SPECIFICATIONS. Endrich Bauelemente Vertriebs GmbH. Thick film chip thermistor TATEYAMA KAGAKU IND. CO., LTD. 1 / 7. Customer. Code No.

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1 Customer Endrich Bauelemente Vertriebs GmbH 1 /7 SPECIFICATIONS Code No. Type: TFT6G(2.00mm1.25mm) (Sn Plating) TFT3G(1.60mm0.80mm) (Sn Plating) TFT16G(1.00mm0.50mm) (Sn Plating) If you find herein anything not in order, please let us know immediately. Otherwise, these terms and conditions shall be expressly accepted by you. Date: Jun. 14, 2005 APPR. CHK DWG K. Murakami T. Horita T. Matsumoto 3-6 TSUKIOKA-MACHI, TOYAMA CITY TOYAMA JAPAN Tel: Fax:

2 Specifications VERSION 1 2 / 7 1 Scope This specification apply to thick film chip thermistor, product code is TFT6G/3G/16G. 2 Part Number (Example)TFT 6G J 154 H 410 V Item Code 1. Product name TFT TFT: (Sn Plating) 2. Size (ex) 6G 6G: 2.00mm1.25mm 3G: 1.60mm0.80mm 16G: 1.00mm0.50mm 3. Function (ex) Nil Nil: B 25/85 ( 1 = 25, 2 = 85) D: B 25/50 ( 1 = 25, 2 = 50) E: B 25/100 ( 1 = 25, 2 = 100) 4. Resistance tolerance (ex) J K: ±10% J: ±5% H: ±3% G: ±2% F: ±1% 5. Nominal resistance (ex) 472 (=4.7k) 154 (=150k) 3 figures : Applied to all nominal resistance. (E-24) (2 significant figures, number of zeros) 6. B-value tolerance (ex) H J: ±5% H: ±3% G: ±2% F: ±1% 7. Nominal B-value (ex) 345 (=3450K) 410 (=4100K) 8. Taping (ex) V V: 180 taping 3 Ratings 3.1 Ratings Item Spec Conditions Resistance Within specified value B-value Within specified value 3 figures : Applied except B-value 3435K. (3 significant figures) 4 figures : Only applied to B-value 3435K. (4 significant figures) Measured temperature: 25±0.1 C Measured power: 0.1mW or less Calculate B-value by expression in below. -value[](ln 1 ln 2 )(/ 1 / 2 ) 1, 2 resistance at 1, 2 [] 1, 2 absolute temperature of 1, 2 = ( )[], ( ) [] Dissipation factor Within 1.5mW/ C It means power to heat up 1 C of thermistor itself. Soldered with copper lead (0.1mm) and measured in the static air of 25. Thermal time constant Within 5sec It means time to change 63.2% of temperature from initial to stability. Soldered with copper lead (0.1mm) and measured in the static air. Rated power 5mW For thermistors operated in ambient temperature over 120 C, rated 100 power shall be derated in accordance with the curve right. Category temperature -40 C~+125 C (Note) Dissipation constant and thermal time constant are changed by soldering condition, environment. Ratio to dissipation(%) Ambient temperature

3 Specifications VERSION 1 3 / Resistance range and B-value B-value Standard resistance range Standard resistance range Standard resistance range 6G() 3G() 16G() 4610~4800K 47k~2M 68k~2M 100k2M 4410~4600K 10k~2M 10k~2M 10k~2M 4210~4400K 6.8k~2M 10k~2M 10k~2M 4010~4200K 1k~220k 1k~220k 10k~220k 3810~4000K 1k~150k 1k~150k 2k~150k 3610~3800K 1k~150k 1k~150k 2k~150k 3410~3600K 1k~150k 1k~150k 2k~150k 3210~3400K 680~150k 1k~150k 2k~150k 3010~3200K 220~150k 470~150k 680~68k 2810~3000K 100~100k 150~100k 500~47k 2610~2800K 100~1k 100~1k 100~10k 4 Performances and test methods Item Performances Test methods Resistance to soldering heat No mechanical damage. Temperature of solder: 260±5 C Immersion time: 10±1 seconds. Solderability Substrate bending At least 95%of termination covered with new solder No mechanical damage. Temperature of solder: 245±5 C Immersion time: 3±0.5 seconds. Preparation: Immersion in flux for 1~2 seconds. Flux: rosin: methanol = 25wt%:75wt% Solder: Sn-3.0Ag-0.5Cu Applied bending: 5mm Substrate: glass fiber base epoxy resin Holding time: 10±1seconds t=1.6mm unitmm R230 Strength Vibration Stability Low temperature Humidity Temperature cycle Load humidity No mechanical damage. Applied frequency: 10~55~10Hz / 1minute Amplitude: 1.5mm in each X,Y,Z directions Applied time: 2 hours in each X,Y,Z directions Temperature: 125±3 C Holding time: 1000± hours Temperature: -40±3 C Holding time: 1000± hours Temperature: 85±2 C Humidity: 85±5%RH Holding time: 1000± hours Repeat the temperature cycle as below 100 times. Step-40±3 C 30minutes Steproom temperature within 3minutes Step125±3 C 30minutes Steproom temperature within 3minutes Temperature: 85±2 C Humidity: 85±5% RH Applied power: rated power Holding time: 90minutes on, 30minutes off for 1000± hours

4 Specifications VERSION 1 4 / 7 5 Appearance and Dimensions 5.1 Appearance and construction Appearance: No mechanical damage and no abnormalities. Protective coating: Black. Construction: Thermistor Protective coating Term ination Inner + Second + Third Substrate Materials: Construction Main Material Substrate Al 2 O 3 (96%) Thermistor Thick film (Mn-Co) Protective coating Thick film (Glass) Inner termination Thick film (Ag-Pd) Second termination Plating(Ni) Third termination Plating(Sn) 5.2 Dimensions L Unit : mm t W b b L W t b 6G 2.00± ± ± ±0.20 3G 1.60± ± ± ± G 1.00± ± ± Taping 6.1 Materials Type of taping Carrier tape Top cover tape Bottom cover tape Taping of rectangular punched carrier system Paper Thermal adhesion plastics Thermal adhesion paper

5 Specifications VERSION 1 5 / Dimensions 6G, 3G 16G D0 D0 1 P0 P2 Sprocket hole 1 P0 Sprocket hole E E B F W B F W 2 Chip A P1 Rectangularly-hole component compartment Direction of unreeling 2 Chip A P1 Rectangularly-hole component compartment Direction of unreeling Type Unit:mm 6G G G Type G, 3G max. 1.40max. 16G max. 1.00max. remarkpitch tolerance over any 10 pitches of 0 is 0.2mm. 6.3 Performances of taping 1. Strength of carrier tape and cover tape: 10N(1.02kgf) or more 2. Peel force of top cover tape: 5~70gf (Peeling angle = 165~180, peeling speed = about 200mm/min.)

6 Specifications VERSION 1 6 / 7 7 Packaging 7.1 Tape Packaging 1.Quantity, reeling 6G,3G 16G Quantity 5,000(180reel) 10,000(180reel) Type of reel Plastics Adhesion Tape END Reel Chips Empty Portion Lead Part The length of the part combined adhesion tape and lead part should be kept over a quarter of adhesion tape. START Empty Portion Chips Empty Portion Lead Part 120mm or more 6G,3G 5,000 Pitches 16G 10, 000 Pitches 120mm or more 150mm or more 2.Reel dimensions, reel label Thick Film Chip ThermistorEx. Type TFT6G J154H410V R.Value 150k 5 B-Value Qty 5,000 LotNo TATEYAMA KAGAKU Made in JAPAN Label 180 reel Unit: mm A B C D E W1 W ± ± ± ± ±

7 Specifications VERSION 1 7 / Packing 1.Packaging of taping reel Pack reels into the box below. Label the packed box. L W T Unit: mm Thick Film Chip ThermistorEx. Type TFT6G J154H410V R.Value 150k 5 B-Value Qty 30,000 LotNo TATEYAMA KAGAKU Made in JAPAN 2.Outer carton box Pack some of above boxes contains reels into the carton box below. L W T Unit: mm 8 Notes 8.1 Storage The products should be kept packed and stored at a temperature of 15~35 C and a humidity of 25~85%RH. The products should not be left the place affected by direct sunlight and harmful gas (chlorine, sulfur, etc). 8.2 Application note Take measures against the damage and crack by mechanical mounting stress. Use soldering iron tip of below 20W, using time should be within 5 seconds per one time, besides temperature should be below 300 C. 8.3 Priority of specifications This specification shall precede the old specifications, the catalogues and others when some differences found out. 8.4 Conference If some problems which is not listed on this specification happen conferences between the two shall be made to solve the problems.