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1 PCB Power Delivery Design from DC to Mid-Frequency Foxconn Abby Chou
2 Company Introduction February 1974 Tucheng District 1.23 million Server Storage Mobile Phone Pad TV
3 Voltage Drop and Thermal Co-Simulation
4 Illustration for Voltage Drop Energy Energy
5 How to Calculate Resistance 40mil trace width for 1A current? R Copper = L ρ A = 1 L σ A Need to take cross-section area and length into consideration. 40mil? Length 1A R : Resistance (Ω) ρ : Resistivity (Ω*m) σ : Conductivity (S/m) L : Length (m) A : Cross-Section Area (m 2 ) Cross-Section
6 Analysis in PowerDC For the irregular shape, manual calculation by formula is difficult and simulation is necessary. VRM SINK
7 Voltage Drop Correlation Equivalent MB resistance matrix derived from PowerDC FB1 FB2 FB3 FB4 FB5 FB6 FB7 FB8 Measured 1.474V 1.480V 1.477V 1.483V 1.481V 1.488v 1.487V 1.493v Simulated 1.473V 1.475V 1.477V 1.480V 1.482V 1.485V 1.489V 1.493V
8 PCB Temperature HOT!! High Current Density High Temperature Rise PCB Burned
9 PCB Temperature Simulator PCB temperature become higher and more important due to the larger current. Copper Width : 1mm, Cross-Section : 0.067mm 2 Current : 1.1A, PCB Temperature Rise : 5 o C Copper Width (mm) Current (A) Cross-Section (mm 2 ) Cross-Section (mm 2 ) 9
10 PCB Temperature Distribution Foxconn in-house tool can calculate PCB temperature distribution by using copper width, cross-section and flowing current. (Ref. doc. : IPC-2221, IPC-2152) 2 ~ 3 variation due to the air-flow and heat transfer. In-House Simulator Infrared Ray Camera
11 Temperature Simulation in PowerDC (1/2) Total power: 1400W Variation < 4
12 Temperature Simulation in PowerDC (2/2) Total power: 3900W Simulation Measurement Variation < 5
13 Via Current Simulation in PowerDC (1/2) The connector via current can not over 10A for thermal concern. Current Vector & Density Plot Via Current Plot Over 10A! 7.7A 6.4A 6.5A 7.8A 11A
14 Via Current Simulation in PowerDC (2/2) Cut the shape to change path resistance for via current balancing purpose. Current Vector & Density Plot Via Current Plot Under 10A! 7.1A 6.1A 8.1A 8.8A 9.3A
15 PDN AC Analysis
16 Power Delivery Network VRM Bulk MLCC Plane Package Chip Impedance khz MHz GHz Freq.
17 Transient Simulation VR Model PDN extract by PowerSI Load
18 Transient Voltage Correlation Simulation Measurement Measurement Value Simulation Value Difference 1 st Voltage Spike 1.086V V 0.3mV
19 Measurement Fail Issue The min voltage fail to meet specification.
20 Transient Correlation - Original Using PowerSI to extract PDN model to get transient waveform. Max Voltage Simulation Results Measurement Results Min Voltage Simulation Measurement Min Voltage (V)
21 Failure Issue Analysis Simulation Measurement V1=L loop *di/dt V2=R loop * I V1 V2 It can be found that the parasitic loop inductance dominates most of the droop. Thus it is necessary to inspect the loop inductance of board file.
22 Impedance Analysis in PowerSI The original 22uF MLCC self-resonant frequency is 2.36MHz, but now it moves to 700kHz. MLCC self-resonant is around 700kHz.
23 Current Loop Analysis Original: Top Pwr2 Cap (Top) CPU 2.7mil 50mil VCCP GND Improvement: Change pwr2 to GND plane Gnd3 Bottom Top Pwr2 Cap (Top) CPU 2.7mil 2.7mil 50mil Gnd3 Bottom 2.7mil
24 Loop Inductance Analysis in OPI Original Improvement Top Layer For overall loop inductance, improvement case is better than original.
25 Measurement Original Layout After Modifying Layout CH1:VCCP CH1:VCCP CH2:Io CH2:Io Spec. = 70mV Original Layout Modified Layout Voltage Droop (mv) Improvement V = = mv
26 Summary Simulation tools can.. help designer to ensure design quality predict validation results and has good correlation verify designer s thought and find the best solution more..
27
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