AME. High PSRR, Low Noise, 600mA CMOS Regulator AME8855. n General Description. n Typical Application. n Features. n Functional Block Diagram

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1 8855 n General Description n Typical Application The 8855 family of positive, CMOS linear regulators provide low dropout voltage(42mv@6ma), low quiescent current, and low noise CMOS LDO. These rugged devices have both Thermal Shutdown, and Current limit to prevent device failure under the "Worst" of operating conditions. IN C IN 1µF IN EN 8855 GND OUT OUT C OUT 1µF n Features l Low Dropout Voltage: 42mV@6mA l Guaranteed Current: 6mA l Quiescent Current: 6µA (typ.) l Over-Temperature Shutdown l Current Limiting protection l PSRR:6dB@1KHz l Ultra-Low-Noise: 1µV RMS at 1Hz to 1KHz l Low Temperature Coefficient l Input Voltage Range 2.8V~5.5V l Output Voltage Range:.8V ~ 4.3V l Green Products Meet RoHS Standards n Functional Block Diagram IN Overcurrent Shutdown Thermal Shutdown OUT EN R1 n Applications - AMP + l Instrumentation l Portable Electronics l Wireless Devices l Cordless Phones Vref R2 GND l PC Peripherals l Battery Powered Widgets 1

2 8855 n Pin Configuration 3 Pin SOT-223 Top View SOT-223 Top View 8855-AGTxxx 8855-BGTxxx 1. IN 1. GND GND (TAB) 3. OUT OUT (TAB) 3. IN * Die Attach: Conductive Epoxy * Die Attach: Non-Conductive Epoxy SOT-89 Top View SOT-89 Top View 8855-AFTxxx 8855-BFTxxx IN 2. GND (TAB) GND 2. OUT (TAB) 3. OUT 3. IN * Die Attach: Conductive Epoxy * Die Attach: Non-Conductive Epoxy SOT-89 Top View 8855-CFTxxx GND 2. IN (TAB) 3. OUT * Die Attach: Non-Conductive Epoxy 2

3 8855 n Pin Configuration (Contd.) 3 Pin SOT-23 Top View SOT-23 Top View AETxxx 1. IN BETxxx 1. GND 2. GND 2. OUT OUT IN 1 2 * Die Attach: Non-Conductive Epoxy 1 2 * Die Attach: Non-Conductive Epoxy 5 Pin 8 Pin SOT-25 Top View SOP-8 Top View AEVxxx 1. IN 2. GND 3. EN 4. NC 5. OUT * Die Attach: Conductive Epoxy AHAxxx 1. IN 2. GND 3. GND 4. OUT 5. NC 6. GND 7. GND 8. EN * Die Attach: Conductive Epoxy 3

4 8855 n Pin Description SOT-223 Pin Number Pin Name A B 1 3 IN Pin Description Input voltage pin; should be decoupled with 1F or greater capacitor. 2 1 GND Ground connection pin. 3 2 OUT LDO voltage regulator output pin; should be decoupled with a 1.F or greater value low ESR ceramic capacitor. SOT-89 Pin Number Pin Name A B C IN Pin Description Input voltage pin; should be decoupled with 1F or greater capacitor GND Ground connection pin OUT LDO voltage regulator output pin; should be decoupled with a 1.F or greater value low ESR ceramic capacitor. SOT-23 Pin Number Pin Name A B 1 3 IN Pin Description Input voltage pin; should be decoupled with 1F or greater capacitor. 2 1 GND Ground connection pin. 3 2 OUT LDO voltage regulator output pin; should be decoupled with a 1.F or greater value low ESR ceramic capacitor. 4

5 8855 n Pin Configuration SOP-25 Pin Number Pin Name IN GND EN NC OUT Pin Description Input voltage pin; should be decoupled with 1F or greater capacitor. Ground connection pin. Enable pin, Active high". When pulled low, the PMOS pass transistor turns off, current consuming less than 1A. When EN pin floating outside, it s weakly pulled high from internal MOS. No connection. LDO voltage regulator output pin; should be decoupled with a 1.F or greater value low ESR ceramic capacitor. SOP-8 Pin Number 1 2 Pin Name IN GND Pin Description Input voltage pin; should be decoupled with 1F or greater capacitor. Ground connection pin GND OUT NC Ground connection pin. LDO voltage regulator output pin; should be decoupled with a 1.F or greater value low ESR ceramic capacitor. No connection. 6 GND Ground connection pin. 7 8 GND EN Ground connection pin. Enable pin, Active high". When pulled low, the PMOS pass transistor turns off, current consuming less than 1A. When EN pin floating outside, it s weakly pulled high from internal MOS. 5

6 8855 n Ordering Information x x x xxx Output Voltage Number of Pins Package Type Pin Configuration Pin Configuration Package Type Number of Pins Output Voltage A 1. IN E: SOT-2X A: 8 8:.8V (SOT-223) 2. GND F: SOT-89 T: 3 9:.9V (SOT-23) 3. OUT G: SOT-223 V: 5 1: 1.V (SOT-89) H: SOP 11: 1.1V B 1. GND 12: 1.2V (SOT-223) 2. OUT 13: 1.3V (SOT-23) 3. IN 14: 1.4V (SOT-89) 15: 1.5V : : C 1. GND : : (SOT-89) 2. IN 42: 4.2V 3. OUT 43: 4.3V A (SOT-25) A (SOP-8) 1. IN 2. GND 3. EN 4. BYP 5. OUT 1. IN 2. GND 3. GND 4. OUT 5. NC 6. GND 7. GND 8. EN 6

7 8855 n Absolute Maximum Ratings Parameter Maximum Unit Input Voltage EN Voltage -.3 to 6 V -.3 to 6 V Output Current Output Voltage P D /(V IN - ) GND-.3 to V IN +.3 ma V ESD Classification HBM 2 kv MM 2 V Caution: Stress above the listed in absolute maximum ratings may cause permanent damage to the device. n Recommended Operating Conditions Parameter Symbol Rating Unit Ambient Temperature Range T A - 4 to +85 o C Junction Temperaturen Range T J - 4 to +125 o C Storage Temperaturen Range T STG - 65 to +15 o C 7

8 8855 n Thermal Information Parameter Package Die Attach Symbol Maximum Unit SOT-89 Conductive Epoxy 4 Non-Conductive Epoxy 46 Thermal Resistance* (Junction to Case) SOT-223 Conductive Epoxy 25 Non-Conductive Epoxy 31 θ JC SOT-23 Non-Conductive Epoxy 14 SOT-25 Conductive Epoxy 81 SOP-8 Conductive Epoxy 6 o C / W SOT-89 Conductive Epoxy 18 Non-Conductive Epoxy 18 Conductive Epoxy 12 Thermal Resistance SOT-223 (Junction to Ambient) Non-Conductive Epoxy θ JA 135 SOT-23 Non-Conductive Epoxy 28 o C / W SOT-25 Conductive Epoxy 26 SOP-8 Conductive Epoxy 15 SOT-89 Conductive Epoxy 55 Non-Conductive Epoxy 55 Internal Power Dissipation SOT-223 Conductive Epoxy 9 P D Non-Conductive Epoxy 8 mw SOT-23 Non-Conductive Epoxy 4 SOT-25 Conductive Epoxy 4 SOP-8 Conductive Epoxy 81 Maximum Junction Temperature Lead Temperature (Soldering, 1Sec.)** 15 o C 26 o C * Measure θ JC on backside center of molding compound if IC has no tab. ** MIL-STD-22G 21F 8

9 8855 n Electrical Specifications V IN =(NOM) +1V, (for <2V, V IN =2.8V), I OUT =1mA, and C OUT =1µF, C IN =1µF unless otherwise noted. Typical values are at T A =25 o C. Parameter Symbol Test Condition Min Typ Max Units Input Voltage V IN V Output Accuracy,ACC I OUT =1mA % Output Voltage Range V Dropout Voltage (Note 1) V DROP I OUT=6mA,.8V (NOM) 2.V I OUT =6mA, 2.V<(NOM) 2.8V I OUT =6mA, 2.8V<(NOM) Note Output Current I OUT 6 ma mv Quiescent Current I Q I OUT =ma 6 9 µa Line Regulation V V OUT IN V 1% OUT REG LINE I OUT =1mA,.8V 1.2V, 2.8V V IN 3.5V I OUT =1mA, 1.2V< 2.V, 2.8V V IN 3.5V I OUT =1mA, 2.V< 4.2V, V IN(MIN) V IN V IN(MIN) +1V %/V I OUT =1mA, 4.2V< 4.5V, V IN(MIN) V IN 5.5V (Note2).5.1 Load Regulation 1mA I OUT 6mA.8V (NOM) 1.2V V V OUT OUT I 1% OUT REG LOAD 1mA I OUT 6mA 1.2V (NOM) 2.V %/A 1mA I OUT 6mA 2.V<(NOM)

10 8855 n Electrical Specifications (Contd.) Parameter Symbol Test Condition Min Typ Max Units Power Supply Rejection Ration F=1Hz 6 F=1KHz 6 F=1KHz 6 I OUT =1mA, =.8V, Output Voltage Noise en 1 µv f=1hz to 1KHz RMS Enable High (Enabled) V EN,HI V IN(MIN) V IN 5.5V 1.4 V IN Enable Low (Shutdown) V EN,LO V IN(MIN) V IN 5.5V.4 Enable Input Bias Current I EN,HI V EN= V IN 1 I EN,LO V EN =V 2 Shutdown Current I SHDN V IN =5.V, V EN =V.1 1 µa Shutdown Output Voltage,SD I OUT =.4mA, V EN =V.4 V Protection Output Current Limit I LIM =.9 x (NOM) 75 Short-Circuit Current I SC.6V 3 Thermal Shutdown Temperature Thermal Shutdown Hysteresis PSRR C OUT =1uF, =.8V I OUT =1mA V IN =2.8V T SHDN Shutdown, temperature increasing 15 T SHDN(HYS) 2 db V µa ma o C Note1: Dropout Voltage is measured at =(NOM) x98% Note2:For below 2.V, Dropout Voltage is the Input(MIN) Voltage to Output Voltage differential. 1

11 8855 n Detailed Description The 8855 family of CMOS regulators contain a PMOS pass transistor, voltage reference, error amplifier, over-current protection thermal shutdown, and Power Good detection circuitry. The P-channel pass transistor receives data from the error amplifier, over-current shutdown, and thermal protection circuits. During normal operation, the error amplifier compares the output voltage to a precision reference. Over-current and Thermal shutdown circuits become active when the junction temperature exceeds 15 o C, or the current exceeds 6mA. During thermal shutdown, the output voltage remains low. Normal operation is restored when the junction temperature drops more 2 o C. Capacitor Selection and Regulator Stability The maximum output power of the 8855 is limited by the maximum power dissipation of the package. By calculation the power dissipation of the package as a function of the input voltage, output voltage and output current, the maximum input voltage can be obtained. The maximum power dissipation should not exceed the package s maximum power rating. P MAX = (V IN(MAX) - ) x I OUT Where: V IN(MAX) = maximum input voltage P MAX = maximum power dissipation of the package Capacitor Selection and Regulator Stability The 8855 is stable with an output capacitor to ground of 1µF or greater. Ceramic capacitors have the lowest ESR, and will offer the best AC performance. Conversely, Aluminum Electrolytic capacitors exhibit the highest ESR, resulting in the poorest AC response. Unfortunately, large value ceramic capacitors are comparatively expensive. One option is to parallel a.1µf ceramic capacitor with a 1µF Aluminum Electrolytic. The benefit is low ESR, high capacitance, and low overall cost. A second capacitor is recommended between the input and ground to stabilize V IN. The input capacitor should be at least.1µf to have a beneficial effect. Enable Pin The Enable Pin is Active High. When activated pulled low, the MOS pass transistor shuts off, and all internal circuits are powered down. In this state, the stand by current is than 1µA. When EN pin float outside, It's pulled high. 11

12 8855 n Characterization Curve Output Voltage Output Voltage VIN = 2.8V, VOUT = 1V, IOUT = 1mA 1.4 VIN = 2.8V, VOUT = 1V, I OUT = 6mA Output Voltage (V) Output Voltage (V) Temperature ( o C) Temperature ( o C) Output Voltage Output Voltage VIN = 5.5V, VOUT = 4.3V, IOUT = 1mA VIN = 5.5V, VOUT = 4.3V, IOUT = 6mA Output Voltage (V) Output Voltage (V) Temperature ( o C) Temperature ( o C) Quiescent Current Quiescent Current VOUT = 1V 9 = 4.3V Quiescent Current (µa) Quiescent Current (µa) Temperature ( o C) Temperature ( o C) 12

13 8855 n Characterization Curve (Contd.) Current Limit vs Input Voltage Current Limit vs Input Voltage = 1V VOUT =4.3V Current Limit (ma) 12 1 Current Limit (ma) Input Voltage (V) Input Voltage (V) 5.5 Dropout Voltage Stability vs. ESR vs. Load Current Dropout Voltage (mv) VOUT = 4.3V Stability of Stable ESR (Ω) VIN = 5V CIN = COUT= 1µF / X7R Unstable Range Stable Range Unstable Range Temperature ( o C) Load Current Short Circuit Current Protection Short Circuit Current Protection Short Circuit Current Protection (ma) 8 VOUT = 1V Input Voltage (V) Short Circuit Current Protection (ma) 8 VOUT = 1V Input Voltage (V) 13

14 8855 n Characterization Curve (Contd.) Line Transient Response Line Transient Response TA = -4 O C, VOUT = 1V, IOUT = 1mA 5.5V TA = -4 O C, VOUT = 4.3V, IOUT = 1mA 5.5V V IN (1V/DIV) 4.8V V IN (1V/DIV) 2.5V 2mV 2mV (2mV/DIV) (2mV/DIV) -2mV -2mV 2µS / DIV 2µS / DIV Line Transient Response Line Transient Response TA = -4 O C, VOUT = 4.3V, I OUT = 6mA TA = 25 O C, VOUT = 4.3V, I OUT = 1mA V IN (1V/DIV) 5.5V 4.8V V IN (1V/DIV) 5.5V 4.8V 2mV (2mV/DIV) -2mV (2mV/DIV) 2mV -2mV 2µS / DIV 2µS / DIV Line Transient Response Line Transient Response TA = 125 O C, VOUT =1V, IOUT = 1mA TA = 125 O C, VOUT =4.3V, IOUT = 1mA 5.5V 5.5V V IN (1V/DIV) 4.8V V IN (1V/DIV) 2.5V 2mV 2mV (2mV/DIV) (2mV/DIV) -2mV -2mV 2µS / DIV 2µS / DIV 14

15 8855 n Characterization Curve (Contd.) Line Transient Response Line Transient Response TA = -4 O C, VOUT = 1V, IOUT = 6 ma 5.5V TA = -4 O C, VOUT = 4.3V, I OUT = 6mA 5.5V V IN (1V/DIV) 4.8V V IN (1V/DIV) 2.5V 2mV 2mV (2mV/DIV) -2mV (2mV/DIV) -2mV 2µS / DIV 2µS / DIV Line Transient Response Line Transient Response TA = 25 O C, VOUT = 1V, IOUT = 6 ma TA = 25 O C, VOUT =4.3V, IOUT = 6mA 5.5V 4.8V V IN (1V/DIV) 5.5V 4.8V V IN (1V/DIV) 2mV 2mV (2mV/DIV) (2mV/DIV) -2mV -2mV 2µS / DIV 2µS / DIV Line Transient Response Line Transient Response TA = 125 O C, VOUT =1V, I OUT = 6mA 5.5V TA = 125 O C, VOUT =4.3V, IOUT = 6mA 5.5V V IN (1V/DIV) 4.8V V IN (1V/DIV) 2.5V 4mV 2mV 2mV (2mV/DIV) -2mV (2mV/DIV) -2mV 2µS / DIV 2µS / DIV -4mV 15

16 8855 n Characterization Curve (Contd.) Load Transient Response Load Transient Response TA = -4 O C, VOUT =1V, IOUT = 1~6mA 2mV TA = -4 O C, VOUT =4.3V, IOUT = 1~6 ma 2mV (2mV/DIV) -2mV (2mV/DIV) -2mV 6mA 6mA I OUT (2mA/DIV) 1mA I OUT (2mA/DIV) 1mA Time (2µSec/DIV) Time (2µSec/DIV) Load Transient Response Load Transient Response T A = 25 O C, =1V, I OUT = 1~6 ma 2mV TA = 25 O C, VOUT =4.3V, IOUT = 1~6mA 2mV (2mV/DIV) -2mV (2mV/DIV) -2mV 6mA 6mA I OUT (2mA/DIV) 1mA I OUT (2mA/DIV) 1mA Time (2µSec/DIV) Time (2µSec/DIV) Load Transient Response Load Transient Response TA = 125 O C, VOUT =1V, I OUT = 1~6 ma 2mV TA = 125 O C, VOUT =4.3V, IOUT = 1~6mA 2mV (2mV/DIV) -2mV (2mV/DIV) -2mV 6mA 6mA I OUT (2mA/DIV) 1mA I OUT (2mA/DIV) 1mA Time (2µSec/DIV) Time (2µSec/DIV) 16

17 8855 n Characterization Curve (Contd.) Chip Enable Transient Response Chip Enable Transient Response = 1V IOUT = ma 2 VOUT = 4.3V IOUT = ma 1µS/DIV 1) EN= 2V/Div 2) = 5mV/Div 1) EN= 2V/Div 2) = 2V/Div 4µS/DIV Chip Enable Transient Response Chip Enable Transient Response = 1V IOUT = 6mA 2 VOUT = 4.3V I OUT = 6mA 1µS/DIV 1) EN= 1V/Div 2) = 5mV/Div 1) EN= 2V/Div 2) = 2V/Div 4µS/DIV 17

18 8855 n Characterization Curve (Contd.) Shut Down Curve Output Voltage Shut Down Curve Output Voltage VOUT = 1V IOUT = ma 2 VOUT = 1V IOUT = 6mA 4µS/DIV 1) EN= 1V/Div 2) = 5mV/Div Shut Down Curve Output Voltage 4µS/DIV 1) EN= 1V/Div 2) = 5mV/Div Shut Down Curve Output Voltage VOUT = 4.3V IOUT = ma 2 VOUT = 4.3V I OUT = 6 ma 4µS/DIV 1) EN= 2V/Div 2) = 2V/Div 2µS/DIV 1) EN= 2V/Div 2) = 2V/Div PSRR vs Frequency PSRR (db) = 4.3V I OUT = 1mA 1K 1K 1K Frequency (Hz) 1M

19 8855 n Tape and Reel Dimension SOT-223 P W PIN 1 P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SOT ±.1 mm 8.±.1 mm 4.±.1 mm 25pcs 33±1 mm SOP-8 P PIN 1 W P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SOP-8 12.±.1 mm 8.±.1 mm 4.±.1 mm 25pcs 33±1 mm 19

20 8855 n Tape and Reel Dimension (Contd.) SOT-89 P W PIN 1 P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SOT ±.1 mm 8.±.1 mm 4.±.1 mm 1pcs 18±1 mm 2

21 8855 n Tape and Reel Dimension (Contd.) SOT-23 P W PIN 1 P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SOT-23 8.±.1 mm 4.±.1 mm 4.±.1 mm 3pcs 18±1 mm SOT-25 P W PIN 1 P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SOT-25 8.±.1 mm 4.±.1 mm 4.±.1 mm 3pcs 18±1 mm 21

22 8855 n Package Dimension SOT-223 Top View D B1 Side View C H E 13 o (4X) PIN 1 K e Front View 13 o (4X) F A1 B n Lead Pattern n Lead Pattern 4. BSC 2.2 BSC 2.2 BSC 1.2 BSC 6. BSC Note: 1. Lead pattern unit description: BSC: Basic. Represents theoretical exact dimension or dimension target. 2. Dimensions in Millimeters. 3. General tolerance +.5mm unless otherwise specified. 2.3 BSC 2.3 BSC 22

23 8855 n Package Dimension (Contd.) SOP-8 Top View Side View C H E PIN 1 D L Front View 7 o (4X) A2 A A1 B e 23

24 8855 n Package Dimension (Contd.) SOT-89 TOP VIEW SIDE VIEW D PIN 1 D1 e S1 H E A1 3' 1' C MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A A 1.8 REF.315 REF C D D E I e 3. REF.1181 REF H.7 REF.276 REF A S1 1.5 REF.591 REF I FRONT VIEW n Lead Pattern 2.6 BSC 1.4 BSC 4.4 BSC 3.2 BSC 45 o C 1.9 BSC Note: 2.8 BSC 1. Lead pattern unit description: BSC: Basic. Represents theoretical exact dimension or dimension target. 1.8 BSC 1.6 BSC 2. Dimensions in Millimeters. 3. General tolerance +.5mm unless otherwise specified. 3. BSC 24

25 8855 n Package Dimension (Contd.) SOT-25 Top View Side View D H E PIN 1 S1 e L Front View A b A1 n Lead Pattern.7 BSC 1. BSC.95 BSC.95 BSC 1.9 BSC 2.4 BSC Note: 1. Lead pattern unit description: BSC: Basic. Represents theoretical exact dimension or dimension target. 2. Dimensions in Millimeters. 3. General tolerance +.5mm unless otherwise specified. 25

26 8855 n Package Dimension (Contd.) SOT-23 Top View Side View D E H PIN 1 e L Front View A b A1 n Lead Pattern.8 BSC 1. BSC 1.9 BSC 2.4 BSC Note: 1. Lead pattern unit description: BSC: Basic. Represents theoretical exact dimension or dimension target. 2. Dimensions in Millimeters. 3. General tolerance +.5mm unless otherwise specified. 26

27 Life Support Policy: These products of, Inc. are not authorized for use as critical components in life-support devices or systems, without the express written approval of the president of, Inc., Inc. reserves the right to make changes in the circuitry and specifications of its devices and advises its customers to obtain the latest version of relevant information., Inc., August 214 Document: TM1-DS8855-C.3 Corporate Headquarter, Inc. 8F, 12, WenHu St., Nei Hu Taipei, Taiwan. 114 Tel: Fax:

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