Broadband transmission line models for analysis of serial data channel interconnects

Transcription

1 PCB Design Conference East, Durham NC, October 23, 2007 Broadband transmission line models for analysis of serial data channel interconnects Y. O. Shlepnev, Simberian, Inc. Simberian: Advanced, Easy-to-Use and Affordable Electromagnetic Solutions

2 Agenda Introduction Broadband transmission line theory Modal superposition S-parameters of t-line segment Signal degradation factors Conductor effects Dielectric effects RLGC parameters extraction technologies 2D static field solvers 2D magneto-static field solvers 3D full-wave solvers Examples of broadband parameters extraction Conclusion 12/23/ Simberian Inc. 2

3 Introduction Faster data rates drive the need for accurate electromagnetic models for multi-gigabit data channels Without the electromagnetic models, a channel design may require Test boards, experimental verification, Multiple iterations to improve performance No models or simplified static models may result in the design failure, project delays, increased cost 12/23/ Simberian Inc. 3

4 Trends in the Signal Integrity Analysis 80-s Static field solvers for parameters extraction, simple frequencyindependent loss models Simple time-domain line segment simulation algorithms Behavioral models, lumped RLGC models, finite differences, Since 90-s Static field solvers for parameters extraction, frequencydependent analytical loss models W-element for line segment analysis Trends in this decade Transition to full-wave electromagnetic field solvers Method of characteristic type algorithms or W-elements with tabulated RLGC per unit length parameters for analysis of line segment 12/23/ Simberian Inc. 4

5 De-compositional analysis of a channel W-element models for t-line segments defined with RLGC per unit length parameters Tx Rx Tx port Driver Package T-Line Segment Diff Vias Model Decomposition T-Line Segment Multiport S-parameter models for via-hole transitions and discontinuities Diff. Vias Model T-Line Segment Split crossing discontinuity T-Line Segment Diff. Vias Model Transmission line and discontinuity models are required for successful analysis of multi-gigabit channels! Receiver Package 12/23/ Simberian Inc. 5 Rx port

6 Agenda Introduction Broadband transmission line theory Modal superposition S-parameters of t-line segment Signal degradation factors Conductor effects Dielectric effects RLGC parameters extraction technologies 2D static field solvers 2D magneto-static field solvers 3D full-wave solvers Examples of broadband parameters extraction Conclusion 12/23/ Simberian Inc. 6

7 Transmission line description with generalized Telegrapher s equations ( ) V x x I x ( x) ( ω) ( ) = Z I x = Y ( ω) V ( x) Plus boundary conditions at the ends of the segment ( ω) = ( ω) + ω ( ω) Z R i L ( ω) = ( ω) + ω ( ω) Y G i C 1 2 N I complex vector of N currents V complex vector of N voltages Z [Ohm/m] and Y [S/m] are complex NxN matrices of impedances and admittances per unit length R [Ohm/m], L [Hn/m] real NxN frequency-dependent matrices of resistance and inductance per unit length G [S/m], C [F/m] real NxN frequency-dependent matrices of conductance and capacitance per unit length 12/23/ Simberian Inc. 7

8 Transformation to modal space ( ω) = ( ω) + ω ( ω) ( ω) = ( ω) + ω ( ω) Z R i L Y G i C 1 ( ω) I ( ω) 1 ( ω) ( ω) y = M Y M z = M Z M V V I Per unit length matrix parameters (NxN complex matrices) Matrices of impedances and admittances per unit length are transformed into diagonal form with current MI and voltage MV transformation matrices (both are frequency-dependent) V = MV v I = M i I Definition of terminal voltage and current vectors through modal voltage and current vectors and transformation matrices W = M M = M M P = M M Z 0n ( ω) t t I V V I t V = * I z y nn, nn, ( ω) ( ω) ( ω) z ( ω) y ( ω) Γ = n n, n n, n Diagonal modal reciprocity matrix Complex power transferred by modes along the line Modal complex characteristic impedance and propagation constant are defined by elements of the diagonal impedance and admittance matrices 12/23/ Simberian Inc. 8

9 Waves in multiconductor t-lines ( ω) = ( ω) ( ω) Z z y 0 n n, n n, n ( ω) z ( ω) y ( ω) Γ = n n, n n, n Modal complex characteristic impedance and propagation constant Current and voltage of mode number n (n=1,,n) i n + n v - x Voltage waves for mode number n (n=1,,n) v n v + n + ( ) = exp( Γ ) + exp( Γ ) v x v x v x n n n n n 1 i x v x v x + ( ) = exp( Γ ) exp( Γ ) n n n n n Z0n x V = MV v I = M i I Voltage and current in multiconductor line can be expressed as a superposition of modal currents and voltages 12/23/ Simberian Inc. 9

10 One and two-conductor lines One-conductor case M V = M = 1 I 0 ( ω) = ( ω) ( ω) Z Z Y ( ω) Z( ω) Y( ω) Γ = Symmetric two-conductor case even and odd mode normalization M = M = M = V I eo ( ω ) ( ω ) y = M Y M eo eo eo z = M Z M eo eo eo ( ω ) = 1,1 1,1 Z z y odd eo eo ( ω ) = 2,2 2,2 Z z y even eo eo ( ω) z 2,2 y 2,2 Γ = odd eo eo ( ω) z 2,2 y 2,2 Γ = even eo eo Common and differential mode normalization y = M Y M MV = MVmm =, MI = MImm = z = M Z M ( ω ) = 1,1 1,1 ( ω ) = 2,2 2,2 Z z y differential mm mm Z z y common mm mm Z Z differential common = 2 Z odd = 0.5 Z even ( ω ) ( ω ) 1 mm Imm Vmm mm Vmm Imm Γ =Γ differential Γ =Γ common odd even 12/23/ Simberian Inc. 10

11 Example of causal R, L, G, C for a simple strip-line case (N=1) 8-mil strip, 20-mil plane to plane distance, DK=4.2, LT=0.02 at 1 GHz, no dielectric conductivity. Strip is made of copper, planes are ideal, no roughness, no high-frequency dispersion. Resistance [Ohm/m] Inductance [Ohm/m] R DC R DC ~ f L DC ~1 f L ext Frequency, Hz Frequency, Hz Conductance [S/m] Capacitance [F/m] R ~ f C DC 10 ~ln 10 + f + f C Frequency, Hz Frequency, Hz 12/23/ Simberian Inc. 11

12 Broadband characteristic impedance and propagation constant for a simple strip-line 0 ( ω) = ( ω) ( ω) Z Z Y ( ) ( ) ( ) Γ ω = Z ω Y ω = α + iβ Complex characteristic impedance [Ohm] Attenuation Constant [Np/m] Phase Constant [rad/m] 8-mil strip, 20-mil plane to plane distance. DK=4.2, LT=0.02 at 1 GHz, no dielectric conductivity. Strip is made of copper, planes are ideal, no roughness, no high-frequency dispersion. Characteristic impedance, [Ohm] Re( Z 0 ) ( ) Re Z 0 ( ) Re Z 0 Im( Z 0 ) Propagation Constant [ rad m] β, / [ Np m] α, / Frequency, Hz Frequency, Hz 12/23/ Simberian Inc. 12

13 Definitions of modal parameters ( ) ( ) ( ) Γ ω = z ω y ω = α + iβ n n, n n, n n n α = Re( Γ) α db 20 α = α ln 10 ( ) β = Im( Γ) attenuation constant [Np/m] attenuation constant [db/m] phase constant [rad/m] υ τ p p ω = β β = ω phase velocity [m/sec] phase delay [sec/m] Λ= ε eff 2π β c Γ = Re ω wavelength [m] 2 effective dielectric constant ω υg = β τ g β = ω group velocity [m/sec] group delay [sec/m] p c = = υ p c β ω slow-down factor, c is the speed of electromagnetic waves in vacuum 12/23/ Simberian Inc. 13

14 Admittance parameters of multiconductor line segment 1 2 N N+1 2N I 1 V N Y N+1 N+2 2N I 2 V 2 Y ( ω, l) ( ) ( ) cth Γnl csh Γnl diag diag Z0n Z0n = csh( Γnl) cth( Γnl) diag diag Z0n Z0n l 1 M 0 M 0 Y( ω, l) = (, ) 1 0 I Y ω l M 0 V I MV 2N x 2N three-diagonal admittance matrix of the line segment in the modal space 2N x 2N admittance matrix of the line segment in the terminal space I V = Y ( ω, l) 1 1 I 2 V 2 Admittance matrix leads to a system of linear equations with voltages and currents at the external line terminals Alternative equivalent formulation with admittance and propagation operators is used in W-element to facilitate integration in time domain 12/23/ Simberian Inc. 14

15 Scattering parameters of multiconductor line segment Z 0 Z 0 a 1 b 1 a 2 b 2 V 1 V 2 I 1 I 2 [ Y ] [ S] I N + 1 I N + 2 a N + 1 V N + b 1 N + 1 a N + 2 V N + b 2 N + 2 Z 0 Z 0 I V = Y ( ω, l) 1 1 I 2 V 2 1 a = V + Z I 2 Z ( ) 1,2 1,2 0 1,2 0 1 b = V Z I 2 Z ( ) 1,2 1,2 0 1,2 0 Admittance parameters Vectors of incident waves Vectors of reflected waves Z 0 a N b N V N I N I 2N V 2N a 2N b 2N Z 0 b a 1 S( ω, l) a 1 b = 2 2 Scattering parameters N ( ω, ) Y = Z Y l Z 1/2 1/2 0 0 Normalization matrix is diagonal matrix usually with 50-Ohm values at the diagonal ( ω ) ( ) ( ) 1 S l = U Y U + Y S-matrix of the line segment computed as the, N N Cayley transform of the normalized Y-matrix 12/23/ Simberian Inc. 15

16 Simple strip-line segment example 8-mil strip, 20-mil plane to plane distance, DK=4.2, LT=0.02 at 1 GHz, no dielectric conductivity. Strip is made of copper, planes are ideal, no roughness, no high-frequency dispersion. Z 0 a 1 b 1 V 1 I 1 [ S] I 2 V 2 a 2 b 2 Z 0 20log S1,1, [ db] Infinite line 20 log S, 2,1 [ db] 5-inch line segment 5-inch line Normalized to 50-Ohm Normalized to characteristic impedance (ideal termination) Frequency, Hz Frequency, Hz 12/23/ Simberian Inc. 16

17 Agenda Introduction Broadband transmission line theory Modal superposition S-parameters of t-line segment Signal degradation factors Conductor effects Dielectric effects RLGC parameters extraction technologies 2D static field solvers 2D magneto-static field solvers 3D full-wave solvers Examples of broadband parameters extraction Conclusion 12/23/ Simberian Inc. 17

18 Signal degradation factors Transmission lines: Attenuation and dispersion due to physical conductor and dielectric properties High-frequency dispersion Attenuation Dispersion Via-hole transitions and discontinuities: Reflection, radiation and impedance mismatch Reflection 12/23/ Simberian Inc. 18

19 Conductor attenuation and dispersion effects Roughness ~40 MHz Frequency dispersion and edge effects further degradation Hz Z E R(f) and L(f) increase y = ρj y ( 1 i) + Jy = Js exp x δ s Y X δ = s Skin-effect ρ πμ f [ m] Resistance p.u.l. R(f) increases Inductance p.u.l. L(f) decreases Low Medium High DC well-developed skineffect ~100 MHz or higher proximity and edgeeffects or transition to skin-effect ~1 MHz or higher proximity effect in planes ~10 KHz uniform current distribution 12/23/ Simberian Inc. 19

20 Current distribution in rectangular conductor Current density distribution in 10 mil wide and 1 mil thick copper at different frequencies 1.7 MHz, t/s=0.5, Jc/Je= MHz, t/s=2.0, Jc/Je=0.76 Z Z( 1.7MHz) = i0.11 ( 28MHz) = i MHz, t/s=5, Jc/Je= GHz, t/s=12.2, Jc/Je=0.005 Z( 170MHz) = i6.22 t/s is the strip thickness to the skin depth ratio Jc/Je is the ratio of current density at the edge to the current in the middle. 12/23/ Simberian Inc. 20

21 Transition to skin-effect and roughness Transition from 0.5 skin depth to 2 and 5 skin depths for copper interconnects on PCB, Package, RFIC and IC Ratio of skin depth to r.m.s. surface roughness in micrometers vs. frequency in GHz PCB Well-developed skin-effect Package Account for roughness 40 MHz 150 MHz 4 GHz 18 GHz 400 GHz No skineffect RFIC 10 um 5 um 1 um 0.5 um 0.1 um IC No roughness effect Interconnect or plane thickness in micrometers vs. Frequency in GHz Roughness has to be accounted if rms value is comparable with the skin depth 12/23/ Simberian Inc. 21

22 Dielectric attenuation and dispersion effects Dispersion of complex dielectric constant Polarization changes with frequency High frequency harmonics propagate faster Almost constant loss tangent in broad frequency range loss ~ frequency Re( εlp j ) f j Dk vs. Frequency Loss Tangent vs. Frequency tan δlp j High-frequency dispersion due to nonhomogeneous dielectrics TEM mode becomes non-tem at high frequencies Fields concentrate in dielectric with high Dk or lower LT High-frequency harmonics propagate slower Interacts with the conductor-related losses f j At higher frequency 12/23/ Simberian Inc. 22

23 Agenda Introduction Broadband transmission line theory Modal superposition S-parameters of t-line segment Signal degradation factors Conductor effects Dielectric effects RLGC parameters extraction technologies 2D static field solvers 2D magneto-static field solvers 3D full-wave solvers Examples of broadband parameters extraction Conclusion 12/23/ Simberian Inc. 23

24 Extraction of RLGC parameters 2D Static and Magneto- Quasi-Static Solvers E = ϕ jω A 1 H = A μ 2D Full-Wave Solvers E = iωμh H = iωεe+ σe+ J E = Et exp Γ l H = H exp Γ l t ( ) ( ) 3D Full-Wave Solver E = iωμh H = iωεe+ σe+ J W-element model V = ( R( ω) + iωl( ω) ) I x I = ( G( ω) + iωc( ω) ) V x System-level simulator 12/23/ Simberian Inc. 24

25 2D static field solvers Solve Laplace s equations for a transmission line cross-section to find capacitance and conductance p.u.l. matrices and distribution or charge on metal boundaries y x ( xy i ) 2 ϕ ε ε = ϕ S i,, 0 = ϕ ( i = 1,..., N) i Plus additional boundary conditions at the boundaries between dielectrics ( ε ( )), ( ε ( )) = d ( ε ) ( ) 1 0 ext = μ0ε0 ε0 ( ) ( ) C f G f G f C L C q x y R f, s 0 Integral equation or boundary element methods with meshing of conductor and dielectric boundaries are usually used to solve the problem. Conductor loss accounted for with diagonal RDC and with R computed at 1 GHz with the perturbation method, assuming well-developed skin effect Solver outputs Lo=Lext, Co=C(f), Ro, Go, Rs=Rs(fo)/sqrt(fo), Gd=G(fo)/fo Frequency-dependency is reconstructed.model Model_W001 W MODELTYPE=RLGC N=1 * Lo (H/m) + Lo = e-007 * Co (F/m) + Co = e-010 * Ro (Ohm/m) + Ro = 4.77 * Go (S/m) + Go = 0 * Rs (Ohm/m-sqrt(Hz)) + Rs = * Gd (S/m-Hz) + Gd = e /23/ Simberian Inc. 25

26 Frequency-dependent impedance p.u.l. model based on static solution 8-mil strip, 20-mil plane to plane distance. DK=4.2, LT=0.02 at 1 GHz, no dielectric conductivity. Strip is made of copper, planes are ideal, no roughness no high-frequency dispersion. f Z( f) = R + (1 + i) R ( f ) + i2π f L DC s 0 ext f0 Resistance [Ohm/m] Ohm m RDC included at high-frequencies Inductance diverges to infinity at DC No actual transition to skin-effect No roughness of metal finish effects Inductance [Hn/m] R DC Static solver Rs ( 1GHz) Static solver L DC Actual R DC Actual L ext Frequency,Hz Frequency,Hz 12/23/ Simberian Inc. 26

27 Frequency-dependent admittance p.u.l. model based on static solution ( ) G ε, f0 Y( f) = f + i2 π f C( ε, f ) Non-causal admittance model (typical) 0 f0 m2 CDC C 10 + if Y( f) = i2π f C + ln m1 ( m2 m1) ln(10) 10 + if 10 + if m2 0 Re ln 10 m1 + if0 0 m2 d if 0 2π Im ln 10 m1 + if0 C = C( f ) + G ( f ) Conductance [S/m] Causal wideband Debye model from Eldo (valid for lines with homogeneous dielectric) ( m m ) ln(10) 2 1 CDC = C + G 2 d f m if 0 2π Im ln 10 m1 + if0 No high-frequency dispersion due to inhomogeneous dielectric ( ) Capacitance [F/m] Non-causal Non-causal Causal wideband Causal wideband Frequency,Hz Frequency,Hz 12/23/ Simberian Inc. 27

28 2D quasi-static field solvers Solve Laplace s equations outside of the conductors simultaneously with diffusion equations inside the conductors to find frequency-dependent resistance and inductance p.u.l. (, ) ωσμ ( z 0 ) (, ) 0 2 z = 2 z = A x y i A A insideconductors A x y outsideconductors Plus additional boundary conditions at the conductor surfaces ( ) ( ) R f L f Finite Element Method meshes whole cross-section of t-line including the metal interior Integral Equation Method can be used to mesh just the interior of the strips and planes Both approaches have significant numerical complexity (despite on being 2D): To extract parameters of a line up to 10 GHz, the element or filament size near the metal surface has to be at least ¼ or skin depth that is about 0.16 um It would be required about elements to mesh interior of 10 mil by 1 mil trace for instance and in addition interior of one or two planes have to be meshed too (another two million elements may be required) If element size is larger than skin-depth, effect of saturation of R can be observed (R does not grow with frequency) In addition, there is no influence of dielectric on the extracted R and L 12/23/ Simberian Inc. 28

29 3D full-wave solvers Solve Maxwell s equations for a transmission line segment to find S-parameters: 1 2 N l N+1 2N E = iωμh H = iωεe+ σe+ J Plus additional boundary conditions such as Surface Impedance Boundary Conditions (SIBC) S ( ω, l) Finite Element Method (FEM) meshes space and possibly interior of metal, but more often uses SIBC at the metal surface Finite Integration Method (FIT) or Finite Difference Time Domain (FDTD) Method mesh space and usually use narrow-band approximation of SIBC Method of Moments (MoM) meshes the surface of the strips and uses SIBC No RLGC parameters per unit length as output Approximate roughness models based on adjustment of conductor resistivity No models for multilayered metal coating No broadband dielectric models (1 or 2-poles Debye models in some solvers) 12/23/ Simberian Inc. 29

30 Simbeor: 3D full-wave hybrid solver Solve Maxwell s equations for a transmission line segment to find S-parameters and frequency-dependent matrix RLGC per unit length parameters: E = iωμh H = iωεe+ σe+ J Plus additional boundary conditions at the metal and dielectric surfaces S R G ( ω, l) (, L( ( ω), C( ω) 1 2 N l N+1 2N Method of Lines (MoL) for multilayered dielectrics High-frequency dispersion in multilayered dielectrics Losses in metal planes Causal wideband Debye dielectric polarization loss and dispersion models Trefftz Finite Elements (TFE) for metal interior Metal interior and surface roughness models to simulate proximity edge effects, transition to skin-effect and skin effect Method of Simultaneous Diagonalization (MoSD) for lossy multiconductor line and multiport S-parameters extraction Advanced 3-D extraction of modal and RLGC(f) p.u.l. parameters of lossy multiconductor lines 12/23/ Simberian Inc. 30

31 Comparison of field solvers technologies Feature \ Field Solver Static Field Solvers Quasi-Static Field Solvers 3D EM with intrametal models (Simbeor 2007) Output parameters C, L, Ro, Go, Rs, Gs L(f), R(f) R(f), L(f), G(f), C(f) Thin dielectric layers Difficult No Yes Transition to skin-effect in planes and traces No Yes Yes Skin and proximity effects Yes Yes with high-frq saturation effect Metal surface roughness No No Yes Dispersion No No Yes Yes 3D characteristic impedance No No Yes 12/23/ Simberian Inc. 31

32 Agenda Introduction Broadband transmission line theory Modal superposition S-parameters of t-line segment Signal degradation factors Conductor effects Dielectric effects RLGC parameters extraction technologies 2D static field solvers 2D magneto-static field solvers 3D full-wave solvers Examples of broadband parameters extraction Conclusion 12/23/ Simberian Inc. 32

33 Effect of skin-effect in thin plane on a PCB differential microstrip line Differential mode impedance Attenuations Common mode impedance Skin Effects in thin plane Effect of Dispersion 7.5 mil wide 2.2 mil thick strips 20 mil apart. Dielectric substrate with Dk=4.1 and LT=0.02 at 1 GHz. Substrate thickness 4.5 mil, plane thickness mil, metal surface roughness 0.5 um 12/23/ Simberian Inc. 33

34 Eye diagram comparison for 5-inch differential micro-strip line segment with 20 Gbs data rate Two 7.5 mil traces 20 mil apart on 4.5 mil dielectric and 0.6 mil plane, 0.5 um roughness. Worst case eye diagram for 50 ps bit interval May affect channel budget! Worst case eye diagram computed with W- element defined with tabulated RLGC parameters extracted with Simbeor Worst case eye diagram computed with W- element defined with t-line parameters extracted with a static solver Computed by V. Dmitriev-Zdorov, Mentor Graphics 12/23/ Simberian Inc. 34

35 Effect of roughness on a PCB microstrip line 7 mil wide and 1.6 mil thick strip, 4 mil substrate, Dk=4, 2-mil thick plane. Strip and plane is copper. Metal surface RMS roughness 1 um, rms roughness factor 2 No dielectric losses 25 % loss increase at 1 GHz and 65% at 10 GHz Rough Transition to skin-effect Flat Lossy Rough Flat Lossless 12/23/ Simberian Inc. 35

36 Transition to skin-effect and roughness in a package strip-line 79 um wide and 5 um thick strip in dielectric with Dk=3.4. Distance from strip to the top plane 60 um, to the bottom plane 138 um. Top plane thickness is 10 um, bottom 15 um. RMS roughness is 1 um on bottom surface and almost flat on top surface of strip, RMS roughness factor is 2. 33% loss increase at 10 GHz Rough Transition to skin-effect Flat Lossy Rough Lossless Flat 12/23/ Simberian Inc. 36

37 Effect of metal surface finish on a PCB microstrip line parameters Gold Nickel Copper Strip NoFinish 8 mil microstrip on 4.5 mil dielectric with Dk=4.2, LT=0.02 at 1 GHz. ENIG2 - microstrip surface is finished with 6 um layer of Nickel and 0.1 um layer of gold on top Nickel resistivity is 4.5 of copper, mu is 10 ENIG2 (+50%) ENIG2 No Finish No Finish 12/23/ Simberian Inc. 37

38 Effect of dielectric models on a PCB microstrip line parameters FlatNC 7 mil microstrip on 4.0 mil dielectric with Dk=4.2, LT=0.02 and without dispersion 1PD same line with Dk=4.2, LT=0.02 at 1 GHz and 1-pole Debye dispersion model WD same line with Dk=4.2, LT=0.02 at 1 GHz and wideband Debye dispersion model No metal losses to highlight the effect FlatNC 1PD FlatNC 1PD 12/23/ Simberian Inc. 38

39 Conclusion Select the right tool to build broadband transmission line models Use broadband and causal dielectric models Simulate transition to skin-effect, shape and proximity effects at medium frequencies Account for skin-effect, dispersion and edge effect at high frequencies Have conductor models valid and causal over 5-6 frequency decades in general Account for conductor surface roughness and finish Automatically extract frequency-dependent modal and RLGC matrix parameters per unit length for W-element models of multiconductor lines 12/23/ Simberian Inc. 39

40 Author: Yuriy Shlepnev Contact Tel Skype shlepnev Biography Yuriy Shlepnev is the president and founder of Simberian Inc., were he develops electromagnetic software for electronic design automation. He received M.S. degree in radio engineering from Novosibirsk State Technical University in 1983, and the Ph.D. degree in computational electromagnetics from Siberian State University of Telecommunications and Informatics in He was principal developer of a planar 3D electromagnetic simulator for Eagleware Corporation. From 2000 to 2006 he was a principal engineer at Mentor Graphics Corporation, where he was leading the development of electromagnetic software for simulation of high-speed digital circuits. His scientific interests include development of broadband electromagnetic methods for signal and power integrity problems. The results of his research published in multiple papers and conference proceedings. 12/23/ Simberian Inc. 40