Simulator Development and Prototype Evaluation for a Spatially Controllable Chemical Vapor Deposition System
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1 Simulator Development and Prototype Evaluation for a Spatially Controllable Chemical Vapor Deposition System Jae-Ouk Choo a,b, Raymond A. Adomaitis a,b, Gary W. Rubloff b,c, Laurent Henn-Lecordier c and Yijun Liu c a Department of Chemical Engineering and ISR b Department of Material and Nuclear Engineering and ISR c Institute for System Research University of Maryland College Park, MD Support: National Science Foundation CTS (SGER), CTS (ITR)
2 Limitations of current commercial CVD reactor design Inflexible Process throughput / uniformity trade-offs Few control inputs Limited wafer access and few sensors
3 The programmable reactor concept - goals To achieve true 2D control of reactant gas composition across the wafer surface To enable single wafer combinatorial experiments for process and materials discovery Subsequently reprogrammable for across-wafer uniformity Library wafer: programmed nonuniformity Uniform deposition at specified conditions
4 Authors Moslehi, Davis, Matthews (1995) Van der Stricht, Moerman, Demeester, Crawley, Thruch (1997) Theodoropoulos, Mountziaris, Moffat, Han, Shadid, Thrush (2000) Wang, Wang, Mahanty, Komatsu, Inaoka, Nishino, Sakai (2000) Representative showerhead designs for gas composition or uniformity control Design innovation 3 annular zone showerhead Separate TMG, NH3 injection to reduce gas phase reactions Annual ring showerhead with alternating TMG, NH3 inlet rings Stacked gas delivery system with inert flow forcing reactants to wafer Materia l system W CVD GaN MOCVD GaN MOCVD GaN MOCVD Chamber center line Heated stage Annular-segmented showerhead gas inlets Designs above exhaust in conventional ways Wafer Inert Reactant Inert Segmented designs are subject to considerable inter-segment convective transport Gas outlet
5 Recirculating segmented showerhead design Gas outlets Gas inlet Gas outlets Residual gas drawn back up through showerhead Periodic gas flow fields minimize inter-segment convective transport Residual gas can be sampled from each segment, simplifying spatial composition measurements
6 Control of across-wafer gas composition gradients 2 feed/exhaust segments wafer plane Inter-segment region mass transfer is governed by diffusion Composition gradients are controlled by Feed composition to each segment Showerhead/wafer spacing
7 Design and construction of the 3-zone prototype Early simulation of 2D diffusive transport above wafer surface for W CVD ULVAC vacuum chamber modified for 3-segment prototype
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10 Initial experimental testing 3-zone prototype has been running since summer 2002 First films deposited have demonstrated that spatially patterned wafers can be produced by controlling gas phase composition Seg 1 Seg 2 Seg torr 50 sccm Ar 50 sccm WF6 50 sccm H2 300 C
11 Inter-segment diffusion increases with segment/wafer spacing 1mm 3mm 5mm
12 Programmable CVD reactor data archiving/analysis Significant simulation research is needed to understand prototype and materials produced by prototype Large amount of heterogeneous data types, incomplete data sets Represent data in XML, Java parser methods called from MATLAB applications Laboratory for Advanced Material Processing Real-time process data Processed exp data Archived exp data (XML) ISR Detailed simulator development & validation (MATLAB, Java) Gas composition settings to each segment Off-line metrology data Reduced models, process recipes (XML, Java) Reduced models (XML, Java) Educational case studies: data, simulations (XML, http) Off-campus physical prop, chem kinetics databases (XML)
13 Experimental data hierarchical structure Wafer number: w EquipmentData (process diagnosis) Gas line pressure Wafer position OperatingConditions data (simulator input) Wafer/segment spacing Segment gas flows Measurements data (analysis, simulator validation) Initial wafer mass Final wafer mass Sheet resistance profiles Structure influenced by use Store raw data only
14 ExperimentalData RunDate RunDate RunDate RunDate RunDate RunDate (Year / Month / Day) Wafer Wafer Wafer ( Number ) Wafer Wafer Wafer Wafer EquipmentData OperatingConditions Measurements SegmentDown ( Unit ) WF6LinePres ( Unit ) Voltage ( Unit ) Current ( Unit ) Image Weight ( Unit ) Temperature ( Unit ) Pressure ( Unit ) PreHeatingTime ( Unit / Gas ) FlowRate ( Unit ) Gap ( Unit ) StartTime (hr/min/sec) StopTime (hr/min/sec) Before After WaferSurface Substrate Segment1 ( Ar / WF6 / H2) Segment2 (Ar / WF6 / H2) Segment3 ( Ar / WF6 / H2) Segment1 Segment2 Segment3 Point1 ( x / y ) Point2 ( x / y ) Point3 ( x / y ) Point4 ( x / y ) Point5 ( x / y ) Point6 ( x / y ) Point7 ( x / y )
15 Document begins with declaration that specifies XML version 1.0 Comments Document type definition (DTD) defines document structure and entities Element RunDate contains three attributes: year, month and day Root element ExperimentalData contains child element(s) RunDate Child elements of element Temperature
16 Using the archived data EquipmentData ExpData.dtd ExpData.xml String[ ] unit double SegDown double LinePres OperatingConditions MATLAB simulation By Jing Chen DOMExpData String sdate String swaferno EquipmentData ed OperatingConditions oc Measurements mr findwafer( ) processchilenodes( ) String[ ] unit String PrtreatingGas double[ ][ ] Time double[ ] Temperature double Pressure double Gap double[ ][ ] FlowRate DepositionTime( ) Measurements String[ ] unit String photo double Current double[ ] Weight double[ ][ ] Coordinate double[ ] Voltage Weightdiff ( ) Thickness( )
17 Reading data into a MATLAB session - Java methods ExpData.xml ExpData.dtd DOMExpData String sdate String swaferno EquipmentData ed OperatingConditions oc Measurements mr findwafer( ) processchilenodes( )
18 MATLAB application: Measurements branch Voltage measurements taken at 21 points on wafer surface, archived in XML Wafer metrology data stored in Java OperatingConditions object after parsing Film thickness = ρ I / (4.53 V)
19 MATLAB application: Measurements branch Results from MATLAB function waferplot(wjo) Feed conditions: pure Ar to segment 1, pure WF 6 to segment 2, pure H 2 to segment 3 Q: why is W deposited in any of the segments?
20 MATLAB application: OperatingConditions branch Convert Java WJO object to MATLAB segsim (segment simulation) object Model transport through segments by Stefan-Maxwell equations including thermal diffusion Define segsim method to solve BVPs for each segment using a global spectral method (MWRtools) A: back-diffusion from common exhaust region to wafer surface, Si reduction by WF
21 Conclusions A prototype next-generation CVD reactor was constructed; initial testing demonstrated the feasibility of spatial patterning in CVD Initial success in developing an XML-based framework for online archiving and distributed simulation for semiconductor CVD manufacturing processes Current work focuses on Detailed surface chemistry modeling 3D simulation of gas composition between wafer and segment bottom Higher-resolution wafer metrology Gas delivery and other mechanical design improvements
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