papadopoulos, G. K. Papagiannis, D. P. Labridis Power Systems Laboratory Dept. of Electrical & Computer Engineering Aristotle University
More informationPHY3128 / PHYM203 (Electronics / Instrumentation) Transmission Lines
Transmission Lines Introduction A transmission line guides energy from one place to another. Optical fibres, waveguides, telephone lines and power cables are all electromagnetic transmission lines. are
More informationElectromagnetic Modeling and Signal Integrity Simulation of Power/Ground Networks in High Speed Digital Packages and Printed Circuit Boards
Electromagnetic Modeling and Signal Integrity Simulation of Power/Ground Networks in High Speed Digital Packages and Printed Circuit Boards Frank Y. Yuan Viewlogic Systems Group, Inc. 385 Del Norte Road
More informationPower Distribution Network Design for High-Speed Printed Circuit Boards
Power Distribution Network Design for High-Speed Printed Circuit Boards Jun Fan NCR Corporation 1 Outline Overview of PDN design in multi-layer PCBs Interconnect Inductance Individual Capacitor Values
More informationARTIFICIAL TRANSMISSION LINE WITH LEFT/RIGHT-HANDED BEHAVIOR BASED ON WIRE BONDED INTERDIGITAL CAPACITORS
Progress In Electromagnetics Research B, Vol. 11, 245 264, 29 ARTIFICIAL TRANSMISSION LINE WITH LEFT/RIGHT-HANDED BEHAVIOR BASED ON WIRE BONDED INTERDIGITAL CAPACITORS J. J. Sánchez-Martínez, E. Márquez-Segura,
More informationHigh Speed Communication Circuits and Systems Lecture 4 Generalized Reflection Coefficient, Smith Chart, Integrated Passive Components
High Speed Communication Circuits and Systems Lecture 4 Generalized Reflection Coefficient, Smith Chart, Integrated Passive Components Michael H. Perrott February 11, 2004 Copyright 2004 by Michael H.
More informationNetworks and Systems Prof. V. G. K. Murti Department of Electrical Engineering Indian Institution of Technology, Madras
Networks and Systems Prof. V. G. K. Murti Department of Electrical Engineering Indian Institution of Technology, Madras Lecture - 32 Network Function (3) 2-port networks: Symmetry Equivalent networks Examples
More informationMLC Discoidal Capacitors for EMI-RFI Filters Employing Non- Overlapping Electrodes Yield Substantial Performance Improvements.
CARTS USA 2005 March 21-24, 2005 Palm Springs, CA MLC Discoidal Capacitors for EMI-RFI Filters Employing Non- Overlapping Electrodes Yield Substantial Performance Improvements. Hung V. Trinh, Daniel F.
More informationConventional Paper I-2010
Conventional Paper I-010 1. (a) Sketch the covalent bonding of Si atoms in a intrinsic Si crystal Illustrate with sketches the formation of bonding in presence of donor and acceptor atoms. Sketch the energy
More informationLipparini* anazysis which compare favourabzy with experimentaz results. The same modez. described. It is shown that the discrepancies between computed
ACCURATE ANALYSIS AND DESIGN OF MICROSTRIP INTERDIGITATED COUPLERS Vittorio Rizzoli*- Alessandro Lipparini* Abstract. The ezectricaz behaviour of interdigitated directionaz coupzers in an inhomogeneous
More informationEMC Considerations for DC Power Design
EMC Considerations for DC Power Design Tzong-Lin Wu, Ph.D. Department of Electrical Engineering National Sun Yat-sen University Power Bus Noise below 5MHz 1 Power Bus Noise below 5MHz (Solution) Add Bulk
More informationContents. Transmission Lines The Smith Chart Vector Network Analyser (VNA) ü structure ü calibration ü operation. Measurements
Contents Transmission Lines The Smith Chart Vector Network Analyser (VNA) ü structure ü calibration ü operation Measurements Göran Jönsson, EIT 2015-04-27 Vector Network Analysis 2 Waves on Lines If the
More informationMicrowave Engineering 3e Author - D. Pozar
Microwave Engineering 3e Author - D. Pozar Sections 3.6 3.8 Presented by Alex Higgins 1 Outline Section 3.6 Surface Waves on a Grounded Dielectric Slab Section 3.7 Stripline Section 3.8 Microstrip An Investigation
More informationMultilayer Ceramic Capacitors Leaded Capacitors. Packaging. Internal coding. Capacitance tolerance
Leaded Capacitors Leaded Ordering code system B37979N 1 100 K 0 54 Packaging 51 ^ cardboard tape, reel packing (360-mm reel) 54 ^ Ammo packing (standard) 00 ^ bulk Internal coding Capacitance tolerance
More informationContents. Transmission Lines The Smith Chart Vector Network Analyser (VNA) ü structure ü calibration ü operation. Measurements
Contents Transmission Lines The Smith Chart Vector Network Analyser (VNA) ü structure ü calibration ü operation Measurements Göran Jönsson, EIT 2017-05-12 Vector Network Analysis 2 Waves on Lines If the
More informationModeling of Signal and Power Integrity in System on Package Applications
Modeling of Signal and Power Integrity in System on Package Applications Madhavan Swaminathan and A. Ege Engin Packaging Research Center, School of Electrical and Computer Engineering, Georgia Institute
More informationConventional Paper-I Part A. 1. (a) Define intrinsic wave impedance for a medium and derive the equation for intrinsic vy
EE-Conventional Paper-I IES-01 www.gateforum.com Conventional Paper-I-01 Part A 1. (a) Define intrinsic wave impedance for a medium and derive the equation for intrinsic vy impedance for a lossy dielectric
More informationPreamplifier in 0.5µm CMOS
A 2.125 Gbaud 1.6kΩ Transimpedance Preamplifier in 0.5µm CMOS Sunderarajan S. Mohan Thomas H. Lee Center for Integrated Systems Stanford University OUTLINE Motivation Shunt-peaked Amplifier Inductor Modeling
More information2GHz Microstrip Low Pass Filter Design with Open-Circuited Stub
IOSR Journal of Electronics and Communication Engineering (IOSR-JECE) e-issn: 2278-2834,p- ISSN: 2278-8735.Volume 13, Issue 2, Ver. II (Mar. - Apr. 2018), PP 01-09 www.iosrjournals.org 2GHz Microstrip
More informationD-Pack 3D Interposer Decoupling System
D-Pack 3D Interposer Decoupling System Michael Randall, John Prymak, Mark Laps, Garry Renner, Peter Blais, Paul Staubli, Aziz Tajuddin KEMET Electronics Corporation, P.O. Box 5928, Greenville, SC 29606
More informationModeling frequency-dependent conductor losses and dispersion in serial data channel interconnects
Modeling frequency-dependent conductor losses and dispersion in serial data channel interconnects Yuriy Shlepnev Simberian Inc., www.simberian.com Abstract: Models of transmission lines and transitions
More informationApplication of EM- Simulators for Extraction of Line Parameters
Chapter - 2 Application of EM- Simulators for Extraction of Line Parameters 2. 1 Introduction The EM-simulators-2D, 2.5D and 3D, are powerful tools for the analysis of the planar transmission lines structure.
More informationR. Ludwig and G. Bogdanov RF Circuit Design: Theory and Applications 2 nd edition. Figures for Chapter 6
R. Ludwig and G. Bogdanov RF Circuit Design: Theory and Applications 2 nd edition Figures for Chapter 6 Free electron Conduction band Hole W g W C Forbidden Band or Bandgap W V Electron energy Hole Valence
More informationCharacteristics of Passive IC Devices
008/Oct 8 esistors Characteristics of Passive IC Devices Poly esistance Diffusion esistance Well esistance Parasitic esistance Capacitors Poly Capacitors MOS Capacitors MIM Capacitors Parasitic Capacitors
More informationDetermining Characteristic Impedance and Velocity of Propagation by Measuring the Distributed Capacitance and Inductance of a Line
Exercise 2-1 Determining Characteristic Impedance and Velocity EXERCISE OBJECTIVES Upon completion of this exercise, you will know how to measure the distributed capacitance and distributed inductance
More informationNONLINEAR TRAVELING-WAVE FIELD-EFFECT TRAN- SISTORS FOR MANAGING DISPERSION-FREE ENVE- LOPE PULSES
Progress In Electromagnetics Research Letters, Vol. 23, 29 38, 2011 NONLINEAR TRAVELING-WAVE FIELD-EFFECT TRAN- SISTORS FOR MANAGING DISPERSION-FREE ENVE- LOPE PULSES K. Narahara Graduate School of Science
More informationProbe Tip Characterization Using Self-Calibration. Lab. RF Modeling
Probe Tip Characterization Using Self-Calibration 1 Overview - equipment - how to determine probe S-parameter and parasitics (probe specific calibration coefficients) for different probes with only one
More informationAccurate Estimating Simultaneous Switching Noises by Using Application Specific Device Modeling
Accurate Estimating Simultaneous Switching Noises by Using Application Specific Device Modeling Li Ding and Pinaki Mazumder Department of Electrical Engineering and Computer Science The University of Michigan,
More informationCHP4012a98F RoHS COMPLIANT
RoHS COMPLIANT GaAs Monolithic Microwave IC Description The CHP4012a98F is a 6-bit phase shifter monolithic circuit, which integrates a CMOS and TTL compatible interface. It is designed for a wide range
More informationRelative Permittivity Variation Surrounding PCB Via Hole Structures
Relative Permittivity Variation Surrounding PCB Via Hole Structures SPI2008 Avignon France May 12-15, 2008 Lambert Simonovich lambert@nortel.com 1 SPI2008 Relative Permittivity Variation Surrounding PCB
More informationAdvanced Current Mirrors and Opamps
Advanced Current Mirrors and Opamps David Johns and Ken Martin (johns@eecg.toronto.edu) (martin@eecg.toronto.edu) slide 1 of 26 Wide-Swing Current Mirrors I bias I V I in out out = I in V W L bias ------------
More informationMaterial parameters identification with GMS-parameters in Simbeor 2011
Simbeor Application Note #2011_04, April 2011 Material parameters identification with GMS-parameters in Simbeor 2011 www.simberian.com Simbeor : Accurate, Fast, Easy, Affordable Electromagnetic Signal
More information