Ultra-Low-Noise, High PSRR, Low-Dropout, 300mA Linear Regulator VOUT V OUT GND

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1 Ultra-Low-Noise, High PSRR, Low-Dropout, 300m Linear Regulator Features General Description Wide Operating Voltage: 2.5~6V Low Dropout Voltage: 3V/300m Fixed Output Voltages: 1.2~3.7V with Step 100mV, and 2.85V, 4.75V Guaranteed 300m Output Current High PSRR: 70dB Current-Limit Protection Controlled Short-Circuit Current: 50m Over-Temperature Protection Stable with 1mF Capacitor for ny Load Excellent Load/Line Transient SOT-23-5, TSOT-23-5, SOT-23-3, SC-70-5, VTDFN1.2x1.6-4, and TDFN1.6x1.6-6 Packages Lead Free and Green Devices vailable (RoHS Compliant) The PL5320 is a P-channel low dropout linear regulator which needs only one input voltage from 2.5 to 6V, and delivers current up to 300m to set output voltage. It also can work with low ESR ceramic capacitors and is ideal for using in the battery-powered applications such as notebook computers and cellular phones. Typical dropout voltage is only 290mV at 300m loading. The PL5320 provides several versions of fixed output voltages ranging from 1.2 to 3.7V with step 100mV and 2.85V, 4.75V. Current-limit with current foldback and thermal shutdown functions protects the device against current over-loads and over-temperature. The PL5320 is available in SOT-23-5, TSOT-23-5, SOT-23-3, SC-70-5, VTDFN1.2x1.6-4, and TDFN 1.6x1.6-6 packages. Pin Configuration pplications Cellular Phones Portable and Battery-Powered Equipments Laptops, Palmtops, Notebook Computers Wireless LNs Portable Information ppliances GPSes Simplified pplication Circuit Enable VIN SHDN GND VOUT VIN 1 GND 2 SHDN 3 5 VOUT 4 NC SOT23-5/TSOT-23-5/SC-70-5 (Top View) VTDFN1.2x1.6-4 (Top View) VOUT 1 4 VIN SHDN 1 6 GND NC 2 5 NC GND 2 3 SHDN VIN 3 4 VOUT TDFN1.6x1.6-6 (Top View) = Exposed Pad (connected to ground plane for better heat dissipation) NPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. 1

2 Ordering and Marking Information PL5320 ssembly Material Handling Code Temperature Range Package Code Voltage Code Package Code B : SOT-23-5 BT : TSOT-23-5 : SOT-23-3 S5 : SC-70-5 QB : TDFN1.6x1.6-6 QF: VTDFN1.2x1.6-4 Operating mbient Temperature Range I : -40 to 85 o C Handling Code TR : Tape & Reel Voltage Code 12 : 1.2V 36 : 3.6V ssembly Material G : Halogen and Lead Free Device Note : NPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. NPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. NPEC defines Green to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). SOT-23-5 Product Name Marking Product Name Marking Product Name Marking Product Name Marking PL B 205 PL B 207 PL B 208 PL B 209 PL B 20 PL B 20B PL B 20C PL B 20D PL B 20E PL B 20F PL B 20G PL B 20H PL B 20I PL B 20J PL B 20K PL B 20L PL B 20M PL B 20N PL B 20O PL B 20P PL B 20Q PL B 20R PL B 20S PL B 20T PL B 20g PL B 20d PL B 206 PL B 204 Note: - Code. TSOT-23-5 Product Name Marking Product Name Marking Product Name Marking Product Name Marking PL BT 205 PL BT 207 PL BT 208 PL BT 209 PL BT 20 PL BT 20B PL BT 20C PL BT 20D PL BT 20E PL BT 20F PL BT 20G PL BT 20H PL BT 20I PL BT 20J PL BT 20K PL BT 20L PL BT 20M PL BT 20N PL BT 20O PL BT 20P PL BT 20Q PL BT 20R PL BT 20S PL BT 20T PL BT 20g PL BT 20d PL BT 206 PL BT 204 Note: - Code. SOT-23-3 Product Name Marking Product Name Marking Product Name Marking Product Name Marking PL PL PL PL PL PL B PL C PL D PL E PL F PL G PL H PL I PL J PL K PL L PL M PL N PL O PL P PL Q PL R PL S PL T PL g PL d PL PL Note: - Code. 2

3 Ordering and Marking Information (Cont.) TDFN1.6x1.6-6 Product Name Marking Product Name Marking Product Name Marking Product Name Marking PL QB PL QB PL QB PL QB PL QB PL QB PL QB Note: - Code. SC E 20I 20M 20Q 20g PL QB PL QB PL QB PL QB PL QB PL QB PL QB B 20F 20J 20N 20R 20d PL QB PL QB PL QB PL QB PL QB PL QB PL QB C 20G 20K 20O 20S 206 PL QB PL QB PL QB PL QB PL QB PL QB PL QB Product Name Marking Product Name Marking Product Name Marking Product Name Marking PL S5 205 P S5 207 PL S5 208 PL S5 209 PL S5 20 PL S5 20B PL S5 20C PL S5 20D PL S5 20E PL S5 20F PL S5 20G PL S5 20H PL S5 20I PL S5 20J PL S5 20K PL S5 20L PL S5 20M PL S5 20N PL S5 20O PL S5 20P PL S5 20Q PL S5 20R PL S5 20S PL S5 20T PL S5 20g PL S5 20d PL S5 206 PL S D 20H 20L 20P 20T 204 VTDFN1.2x1.6-4 Product Name Marking Product Name Marking Product Name Marking Product Name Marking PL QF PL QF PL QF PL QF PL QF PL QF PL QF Note : - Code E 0I 0M 0Q 0g PL QF PL QF PL QF PL QF PL QF PL QF PL QF 07 0B 0F 0J 0N 0R 0d PL QF PL QF PL QF PL QF PL QF PL QF PL QF 08 0C 0G 0K 0O 0S 06 PL QF PL QF PL QF PL QF PL QF PL QF PL QF 09 0D 0H 0L 0P 0T 04 3

4 bsolute Maximum Ratings (Note 1) Symbol Parameter Rating Unit VIN to GND Voltage -0.3 ~ 6.5 V VOUT to GND Voltage -0.3 ~ 6.5 V V SHDN SHDN to GND Voltage -0.3 ~ 6.5 V T J Maximum Junction Temperature -40 ~ 150 T STG Storage Temperature -65 ~ 150 T SDR Maximum Lead Soldering Temperature, 10 Seconds 260 o C o C o C Note 1 : bsolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Typical Value Unit θ J (Note 2) Junction-to-mbient Resistance in Free ir SOT-23-5 TSOT-23-5 SOT-23-3 SC-70-5 TDFN1.6x1.6-6 VTDFN1.2x1.6-4 Note 2 : θ J is measured with the component mounted on a high effective thermal conductivity test board in free air o C/W Recommended Operating Conditions (Note 3) Symbol Parameter Range Unit VIN Input Voltage 2.5 ~ 6 V V SHDN SHDN Input Voltage 2.5 ~ 6 V I OUT VOUT Output Current 0 ~300 m Output Voltage Fixed Voltage C OUT Output Capacitor 1~22 µf T mbient Temperature -40 ~ 85 T J Junction Temperature -40 ~ 125 o C o C Note 3 : Refer to the typical application circuit. Electrical Characteristics Unless otherwise specified, these specifications apply over = +1V, C IN =C OUT =1µF and T =-40~85 o C. Typical values are at T =25 o C. Symbol Parameter Test Conditions UNDER-VOLTGE LOCKGE (UVLO) ND SUPPLY CURRENT PL5320 Min. Typ. Max. Unit VIN UVLO Threshold Voltage rising, T =-40~85 o C V VIN UVLO Hysteresis V I Q Quiescent Current I OUT=0m, V SHDN=5V µ I OUT=300m V SHDN=5V µ I QSHDN Shut Down Supply Current V SHDN=0V, = +1V µ 4

5 Electrical Characteristics (Cont.) Unless otherwise specified, these specifications apply over = +1V, C IN =C OUT =1µF and T =-40~85 o C. Typical values are at T =25 o C. Symbol Parameter Test Conditions OUTPUT VOLTGE PL5320 Min. Typ. Max. Unit Output Voltage ccuracy REG LINE Line Regulation REG LOD Load Regulation V DROP Dropout Voltage I OUT=1m, T =25 o C -2-2 % I OUT=1m to 300m, T =-40~85 o C -3-3 % VOUT%/ VIN, +0.3V<<6V, I OUT=1m VOUT%, = +1V, 0m<I OUT<300m %/V % =1.5V, I OUT=300m V =2V, I OUT=300m V =3V, I OUT=300m V OUTPUT VOLTGE PSRR Ripple Rejection C OUT=1µF, I OUT=50m f=1khz db f=10khz db f=100khz db SHUT DOWN Output Noise f=10hz to 100kHz, C OUT=10µF, I OUT = 1m µv RMS VOUT Discharge Resistance V SHDN=0V kω V SHDN High Threshold Voltage =2.5 to 6V V Low Threshold Voltage =2.5 to 6V V I SHDN SHDN Input Current V SHDN=5V µ PROTECTIONS I LIMIT Current-Limit Threshold m I SHORT Short-Circuit Current =0V m t SS Soft-Start VOUT rising from 0 to 90%, R LOD=50Ω µs TOTP Over-Temperature Threshold T J rising Over-Temperature Hysteresis o C o C 5

6 Typical Operating Characteristics Quiescent Current vs. Supply Voltage Quiescent Current vs. Temperature PL , =V EN =4.2V Quiescent Current (µ) Quiescent Current (µ) Supply Voltage (V) Temperature ( o C) PSRR (db) PSRR vs. Frequency PL , =4V, C OUT =1µF, I OUT =50m Dropout Voltage (mv) Dropout Voltage vs. Output Current PL , C OUT =1µF T J =25 o C T J =125 o C T J =-40 o C k 10k 100k 1M Frequency (Hz) Output Current (m) Output Noise Current-Limit Threshold vs. Input Voltage Output Noise (µv) PL , I OUT =50m, =V EN =4.2V(Battery) Current-Limit (m) Time (ms) Input Voltage (V) 6 6

7 Typical Operating Characteristics (Cont.) Current-Limit Threshold vs. Temperature Quiescent Current vs. Output Current Current-Limit (m) Quiescent Current (µ) PL , C OUT =1µF, =V EN =4.2V Temperature ( o C) Output Current (m) EN Pin Threshold (V) SHDN Pin Threshold Voltage vs. Supply Voltage SHDN Rising Threshold SHDN Falling Threshold Supply Voltage (V) 6 7

8 Operating Waveforms The test condition is =4.2V, T = 25 o C unless otherwise specified. Load Transient Response Load Transient Response I OUT 2 I OUT =4.2V, =1.2V, C IN =C OUT =1µF, =4.2V, =1.2V, C IN =C OUT =1µF, I OUT =10m to 300m to 10m ( µ I OUT =10m to 150m to 10m ( µ CH1:, 50mV/Div, DC, Offset=1.2V CH1:, 50mV/Div, DC, Offset=1.2V CH2: I OUT, 200m/Div, DC CH2: I OUT, 100m/Div, DC TIME: 20µs/Div TIME: 20µs/Div Load Transient Response Line Transient Response I OUT =4.2V, =1.2V, C IN =C OUT =1µF, I OUT =10m to 50m to 10m ( µ CH1:, 20mV/Div, DC, Offset=1.2V CH2: I OUT, 50m/Div, DC TIME: 20µs/Div =3.8V to 4.8V to 3.8V ( µ, =1.2V, C IN =C OUT =1µF, I OUT =100m CH1:, 500mV/Div, DC, Offset=3.8V CH2:, 20mV/Div, DC, Offset=1.2V TIME: 20µs/Div 8

9 Operating Waveforms (Cont.) The test condition is =4.2V, T = 25 o C unless otherwise specified. Line Transient Response Line Transient Response =3.8V to 4.8V to 3.8V ( µ, =1.2V, C IN =C OUT =1µF, I OUT =50m CH1:, 500mV/Div, DC, Offset=3.8V CH2:, 20mV/Div, DC, Offset=1.2V TIME: 20µs/Div =3.8V to 4.8V to 3.8V ( µ, =1.2V, C IN =C OUT =1µF, I OUT =10m CH1:, 500mV/Div, DC, Offset=3.8V CH2:, 20mV/Div, DC, Offset=1.2V TIME: 20µs/Div Exiting Shutdown Entering Shutdown 1 V SHDN 1 V SHDN 2 2 =4.2V, =1.2V, C IN =C OUT =1µF, I OUT =10m CH1: V SHDN, 2V/Div, DC CH2:, 500mV/Div, DC TIME: 20µs/Div =4.2V, =1.2V, C IN =C OUT =1µF, I OUT =10m CH1: V SHDN, 2V/Div, DC CH2:, 500mV/Div, DC TIME: 10µs/Div 9

10 Pin Description PIN SOT-23-5/ TSOT-23-5/ SC-70-5 SOT-23-3 NO. TDFN 1.6x1.6-6 VTDFN 1.2x1.6-4 NME VIN Voltage Supply Input Pin. FUNCTION GND Ground SHDN 4-2, 5 - NC NC Pin VOUT Regulator Output Pin. Shut Down Control Pin. Logic high: enable; logic low: shutdown. This pin can not be left floating. Block Diagram SHDN Thermal Shutdown Current- Limit VIN VOUT V REF GND Typical pplication Circuit VIN PL5320 VOUT C IN 1µF SHDN GND C OUT 1µF Enable Shutdown 10

11 Function Description Internal Soft-Start n internal soft-start function controls rising rate of the output voltage to limit the surge current at start-up. The typical soft-start interval is about 60µs. Thermal Shutdown thermal shutdown circuit limits the junction temperature of PL5320. When the junction temperature exceeds +160 o C, a thermal sensor turns off the output PMOS, allowing the device to cool down. The regulator regulates the output again through initiation of a new soft-start cycle after the junction temperature cools by 40 o C.The thermal shutdown is designed with a 40 o C hysteresis to lower the average junction temperature during continuous thermal overload conditions, extending lifetime of the device. For normal operation, device power dissipation should be externally limited so that junction temperature will not exceed 125 o C. Current-Limit with Current Foldback The PL5320 monitors the current via the output PMOS and limits the maximum current. When the output current reaches the current-limit threshold, current-limit with current foldback circuit starts to work to prevent load and PL5320 from damages during overload or short-circuit conditions. Typical foldback current is about 50m. Shutdown Control The PL5320 has an active-low shutdown function. Forcing SHDN high (>1.5V) enables the ; forcing SHDN low (<0.4V) disables the. The SHDN can not be left floating. If it is not used, connect it to VIN for normal operation. Under-Voltage Lock Out (UVLO) The PL5320 monitors the input voltage to prevent wrong logic control. The UVLO function initiates a soft-start process after input voltage exceeds its rising UVLO threshold during power on. The UVLO function also shuts off the output when the input voltage falls below it s falling threshold. 11

12 pplication Information Input capacitor The PL5320 requires proper input capacitors to supply surge current during stepping load transients to prevent the input rail from dropping. Because the parasitic inductor from the voltage sources or other bulk capacitors to the VIN limit the slew rate of the surge current, place the Input capacitors near VIN as close as possible. Input capacitors should be larger than 1µF and a minimum ceramic capacitor of 1µF is necessary. Output Capacitor The PL5320 needs a proper output capacitor to maintain circuit stability and improve transient response overtemperature and current. In order to insure the circuit stability, the proper output capacitor value should be larger than 1µF. With 5R and 7R dielectrics, 1µF is sufficient at all operating temperatures. Large output capacitor value can reduce noise and improve load-transient response and PSRR, Figure 1 shows the curves of allowable ESR range as the function of load current for various output capacitor values. Region of Stable C OUT ESR (Ω) Region of Stable C OUT ESR vs. Output Current Unstable Range Stable Range Simulation Verify Output Current (m) PL =V EN =4.2V C IN =C OUT =1µF/7R Figure1. Stable C OUT ESR Range Operation Region and Power Dissipation The PL5320 maximum power dissipation depends on the thermal resistance and temperature difference between the die junction and ambient air. The TDFN1.6x1.6-6 package power dissipation P D across the device is: P D = (T J - T ) / θ J where (T J - T ) is the temperature difference between the junction and ambient air. θ J is the thermal resistance between Junction and ambient air. ssuming the T =25 o C and maximum T J =160 o C (typical thermal limit threshold), the maximum power dissipation is calculated as: P D (max)=(160-25)/165=0.81(w) For normal operation, do not exceed the maximum junction temperature rating of T J =125 o C. The calculated power dissipation should be less than: P D =(125-25)/165=0.6(W) The GND provides an electrical connection to the ground and channels heat away. Connect the GND to the ground by using a large pad or a ground plane. Layout Consideration Figure 2 illustrates the layout. Below is a checklist for your layout: 1. Please place the input capacitors close to the VIN. 2. Ceramic capacitors for load must be placed near the load as close as possible. 3. To place PL5320 and output capacitors near the load is good for performance. 4. Large current paths, the bold lines in figure 2, must have wide tracks. OFF ON VIN SHDN GND VOUT Figure2. Large Current Paths Shown as Bold Lines 12

13 pplication Information(Cont.) Recommended Minimum Footprint SOT-23-5/TSOT-23-5 SC-70-5 TDFN1.6x1.6-6 VTDFN1.2x

14 Package Information SOT-23-5 D e SEE VIEW e1 b c E1 E L 0 GUGE PLNE SETING PLNE VIEW S Y M B O L 1 2 b c D E E1 e e1 L MIN MILLIMETERS 0.95 BSC 1.90 BSC M SOT-23-5 MIN INCHES BSC BSC M Note : 1. Follow JEDEC TO Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 14

15 Package Information TSOT-23-5 D e SEE VIEW E1 E b c e1 2 1 L 0.25 GUGE PLNE SETING PLNE S Y M MILLIMETERS B O L MIN. M. 1 c D E E1 e e1 L b BSC 1.90BSC TSOT-23-5 VIEW MIN INCHES BSC M BSC Note : 1. Followed from JEDEC TO Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 15

16 Package Information SC-70-5 D e SEE VIEW 2 1 VIEW L 0.15 E1 E b c e1 GUGE PLNE SETING PLNE S Y M SC-70-5 B O L MIN. M. MIN. M. MILLIMETERS INCHES b c D E E1 e e1 L BSC BSC 1.30 BSC BSC o 8 o 0 o 8 o Note : 1. Followed from JEDEC MO-223 B. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 16

17 Package Information SOT-23-3 D e SEE VIEW E1 E b c e1 1 L 0 GUGE PLNE SETING PLNE S Y M B O L 1 2 b c D E E1 e e1 L MIN MILLIMETERS 0.95 BSC 1.90 BSC M SOT-23-3 VIEW MIN INCHES BSC BSC M Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 17

18 Package Information TDFN1.6x1.6-6 D D2 L K b E Pin 1 1 E2 3 Pin 1 Corner e S TDFN1.6x1.6-6 Y M B MILLIMETERS INCHES O L MIN. M. MIN. M REF REF b D D E E e 0.50 BSC BSC K L

19 Package Information VTDFN1.2x1.6-4 D e E2 b E Pin 1 Cirner D2 K L S Y M VTDFN1.2x1.6-4 B O L MIN. M. MIN. M. MILLIMETERS INCHES b D D2 E E e 0.60 BSC BSC L K

20 Carrier Tape & Reel Dimensions OD0 P0 P2 P1 W F E1 B 0 OD1 B T B0 K0 SECTION - SECTION B-B d H T1 pplication H T1 C d D W E1 F SOT MIN MIN MIN P0 P1 P2 D0 D1 T 0 B0 K MIN pplication H T1 C d D W E1 F TSOT MIN MIN MIN P0 P1 P2 D0 D1 T 0 B0 K MIN pplication H T1 C d D W E1 F SOT MIN MIN MIN P0 P1 P2 D0 D1 T 0 B0 K MIN (mm) 20

21 Carrier Tape & Reel Dimensions (Cont.) pplication H T1 C d D W E1 F SC MIN MIN MIN P0 P1 P2 D0 D1 T 0 B0 K MIN pplication H T1 C d D W E1 F TDFN1.6x MIN MIN MIN P0 P1 P2 D0 D1 T 0 B0 K MIN pplication H T1 C d D W E1 F VTDFN1.2x MIN MIN MIN P0 P1 P2 D0 D1 T 0 B0 K MIN MIN 1.8 MIN (mm) Devices Per Unit Package Type Unit Quantity SOT-23-5 Tape & Reel 3000 TSOT-23-5 Tape & Reel 3000 SOT-23-3 Tape & Reel 3000 SC-70-5 Tape & Reel 3000 TDFN1.6x1.6-6 Tape & Reel 3000 VTDFN1.2x1.6-4 Tape & Reel 3000 Taping Direction Information (T)SOT-23-5 USER DIRECTION OF FEED 21

22 Taping Direction Information (Cont.) SOT-23-3 USER DIRECTION OF FEED SC-70-5 USER DIRECTION OF FEED TDFN1.6x1.6-6 USER DIRECTION OF FEED 22

23 Taping Direction Information (Cont.) VTDFN1.2x1.6-4 Classification Profile 23

24 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic ssembly Pb-Free ssembly Preheat & Soak Temperature min (T smin) Temperature max (T smax) Time (T smin to T smax) (t s) 100 C 150 C seconds 150 C 200 C seconds verage ramp-up rate (T smax to T P) 3 C/second max. 3 C/second max. Liquidous temperature (T L) Time at liquidous (t L) Peak package body Temperature (T p)* Time (t P)** within 5 C of the specified classification temperature (T c) 183 C seconds 217 C seconds See Classification Temp in table 1 See Classification Temp in table 2 20** seconds 30** seconds verage ramp-down rate (T p to T smax) 6 C/second max. 6 C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (T p) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Volume mm <2.5 mm 235 C 220 C 2.5 mm 220 C 220 C Table 2. Pb-free Process Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Volume mm Volume mm 3 >2000 <1.6 mm 260 C 260 C 260 C 1.6 mm 2.5 mm 260 C 250 C 245 C 2.5 mm 250 C 245 C 245 C Reliability Test Program Test item Method Description SOLDERBILITY JESD-22, B102 5 Sec, 245 C HOLT JESD-22, Hrs, T j=125 C PCT JESD-22, Hrs, 100%RH, 2atm, 121 C TCT JESD-22, Cycles, -65 C~150 C HBM MIL-STD VHBM 2KV MM JESD-22, 115 VMM 200V Latch-Up JESD 78 10ms, 1 tr 100m 24

25 Customer Service npec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : Fax : Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : Fax :

General Description V IN C IN VOUT 1 VIN GND 2 VIN 3

General Description V IN C IN VOUT 1 VIN GND 2 VIN 3 Low Dropout 600mA Fixed Voltage Linear Regulator Features Low Dropout Voltage: 220mV (Typical) @600mA Wide Input Voltage from 2.9V~6.5V Low Quiescent Current: 140mA Output Voltage Range : 1~5V Fixed Output