AOZ1336DI. Single Channel Smart Load Switch. Features. General Description. Applications. Typical Application AOZ1336DI

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Single Channel Smart Load Switch General Description The AOZ1336DI is a single channel load switch with typical 27mΩ on-resistance in a small package. It contains an n-channel MOSFET for up to 5.

1 Single Channel Smart Load Switch General Description The AOZ1336DI is a single channel load switch with typical 27mΩ on-resistance in a small package. It contains an n-channel MOSFET for up to 5.5V input voltage operation and 4A current channel with 2.5V to 5V bias supply. The load switch is independently controlled by a low voltage control signal through ON pin. The AOZ1336DI integrates an internal 22Ω load resistor for quick output discharge when load switch is off. The optional external capacitor connected CT for output slew rate control. The AOZ1336DI is available in a 2mm x 2mm DFN-8L package with bottom thermal pad and is rated over a -4 C to +85 C ambient temperature range. Features.8V to 5.5V input voltage range 4A continuous current Low R DS(ON) internal NFETs 27mΩ at V BIAS = 2.5V to 5V & V BIAS > V IN 5µA low quiescent current Adjustable rise time 2.5V to 5V bias voltage Integrated quick output discharge resistor Thermally enhanced 2mm x 2mm DFN-8L package Applications Portable computers Ultrabooks Tablet PC Set top boxes LCD TVs Telecom/Networking/Datacom equipment SSD Consumer electronics Typical Application VIN CIN IN OUT CL VOUT OFF ON IN ON AOZ1336DI OUT CT CT VBIAS CBIAS VBIAS GND Rev. 1. January Page 1 of 14

2 Ordering Information Part Number Temperature Range Package Environmental AOZ1336DI -4 C to +85 C 2mm x 2mm DFN-8L Green All AOS products are offered in packages with Pb-free plating and compliant to RoHS standards. Please visit for additional information. Pin Configuration IN 1 8 OUT IN 2 7 OUT ON 3 6 CT VBIAS 4 EPAD 5 GND 2mm x 2mm DFN-8 (Top View) Pin Description Pin Number Pin Name Pin Function 1, 2 IN Load Switch Input. Bypass IN and GND with ceramic capacitor. 3 ON Enable Input. Load switch is on when ON is pulled high. Load switch is off when ON is pulled low. 4 VBIAS Supply input for the device. 5 GND Ground. 6 CT Load switch slew rate control. 7, 8 OUT Load switch output. EPAD Exposed Pad The exposed bottom pad must be connected to GND. Rev. 1. January Page 2 of 14

3 Functional Block Diagram IN OUT IN ON Control Logic Charge Pump Typical Performance Characteristics Timing Diagram OUT CT VBIAS GND Rev. 1. January Page 3 of 14

4 Absolute Maximum Ratings Exceeding the Absolute Maximum ratings may damage the device. Parameter IN, ON, VBIAS, OUT to GND Junction Temperature (T J ) Storage Temperature (T S ) ESD Rating HBM/CDM Rating -.3V to 6V +15 C -65 C to +15 C 2kV/1kV Recommend Operating Ratings The device is not guaranteed to operate beyond the Maximum Operating Ratings. Parameter Rating Supply Voltage (V IN ) 5.5V Ambient Temperature (T A ) -4 C to +85 C Package Thermal Resistance 2x2 DFN-8 ( JC ) 2x2 DFN-8 ( JA ) 12 C/W 9 C/W Electrical Characteristics T A = 25 C, V BIAS = 5V, unless otherwise specified. Specifications in BOLD indicate a temperature range of -4 C to +85 C. Symbol Parameter Conditions Min. Typ. Max. Units V IN IN Supply Voltage.8 V BIAS V V BIAS VBIAS Supply Voltage V I q Quiescent Supply Current of V BIAS I OUT = V, = V, 5 75 µa V IN = = 5V I OFF VBIAS Shutdown Supply Current = V, = V 1 2 µa I D Maximum Continuous Current V IN = = 5V 4 A I PLS Maximum Pulsed Switch Current V IN = = 5V Pulse < 3µs, 2% Duty Cycle 6 A Note: Greater on-resistance if V IN > V BIAS. = V, = V, V IN = 5V I INOFF IN Shutdown Supply Current = V, = V, V IN = 3.3V.3 3 = V, = V, V IN = 1.8V.7 2 µa = V, = V, V IN =.8V.4 1 I ON ON Leakage Current = 5V 1 µa H ON High Level Voltage V IN =.8V to 5V 1.2 V L ON Low Level Voltage V IN =.8V to 5V.5 V Switching ON Resistance R ON Switch ON-State Resistance I OUT = -2mA, V IN =.8V to 5V mω R PD Output Pull-Down Resistance I OUT = 15mA, V IN = 5V, = V 22 3 Ω Rev. 1. January Page 4 of 14

5 Switching Characteristics 5% 5% t OFF t ON t D-ON 1% 1% 5% t R 9% 9% 1% t F 5% Test conditions: T A = 25 C, C IN = 1µF, C T = 1nF, C L =.1µF, R L = 1Ω (unless otherwise specified). Symbol Parameter Min. Typ. Max. Units VIN = 5V, VBIAS = VON = 5V t ON Turn-ON Time 142 t D-ON Turn-ON Delay time 45 t R Turn-ON Rise Time 174 t OFF Turn-OFF Time 7.7 t F Turn-OFF Fall Time 2.5 VIN =.8V, VBIAS = VON = 5V t ON Turn-ON Time 62 t D-ON Turn-ON Delay time 45 t R Turn-ON Rise Time 28 t OFF Turn-OFF Time 89 t F Turn-OFF Fall Time 1 VIN = 2.5V, VBIAS = VON = 2.5V t ON Turn-ON Time 21 t D-ON Turn-ON Delay time 78 t R Turn-ON Rise Time 22 t OFF Turn-OFF Time 8 t F Turn-OFF Fall Time 2.5 VIN =.8V, VBIAS = VON = 2.5V t ON Turn-ON Time 125 t D-ON Turn-ON Delay time 73 t R Turn-ON Rise Time 75 t OFF Turn-OFF Time 76 t F Turn-OFF Fall Time 1 µs µs µs µs Rev. 1. January Page 5 of 14

6 Typical Characteristics 7 Quiescent Current vs. VBIAS (VIN=VBIAS, VON=5V) 229 RPD vs. VIN (VBIAS=5.5V) IBIAS (μa) RPD (Ω) VBIAS (V) RDSON vs. VIN (VBIAS=2.5V, IOUT=-2mA) 2.5 VOUT vs. VON (TA=, VOUT=2V) 4 2. RSDON (mω) VOUT (V) VBIAS = 2.5V VBIAS = 3.3V VBIAS = 5.V VBIAS = 5.5V VON (V) 4 RDSON vs. VIN (VBIAS=5.5V, IOUT=-2mA) 35 RDSON (mω) Rev. 1. January Page 6 of 14

7 Typical Characteristics (Continued) 25 ton vs. VIN (VBIAS=2.5V) 5 td-on vs. VIN (VBIAS=5.5V) ton (μs) 15 1 td-on (μs) ton vs. VIN (VBIAS=5.5V) 25 tr vs. VIN (VBIAS=2.5V) ton (μs) tr (μs) td-on vs. VIN (VBIAS=2.5V) 2 tr vs. VIN) (VBIAS=5.5V) td-on (μs) tr (μs) Rev. 1. January Page 7 of 14

8 Typical Characteristics (Continued) 9 toff vs. VIN (VBIAS=2.5V) 1 toff vs. VIN (VBIAS=5.5V) toff (μs) toff (μs) ºC tf vs. VIN (VBIAS=2.5V) 14 tf vs. VIN (VBIAS=5.5V) tf (μs) 8 6 tf (μs) Rev. 1. January Page 8 of 14

9 Functional Characteristics Turn-ON & Turn-ON Rise Times (V IN =5V, V BIAS =5V, C IN =1μF, C T =1nF, C L =.1μF, R L =1Ω) Turn-ON & Turn-ON Rise Times (V IN =.8V, V BIAS =5V, C IN =1μF, C T =1nF, C L =.1μF, R L =1Ω) (2V/div) (2mV/div) Turn-ON & Turn-ON Rise Times (V IN =2.5V, V BIAS =2.5V, C IN =1μF, C T =1nF, C L =.1μF, R L =1Ω) Turn-ON & Turn-ON Rise Times (V IN =.8V, V BIAS =2.5V, C IN =1μF, C T =1nF, C L =.1μF, R L =1Ω) (1V/div) (2mV/div) Turn-OFF & Turn-OFF Fall Times (V IN =5V, V BIAS =5V, C IN =1μF, C T =1nF, C L =.1μF, R L =1Ω) Turn-OFF & Turn-OFF Fall Times (V IN =.8V, V BIAS =5V, C IN =1μF, C T =1nF, C L =.1μF, R L =1Ω) (1V/div) (2mV/div) Rev. 1. January Page 9 of 14

10 Functional Characteristics (Continued) Turn-OFF Fall Times (V IN =2.5V, V BIAS =2.5V, C IN =1μF, C T =1nF, C L =.1μF, R L =1Ω) Turn-OFF Fall Times (V IN =.8V, V BIAS =2.5V, C IN =1μF, C T =1nF, C L =.1μF, R L =1Ω) (1V/div) (2mV/div) Turn-ON & I OUT = 4A (V IN =5V, V BIAS =5V, C IN =4.7μF, C L =4.7μF) Turn-ON & I OUT = 4A (V IN =2.5V, V BIAS =5V, C IN =4.7μF, C L =4.7μF) (2V/div) (1V/div) I OUT (2A/div) I OUT (2A/div) Rev. 1. January Page 1 of 14

11 Detailed Description ON/OFF Control The AOZ1336DI is enabled when the ON pin is on active high with 1.2V or above voltage. The device is disabled when the ON pin voltage is.5v or lower. The EN input is compatible with both TTL and CMOS logic. VBIAS Voltage Range For optimal on-resistance of load switch, make sure V IN V BIAS and V BIAS is within the voltage range from 2.5V to 5.5V. On-resistance of load switch will be higher if V IN > V BIAS. Resistance curves of a typical sample device at different V BIAS and different V IN are shown as below. RDSON (mω) Adjustable Rise Time The slew rate of VOUT can be adjusted by external capacitors connected to the corresponding CT and GND pins. Multiply the input voltage and the slew rate to obtain the rise time. The table below shows rise times, which are measured on a typical device at V BIAS = 5V. C T (pf) VBIAS = 2.5V VBIAS = 3.3V VBIAS = 3.6V VBIAS = 4.2V VBIAS = 5.V VBIAS = 5.5V Rise Time (µs) 1%~9%, C L =.1µF, C IN 1µF, R L =1Ω (Typical values at 25 C, 25V X7R 1% Ceramic Cap) V IN =5V 3.3V 1.8V 1.5V 1.2V 1.5V.8V Applications Information The basic AOZ1336DI application circuit is shown in the first page. Component selection is explained below. Input Capacitor Selection A capacitor of 1μF or higher value is recommended to be place close to the IN pins of AOZ1336DI. This capacitor can reduce the voltage drop caused by the in-rush current during the turn-on transient of the load switch. A higher value capacitor can be used to further reduce the voltage drop during high-current application. Output Capacitor Selection A capacitor of.1μf or higher value is recommended to be place between the OUT pins and GND. The switching times are affected by the capacitance. A larger capacitor makes the initial turn-on transient smoother. This capacitor must be large enough to supply a fast transient load in order to prevent the output from dropping. Thermal Considerations To ensure proper operation, the maximum junction temperature of the AOZ1336DI should not exceed 15 C. Several factors attribute to the junction temperate rise: load current, MOSFET on-resistance, junction-to-ambient thermal resistance, and ambient temperature. The maximum load current can be determined by: T I T JMAX C LOAD MAX = JC R DSON It is noted that the maximum continuous load current is 4A. Layout Guidelines Good PCB is important for improving the thermal performance of AOZ1336DI. Place the input and output bypass capacitors close to the IN and OUT pins. The input and output PCB traces should be as wide as possible for the given PCB space. Use a ground plane to enhance the power dissipation capability of the device. Rev. 1. January Page 11 of 14

12 Package Dimensions, DFN2x2_8L, EP1_S D b e R E E1 Pin#1 Identification Option 1 L D1 TOP VIEW BOTTOM VIEW c A SIDE VIEW A1 Seating Plane RECOMMENDED LAND PATTERN UNIT: mm Dimensions in millimeters Symbols A A1 b c D D1 E E1 e L R aaa bbb ccc ddd Dimensions in inches Min Nom REF BSC Max Symbols A A1 b c D D1 E E1 e L R aaa bbb ccc ddd Min Nom REF BSC Max Notes: 1. Dimensions and tolerances conform to ASME Y14.5M Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 3. Dimension b applied to metallized terminal and is measured between.1mm and.3mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, dimension b should not be measured in that radius area. 4. Coplanarity ddd applies to the terminals and all other bottom surface metallization. Rev. 1. January Page 12 of 14

13 Tape and Reel Dimensions, DFN2x2_8L, EP1_S Carrier Tape T D1 P2 P1 E1 E2 E B K UNIT: mm A D P Feeding Direction Package DFN 2x2 A 2.3 ±.2 B 2.3 ±.2 K 1. ±.2 D 1. MIN. D /-. E /-.1 E ±.1 E2 3.5 ±.5 P 4. ±.2 P1 4. ±.2 P2 2. ±.5 T.3 ±.5 Reel W1 S G M N K V R H UNIT: mm W Tape Size 8mm Reel Size ø178 M ø178. ±1. N ø7.5 ±1. W W ±.5 ± 1.1 H ø13. K 1.25 S /-.2 ±.2 ±.1 G ø9.8 R N/A V N/A Leader / Trailer & Orientation Unit Per Reel: 3pcs Trailer Tape Components Tape Leader Tape 3mm Min. OR Orientation in Pocket 5mm Min. OR 75 Empty Pockets 125 Empty Pockets Rev. 1. January Page 13 of 14

14 Package Marking AOZ1336DI (DFN2x2-8) Part Number Code BCXX YWLT Assembly Location Code Option Code Week & Year Code Assembly Lot Code LEGAL DISCLAIMER Alpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or completeness of the information provided herein and takes no liabilities for the consequences of use of such information or any product described herein. Alpha and Omega Semiconductor reserves the right to make changes to such information at any time without further notice. This document does not constitute the grant of any intellectual property rights or representation of non-infringement of any third party s intellectual property rights. LIFE SUPPORT POLICY ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Rev. 1. January Page 14 of 14

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