NTMFS4119NT3G. Power MOSFET. 30 V, 30 A, Single N Channel, SO 8 Flat Lead

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1 Power MOFET V,, ingle N Channel, O 8 Flat Lead Features Low R (on) Fast witching Times Low Inductance O 8 Package These are Pb Free evices V (BR) R (on) Typ I Max (Note ) pplications Notebooks, raphics Cards Low ide witch C C V. V. V MXIMUM RTIN ( unless otherwise noted) Parameter ymbol Value Unit rain to ource Voltage V V ate to ource Voltage V V Continuous rain Current teady T = C I 8 (Note ) tate T = 8 C Power issipation (Note ) Continuous rain Current (Note ) t s T = C teady P. W tate T = C t s 6. T = C I teady T tate = 8 C 8. Power issipation (Note ) T = C P.9 W Pulsed rain Current t p = s I M 89 Operating Junction and torage Temperature T J, T stg to C ource Current (Body iode) I 8. ingle Pulse rain to ource valanche Energy (V = V, V = V, I PK = 9, L = mh, R = ) Lead Temperature for oldering Purposes (/8 from case for s) THERML REITNCE MXIMUM RTIN E mj T L 6 C Parameter ymbol Value Unit Junction to Case teady tate R JC. C/W Junction to mbient teady tate (Note ) R J.7 Junction to mbient t s (Note ) R J. Junction to mbient teady tate (Note ) R J 8. tresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. urface mounted on FR board using in sq pad size (Cu area =.7 in sq [ oz] including traces).. urface mounted on FR board using the minimum recommended pad size (Cu area =. in sq). O 8 FLT LE CE 88 TYLE 9N Y WW ZZ ORERIN INFORMTION evice Package hipping NTMF9NT NTMF9NT O 8 FL (Pb Free) O 8 FL (Pb Free) MRKIN IRM 9N YWZZ = pecific evice Code = ssembly Location = Year = Work Week = Lot Traceability / Tape & Reel / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging pecification Brochure, BR8/. emiconductor Components Industries, LLC, May, Rev. 6 Publication Order Number: NTMF9N/

2 ELECTRICL CHRCTERITIC ( unless otherwise noted) Characteristic ymbol Test Condition Min Typ Max Unit OFF CHRCTERITIC rain to ource Breakdown Voltage V (BR) V = V, I = V rain to ource Breakdown Voltage Temperature Coefficient Zero ate Voltage rain Current I V = V, V = V V (BR) /T J 9 mv/ C. T J = C ate to ource Leakage Current I V = V, V = V n ON CHRCTERITIC (Note ) ate Threshold Voltage V (TH) V = V, I =.. V Negative Threshold Temperature Coefficient V (TH) /T J 7. mv/ C rain to ource On Resistance R (on) V = V, I = 9.. m V =. V, I =..8 Forward Transconductance g F V = V, I = Input Capacitance C I CHRE, CPCITNCE N TE REITNCE 8 pf Output Capacitance C O V = V, f =. MHz, V = V 8 Reverse Transfer Capacitance C R Total ate Charge Q (TOT) nc Threshold ate Charge Q (TH) 7. V =. V, V = V, I = 8 ate to ource Charge Q ate to rain Charge Q 7. ate Resistance R.7 WITCHIN CHRCTERITIC, V =. V (Note ) Turn On elay Time t d(on) Rise Time t r V =. V, V = V, 6 Turn Off elay Time t d(off) I =., R =. Fall Time t f RIN OURCE IOE CHRCTERITIC Forward iode Voltage V V = V, I = 8. 8 ns.7. V T J = C.6 Reverse Recovery Time t RR 6. ns Charge Time t a V = V, di /dt = / s, 9. ischarge Time t b I = Reverse Recovery Charge Q RR 7 nc. Pulse Test: Pulse Width s, uty Cycle %.. witching characteristics are independent of operating junction temperatures.

3 TYPICL PERFORMNCE CURVE I, RIN CURRENT (MP) V V V 6 V =.8 V to V. V 6. V. V T J = C.8 V.6 V V, RIN TO OURCE VOLTE (VOLT) I, RIN CURRENT (MP) T J = C V, TE TO OURCE VOLTE (VOLT) Figure. On Region Characteristics Figure. Transfer Characteristics R (on), RIN TO OURCE REITNCE ( ) I = V, TE TO OURCE VOLTE (VOLT) I, RIN CURRENT (MP) Figure. On Resistance vs. ate to ource Voltage R (on), RIN TO OURCE REITNCE ( )..... V =. V V = V Figure. On Resistance vs. rain Current and ate Voltage R (on), RIN TO OURCE REITNCE (NORMLIZE) I = 9 V = V I, LEKE (n) V = V T J = C T J = C T J, JUNCTION TEMPERTURE ( C) V, RIN TO OURCE VOLTE (VOLT) Figure. On Resistance Variation with Temperature Figure 6. rain to ource Leakage Current vs. Voltage

4 TYPICL PERFORMNCE CURVE C, CPCITNCE (pf) C iss C oss 7 C rss TE TO OURCE OR RIN TO OURCE VOLTE (VOLT) Figure 7. Capacitance Variation V = V V, TE-TO-OURCE VOLTE (VOLT) V Q QT Q V I = 8 Q, TOTL TE CHRE (nc) Figure 8. ate To ource and rain To ource Voltage vs. Total Charge 6 8 V, RIN-TO-OURCE VOLTE (VOLT) t, TIME (ns) V = V I = V =. V t f t d(off) t d(on) t r I, OURCE CURRENT (MP) 8 6 V = V R, TE REITNCE (OHM) V, OURCE TO RIN VOLTE (VOLT).9 Figure 9. Resistive witching Time Variation vs. ate Resistance Figure. iode Forward Voltage vs. Current

5 PCKE IMENION. C. C 8X b. C B. c L X TOP VIEW IE VIEW e/. C B X E E ETIL. C c FN x6,.7p (O 8FL) CE 88 IUE X e ETIL X C ETIN PLNE OLERIN FOOTPRINT* X.7 X.7 X. NOTE:. IMENIONIN N TOLERNCIN PER ME Y.M, 99.. CONTROLLIN IMENION: MILLIMETER.. IMENION N E O NOT INCLUE MOL FLH PROTRUION OR TE BURR. MILLIMETER IM MIN NOM.9.. b.. c..8. BC..9. E 6. BC E..8 E. e.7 BC..6 K.. L..6 L..7 M.. TYLE : PIN. OURCE. OURCE. OURCE. TE. RIN MX PIN (EXPOE P) E K L M.96. X.9. X.9..7 BOTTOM VIEW X..6 *For additional information on our Pb Free strategy and soldering details, please download the ON emiconductor oldering and Mounting Techniques Reference Manual, OLERRM/. ON emiconductor and are registered trademarks of emiconductor Components Industries, LLC (CILLC). CILLC reserves the right to make changes without further notice to any products herein. CILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does CILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in CILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. CILLC does not convey any license under its patent rights nor the rights of others. CILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the CILLC product could create a situation where personal injury or death may occur. hould Buyer purchase or use CILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold CILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that CILLC was negligent regarding the design or manufacture of the part. CILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORERIN INFORMTION LITERTURE FULFILLMENT: Literature istribution Center for ON emiconductor P.O. Box 6, enver, Colorado 87 U Phone: 67 7 or 8 86 Toll Free U/Canada Fax: or Toll Free U/Canada orderlit@onsemi.com N. merican Technical upport: Toll Free U/Canada Europe, Middle East and frica Technical upport: Phone: 79 9 Japan Customer Focus Center Phone: 8 87 ON emiconductor Website: Order Literature: For additional information, please contact your local ales Representative NTMF9N/

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