BS0300N-2C. Order Code: Exterior. Features. Agency Approvals. Schematic Symbol. Part SMB-T. Weight 88 mg Non degenerative RS485/232/422.

Transcription

1 eatures xterior xcellent capability of absorbing transient surge Quick response to surge voltage(ns Level) liminates overvoltage caused by fast rising transients Moisture sensitivity level: Level 1 Weight 88 mg Non degenerative SM-T pplication information Package (Top iew) ` RS485/232/ N2C d gency pprovals Schematic Symbol Icon escription Compliance with 2011/65/U Compliance with IC :2003 Part Number and lectrical Parameterr IRM@ RM S IS T@ IT IH CO 2 Part Number μ m m p MX Pin1,3-2 Pin1,3-2 MX MIN MX bsolute maximum ratings measured at T= 25ºC RH = 45%-75% (unless otherwise noted). 1 s is measured at 100K/S 2 Off-state capacitance is measured at C=2,RMS=1,f=1MHz 1/5

2 Part Numbering System Mark S N 2 C (1) (2) ( 3) (4) (5) (1)encent Semiconductor Surge rrester (2) Off state voltage,e.g:0300= =30. (3) Package : SM-T (4) 2 Lines Protection (5) Rating Surge oltage: 6K(10/700μS) 03N2C N2C: Part Number 1309 : Septempter,2013 -I Curve Parameters RM efinitionn Peak off-state voltage +I IRM Off-state Current IT IS S Switching oltage I H IS IH T Switching Current Holding Current On-state voltage - IRM T RM S + IT On-state current CO Off-state capacitance - I Surge Ratings Current Waveform oltage Waveform 2/10μs 2/10μs 8/20μs 1.2/50μs 10/160μs 10/160μs 5/320μs* 10/700μs* 10/1000μs 10/1000μs Ipp Peak pulse current rating(i PP )is repetitive and guaranteed for the life of the product; -encent only makes the test for but for other IPP value derived from experiencee is just for reference only. encent will not take any obligation for these parameters, so before applying our parts, please make sure to verify the parameters listed in the above table. Thermal Considerations Product Characteristics Symbol Parameter alue Unit Lead Material Copper lloy TJ Operating Junction Temperature Range -40 to +150 ody Material UL recognized epoxy meeting flammability classification 94-0 TS Storage Temperature Range -60 to +150 Terminal inish 100% Matte-Tin Plated 2/5

3 Typical Characteristics 3/5

4 nvironmental Characteristics Testing items High temperature Reverse ias Test High Temperature Life Test High-low Temperature Cycle test High Temperature &High Humidity Test Pressure cooker Test Resistance of soldering heat Technical standards Temperature: 150±3 ias=80% Time:168H %RM Temperature: 150 Time:168H Temperature: rom -40 to125 well time :30min,10cycles Temperature: 85 Humidity:85% Test time:168h Temperature: 121, 2atm. Humidity:100% Test time:24h Temperature: 260±5 Time of dip soldering:10s,3times Note: The above testing items can be specified by customer s special request Product imensions R mm 5.4± ± ± ±0.012 C 0.7± ± ± ±0.008 ottom view 0.9± ± ± ±0.012 I H G 1.13± ±0.012 H 2± ±0.012 Side view Recommended Soldering Pad I 0.25± ±0.002 R C mm /5

5 Reflow Profile Reflow Condition Pb-ree assembly Temperature Min 150 C Pre Heat Temperature Max 200 C Time (min to max) secs verage ramp up rate(liquid) )Tamp (T ) to peal 3 C/second max T P Ramp-up T P Critical Zone TL to TP T S (max) to - Ramp-up Rate - Temperature (T L ) Reflow (Liquid) 3 C/second max 217 C Temperature T S(max) Preheat Ramp-down - Temperature (T L ) seconds T S(min) Peak Temperaturee (T P ) 260+0/-5 C T S Time within 5 C of actual peak Temperature (T P ) Ramp-down Rate 8 15 seconds 6 C/second max 25 time to peak temperature Time Time 25 C to peak Temperaturee (T P ) 8 minutes Max. o not exceed 260 C Package Reel Information R d 1 2 P P0 P1 W W1 mmm 3.65+/ / / / / / /-3 13+/ / / / / / / / / / / / / / / / / / / / / / / / / / / OUTLIN RL (PCS) PR CRTON (PCS) RL IMTRS (mm) L CRTON SIZ(mm) W H TPING 3,000 24, /5