BS0060N-2C. Order Code: B006N2C. Exterior. Features. Agency Approvals. Schematic Symbol. Part SMB-T. Weight:88mg Non degenerative. Video.

Transcription

1 eatures xterior xcellent capability of absorbing transient surge Quick response to surge voltage(ns Level) liminates overvoltage caused by fast rising transients Moisture sensitivity level: level 1 Weight:88mg Non degenerative SM-T pplication information Package (Top iew) ` ideo N2C d gency pprovals Schematic Symbol Icon escription Compliance with 2011/65/U Compliance withic :2003 Part Number and lectrical Parameterr IRM@RM S IS T@ IT I CO 2 Part Number μ m m p MX Pin1,3-2 Pin1,3-2 MX MIN MX bsolute maximum ratings measured at T= 25ºC R = 45%-75% (unless otherwise noted). 1s is measured at 100K/S 2 Off-state Capacitance is measured at C=2,RMS=1,f=1Mz 1/5

2 Part Numbering System Mark S N 2 C (1) (2) ( 3) (4) (5) (1)encent Semiconductor Surge rrester (2)Off state voltage,e.g:0060= =6. (3) Package : SM-T (4) 2 Lines Protection (5) Rating Surge oltage: 6K(10/700μS) 006N2C N2C: Part Number 1309 : September, I Curve Parameters efinitionn +I RM Peak Off-stateoltage IRM Off-stateCurrent IT IS S Switching oltage I IS I Switching Current olding Current - IRM T RM + T On-state oltage S IT On-state Current CO Surge Ratings Off-state Capacitance - I Current Waveform oltage Waveform 2/10μs 2/10μs 8/20μs 1.2/50μs 10/160μs 10/160μs 5/320μs* 10/700μs* 10/1000μs 10/1000μs Ipp Peak pulse current rating (I PP P) is repetitivee and guaranteed for the life of the product; -encent only makes the test for (10/700μs@6K), but for other IPP valuederived from experiencee is just for reference only. encent will not take any obligation for these parameters, so before applyingour parts, please make sure to verify the parameters listed in the above table. Thermal Considerations Product Characteristics Symbol Parameter alue Unit Lead Material Copper lloy T TJ Operating Junction Temperature Range -40 to +150 ody Material UL recognized epoxy meeting flammability classification 94-0 T TS Storage Temperature Range -60 to +150 Terminal inish 100% Matte-Tin Plated 2/5

3 Typical Characteristics 3/5

4 nvironmental Characteristics Testing Items Technical Standards igh Temperature Reverse ias Test igh Temperature Life Test igh-low Temperature Cycle Test igh Temperature &igh umidity Test Pressure Cooker Test Resistance of Soldering eat Temperature: 150±3, ias=80% Time:168 %RM Temperature: 150 Time:168 Temperature:rom -40 to125 well time: 30min, cycles Temperature: 85 umidity:85% Test time:168 Temperature: 121, 2atm. umidity:100% Test time: 24 to 168 Temperature: 260±5 Time of dip soldering: 10s, 3times Note: The above testing items can be specified by customers by contacting encent service Product imensions R mm 5.4± ± ± ±0.012 C 0.7± ± ± ±0.008 ottom view 0.9± ± ± ±0.012 I G 1.13± ± ± ±0.012 Side view Recommended Soldering Pad I 0.25± ±0.002 R C mm /5

5 Reflow Profile Reflow Condition Pb-ree ssembly Temperature Min C Pre eat Temperature Max C Time(Min to Max) secs. verage ramp up rate(liquidustemp( ) to peak) TS(max) to TL - Ramp-up Rate - Temperature (T L ) Reflow (Liquidus) 3 C/ /sec. Max. 3 C/ /sec. Max C - Temperature (T L ) secs. Temperature T P T S(max) T S(min) Ramp-up Preheat T P Critical Zone TL to TP Ramp-down Peak Temp (T P ) +(260+0/-5 ) C T S Time within 5 C of actual Peak Temp (T P ) Ramp-down Rate 8 15 secs. 6 C/ /sec. Max. 25 time to peak temperature Time Time 25 C to peak Temp (T P ) 8 min. Max. o not exceed +260 C Package Reel Information R d 1 2 P P0 P1 W W1 mmm 3.65+/ / / / / / /-3 13+/ / / / / / / / / / / / / / / / / / / / / / / / / / / Outline Reel (pcs) Per Carton (pcs) Reel iameters (mm) L Carton Size(mm) W Taping 3,000 24, /5