Low VF SMD Schottky Barrier Diode
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1 Low F SMD Schottky Barrier Diode FEATURES - Metal-on-silicon schottky barrier - Surface device type mounting - Moisture sensitivity level - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Packing code with suffix "G" means green compound (halogen-free) MECHANICAL DATA - Case: SOT- 23, molded plastic - Terminal: Matte tin plated, lead free, solderable per MIL-STD-22, Method 28 guaranteed - High temperature soldering guaranteed: 26 o C/s - Weight:.8g (approximately) SOT-23 MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (T A =25 unless otherwise noted) PARAMETER SYMBOL ALUE UNIT Power Dissipation P D mw Repetitive Peak Reverse oltage RRM 4 Reverse oltage R 4 Repetitive Peak Forward Current I FRM ma Mean Forward Current I O ma Non-Repetitive Peak Forward Surge Current (Note ) I FSM.6 A Thermal Resistance (Junction to Ambient) (Note 2) R θja 357 o C/W Junction and Storage Temperature Range T J, T STG -65 to +25 o C PARAMETER SYMBOL MIN MAX UNIT Reverse Breakdown oltage I R =μa (BR) 4 - I F =ma Forward oltage I F =ma I F =4mA Junction Capacitance R =, f=.mhz C J - 5. pf Reverse Recovery Time I F =I R =ma, R L =Ω, I RR =ma t rr - 5. ns Notes :. Test Condition : 8.3ms single half sine-wave superimposed on rated load Notes : 2. alid provided that electrodes are kept at ambient temperature I R Reverse Leakage Current R =3 -.2 F μa Document Number: DS_S46 ersion: F4
2 RATINGS AND CHARACTERISTICS CURES (TA=25 unless otherwise noted) Fig. Power Derating Curve Fig. 2 Maximum Non-Repetitve Peak Forward Surge Current Per Leg P D - Power Dissipation (mw) Peak Forward Surge Current (ma) ms single half sine wave T A - Ambient Temperature ( o C) Numbers of Cycles at 6 Hz Fig. 3 Typical Forward Characteristics Fig. 4 Typical Reverse Characteristics T A =25 C Instantaneous Forward Current (ma).... T A = -4 C T A = C T A = 25 C T A =7 C T A = 25 C I R - Instantaneous Reverse Current (ma). T A =7 C T A =25 C T A = C T A = -4 C F, Instantaneous Forward oltage (m) R - Reverse oltage () Fig. 5 Typical Total Capacitance S. Reverse oltage Fig. 6 Typical Transient Thermal Junction Capacitance (pf) 4 2 f=.mhz Transient Thermal Impedance ( o C/W) Reverse oltage () Pulse Duration (sec) Document Number: DS_S46 ersion: F4
3 ORDERING INFORMATION (Note ) PACKING CODE PACKAGE PACKING MARKING BAS4 BAS4-4 BAS4-5 BAS4-6 -xx G SOT-23 3K / 7" Reel Note : Part No. Suffix -xx would be used for special requirement EXAMPLE PREFERRED P/N DESCRIPTION BAS4 BAS4 Multiple manufacture BAS4 G BAS4 G Multiple manufacture Green compound BAS4-D G BAS4 -D G Define manufacture Green compound Document Number: DS_S46 ersion: F4
4 PACKAGE OUTLINE DIMENSIONS DIM. Unit(mm) Unit(inch) Min Max Min Max A B C D E F G H.55 REF. REF.22 REF.4 REF SUGGEST PAD LAYOUT DIM. Z X Y C E Unit(mm) Typ Unit(inch) Typ PIN CONFIGURATION Document Number: DS_S46 ersion: F4
5 Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S46 ersion: F4
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