EUV Mask Carrier & Load Port Standards Workshop Overview

Transcription

1 EUV Mask Carrier & Load Port Standards Workshop Barcelona Spain Oct. 19 th 2006 EUV Mask Carrier & Load Port Standards Workshop Overview Phil Seidel SEMATECH (Co-Chair) Long He SEMATECH / Intel (Co-Chair) Dave Halbmaier Entegris (Co-Chair) Michael Salib Intel (Co-Chair) SEMATECH, the SEMATECH logo, AMRC, Advanced Materials Research Center, ATDF, the ATDF logo, Advanced Technology Development Facility, ISMI and International SEMATECH Manufacturing Initiative are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

2 2 Topic: EUV Mask Carrier & loadport Stdrs. Start Time: Topic/Presenter (Organization): 13:30 Opening Statements/P. Seidel (SEMATECH) 13:0 General Status, Agreements, and Plans Resulting from July '06 San Fran. P. Seidel (SEMATECH) 1:00 Vacuum Pod for EUV Mask/H. Horibe-san (TDK Corporation) 1:15 Mask Maker "Customer View" Perspective/M. Lering (Qimonda/AMTC) 1:25 Japanese EUV Mask Carrier Standards Activity Update/Ota-san (Selete) 1:0 SEMATECH Update/L. He (SEMATECH/Intel) 1:5 Current Semi Draft Ballot Proposal Review/D. Halbmeier (Entegris) 15:15 Detailed review and Discussion of current Draft/P. Seidel (SEMATECH) Discussions will be focused on but not limited to section details such as: > General review of sections and proposed values > Review & discuss details on carrier exclusion tolerance > EUV reticle conducting and grounding > Reticle frame dimensions > Reticle enclosure size, exclusion volume > Reticle position within enclosure, enclosure mass, contact Points > Carrier outer dimensions, exclusion volume, mass 16:5 Assess current status, direction, schedule on Blue Ballot Draft by Y.E. '06 17:00 Adjourn

3 Welcome to the EUV Mask Flatness & Carrier/Loadport Workshop 3 The EUV Mask Flatness & Carrier/Loadport Workshop is one in a collection of single-focus industry meetings designed to increase global knowledge in key areas of semiconductor R&D. As part of the SEMATECH Knowledge Series, this series focuses on accelerating solutions for critical challenges in the nanoelectronics industry. For more details on other meetings in this series, please pick up one of our SEMATECH Knowledge Series flyers located in the registration desk area.

4 Outline: Welcoming and specific meeting guidelines Objectives and goals of the meeting Brief historical timeline Overview and output from July 11 th 2006 EUV Carrier & Load Ports Standards Meeting (Semicon West San Francisco) Activity and accomplishments highlights since July 11 th 06

5 Public Meeting Notice: 5 This activity is affiliated with the Semi Physical Interface & Carriers Committee. (Paul Trio Semi main contact) Semi meeting guidelines, legal, and intellectual property handling are to be followed This EUV Mask Carrier & Load Port Task Force = EUV Standards Sub Committee (EUVSSC) is recognized and reports through the N.A. Physical Interface & Carrier (PIC) Committee This meeting is classified as an Open Conference per the U.S. Export Administration Regulations. All meeting attendees are permitted to take notes or otherwise make a personal record of these proceedings. Some representatives are participating through teleconference and internet WebEx; please speak clearly for those listening through teleconference line Presentations and meeting minutes will be available to the public which may include posting on the SEMATECH website or attachment packages.

6 6 Semi Global Participation for EUV Carriers & Load Ports This is a global coordination effort; all regions understand that EUV Mask Carriers & Load Port Standards Development should be unified Key stakeholders (suppliers and organizations) are global Single requirement set is most effective and cost efficient We would like to thank and recognize all of the Semi regional PIC Committees and Task Forces that are participating Asian PIC and Semi (Japan, Korea) European PIC and Semi North American PIC and Semi

7 7 EUV Mask Carrier & Load port Standards Meeting Purpose: Review and improve the EUV mask carrier/handling and loadport standard requirements needed for SEMI specification draft. Updated presentations will be provided on stakeholder and or regional activity, Propose updated proposal of the EUV Mask Carrier & Loadport Standards. Significant review and discussion period will be conducted on the current draft.

8 8 EUV Mask Carrier & Load Port Standards Expected Results: Obtain industry direction on requirements needed to proceed in the EUV mask carrier, carrier frame, common handling, and other requirements. Review and obtain inputs and suggested modifications to the updated SEMI draft ballot document. Direction will be obtained on the proposed specifications to identify which areas require additional agreements or data. Assessment of the current status and scheduled plan to have a completed blue informational ballot by Y.E will be made.

9 9 Status of SEMI EUV Reticle Handling Standardization Handling Standards SEMI TF formed Ballots Standards available

10 10 EUV Mask Carrier / Load Port Standards W/S Global current EUV Mask Carrier & Load Port Standard Campaign in 20 th month Feb 05 San Jose CA (SPIE): Review of state of art carrier data and experiments July 06 San Francisco CA (Semicon): Official dedicated Task Force Sub Committee under N.A. PIC Oct 06 Portland OR (Semi Fall 2005 Conference): Review stakeholders issues and requirements survey (questions to answered) First pass at new carrier & L.P. Standard Document Nov 06 San Diego CA ( th EUVL Syp) Feb 06 San Jose CA (SPIE): 35 participants from 19 org. Most recent perf. data to date July 06 San Francisco CA (Semi West): 27 participants from 19 org.

11 EUV Mask Carrier / Load Port Standards W/S July 06 San Francisco CA (Semi West): 27 participants from 19 org. Morning: Reviewed details of four standards proposals ASML: system based from ASML EUV alpha tool [G. van der Feltz] Canon / Nikon / Entegris: joint proposal of EIP [D. Halbmaier] Alcatel: new bottom opening carrier proposal [P. Maquin] SEMATECH: mask contact area proposal (survey driven) [P. Seidel] Afternoon: In depth discussions, agreements, and path forward Overall bounds where in life cycle standard requirements cover Multiple carrier / load port component area commonality (ASML C/N/E) Start populating Semi draft ballot with actual tolerances / spec with detailed schedule having multiple check-points over next 5 mo. 11

12 July 06 Highlight Outputs & Agreements (pt 1) Agreement and reinforcement of overall standards schedule for robust blue ballot by Q1 07 and voting (yellow) ballot passing Q2 07 Agreements on bounds within EUV mask life cycle where standard requirements are to cover Starting at shipment from mask house through the mask end of life including repair / clean loops back to Mask House Expectation is the standard will define ONE carrier system / solution needed to meets these requirements. Mask House have many equipment / processes with pattern side up; many tools may need retrofit to flip masks AMTC MH stakeholder presented considerations including specifying reduced end effecter contact areas, carrier sealing / hold down force requirements, and need for some mask house carrier needs. Agreements generally made on which carrier and load port component areas need standardization Areas identified with most common ASML, Canon / Nikon / Entegris, and Alcatel proposals Outline of the common areas which were supported by multiple proposals are defined 12

13 13 July 06 Highlight Outputs & Agreements (pt 2) Agreements were made to begin populating the Semi draft ballot with actual tolerances / spec with detailed schedule having multiple Task Force review check-points over next 5 months OEM s need to understand alignment and placement issues specific to EUV Schedule of meetings and activities was developed Current RSP200 carrier load port systems shown not to perform at needed defect levels to support EUV mask handling. TF recommends effort to understand the improvements in load ports needed Additional discussion items included important areas to consider: Use of Kinematic Coupling (KC) pins for location of frame or enclosure on / in carrier required. Healthy discussion of needed tolerance stack build up analysis to assure no rubbing / particle gen. (OEM input) Use of purged inert gas within carriers during shipment and stocking to improve molecular contamination Ota-san (Selete) proposed an integration and stakeholder involvement requirements chart

14 1 Activities and Accomplishments since July 06 Several follow on teleconferences were accomplished however global stakeholder representation and progress was less than expected Several action items were address and completed by the Task Force Detailed discussions ensued with C/N/E on key standard items needing to be quantified in draft ASML and C/N/E initial discussion to obtain initial agreement proposals for additional commonality Semi JP Regional PIC committee meetings took place (update review by Otasan) Improvement to the EUV Mask life cycle process flow chart made by AMTC (M. Lering Qimonda / AMTC) An additional key stakeholder with new proposed carrier solution identified based on bottom opening vacuum system (TDK Corp.) Co-chair update of the working SEMI pre-blue ballot with proposed additional definition (Section 7.0) and contact area exclusion map. This was deployed to the global task force October 12 th 2006.

15 EUV Mask Carrier / Load Port Standards W/S Commonality with degree of similar specs EUV Mask Carrier & Load Port Specification ASML C/N/E Alcatel Carrier end-effecter exclusion volume X X? Frame/enclosure end-effecter exclusion volume X X? Frame/enclosure position with Carrier X X? Frame/enclosure interface to carrier to be KC pins X X? Reticle alignment within frame/enclosure X X? Alignment optics, windows, size, transmission rate X X? Info pads on the Carrier X? Carrier sensing pads X? ID. Exclusion volume, tags, labels, RFID, etc X X? Mass of carrier, frame, enclosure including maximum and minimum mass. X X X Carrier to load port interface to be KC pins like RSP 200 in Compliant X X SEMI E100. with E57? Vacuum Compatibility X X X Mask carrier and handling with vacuum X Mask carrier specifications for mask usage and shipping X X Load port bottom opening carrier design X X X Inner box (pod) within outer carrier concepts X X X Mask conductive / charge dissipation requirements X X? Out gassing requirements X X Data Ge Areas with stronger commonality 15

16 16 EUV Mask Carrier / Load Port Standards W/S Needed Specifications For Segments (Ota-san) Action 1. Open/close carrier RSP150, RSP200, FOUP, weight of carrier 2. Protective enclosure (PE) carrier base E-E exclusion volume for carrier, size, shape, weight of PE 3. Open/close protective enclosure size, shape, weight of PE. Mask protective enclosure E-E exclusion volume for PE 5. Protective enclosure vacuum Air path, filters 6. Protective enclosure tool inside Detailed size of PE, registration windows Mask process tool Inspection tool Exposure tool X X X X X X X X X X X X X

17 17 EUV Mask Carrier / Load Port Standards W/S - Update of Standards Domain (life cycle) Life of a EUV Reticle Attempted lifecycle (July 06) Proposed Lifecycle Flow by M. Lering AMTC / Qimonda Blank Supplier Resist mask characteristics: Blank maker Absorber Buffer Capping Layer Polishing Patterning- Cr coating Clean Resist Multilayer E-Beam Mask maker applied BORB C low expansion substrate Blank inspection Mask Mfr. Data preparation EUV Blank making process Shipping Resist coating Pattern generation Inspection Repair Inspect Clean Litho process Pellicle X BORB VB Etch Stocker Strip full field Transport Buffer etch Maintenance Inspection (Wet) Clean Inspect Sorter X Inspect Stocker Metrology OHT Stepper OHT IF Phase Shift AMHS Stocker Inspection Transport Fab Use IF Repair Final clean/co2,selective? Inspect OHT End of Life BORB Cleaning FINAL audit EUV Scanner Load Change ESP Cassette to Vacuum Box Library EUV Mask Carrier Shipping Pre aligning & Load Port Standard EUV Blank Shipper Exposure Library will be defined around single system Unload EUV Reticle Carrier (solution) leaving Mask Mask House under till vacuum EOL Mask user (July 11 th 2007) Mask under atmospheric pressure

18 EUV Mask Carrier Contact Area / exclusion zone map improvement Backside corner 5 chamfer reticle North backside surface Backside corner chamfer Contact / frame or carrier point Handling Areas for end effectors reticle West backside surface Mechanical Stage Contacts 6 Corner segments are 5.0mm x 5.0 mm Center Line segments are 6.0mm x 5.0 mm W reticle frontside surface All other segments are.0mm x 5.0 mm N E mm mm reticle East backside surface S mm mm 6.35 mm mm Backside corner chamfer 5 reticle South backside surface 18

19 19 Summary Task Force continues to support schedule of developing SEMI draft by Q1 07 and enact voting ballot (yellow) by Q2 07 Most critical elements of SEMI standard is needed to support timely infrastructure coordination in that will influence beta systems developments Global coordination / consensus needed to suppress regional standards Additional carrier and load port standards revisions through evolution is expected over the next few years If refined additional solutions become robust and gain interest by the stakeholders subsequnet standards revisions are expected to cover those elements of the new solution needed to be defined

20 BACK UP MATERIALS 20

21 21 Action Items recorded at July 11 th meeting: 1. Need to use ONE mask life cycle chart. Proposal is to use the newer Entegris chart with modifications (to include returns to Mask house) Owner Entegris to update their chart [DONE] 2. Next Task Force call should be week of July 25th. Needs OEM and Mask Makers included [DONE] 3. Send out current Task Force distribution list to review and update the D.L. to include these OEM and Mask Makers Owner P. Seidel [DONE]. Contact Alcatel (i.e. Phillipe Maquin) to understand their proposal better and assess their roadmap etc... Are any exposure tool companies willing to use this approach? Owner Long He [DONE] 5. Entegris will investigate the use of FOUP standard(s) in relationship to the KC pin alignment required tolerances that could be used for Standard. Owner D. Halbmaier 6. Send out dates and info for the EUV Mask Carrier & LP meeting at Barcelona to the Task Force (Meeting already scheduled). Owner P. Seidel [DONE] 7. Task Force should review the results of the previous must haves survey results from Q2 Q 2005 to identify whether new items need to be included in the Standard that was not identified in the July 11th meeting. Owner TBD: 8. A list of key OEM supplier contact names to be submitted for rest of blue ballot refinements Owner D. Halbmaier Integris [DONE] 9. A list of key mask Maker supplier (both captive and merchant) contacts names to be submitted for rest of blue ballot refinements Owner L. He SEMATECH [DONE] 10. A list of key exposure tool stepper supplier contact names to be submitted for rest of blue ballot refinements Owner Gomei-san Canon [DONE]

22 22 EUV Mask Carrier / Load Port Standards W/S Schedule moving forward Semi Draft (Blue) Ballot still holding for Y.E. 05 Schedule aggressive but rate of collaboration and input is improving Follow up teleconferences at 2 week intervals till Y.E. First follow up Week of July 25 th Major F-2-F check point agreed during Mid Sep. (BACUS)? Major F-2-F checkpoint at Barcelona Oct. Voting Ballot (Yellow) by 2Q 07 Program and Will define standard requirements for use starting at shipment from mask house through end of life (will include repair / clean loops back to mask house). Defining this standard that ONE carrier meets these requirements.

23 23 EUV Mask Standards Status Updates Standards for mask handling Carrier and Enclosure Molecular contamination & cleaning Contact areas Load port and interfaces Reticle handling SEMI P37: EUV mask substrates SEMI P38: EUV mask blanks and absorber films SEMI P0: EUV mask chucking Standard: Mask ID marks Draft(s) by Q 06 Voting by Q1 07 Updates expected 07 Future Draft Future Draft 027 For more in-depth information, contact Paul Trio (ptrio@semi.org) to obtain a copy of the SEMI Standards Technical Education Program (STEP) on EUV Masks from July 200. North American Physical Interface & Carrier (PIC) Committee North American Micro Patterning Committee

24 EUV Mask Standards Schedule (Q1 06) Q1 Q2 Q3 Q Q1 Q2 Q3 Q Q1 Q2 Q3 Q Q1 Q2 Q3 Q Q1 Q2 Q3 Q Q1 Q2 Q3 Q EXPOSURE TOOL ROADMAPS Exitech MET ASML Alpha Demo (< 10 wph) ASML Pilot Production Nikon High NA set 3 Nikon EUV-1 (Beta) Nikon EUV-2 (HVM) SFET (Small Field Exposure Tool) Canon VS1 (pre-prod.) Modify SEMI P Modify SEMI P Modify SEMI P0 Frame domain* ID marks Layout* Fiducial marks Carrier / Load Port* * Standards to be accelerated through N.A. PIC EUVSSC Task Force 2 Symbol key - SEMI draft - SEMI voting ballot

25 Carrier & Load Port Standard Survey EUVSSC TF carrier standards development is using results from comprehensive stakeholder survey process to drive specification requirements 16 companies participated in multiple pass survey completed in 2H 05 that has yielded very detailed requirement needs Survey identified what are the needed specifications in the standard and the data needed to acquire A Mini-team organized the results with mapping approach used to understand what type of data is needed to develop which specs Standards Must Haves Questions to be answered Data needed to be acquired 5 general specification areas have been identified for Work Groups Results reviewed and discussed at the EUV Standards SC SEMI Portland OR (10/11/05) and EUVL Symp. W/S 11/11/05 The data / results are to be finalized by agreement today with obtaining any final inputs, concerns, or edits. Provides foundation for detailed work group activity 25

26 Carrier & Load Port Standard Survey 26 Category total line items High Medium Low Not ranked Must-haves Questions Data Item Items MUST be included in EUV mask standards Median Average # comp's ranked Enclosure (Inner Pod / Frame) 2 enclosure dimension enclosure contacts points Frame domain, size, mass, if there is a permanent reticle frame it must be <= 7" square if there is a permanent reticle frame it must not hang more than.25" below the reticle if there is a permanent reticle frame it must not go more than.25" above the reticle Pellicle solution standard(s) If the standard includes inner case to be opend in exposure tools, how is it opend? Locations where bracket may contact mask Outgassing 13 maximum outgassing rate of the enclosure maximum outgassing rate of the carrier Definition of allowed contaminations / deposits outgassing limits: water adsorbtion, hydrocarbons, inorganic & organic contamination Materials of the Contamination, Contamination Level The dependence of the defects and contamination levels on the surface materials of carrier or structure The dependence of the defects and contamination levels on the methods of holding masks The dependence of the defects and contamination levels on the surface materials of mask outgassing of reticle, carrier, frame, Airborne Molecular Contamination and Particle Class for Mask handling and storage Small sample of survey results to show ranking approach

27 Are particles generated during handlng or generation be minimized? Is chuckin standard P38 adequate? What is the particle ge supplier handling Ret Carrier & Load Port Survey Mapping: What are the sources of molecular contamination? What are the carrier and enclosure outgassing specifications? Particle Generation & Contamination Outgassing, airborne molecular contamination, particle requirements Questions Questions MUST be answered in the process of EUV mask standards developments Data to Acquire vs. Questions To Answer Data To Acquire That will Help answer the questions Enclosures (= Inner pod, Frame, Bracket, etc...) Impact of molecular contamination on mask ageing and quality (Outgassing levels of materials used in current and candidate designs, water absorption, hydrocarbons, other, contamination mechanisms including temperature and environments) Particles and molecular contamination for different operation:handling in the fab, shipping, storage: [different enclosures, different carriers, different pattern orientation up / down; and carrier conditions (purged,vacuum ) ] Data to Acquire Carriers Cleaning cleanliness after carrier cleaning in regards to remaining particles, metals, ionic etc. Cleaning efficiency; Mask carrier cleaning/and cleaning cycle data Physical property 27

28 flow? of the standard should be utilized Should One carrier or m What is the Wh Should carrier and Loadport be based Carrier & Load Port Survey Mapping: Questions When is the protective enclosure used in the blank and Enclosures/Carriers/Loadports What is the best protection concept? Partial enclosure (bracket/frame); Full enclosure (Inner Pod); No enclosure Questions MUST be answered in the process of EUV mask standards developments Specification Must Haves vs. Questions To Answer Item Items MUST be included in EUV mask standards Enclosures (= Inner pod, Frame, Bracket, etc...) 1 Enclosure domian and dimensions (exclusion volumes) 2 Enclosure mass 3 requirements to open and close enclosure Carriers Carrier ID location Physical property 5 Carrier size, or dimensions 6 Carrier base form factor 7 Carrier mass 8 9 carrier volume form factor for stocker, inspection and exposure tool design 10 maximum force that can be applied on the enclosure 11 maximum force that can be applied on the mask inside the enclosure 12 Environmental condition inside Carrier, such as what gas, temperature, and pressure Mask protection 13 ESD Protection Must Have Items 28

29 Status of Draft Protection Standards EUV mask enclosure domain: Early SEMATECH Proposal Defines a domain volume around the mask form factor within which any enclosure element must fit Draft discussed with stakeholders and feedback received D E F Mask Frame domain Arbitrary end effector C LX,Y C B A L Z Dim. Value (mm) A B C D E F Same as P37 P mm P mm Same as P37 P mm P mm C B A C LX,Y 29

30 30 Initial Proposed handling area standard Area reserved for handling Q/0 Q1/05 Survey Results These are the mask sidewalls. 5 mm A B C This central block is the EUV mask pattern side, with a 5 mm border of handling area in segments. Corner segments (A) are 5 mm x 5 mm; side center segments (B) are 6 mm x 5 mm; and side general segments (C) are mm x 5 mm (there are 17 side general segments between the corner and the side center segments). 5 mm 5 mm Backside corner chamfer. Plan view of front and back sides of mask D Mask Handling areas on all four sides The mask backside edges. Note corners D are the same segment. D 1 - key 1 company 2 companies 3 companies companies 5 companies 1 company alignment area EUV SSC Task Force recommended to retain all of original proposed 5mm FS, BS, and sides (10/11/05 SEMI Portland OR)

31 Status of Mask Contact Area Standard Survey and Analysis 12 different stakeholder organizations responded THANK YOU TO ALL COMPANIES THAT RESPONDED: (AIXUV, AGC, ASML, Asyst, Brooks, Entegris, Fala, Infineon, Intel, KLA Tencor, Lasertec, and Nikon) Contact area compatibility investigated through survey responses for entire life cycle population Assess the contact areas required through the EUV Mask life cycle (from starting materials to Usage in FAB) Segmentation was established for three general grouping of the mask life cycle (6 7 per segment) Substrate & Blank (material suppliers, blank metrology, handling) Mask (Blank suppliers, mask Makers, mask inspection, handling) Mask Usage (Mask makers, exposure tool, IC mfg., handling) More stakeholder surveys may be needed if finer segmentation is required 31

32 2 nd Pass Survey Results (12 organizations) Enclosure / Frame Contacts 1 supplier vote reticle North backside surface Backside corner 5 5 chamfer 2 supplier vote 3 supplier vote Backside corner chamfer supplier vote 5 supplier vote > / = 6 supplier votes reticle West backside surface N 6 W 5 reticle frontside surface S E mm mm mm mm reticle East backside surface 6.35 mm mm Corner regions appear very common Stakeholder using edges of sides and beyond frontside corner segments (earlier requested as exclusion zones) Carrier / frames alone offer some open available contact areas for transfer Backside corner chamfe 5 5 reticle South backside surface 32

33 2 nd Pass Survey Results (12 organizations) End Effectors Contacts 1 supplier vote Backside corner 5 5 chamfer reticle North backside surface Backside corner chamfer 2 supplier vote 3 supplier vote supplier vote 5 supplier vote > / = 6 supplier votes reticle West backside surface N 6 W 5 reticle frontside surface S E mm mm mm mm reticle East backside surface 6.35 mm mm Extensive use of almost entire area with less dominate concentrations Stakeholder using contact area further inside target zones End Effectors contact higher populations appear on east and west edges Backside corner chamfe 5 5 reticle South backside surface 33

34 2 nd Pass Survey Results (12 organizations) Stage Contacts reticle North backside surface 1 supplier vote Backside corner 5 5 chamfer 2 supplier vote Backside corner chamfer 3 supplier vote supplier vote > supplier vote reticle West backside surface N 6 W 5 reticle frontside surface S E mm mm mm mm reticle East backside surface 6.35 mm mm Not large response on needed stage contact areas Stakeholder using edge contact and inside target backside zones Some commonality on frontside and backside corner regions Backside corner chamfe 5 5 reticle South backside surface 3

35 2 nd Pass Survey Results (12 organizations) Stage vs. End Effectors End Effectors Stage reticle North backside surface 1 supplier vote 1 supplier vote Backside corner 5 5 chamfer Backside corner chamfer 2 supplier vote 2 supplier vote 3 supplier vote 3 supplier vote supplier vote supplier vote supplier vote Interference reticle West backside surface N 6 W 5 reticle frontside surface S E mm mm mm mm reticle East backside surface 6.35 mm mm Backside corner chamfe Major interference at multiple segment spans Interference areas are also at high populations regions: therefore renegotiating space unlikely (11 cells) Clearly also not conducive to support a overall contact area spec. Need to see segments of food chain 5 5 reticle South backside surface 35

36 2nd Pass Survey Results (12 Blank organizations) Sector (7 org.) Stage vs. End Effectors End Effectors Stage reticle reticle North North backside surface 1 supplier vote 1 supplier vote Backside corner chamfer 2 supplier vote 2 supplier vote reticle reticle West West backside surface N N 6 6 WW reticle reticle frontside frontside surface surface E S S supplier overlap mm mm mm mm reticle South backside surface reticle South backside surface mm mm Backside Backside corner corner chamfe chamfer reticle East backside surface reticle East backside surface mm mm mm mm Backside corner cham Backside corner chamfe Significant Food Chain interference at all Segmentation corner regions Interference decreases interference areas are also areas at high (15 cells) populations regions: Although therefore some renegotiating interference space regions unlikely exists it (11 is only cells) due to ~1 Clearly supplier not overlap conducive to support If Negotiations the small a overall number with contact the of area suppliers spec. with to Need reduce overlap to see segments are interference willing of to food areas modify chain can a few provide cells: eliminate Then no issues interference exists 36 3 supplier vote 3 supplier vote supplier vote supplier vote 5 supplier vote Interference

37 37 Mask Contact Area Survey Added Input Mask handling area comments / feedback Q 05 Q Make the reticle contact zones consistent with today on RSP, so that equipment suppliers can make equipment that is common between reticles and EUV reticles, as much as possible. This will reduce cost to the end user. 2. Add No Man's Land Exclusion Zones; small areas that cannot be contacted by either the end effectors, the reticle support, or the stage. A built in tolerance. 3. Remember to include beam paths in order to detect the reticle presence and proper placement. Exclusion areas for reading the location and position of the reticle with a through-beam system. Minimize location areas allowed for the container and for end effectors Minimum area of contact points control contamination better because it will be created just at those contact points. Focus the areas of potential defect creation and control. Make the allowable contact areas as small as reasonable.

38 Requested changes to draft frame standard Physical domain values should be changed Clearance for end effector robot needs to be 2-3 mm, not 0.5mm (dimensions B and E) Height of frame should be 10 mm (instead of 5.5 mm) DOF of optical based mask inspection systems need to be considered when establishing frame domain stand-offs Minimum number of contact points should be three instead of four Frame domain standard appears to need improvements from earlier SEMATECH proposal. Frame domain standard activity will be done with the NA PIC and probably integrated to the Carrier / Load Port Spec. 38