Transmission Lines. Using Scattering Parameter Based. Jimmy Shinn-Hwa Wang. Dr. Wayne Wei-Ming Dai. 11 April 1994.

Size: px
Start display at page:

Download "Transmission Lines. Using Scattering Parameter Based. Jimmy Shinn-Hwa Wang. Dr. Wayne Wei-Ming Dai. 11 April 1994."

Transcription

1 Transient Analysis of Coupled Transmission Lines Using Scattering Parameter Based Macromodel Jimmy Shinn-Hwa Wang Dr. Wayne Wei-Ming Dai UCSC-CRL April 1994 Baskin Center for Computer Engineering & Information Sciences University of California, Santa Cruz Santa Cruz, CA 9504 USA abstract As the system clock speed increases, crosstalk becomes one of the major sources of noise which can limit the performance of high-speed digital systems in addition to delay and ringing. The congruence transformation can be used to decouple a coupled transmission-line system. In this paper, we extended the scattering parameter based macromodel to include the congruence transformation to analyze the crosstalk in the coupled transmission-line systems. After decouple the n coupled transmission lines using the congruence transformation, the computation of scattering matrix of the coupled transmission lines then becomes those of the scattering matrix of the congruence transformers and those of the n decoupled single transmission lines. A very simple scattering parameter description of the congruence transformer for coupled lossless transmission lines is derived. It has been extended to handle the coupled lossy transmission lines. Unlike some of the previous methods[14][1] which only consider the coupling between immediate adjacent lines, our method takes into account the coupling among all lines. We also present the results obtained from our simulator as well as those obtained from the SPICE-like simulators (for example: SPICEe and ASTAP) and state- of-the-art moment-matching simulators (for example: SWEC and Coee). Keywords: Coupled Transmission Lines, Transient Analysis, Congruence Transformation, Scattering Parameters, Macromodel, S-Parameter Based Simulator.

2 CONTENTS 1 Contents 1 Introduction : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Congruence Transformation of the Lossless Coupled Transmission Lines : : : : : : :.1 Quasi-TEM Wave Propagation on the Coupled Lossless Transmission Lines : 4. Congruence Transformation of the Coupled Lossless Transmission Lines : : : 5. Scattering Parameter Matrix of a Congruence Transformer : : : : : : : : : : 8 Congruence Transformation of the Lossy Coupled Transmission Lines : : : : : : : : 1.1 Quasi-TEM Wave Propagation on the Coupled Lossy Transmission Lines : : 1. Congruence Transformation of the Coupled Lossy Transmission Lines : : : : 1 4 Experiment Results : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Example 1 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 1 4. Example : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 1 4. Example : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Example 4 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 1 5 Conclusion : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Acknowledgment : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 5 References : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 5

3 1. Introduction 1 Introduction As the system clock speed increases, crosstalk becomes one of the major source of noise in addition to the delay and ringing which can limit the performance of high-speed digital systems [] [] [5] [] [] [14] [15] [1]. The crosstalk can often lead to excessive overshoots, undershoots and glitches. It can also cause false switchings on the non-active lines as well as undetected switchings on the active lines, not to mention that it can also increase power dissipation of the output drivers. It can be considered as the dominant factor of noise in the high density interconnection networks. Thus for a reliable operation, the crosstalk should be strictly controlled within a certain limit. An ecient and accurate transient analysis also becomes a key element in the combating of the crosstalk. Previous research works which uses scattering parameter for the analysis of coupled transmission lines include those of the full-wave analysis by Cooke et al [] and time domain simulation by Schutt-Aine et al [1]. In Schutt-Aine's paper, they demonstrated a great accuracy improvement in simulating circuits that includes non-linear drivers and terminations [1]. Whereas in Cooke's paper, they illustrated an ability to simulate frequency dependent model propagation []. Recently, a frequency domain simulator using scattering parameter based macromodels has been presented by Liao et al [11] [1]. Based on the scattering parameter based macromodel, Pade technique or Exponentially Decayed Polynomial Function (EDPF) can be used to approximate transfer functions of the coupled interconnects. This approach avoids the costly matrix computation for converting the frequency domain scattering parameter matrix representation into the time domain transfer/reection matrix representation [1] and the time consuming full-wave analysis []. An adoption of the scattering parameter based macromodel and Pade/EDPF approximation do provide a trade o between speed and accuracy. The diculty in high-performance system design comes from the coupled noise among the transmission lines which are placed closely together in today's dense process technology. The coupled noise (crosstalk) is inversely proportion to the interline spacing and is proportional to

4 . Congruence Transformation of the Lossless Coupled Transmission Lines several parameters including those of the thickness of the dielectric material, the distance which the coupled lines are in parallel, the rate of change of the input waveforms, and the line impedances. There are signal distortions caused by coupling mechanisms such as n mode propagation and crosstalk. In order to rigorously analyze crosstalk in a coupled transmission line systems, the method of congruence transformation decoupling can be employed [] [] [9] [14]. The analysis is focused on nding the crosstalk among all of the possible coupling lines, but not limited to the immediate adjacent lines. The scattering parameter based macromodel provides the crucial information about the crosstalk waveforms for the coupled transmission lines analysis and design. In Section, the congruence transformation of lossless coupled transmission lines is derived based on frequency-independent per-unit-length L and C matrices. The scattering parameter based macromodel of lossless coupled transmission lines is derived from the congruence transformation. An addition simplication of the scattering parameter based macromodel is derived based on the similarity transformation property. In Section, the derivation is repeated for coupled lossy transmission lines. In Section 4, several examples of lossless as well as lossy coupled transmission lines are simulated, and their results are compared with published results, commercial tools, and state-of-the-art simulators such as SWEC [1] and Coee [4]. Finally we will conclude this paper with some remarks on the proposed method and directions for the future research. Congruence Transformation of the Lossless Coupled Transmission Lines Wave propagation in multiconductor has been extensively studied by the Microwave, Electronic- Magnetic-Compatibility (EMC), and Electrical engineers. Due to the coupling between transmission lines, dierent modes which have dierent propagation velocities exist simultaneously in the system. For an n conductor system shown in Figure.1, there are n fundamental modes of propagation. Starting with the quasi-tem analysis, the congruence transformation decoupling for the coupled lossless transmission lines can rst be derived. Later based on the congruence transformation

5 4. Congruence Transformation of the Lossless Coupled Transmission Lines i 11 i 1 v 11 v 1 i 1k i k v 1k v k i 1n i n v 1n v n x = 0 x = l

6 . Congruence Transformation of the Lossless Coupled Transmission Lines 5 where 0 x l and v(x; t) and i(x; t) are column vectors dening the voltages v k (x; t) and currents i k (x; t) distributed on the conductors k = 1; ; ; :::; n. The L and C are the n by n symmetric matrices of the per-unit-length inductance and capacitance of the n conductor system. Throughout this paper, the L and C matrices are assumed to be frequency-independent.. Congruence Transformation of the Coupled Lossless Transmission Lines Taking derivative with respect to x for both sides of Equation (.1) and (.) with proper substitution of terms, one obtains the following v(x; t) = v(x; i(x; t) = i(x; t) (.4) In order to decouple the coupled system, all four matrices L, C, LC, and CL in Equation (.1), (.), (.), and (.4), must be simultaneously diagonalized. By applying congruence transformation, we can change the variable basis from v to u and from i to j. The terminal voltages and currents at opposite sides of the transformer are related by (see Figure.) []: v k (x; t) = j k (x; t) =? nx m=1 X km u m (x; t) (.5) nx m=1 X mk i m (x; t); (.) The negative sign is used to indicate the direction of current j k is owing into the transformer. Rewrite Equation (.5) and (.) in a matrix notation, one obtains: V (x; t) = XU(x; t) (.) I(x; t) =? X t?1 J(x; t); (.8)

7 . Congruence Transformation of the Lossless Coupled Transmission Lines where V, U, I and J are column vectors, V = [v 1 (x; t); :::; v n (x; t)] t, U = [u 1 (x; t); :::; u n (x; t)] t, I = [i 1 (x; t); :::; i n (x; t)] t, and J = [j 1 (x; t); :::; j n (x; t)] t. Substituting Equation (.) and (.8) into Equations (.1), (.), (.), and (.4), one t) t)? u(x; t) =?X?1 L X t?1? =?X t) CX = X?1 t) (.9) (.10) j(x; = X t CL X j(x; t) : (.1) It has been shown that the right eigenvector matrix X which is obtained from the similarity transformation of L satisfys the following property [14]: X t = X?1 : (.1) So the right eigenvector matrix X can simultaneously diagonalize all four matrices: ~L = X?1 L X t?1 = X?1 LX = diag(l k ) (.14) ~C = X t CX = X t C X t?1 = diag(ck ) (.15) ~L ~C = X?1 LCX = X?1 L X t?1 X t CX = diag((lc) k ) (.1) ~C~L = X t CL X t?1 = X t CXX?1 L X t?1 = diag((cl)k ); (.1) where k = 1:::n and diag(l k ) represents an n by n diagonal matrix L which all o-diagonal elements are equal to zero. The L k, C k, (LC) k, and (CL) k are the k? th eigenvalue of the matrices L, C, LC, and CL. Redene the Telegraphist Equations of decoupled system to t) t)?~l? (.18)

8 . Congruence Transformation of the Lossless Coupled Transmission u(x; u(x; t) j(x; j(x; t) ; (.1) where the matrices ~L, ~C, ~L ~C, and ~C~L are all diagonal matrix as shown in Equation (.14), (.15), (.1), and (.1). The n coupled lossless transmission lines shown in Figure.1 can be decoupled using the congruence transformation method as shown in Figure.. Each decoupled single transmission line carrys one mode of propagation. The incident waves are decoupled into dierent modes, and propagate through each decoupled transmission line in dierent mode velocity, then all the modes are combined at the other end to form the output and the reected waves. i 11 j L 1 C 1 11 j 11 i 1 v 11 u 11 u 1 v 1 i 1k X j 1k j 1k X i k v 1k u 1k u k v k L k C k i 1n j 1n j 1n i n v 1n u 1n u n v n L n C n

9 8. Congruence Transformation of the Lossless Coupled Transmission Lines macromodel simulator. The scattering parameter based macromodel simulator takes full advantage of being a frequency domain simulator and lumps the multiport components together using the Pade or EDPF approximation [11] [1]. The derivations of equations of the voltage scattering parameter matrices of all the components in the decoupled system are presented in the next two section.. Scattering Parameter Matrix of a Congruence Transformer Due to the choice of identical reference impedance Z 0 at any port for the scattering parameter based macromodel simulator, the scattering parameter matrix S of any multi-port component is equivalent to its voltage scattering parameter matrix S V. Since only the terminal voltages and currents are of an interest, the following representations are introduced (see Figure.1): v 1k (t) v k (x = 0; t) v k (t) v k (x = l; t) i 1k (t) i k (x = 0; t) i k (t) i k (x = l; t); where k = 1:::n. The u 1k, u k, j 1k, and j k are the terminal voltages and currents after the transformation, they represent: u 1k (t) u k (x = 0; t) u k (t) u k (x = l; t) j 1k (t) j k (x = 0; t) j k (t) j k (x = l; t); To nd the voltage scattering parameter matrix of a congruence transformer, rst the time-domain voltage and current are transformed into frequency-domain using Laplace transform. For example, j pk (s) = L(j pk (t)), where p = 1; and k = 1; :::; n. Then the terminal voltages and currents of the both sides of the transformer are separated into the incident and reect wave components as shown in Figure.: Writing the voltage and current wave components in vector notation, one obtains: V p = V + p + V? p (.) U p = U + p + U? p (.) I p = I + p? I? p (.4)

10 Figure.: The separatio. Congruence Transformation of the Lossless Coupled Transmission Lines 9 + t + i p1( t), vp1( ) - i p1 - ( t), v p1 ( t) + + i pk( t), vpk( t) - i pk ( t), v pk ( t) + + i pn( t), vpn( t) - i pn - - ( t), v pn ( t) X + t + j p1( t), up1( ) - j p1 - ( t), u p1 ( t) + + j pk( t), upk( t) - j pk - ( t), u pk ( t) + t + j pn( t), upn( ) - j pn - ( t), u pn ( t)

11 10. Congruence Transformation of the Lossless Coupled Transmission Lines The denitions of voltage scattering parameters matrix S V and its submatrices S V 11, S V 1, S V 1, and S V are: S V = S V 11 = V? p V + p S V 1 = V? p U + p S V 1 = U? p V + p S V = U? p U + p 4 SV 11 S V 1 S V 1 S V U + p =0 V + p =0 U + p =0 V + p =0 5 By arithmetic manipulation of Equations (.), (.), (.4), (.5), (.), (.), (.8), (.9), (.0), and (.1), and by setting U + p to be an all-zero column vector, one can nd S V 11 as: S V 11 =?[X?1 + X t ]?1 [X?1? X t ]: (.) Similarly one can nd other submatrices of S V : S V 1 = [X?1 + X t ]?1 (.) S V 1 = [X + (X t )?1 ]?1 (.4) S V =?[X + (X t )?1 ]?1 [X? (X t )?1 ]: (.5) The voltage scattering parameter matrix S V S V = is: 4?[X?1 + X t ]?1 [X?1? X t ] [X?1 + X t ]?1 [X + (X t )?1 ]?1?[X + (X t )?1 ]?1 [X? (X t )?1 ] 5 (.) Since the similarity transformation property X?1 = X t holds for all X that simultaneously

12 . Congruence Transformation of the Lossless Coupled Transmission Lines 11 diagonalize the L, C, LC, and CL matrices, Now the scattering parameter matrix S can be simplied to: S = 4 0 X X t 0 5 : (.) This equation holds when the right eigenvector matrix X is obtained either from similarity transformation of a full L matrix, or Romeo's method which deals with a tri-diagonal L matrix. Bayard rst outlines the transformation, A t ZA, and calls it \translator" [1]. Hazony is the rst one to name the transformation \congruence transformer" in his book [9]. Chang uses the congruence transformer to decouple both the lossless [] and lossy coupled transmission lines []. Chang's method for the analysis of coupled lossless transmission lines relies on simultaneously diagonalizing the L, C, LC, and CL matrices using special conditioned matrix. Romeo and Santomauro present a dierent method of nding the right eigenvector matrices for coupled lossless transmission lines with tri-diagonal L and C matrices [14]. In this paper, one will nd the right eigenvector matrices of a full L matrix. The method proposed here may be more preferred than Chang's method because it leads to simpler equations for scattering parameter based macromodel representation of congruence transformer. In Chang's method where the similarity transformation property X?1 = X t may not hold, the scattering parameter matrix representation cannot be simplied to Equation (.). The proposed method in more general than Romeo's method because it does not have the limitation that each transmission line is only coupled to the immediate adjacent lines. For each of the decoupled lossless transmission line shown in Figure., its scattering parameter matrix is [8]: [S] = h S V i = 1 Z 0 Z c cosh() + (Z + 0 Z c ) sinh() 4 (Z 0? Z c ) sinh() Z 0Z c Z 0 Z c (Z 0? Z c ) sinh() 5 ;(.8) where Z 0 is the reference impedance, and both Z c and are computed from the eigenvalues L k

13 1. Congruence Transformation of the Lossy Coupled Transmission Lines and C k of the L and C matrices respectively. The Z c = q Lk C k is the characteristic impedance of the k? th line and k = 1:::n, and = s p L k C k l is the propagation constant of the k? th line and l is the coupling length. Congruence Transformation of the Lossy Coupled Transmission Lines When the ohmic loss of the conductors is not negligible, the transmission lines are considered to be lossy. It is very common that the lossy conductors are fabricated by embedding them in several layers of homogeneous dielectrical media. This structure supports TEM waves traveling at multiple propagation speeds. However, there is an attenuation in addition to phase shift that must be considered when the dierent modes of wave propagate through the lossy media. The decoupling analysis is repeated here for the coupled lossy transmission lines similar to the analysis done in previous section..1 Quasi-TEM Wave Propagation on the Coupled Lossy Transmission Lines With the assumption of quasi-tem wave propagation, the distributions of voltages and currents in an n coupled lossy transmission-line system can be described by the generalized Telegraphist's equations t) t) t) =?L? Ri(x; t) t) =?C ; (.) where 0 x l, and v(x; t) and i(x; t) are column vectors dening the voltages v k (x; t) and currents i k (x; t) distributed on the conductors k = 1; ; ; :::; n. The L and C are the n by n symmetric matrices of the per-unit-length inductance and capacitance of the n conductor system. The R = diag(r kk ), k = 1:::n is the diagonal matrix of the per-unit-length resistance of the n conductors.

14 . Congruence Transformation of the Lossy Coupled Transmission Lines 1. Congruence Transformation of the Coupled Lossy Transmission Lines Chang proposes the method of congruence transformation of n coupled lossy transmission lines in his 1989 paper []. Taking derivative with respect to x for both sides of Equation (.1) and (.) with proper substitution of terms, one obtains the following v(x; t) = v(x; + i(x; t) = i(x; t) t) t) ; (.4) In order to decouple the coupled system, all seven matrices R, L, C, LC, CL, RC, and CR must be simultaneously diagonalized. It has been shown that the following steps can achieve this goal []: 1. Construct the time constant matrix T.. Find the eigenvalues of the matrix T.. Construct the congruence transformation matrix X. 4. Diagonalize all matrices using matrix X. 5. Build the decoupled system based on the diagonalized matrices. First, one needs to nd the right eigenvector matrix W of the time constant matrix T using standard mathematical methods such as Givens and Household method. Dene the eigenvalues of time constant matrix T to be k, one obtains: T R?1= LR?1= = W diag( k )W?1 ; (.5) where R?1= = diag(1= p R kk ), k = 1; :::; n, and the right eigenvector matrix W has the property of the similarity transformation W?1 = W t. Now applying the linear transformation: V p (t) = XU p (t) (.)

15 14. Congruence Transformation of the Lossy Coupled Transmission Lines I p (t) =? X t?1 Jp (t); (.) where the congruence transformer matrix X is dened as: p q X diag( R kk )W diag( k =L k ); (.8) into Equation (.1), (.), (.) and (.4), after rearrangement, after rearrangements, one obtains the following Equations (.9) to t) t)? u(x; t) =?X?1 L X t?1? =?X t) CX = X?1 t)? X?1 R X t?1 [?j(x; t)] (.9) + X?1 j(x; = X t CL X j(x; t) + X t CR X t) (.10) (.11) : (.1) It can be shown that the coecient matrices are all diagonal matrices as represented by Equations (.1) to (.1): ~R = X?1 R(X t )?1 = diag(r k ) = diag(l k = k ) ~L = X?1 L(X t )?1 = diag(l k ) ~C = X t CX = diag(c k ) = diag(1= L k ) ~L~C = X?1 LCX = X?1 L X t?1 X t CX = diag(lc k ) = diag(1= ) ~C~L = X t CL X t?1 = X t CXX?1 L X t?1 = diag(clk ) = diag(1= ) ~R~C = X?1 RCX = X?1 R X t?1 X t CX = diag(rc k ) ~C~R = X t CR X t?1 = X t CXX?1 R X t?1 = diag(crk ): where k = 1:::n and diag(l k ) represents an n by n diagonal matrix L which all o-diagonal elements are equal to zero. The R k, L k, C k, (LC) k, (CL) k, (RC) k, and (CR) k are the k? th eigenvalue of

16 . Congruence Transformation of the Lossy Coupled Transmission Lines 15 the matrices R, L, C, LC, CL, RC, and CR. Redened the Telegraphist Equations using Equations as shown in (.1) to t) t)? u(x; u(x; t) + j(x; j(x; t) + ~C~R? ~R [?j(x; t)] (.1) t) t) : (.1) The coupled lossy transmission lines as shown in Figure.1 can be decoupled. The newly decoupled system is now shown in Figure.1. R 11 i 11 j L 11 1 C 1 j 11 i 1 v 11 u 11 u 1 v 1 i 1k X j 1k j 1k X i k v 1k u 1k u k v k R kk L k C k i 1n j 1n j 1n i n v 1n u 1n u n v n R nn L n C n

17 1 4. Experiment Results exception of X where X is now dened in Equation (.8). S = 4?[X?1 + X t ]?1 [X?1? X t ] [X?1 + X t ]?1 [X + (X t )?1 ]?1?[X + (X t )?1 ]?1 [X? (X t )?1 ] 5 : (.1) For each of the decoupled lossy transmission line shown in Figure.1, the scattering parameter matrix representation is the same and the computation of Z c and are dierent [8]: [S] = h S V i = 1 Z 0 Z c cosh() + (Z + 0 Z c ) sinh() 4 (Z 0? Z c ) sinh() Z 0 Z c Z 0 Z c (Z 0? Z c ) sinh() 5 ;(.18) where Z 0 is the reference impedance, and both Z c and are computed from the eigenvalues R k, L k, and C k obtained from the diagonalization of the R, L, and C matrices respectively. The Z c = q Rk +sl k sc k is the characteristic impedance of the k? th line where k = 1:::n, and p = (R k + sl k )(sc k ) l is the propagation constant of the k? th line where l is the coupling length. 4 Experiment Results The examples presented here are some of the MCMC-94 Benchmarks (1994 IEEE Multi-Chip Module Conference Interconnect Simulation Benchmarks). The results are compared with digitized waveforms extracted from the published papers with the exception of Example which instead is compared to Ansoft's Maxwell/Spicelink results. Example is a coupled lossy transmission-line systems whereas the rest of the examples are coupled lossless transmission-line systems. All of the Far-end waveforms are simulated with time-of-ight captured explicitly [10]. The running time reported in all examples using our simulator or SPICE-like simulator are the running time on a SUN SPARC station 1+. The running time of other simulators are not listed because they are executed on dierent machines.

18 4. Experiment Results Example 1 The circuit and geometry parameters of Example 1 as shown in Figure 4.1 (a) is taken from Chang's paper []. The geometry parameters are listed in the circuit schematic with all three transmission lines are uniform in geometry. The C and L of the conguration are: L = C = 4 4 :890 nh=cm 1:8 nh=cm 0:85 nh=cm 1:8 nh=cm :19 nh=cm 1:8 nh=cm 0:85 nh=cm 1:8 nh=cm :890 nh=cm 1:041 pf=cm?0:4 pf=cm?0:0140 pf=cm?0:4 pf=cm 1:198 pf=cm?0:4 pf=cm?0:0140 pf=cm?0:4 pf=cm 1:041 pf=cm 5 5 The simulation waveforms of this example are compared to Chang's and are shown in Figure 4.1 (b), (c), (d), (e), (f), and (g). The total running time for this example is :48 seconds. Our simulation results does not match the published measurement results too well because the extreme long time-of-ight. This kind of coupled lossless transmission line systems are best handled in time-domain using Method of Characteristic model []. 4. Example The circuit and geometry parameters of Example as shown in Figure 4. (a) are taken from Romeo et al paper [14]. The C and L matrices are generated using Maxwell from Ansoft whereas the SPICE simulation results are obtained from Spicelink which uses a method derived from Djordjevic []. The relative permittivity is changed from 4:5 to 10:0. The geometry parameters are listed in the circuit schematic where all three transmission lines are uniform. The C and L of the conguration obtained from Maxwell are:

19 Experiment Results Volt Near-End Active Line Near-End Active Line Far-End 50Ω v in ( t) v 1a ( t) v a ( t) First Sense Line Second Sense Line v a ( t) v b ( t) v b ( t) R b v 1b ( t) R b R 1b spacing = 10.0 mil width = 0.0 mil metal thickness = 1.4 mil dielectric height = 0.0 mil length = 1 in relative permittivity = 4.5

20 4. Experiment Results 19 L = C = 4 4 4:99 nh=cm 1:19 nh=cm 0:495 nh=cm 1:19 nh=cm 4:994 nh=cm 1:191 nh=cm 0:495 nh=cm 1:191 nh=cm 4:95 nh=cm 1:41 pf=cm?0:185 pf=cm?0:01018 pf=cm?0:185 pf=cm 1:445 pf=cm?0:199 pf=cm?0:01018 pf=cm?0:199 pf=cm 1:8 pf=cm 5 5 The simulation waveforms of this example are compared to those generated by SWEC [1], Coee [4], and Spicelink and are shown in Figure 4. (b), (c), (d), and (e). All the simulation results from four dierent simulators agree with each other very well. The total running time of this example is 1:10 seconds. The total simulation time for Ansoft Spicelink is :95 seconds. 4. Example The circuit and geometry parameters of Example as shown in Figure 4. (a) are taken from Schutt-Aine et al paper [1]. The geometry parameters are listed in the circuit schematic where all three transmission lines are uniform. The length of this coupled system is 5 inch. The R, L and C of the conguration are listed as follow: R = L = C = :5000 ohm=cm 0:0000 ohm=cm 0:0000 ohm=cm 0:5000 ohm=cm :100 nh=cm 1:0000 nh=cm 1:0000 nh=cm :100 nh=cm 5 1:0840 pf=cm?0:1940 pf=cm?0:1940 pf=cm 1:0840 pf=cm 5 5 The simulation waveforms of this example are shown in Figure 4. (b), (c), (d), and (e). Results from SPICEe and Schutt-Aine are also plotted for comparison. The SPICEe results are obtains by

21 0 4. Experiment Results 9 ohm Line 1 50 ohm Near End Line Far End V in 9 ohm Line 00 ohm spacing = 0.44 mm width = 0.19 mm metal thickness = 0.0 mm dielectric height = 0.41 mm length = 10 mm relative permittivity = ohm

22 4. Experiment Results 1 applying the decoupling technique in time-domain. For all the waveform plots, our method obtains results that match SPICEe simulation results better than Schutt-Aine's. The total running time for this example is 4:4 seconds. 4.4 Example 4 The circuit and geometry parameters of Example 4 as shown in Figure 4.4 are taken from Cooke's paper []. The driving signal is 100-MHz 50% duty-cycle pulse with 0:1ns rise/fall time. The estimated harmonic bandwidth of this driving signal is well over :5-GHz. The geometry parameters are listed in the circuit schematic where all six transmission lines are uniform. The R, L and C of the conguration are: L = C = 4 4 5:0 nh=cm 1:4 nh=cm 0:818 nh=cm 1:4 nh=cm 4:9 nh=cm 1:4 nh=cm 0:818 nh=cm 1:4 nh=cm 5:0 nh=cm 0: pf=cm?0:1 pf=cm?0:0145 pf=cm?0:1 pf=cm 0: pf=cm?0:1 pf=cm?0:0145 pf=cm?0:1 pf=cm 0: pf=cm 5 5 The simulation waveforms of this example are shown in Figure 4.5 (a), (b), (c), and (d). Two zoom in portion of the simulation waveforms are shown in Figure 4.5 (e) and (f). The ASTAP and Cooke's simulation waveforms are digitized from the results published in Cooke's paper [] while the SWEC results are obtained from MCMC-94 benchmarks. The SWEC uses analytic method to nd the derivatives of the admittance in order to compute the moments; because of the complexity, it only nd lower order moments [1]. In all the plots, the results obtained from SWEC and our macromodel simulator agree with published ASTAP results. However, the macromodel simulation waveforms match those of the ASTAP simulator better than those derived from the SWEC. In all the waveform plots, Cooke's results deviate from the ASTAP results the most. Our method is better than Cooke's scattering parameter approach because our results match those of the ASTAP

23 4. Experiment Results n 40 ohm x = 0 Active Line x = l 40 ohm Sense Line C=5.0pF C=5.0pF

24 Figure 4.4: Two Groups 5. Conclusion L Vc(t) Va(t) 5 ohm L Vd(t) Vb(t) R C + R R R R C C V in R = ohm, C = 1pF, L = 10 nh

25 4 5. Conclusion Volts x Volts x Waveforms of the Near-End of the Active Line (a) Waveforms of the Far-End of Sense Line (c) ASTEP Va(t) Prince s Result Macromodel SWEC Nano Second ASTEP Vc(t) Prince s Result Macromodel SWEC Enlarged Potion of the Waveforms, Near-End Active Line Volts x (e) Nano Second ASTAP Va(t) Prince s Result Macromodel SWEC Nano Second Volts x Volts x Waveforms of the Far-End of the Active Line (b) Waveforms of the Far-End of the Sense Line (d) Enlarged Potion of the Waveforms, Near-End Active Line Volts x (f) ASTEP Vd(t) Prince s Result Macromodel SWEC Nano Second ASTEP Vb(t) Prince s Result Macromodel SWEC ASTAP Vd(t) Prince s Result Macromodel SWEC Nano Second Nano Second Figure 4.5: Simulation Waveforms of the Two Groups of Three Coupled Lossless Transmission Lines: The topology is shown in Figure 4.4. The output waveforms of the near end of the active line are shown in (a) together with its corresponding Cooke's, ASTAP and SWEC simulation results. The output waveforms of the far end of all three lines are shown in (b), (c), and (d) together with their corresponding Cooke's ASTAP and SWEC simulation results. Two enlarged portion of waveforms are shown in (e) and (f).

26 . Acknowledgment 5 This has also been extended to the analysis of the coupled lossy transmission lines. Taking full advantage of the frequency domain simulation nature of the scattering parameter based macromodel simulator, transient analysis of coupled transmission lines can approach the accuracy of SPICE-like simulator with orders of magnitude less computation time. Acknowledgment This work is supported in part by the National Science Foundation Presidential Young Investigator Award under the Grant MIP Appreciations also goes to Ansoft Corporation for providing Maxwell/Spicelink software. References [1] M. Bayard. Synthesis of n-terminal pair networks. Proc. Symposium on Modern Network Synthesis, page 9, 195. Eq. (). [] F. Y. Chang. Transient analysis of lossless coupled transmission lines in a nonhomogeneous dielectric medium. IEEE Trans. on Microwave Theory and Techniques, MTT-18, No. 9:1{, Sep [] F.Y. Chang. The generalized method of characteristic for waveform relaxation analysis of lossy coupled transmission lines. IEEE Trans. on Microwave Theory and Techniques, MTT-, No. 1:08{08, [4] Eli Chiprout and M. Nakhla. Generalized moment-matching methods for transient analysis of interconnect networks. 9 th ACM/IEEE Design Automation Conference Proceedings, pages 01{0, 199. [5] Eli Chiprout and Michel Nakhla. Transient waveform estimation of high-speed mcm networks using complex frequency hopping. In Proc. of IEEE Multi-Chip Module Conference MCMC-9, pages 0{0, 199.

27 References [] Bradly J. Cooke, John Prince, and Andreas C. Cangellaris. S-parameter analysis of multiconductor, integrated circuit interconnect systems. IEEE Trans. on Computer-Aided-Design, 11, No. :5{0, 199. [] Antonije. R. Djordjevic, Tapan. K. Sarkar, and Roger. F. Harrington. Time-domain response of multiconductor transmission lines. Proceedings of the IEEE, 5():111{1, 198. [8] J. Dobrowolski. Introduction to Computer Methods for Microwave Circuit Analysis and Design. Artech House, [9] D. Hazony. Elements of Network Synthesis. Reinhold, New York, 19. [10] Haifang Liao and Wayne Dai. Extracting time-of-ight from scatering-parameter based macromodel. Technical Report 9-5, University of Clifornia, Santa Cruz, 199. [11] Haifang Liao, Wayne Dai, Rui Wang, and F. Y. Chang. Scatering-parameter based macro model of distributed-lumped networks using expnontially decayed polynomial function. In Proc. of 0th ACM/IEEE Design Automation Conference, pages {1, 199. [1] Haifang Liao, Rui Wang, Wayne Dai, and R. Chandra. Scatering-parameter based macro model of distributed-lumped networks using pade approximation. In Proc. of International Symposium on Circuits and Systems, 199. [1] Shen Lin, Marek-Sadowska M., and E. S. Kuh. Swec: a stepwise equivalent conductance timing simulator for cmos vlsi circuits. EDAC. Proceedings of the European Conference on Design Automation, pages 14{148, Feburary [14] Fabio Romeo and Mauro Sanomauro. Time-domain simulation of n coupled transmission lines. IEEE Trans. on Microwave Theory and Techniques, MTT-5, No. :11{1, Feburary 198. [15] David S., Andrew T. Yang, and Sung Mo Kang. Modeling and simulation of interconnect delays and crosstalks in high-speed integrated circuits. IEEE Trans. on Circuits and Systems, Vol. :1{9, January [1] Jose E. Schutt-Aine and Raj Mittra. Nonlinear transient analysis of coupled transmission lines. IEEE Trans. on Microwave Theory and Techniques, MTT-, No. :959{9, 1989.

Networks Characterized by. Data. Jimmy Shinn-Hwa Wang. Wayne Wei-Ming Dai. April 10, Baskin Center for. University of California, Santa Cruz

Networks Characterized by. Data. Jimmy Shinn-Hwa Wang. Wayne Wei-Ming Dai. April 10, Baskin Center for. University of California, Santa Cruz Transient Analysis of Interconnect Networks Characterized by Measured Scattering-Parameter Data Jimmy Shinn-Hwa Wang Wayne Wei-Ming Dai UCSC-CRL-95-05 April 10, 1995 Baskin Center for Computer Engineering

More information

Model-Order Reduction of High-Speed Interconnects: Challenges and Opportunities

Model-Order Reduction of High-Speed Interconnects: Challenges and Opportunities Model-Order Reduction of High-Speed Interconnects: Challenges and Opportunities Michel Nakhla Carleton University Canada Model Reduction for Complex Dynamical Systems Berlin 2010 EMI Delay Crosstalk Reflection

More information

Efficient Simulation of Lossy and Dispersive Transmission Lines

Efficient Simulation of Lossy and Dispersive Transmission Lines Efficient Simulation of Lossy and Dispersive Transmission Lines Tuyen V. guyen* IBM Microelectronics, Hopewell Junction, Y 2533 Abstract - This paper presents an efficient method, based on the transfer

More information

ECE 546 Lecture 13 Scattering Parameters

ECE 546 Lecture 13 Scattering Parameters ECE 546 Lecture 3 Scattering Parameters Spring 08 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 546 Jose Schutt Aine Transfer Function Representation

More information

Electromagnetic Modeling and Signal Integrity Simulation of Power/Ground Networks in High Speed Digital Packages and Printed Circuit Boards

Electromagnetic Modeling and Signal Integrity Simulation of Power/Ground Networks in High Speed Digital Packages and Printed Circuit Boards Electromagnetic Modeling and Signal Integrity Simulation of Power/Ground Networks in High Speed Digital Packages and Printed Circuit Boards Frank Y. Yuan Viewlogic Systems Group, Inc. 385 Del Norte Road

More information

ECE 497 JS Lecture - 18 Noise in Digital Circuits

ECE 497 JS Lecture - 18 Noise in Digital Circuits ECE 497 JS Lecture - 18 Noise in Digital Circuits Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 Announcements Thursday April 15 th Speaker:

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 24: April 19, 2018 Crosstalk and Wiring, Transmission Lines Lecture Outline! Crosstalk! Repeaters in Wiring! Transmission Lines " Where transmission

More information

! Crosstalk. ! Repeaters in Wiring. ! Transmission Lines. " Where transmission lines arise? " Lossless Transmission Line.

! Crosstalk. ! Repeaters in Wiring. ! Transmission Lines.  Where transmission lines arise?  Lossless Transmission Line. ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 24: April 19, 2018 Crosstalk and Wiring, Transmission Lines Lecture Outline! Crosstalk! Repeaters in Wiring! Transmission Lines " Where transmission

More information

ECE 598 JS Lecture 06 Multiconductors

ECE 598 JS Lecture 06 Multiconductors ECE 598 JS Lecture 06 Multiconductors Spring 2012 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 TELGRAPHER S EQUATION FOR N COUPLED TRANSMISSION LINES

More information

Electromagnetic Parameters Extraction for Integrated-circuit Interconnects for Open Three conductors with Two Levels Systems

Electromagnetic Parameters Extraction for Integrated-circuit Interconnects for Open Three conductors with Two Levels Systems Electromagnetic Parameters Extraction for Integrated-circuit Interconnects for Open Three conductors with Two Levels Systems S. M. Musa, M. N. O. Sadiku, and J. D. Oliver Corresponding author: S.M. Musa

More information

Non-Sinusoidal Waves on (Mostly Lossless)Transmission Lines

Non-Sinusoidal Waves on (Mostly Lossless)Transmission Lines Non-Sinusoidal Waves on (Mostly Lossless)Transmission Lines Don Estreich Salazar 21C Adjunct Professor Engineering Science October 212 https://www.iol.unh.edu/services/testing/sas/tools.php 1 Outline of

More information

Accurate Modeling of Lossy Nonuniform Transmission Lines by Using Differential Quadrature Methods

Accurate Modeling of Lossy Nonuniform Transmission Lines by Using Differential Quadrature Methods IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL 50, NO 10, OCTOBER 2002 2233 Accurate Modeling of Lossy Nonuniform Transmission Lines by Using Differential Quadrature Methods Qinwei Xu, Student

More information

ECE 497 JS Lecture - 13 Projects

ECE 497 JS Lecture - 13 Projects ECE 497 JS Lecture - 13 Projects Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 ECE 497 JS - Projects All projects should be accompanied

More information

TC 412 Microwave Communications. Lecture 6 Transmission lines problems and microstrip lines

TC 412 Microwave Communications. Lecture 6 Transmission lines problems and microstrip lines TC 412 Microwave Communications Lecture 6 Transmission lines problems and microstrip lines RS 1 Review Input impedance for finite length line Quarter wavelength line Half wavelength line Smith chart A

More information

Statistical approach in complex circuits by a wavelet based Thevenin s theorem

Statistical approach in complex circuits by a wavelet based Thevenin s theorem Proceedings of the 11th WSEAS International Conference on CIRCUITS, Agios Nikolaos, Crete Island, Greece, July 23-25, 2007 185 Statistical approach in complex circuits by a wavelet based Thevenin s theorem

More information

Rational ABCD Modeling of High-Speed Interconnects

Rational ABCD Modeling of High-Speed Interconnects Rational ABCD Modeling of High-Speed Interconnects Qinwei u and Pinaki Mazumder EECS Dept. University of Michigan, Ann Arbor, MI 4819 Email: qwxu@eecs.umich.edu, mazum@eecs.umich.edu Abstract This paper

More information

Implementation of a Transmission Line Model with the PEEC Method for Lightning Surge Analysis

Implementation of a Transmission Line Model with the PEEC Method for Lightning Surge Analysis Implementation of a Transmission Line Model with the PEEC Method for Lightning Surge Analysis PEERAWUT YUTTHAGOWITH Department of Electrical Engineering, Faculty of Engineering King Mongkut s Institute

More information

STUDY OF LOSS EFFECT OF TRANSMISSION LINES AND VALIDITY OF A SPICE MODEL IN ELECTROMAG- NETIC TOPOLOGY

STUDY OF LOSS EFFECT OF TRANSMISSION LINES AND VALIDITY OF A SPICE MODEL IN ELECTROMAG- NETIC TOPOLOGY Progress In Electromagnetics Research, PIER 90, 89 103, 2009 STUDY OF LOSS EFFECT OF TRANSMISSION LINES AND VALIDITY OF A SPICE MODEL IN ELECTROMAG- NETIC TOPOLOGY H. Xie, J. Wang, R. Fan, andy. Liu Department

More information

Interconnect Energy Dissipation in High-Speed ULSI Circuits

Interconnect Energy Dissipation in High-Speed ULSI Circuits Interconnect Energy Dissipation in High-Speed ULSI Circuits Payam Heydari Soroush Abbaspour and Massoud Pedram Department of Electrical Engineering and Computer Science Department of Electrical Engineering-Systems

More information

ALGORITHM FOR ACCURATE CAPACITANCE MATRIX MEASUREMENTS OF THE MULTICONDUCTOR STRUCTURE FOR VLSI INTERCONNECTIONS

ALGORITHM FOR ACCURATE CAPACITANCE MATRIX MEASUREMENTS OF THE MULTICONDUCTOR STRUCTURE FOR VLSI INTERCONNECTIONS ALGORITHM FOR ACCURATE CAPACITANCE MATRIX MEASUREMENTS OF THE MULTICONDUCTOR STRUCTURE FOR VLSI INTERCONNECTIONS Lech ZNAMIROWSKI Olgierd A. PALUSINSKI DEPARTMENT OF AUTOMATIC CONTROL, DEPARTMENT OF ELECTRICAL

More information

Effects from the Thin Metallic Substrate Sandwiched in Planar Multilayer Microstrip Lines

Effects from the Thin Metallic Substrate Sandwiched in Planar Multilayer Microstrip Lines Progress In Electromagnetics Research Symposium 2006, Cambridge, USA, March 26-29 115 Effects from the Thin Metallic Substrate Sandwiched in Planar Multilayer Microstrip Lines L. Zhang and J. M. Song Iowa

More information

Transient Analysis of Interconnects by Means of Time-Domain Scattering Parameters

Transient Analysis of Interconnects by Means of Time-Domain Scattering Parameters Transient Analysis of Interconnects by Means of Time-Domain Scattering Parameters Wojciech Bandurski, Poznań Univ. of Technology 60-965 Poznań, Piotrowo 3a, Poland, bandursk@zpe.iee.put.poznan.pl INTRODUCTION

More information

ECE 451 Advanced Microwave Measurements. TL Characterization

ECE 451 Advanced Microwave Measurements. TL Characterization ECE 451 Advanced Microwave Measurements TL Characterization Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 451 Jose Schutt-Aine 1 Maxwell s Equations

More information

ECE 497 JS Lecture -03 Transmission Lines

ECE 497 JS Lecture -03 Transmission Lines ECE 497 JS Lecture -03 Transmission Lines Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 MAXWELL S EQUATIONS B E = t Faraday s Law of Induction

More information

Transmission Line Basics II - Class 6

Transmission Line Basics II - Class 6 Transmission Line Basics II - Class 6 Prerequisite Reading assignment: CH2 Acknowledgements: Intel Bus Boot Camp: Michael Leddige Agenda 2 The Transmission Line Concept Transmission line equivalent circuits

More information

Microwave Phase Shift Using Ferrite Filled Waveguide Below Cutoff

Microwave Phase Shift Using Ferrite Filled Waveguide Below Cutoff Microwave Phase Shift Using Ferrite Filled Waveguide Below Cutoff CHARLES R. BOYD, JR. Microwave Applications Group, Santa Maria, California, U. S. A. ABSTRACT Unlike conventional waveguides, lossless

More information

ECE 546 Lecture 15 Circuit Synthesis

ECE 546 Lecture 15 Circuit Synthesis ECE 546 Lecture 15 Circuit Synthesis Spring 018 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 546 Jose Schutt Aine 1 MOR via Vector Fitting Rational

More information

ECE414/514 Electronics Packaging Spring 2012 Lecture 6 Electrical D: Transmission lines (Crosstalk) Lecture topics

ECE414/514 Electronics Packaging Spring 2012 Lecture 6 Electrical D: Transmission lines (Crosstalk) Lecture topics ECE414/514 Electronics Packaging Spring 2012 Lecture 6 Electrical D: Transmission lines (Crosstalk) James E. Morris Dept of Electrical & Computer Engineering Portland State University 1 Lecture topics

More information

Combined FDTD/Macromodel Simulation of Interconnected Digital Devices

Combined FDTD/Macromodel Simulation of Interconnected Digital Devices Combined FDTD/Macromodel Simulation of Interconnected Digital Devices S. Grivet-Talocia, I. S. Stievano, I. A. Maio, F. G. Canavero Dip. Elettronica, Politecnico di Torino, Torino, Italy (E-mail: grivet@polito.it)

More information

EELE 3332 Electromagnetic II Chapter 11. Transmission Lines. Islamic University of Gaza Electrical Engineering Department Dr.

EELE 3332 Electromagnetic II Chapter 11. Transmission Lines. Islamic University of Gaza Electrical Engineering Department Dr. EEE 333 Electromagnetic II Chapter 11 Transmission ines Islamic University of Gaza Electrical Engineering Department Dr. Talal Skaik 1 1 11.1 Introduction Wave propagation in unbounded media is used in

More information

An Optimum Fitting Algorithm for Generation of Reduced-Order Models

An Optimum Fitting Algorithm for Generation of Reduced-Order Models An Optimum Fitting Algorithm for Generation of Reduced-Order Models M.M. Gourary 1, S.G. Rusakov 1, S.L. Ulyanov 1, M.M. Zharov 1, B.J. Mulvaney 2 1 IPPM, Russian Academy of Sciences, Moscow 1523, e-mail:

More information

A Note on the Modeling of Transmission-Line Losses

A Note on the Modeling of Transmission-Line Losses Appears in IEEE Transactions on Microwave Theory & Technology, vol. 51, pp. 483-486, February 2003. A Note on the Modeling of Transmission-Line Losses Antonije R. Djordjević, Alenka G. Zajić, Dejan V.

More information

Transmission Lines. Plane wave propagating in air Y unguided wave propagation. Transmission lines / waveguides Y. guided wave propagation

Transmission Lines. Plane wave propagating in air Y unguided wave propagation. Transmission lines / waveguides Y. guided wave propagation Transmission Lines Transmission lines and waveguides may be defined as devices used to guide energy from one point to another (from a source to a load). Transmission lines can consist of a set of conductors,

More information

SPICE MODELS FOR RADIATED AND CONDUCTED SUSCEPTIBILITY ANALYSES OF MULTICONDUCTOR SHIELDED CABLES

SPICE MODELS FOR RADIATED AND CONDUCTED SUSCEPTIBILITY ANALYSES OF MULTICONDUCTOR SHIELDED CABLES Progress In Electromagnetics Research, PIER 103, 241 257, 2010 SPICE MODELS FOR RADIATED AND CONDUCTED SUSCEPTIBILITY ANALYSES OF MULTICONDUCTOR SHIELDED CABLES H. Xie, J. Wang, R. Fan, and Y. Liu Department

More information

SYNTHESIS OF MICROWAVE RESONATOR DIPLEX- ERS USING LINEAR FREQUENCY TRANSFORMATION AND OPTIMIZATION

SYNTHESIS OF MICROWAVE RESONATOR DIPLEX- ERS USING LINEAR FREQUENCY TRANSFORMATION AND OPTIMIZATION Progress In Electromagnetics Research, Vol. 24, 44 4, 22 SYNTHESIS OF MICROWAVE RESONATOR DIPLEX- ERS USING LINEAR FREQUENCY TRANSFORMATION AND OPTIMIZATION R. Wang *, J. Xu, M.-Y. Wang, and Y.-L. Dong

More information

Transmission Line Basics

Transmission Line Basics Transmission Line Basics Prof. Tzong-Lin Wu NTUEE 1 Outlines Transmission Lines in Planar structure. Key Parameters for Transmission Lines. Transmission Line Equations. Analysis Approach for Z and T d

More information

ECE 546 Lecture 07 Multiconductors

ECE 546 Lecture 07 Multiconductors ECE 546 Lecture 07 Multiconductors Spring 2018 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 546 Jose Schutt Aine 1 TELGRAPHER S EQUATION FOR N COUPLED

More information

Modeling frequency-dependent conductor losses and dispersion in serial data channel interconnects

Modeling frequency-dependent conductor losses and dispersion in serial data channel interconnects Modeling frequency-dependent conductor losses and dispersion in serial data channel interconnects Yuriy Shlepnev Simberian Inc., www.simberian.com Abstract: Models of transmission lines and transitions

More information

General Appendix A Transmission Line Resonance due to Reflections (1-D Cavity Resonances)

General Appendix A Transmission Line Resonance due to Reflections (1-D Cavity Resonances) A 1 General Appendix A Transmission Line Resonance due to Reflections (1-D Cavity Resonances) 1. Waves Propagating on a Transmission Line General A transmission line is a 1-dimensional medium which can

More information

ECE 497 JS Lecture -07 Planar Transmission Lines

ECE 497 JS Lecture -07 Planar Transmission Lines ECE 497 JS Lecture -07 Planar Transmission Lines Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 Microstrip ε Z o w/h < 3.3 2 119.9 h h =

More information

Omar M. Ramahi University of Waterloo Waterloo, Ontario, Canada

Omar M. Ramahi University of Waterloo Waterloo, Ontario, Canada Omar M. Ramahi University of Waterloo Waterloo, Ontario, Canada Traditional Material!! Electromagnetic Wave ε, μ r r The only properties an electromagnetic wave sees: 1. Electric permittivity, ε 2. Magnetic

More information

ECE 451 Macromodeling

ECE 451 Macromodeling ECE 451 Macromodeling Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 451 Jose Schutt Aine 1 Blackbox Macromodeling Nonlinear Network 1 Nonlinear Network

More information

Analytical Delay Models for VLSI Interconnects Under Ramp Input

Analytical Delay Models for VLSI Interconnects Under Ramp Input Analytical Delay Models for VLSI Interconnects Under amp Input Andrew B. Kahng, Kei Masuko, and Sudhakar Muddu UCLA Computer Science Department, Los Angeles, CA 995-596 USA Cadence Design Systems, Inc.,

More information

ECE 107: Electromagnetism

ECE 107: Electromagnetism ECE 107: Electromagnetism Set 2: Transmission lines Instructor: Prof. Vitaliy Lomakin Department of Electrical and Computer Engineering University of California, San Diego, CA 92093 1 Outline Transmission

More information

Compact Distributed RLC Interconnect Models Part I: Single Line Transient, Time Delay, and Overshoot Expressions

Compact Distributed RLC Interconnect Models Part I: Single Line Transient, Time Delay, and Overshoot Expressions 2068 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 47, NO. 11, NOVEMBER 2000 Compact Distributed RLC Interconnect Models Part I: Single Line Transient, Time Delay, and Overshoot Expressions Jeffrey A. Davis

More information

THE recent trend in the VLSI industry toward miniature

THE recent trend in the VLSI industry toward miniature Model Order Reduction of Linear Time Variant High Speed VLSI Interconnects using Frequency Shift Technique J.V.R.Ravindra, Student Member, IEEE, M.B.Srinivas, Member, IEEE International Science Index,

More information

Interconnect s Role in Deep Submicron. Second class to first class

Interconnect s Role in Deep Submicron. Second class to first class Interconnect s Role in Deep Submicron Dennis Sylvester EE 219 November 3, 1998 Second class to first class Interconnect effects are no longer secondary # of wires # of devices More metal levels RC delay

More information

GMII Electrical Specification Options. cisco Systems, Inc.

GMII Electrical Specification Options. cisco Systems, Inc. DC Specifications GMII Electrical Specification Options Mandatory - Communication between the transmitter and receiver can not occur at any bit rate without DC specifications. AC Specifications OPTION

More information

SYMBOLIC ANALYSIS OF POWER/GROUND NETWORKS. focused on nding transfer function solutions for general

SYMBOLIC ANALYSIS OF POWER/GROUND NETWORKS. focused on nding transfer function solutions for general SYMBOLIC ANALYSIS OF POWER/GROUND NETWORKS USING MOMENT-MATCHING METHODS Jatan C Shah 1 Ahmed A Younis 1 Sachin S Sapatnekar 2 Marwan M Hassoun 1 1 Department of Electrical and Computer Engineering, Iowa

More information

PRESENT advanced microprocessor designs rely heavily

PRESENT advanced microprocessor designs rely heavily IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 28, NO. 1, FEBRUARY 2005 57 Experimental Validation of Crosstalk Simulations for On-Chip Interconnects Using S-Parameters Mauro J. Kobrinsky, Sourav Chakravarty,

More information

EECS 117 Lecture 3: Transmission Line Junctions / Time Harmonic Excitation

EECS 117 Lecture 3: Transmission Line Junctions / Time Harmonic Excitation EECS 117 Lecture 3: Transmission Line Junctions / Time Harmonic Excitation Prof. Niknejad University of California, Berkeley University of California, Berkeley EECS 117 Lecture 3 p. 1/23 Transmission Line

More information

Electromagnetic Waves

Electromagnetic Waves Electromagnetic Waves Maxwell s equations predict the propagation of electromagnetic energy away from time-varying sources (current and charge) in the form of waves. Consider a linear, homogeneous, isotropic

More information

The Wire. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Wire. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Wire July 30, 2002 1 The Wire transmitters receivers schematics physical 2 Interconnect Impact on

More information

Accurate Estimating Simultaneous Switching Noises by Using Application Specific Device Modeling

Accurate Estimating Simultaneous Switching Noises by Using Application Specific Device Modeling Accurate Estimating Simultaneous Switching Noises by Using Application Specific Device Modeling Li Ding and Pinaki Mazumder Department of Electrical Engineering and Computer Science The University of Michigan,

More information

Distributed SPICE Circuit Model for Ceramic Capacitors

Distributed SPICE Circuit Model for Ceramic Capacitors Published in Conference Record, Electrical Components Technology Conference (ECTC), Lake Buena Vista, Florida, pp. 53-58, May 9, 00. Distributed SPICE Circuit Model for Ceramic Capacitors Larry D Smith,

More information

A Time Domain Approach to Power Integrity for Printed Circuit Boards

A Time Domain Approach to Power Integrity for Printed Circuit Boards A Time Domain Approach to Power Integrity for Printed Circuit Boards N. L. Mattey 1*, G. Edwards 2 and R. J. Hood 2 1 Electrical & Optical Systems Research Division, Faculty of Engineering, University

More information

Finite Element Method Analysis of Symmetrical Coupled Microstrip Lines

Finite Element Method Analysis of Symmetrical Coupled Microstrip Lines International Journal of Computing and Digital Systems ISSN (20-142X) Int. J. Com. Dig. Sys. 3, No.3 (Sep-2014) Finite Element Method Analysis of Symmetrical Coupled Microstrip Lines Sarhan M. Musa and

More information

Analysis of TSV-to-TSV Coupling with High-Impedance Termination in 3D ICs

Analysis of TSV-to-TSV Coupling with High-Impedance Termination in 3D ICs Analysis of -to- Coupling with -Impedance Termination in 3D ICs Taigon Song, Chang Liu, Dae Hyun Kim, and Sung Kyu Lim School of Electrical and Computer Engineering, Georgia Institute of Technology, U.S.A.

More information

Experiment 06 - Extraction of Transmission Line Parameters

Experiment 06 - Extraction of Transmission Line Parameters ECE 451 Automated Microwave Measurements Laboratory Experiment 06 - Extraction of Transmission Line Parameters 1 Introduction With the increase in both speed and complexity of mordern circuits, modeling

More information

Fast Computation of Capacitance Matrix and Potential Distribution for Multiconductor in Non-Homogenous Multilayered Dielectric Media

Fast Computation of Capacitance Matrix and Potential Distribution for Multiconductor in Non-Homogenous Multilayered Dielectric Media Excerpt from te Proceedings of te OMSOL onference 2009 Boston Fast omputation of apacitance Matrix and Potential Distribution for Multiconductor in Non-Homogenous Multilayered Dielectric Media S. M. Musa

More information

Electrical Characterization of 3D Through-Silicon-Vias

Electrical Characterization of 3D Through-Silicon-Vias Electrical Characterization of 3D Through-Silicon-Vias F. Liu, X. u, K. A. Jenkins, E. A. Cartier, Y. Liu, P. Song, and S. J. Koester IBM T. J. Watson Research Center Yorktown Heights, NY 1598, USA Phone:

More information

EE5900 Spring Lecture 5 IC interconnect model order reduction Zhuo Feng

EE5900 Spring Lecture 5 IC interconnect model order reduction Zhuo Feng EE59 Spring Parallel VLSI CAD Algorithms Lecture 5 IC interconnect model order reduction Zhuo Feng 5. Z. Feng MU EE59 In theory we can apply moment matching for any order of approximation But in practice

More information

PCB Project: Measuring Package Bond-Out Inductance via Ground Bounce

PCB Project: Measuring Package Bond-Out Inductance via Ground Bounce PCB Project: Measuring Package Bond-Out Inductance via Ground Bounce Kylan Roberson July 9, 014 Abstract In this experiment I looked into a way of measuring the ground bounce generated by capacitively

More information

Transient Response of Transmission Lines and TDR/TDT

Transient Response of Transmission Lines and TDR/TDT Transient Response of Transmission Lines and TDR/TDT Tzong-Lin Wu, Ph.D. EMC Lab. Department of Electrical Engineering National Sun Yat-sen University Outlines Why do we learn the transient response of

More information

on a Stochastic Current Waveform Urbana, Illinois Dallas, Texas Abstract

on a Stochastic Current Waveform Urbana, Illinois Dallas, Texas Abstract Electromigration Median Time-to-Failure based on a Stochastic Current Waveform by Farid Najm y, Ibrahim Hajj y, and Ping Yang z y Coordinated Science Laboratory z VLSI Design Laboratory University of Illinois

More information

The Wire EE141. Microelettronica

The Wire EE141. Microelettronica The Wire 1 Interconnect Impact on Chip 2 Example: a Bus Network transmitters receivers schematics physical 3 Wire Models All-inclusive model Capacitance-only 4 Impact of Interconnect Parasitics Interconnect

More information

Digital Integrated Circuits. The Wire * Fuyuzhuo. *Thanks for Dr.Guoyong.SHI for his slides contributed for the talk. Digital IC.

Digital Integrated Circuits. The Wire * Fuyuzhuo. *Thanks for Dr.Guoyong.SHI for his slides contributed for the talk. Digital IC. Digital Integrated Circuits The Wire * Fuyuzhuo *Thanks for Dr.Guoyong.SHI for his slides contributed for the talk Introduction The Wire transmitters receivers schematics physical 2 Interconnect Impact

More information

3294 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 59, NO. 12, DECEMBER 2011

3294 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 59, NO. 12, DECEMBER 2011 3294 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 59, NO. 12, DECEMBER 2011 A Rigorous Solution to the Low-Frequency Breakdown in Full-Wave Finite-Element-Based Analysis of General Problems

More information

RECENT ADVANCES in NETWORKING, VLSI and SIGNAL PROCESSING

RECENT ADVANCES in NETWORKING, VLSI and SIGNAL PROCESSING Optimization of Reflection Issues in High Speed Printed Circuit Boards ROHITA JAGDALE, A.VENU GOPAL REDDY, K.SUNDEEP Department of Microelectronics and VLSI Design International Institute of Information

More information

Conventional Paper-I-2011 PART-A

Conventional Paper-I-2011 PART-A Conventional Paper-I-0 PART-A.a Give five properties of static magnetic field intensity. What are the different methods by which it can be calculated? Write a Maxwell s equation relating this in integral

More information

ECE 451 Transmission Lines & Packaging

ECE 451 Transmission Lines & Packaging Transmission Lines & Packaging Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 Radio Spectrum Bands The use of letters to designate bands has long ago

More information

5/1/2011 V R I. = ds. by definition is the ratio of potential difference of the wire ends to the total current flowing through it.

5/1/2011 V R I. = ds. by definition is the ratio of potential difference of the wire ends to the total current flowing through it. Session : Fundamentals by definition is the ratio of potential difference of the wire ends to the total current flowing through it. V R I E. dl L = σ E. ds A R = L σwt W H T At high frequencies, current

More information

L. Miguel Silveira Ibrahim M. Elfadel Jacob K. White. 555 River Oaks Parkway, MS 3B1. tables of data.

L. Miguel Silveira Ibrahim M. Elfadel Jacob K. White. 555 River Oaks Parkway, MS 3B1. tables of data. An Ecient Approach to Transmission Line Simulation using Measured or Tabulated S-parameter Data L. Miguel Silveira Ibrahim M. Elfadel Jacob K. White Research Laboratory of Electronics and the Department

More information

POLITECNICO DI TORINO Repository ISTITUZIONALE

POLITECNICO DI TORINO Repository ISTITUZIONALE POLITECNICO DI TORINO Repository ISTITUZIONALE Transient Analysis of Lossy Transmission Lines: an Efficient Approach Based on the Method of Characteristics Original Transient Analysis of Lossy Transmission

More information

Simultaneous Switching Noise in On-Chip CMOS Power Distribution Networks

Simultaneous Switching Noise in On-Chip CMOS Power Distribution Networks IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. 10, NO. 4, AUGUST 2002 487 Simultaneous Switching Noise in On-Chip CMOS Power Distribution Networks Kevin T. Tang and Eby G. Friedman,

More information

Comparison of Transient Simulations on Overhead Cables by EMTP and FDTD

Comparison of Transient Simulations on Overhead Cables by EMTP and FDTD Comparison of Transient Simulations on Overhead Cables by EMTP and FDTD H. Xue, M. Natsui, A. Ametani, J. Mahseredjian, H. Tanaka, Y. Baba 1 Abstract--Transient simulations on an overhead cable are performed

More information

Modeling of Multiconductor Microstrip Systems on Microwave Integrated Circuits

Modeling of Multiconductor Microstrip Systems on Microwave Integrated Circuits Modeling of Multiconductor Microstrip Systems on Microwave Integrated Circuits S. M. Musa, M. N. O. Sadiku, and K. T. Harris Roy G. Perry College of Engineering, Prairie View A&M University Prairie View,

More information

EMC Considerations for DC Power Design

EMC Considerations for DC Power Design EMC Considerations for DC Power Design Tzong-Lin Wu, Ph.D. Department of Electrical Engineering National Sun Yat-sen University Power Bus Noise below 5MHz 1 Power Bus Noise below 5MHz (Solution) Add Bulk

More information

AC Circuits. The Capacitor

AC Circuits. The Capacitor The Capacitor Two conductors in close proximity (and electrically isolated from one another) form a capacitor. An electric field is produced by charge differences between the conductors. The capacitance

More information

SRAM System Design Guidelines

SRAM System Design Guidelines Introduction This application note examines some of the important system design considerations an engineer should keep in mind when designing with Cypress SRAMs. It is important to note that while they

More information

Broadband transmission line models for analysis of serial data channel interconnects

Broadband transmission line models for analysis of serial data channel interconnects PCB Design Conference East, Durham NC, October 23, 2007 Broadband transmission line models for analysis of serial data channel interconnects Y. O. Shlepnev, Simberian, Inc. shlepnev@simberian.com Simberian:

More information

Miller Factor for Gate-Level Coupling Delay Calculation

Miller Factor for Gate-Level Coupling Delay Calculation for Gate-Level Coupling Delay Calculation Pinhong Chen Desmond A. Kirkpatrick Kurt Keutzer Dept. of EECS Intel Corp. Dept. of EECS U. C. Berkeley icroprocessor Products Group U. C. Berkeley Berkeley, CA

More information

Transmission-Line Essentials for Digital Electronics

Transmission-Line Essentials for Digital Electronics C H A P T E R 6 Transmission-Line Essentials for Digital Electronics In Chapter 3 we alluded to the fact that lumped circuit theory is based on lowfrequency approximations resulting from the neglect of

More information

Two-pole Analysis of Interconnection Trees *

Two-pole Analysis of Interconnection Trees * wo-pole Analysis of Interconnection rees * Andrew B. Kahng and Sudhakar Muddu UCLA Computer Science Department, Los Angeles, CA 90024-1596 USA Abstract We address the two-pole simulation of interconnect

More information

and Ee = E ; 0 they are separated by a dielectric material having u = io-s S/m, µ, = µ, 0

and Ee = E ; 0 they are separated by a dielectric material having u = io-s S/m, µ, = µ, 0 602 CHAPTER 11 TRANSMISSION LINES 11.10 Two identical pulses each of magnitude 12 V and width 2 µs are incident at t = 0 on a lossless transmission line of length 400 m terminated with a load. If the two

More information

Two-Layer Network Equivalent for Electromagnetic Transients

Two-Layer Network Equivalent for Electromagnetic Transients 1328 IEEE TRANSACTIONS ON POWER DELIVERY, VOL. 18, NO. 4, OCTOBER 2003 Two-Layer Network Equivalent for Electromagnetic Transients Mohamed Abdel-Rahman, Member, IEEE, Adam Semlyen, Life Fellow, IEEE, and

More information

7-9 October 2009, Leuven, Belgium Electro-Thermal Simulation of Multi-channel Power Devices on PCB with SPICE

7-9 October 2009, Leuven, Belgium Electro-Thermal Simulation of Multi-channel Power Devices on PCB with SPICE Electro-Thermal Simulation of Multi-channel Power Devices on PCB with SPICE Torsten Hauck*, Wim Teulings*, Evgenii Rudnyi ** * Freescale Semiconductor Inc. ** CADFEM GmbH Abstract In this paper we will

More information

) Rotate L by 120 clockwise to obtain in!! anywhere between load and generator: rotation by 2d in clockwise direction. d=distance from the load to the

) Rotate L by 120 clockwise to obtain in!! anywhere between load and generator: rotation by 2d in clockwise direction. d=distance from the load to the 3.1 Smith Chart Construction: Start with polar representation of. L ; in on lossless lines related by simple phase change ) Idea: polar plot going from L to in involves simple rotation. in jj 1 ) circle

More information

Time Domain Modeling of Lossy Interconnects

Time Domain Modeling of Lossy Interconnects IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 24, NO. 2, MAY 2001 191 Time Domain Modeling of Lossy Interconnects Christer Svensson, Member, IEEE, and Gregory E. Dermer Abstract A new model for dielectric

More information

PHY3128 / PHYM203 (Electronics / Instrumentation) Transmission Lines

PHY3128 / PHYM203 (Electronics / Instrumentation) Transmission Lines Transmission Lines Introduction A transmission line guides energy from one place to another. Optical fibres, waveguides, telephone lines and power cables are all electromagnetic transmission lines. are

More information

Interconnect Energy Dissipation in High-Speed ULSI Circuits

Interconnect Energy Dissipation in High-Speed ULSI Circuits Interconnect Energy Dissipation in High-Speed ULSI Circuits Payam Heydari Massoud Pedram Department of Electrical and Computer Engineering Department of Electrical Engineering-Systems University of California

More information

Numerical Solution of BLT Equation for Inhomogeneous Transmission Line Networks

Numerical Solution of BLT Equation for Inhomogeneous Transmission Line Networks 656 PIERS Proceedings, Kuala Lumpur, MALAYSIA, March 27 30, 2012 Numerical Solution of BLT Equation for Inhomogeneous Transmission Line Networks M. Oumri, Q. Zhang, and M. Sorine INRIA Paris-Rocquencourt,

More information

TRANSIENTS POWER SYSTEM. Theory and Applications TERUO OHNO AKIH1RO AMETANI NAOTO NAGAOKA YOSHIHIRO BABA. CRC Press. Taylor & Francis Croup

TRANSIENTS POWER SYSTEM. Theory and Applications TERUO OHNO AKIH1RO AMETANI NAOTO NAGAOKA YOSHIHIRO BABA. CRC Press. Taylor & Francis Croup POWER SYSTEM TRANSIENTS Theory and Applications AKIH1RO AMETANI NAOTO NAGAOKA YOSHIHIRO BABA TERUO OHNO CRC Press Taylor & Francis Croup Boca Raton London New York CRC Press is an imprint of the Taylor

More information

INTRODUCTION TO TRANSMISSION LINES DR. FARID FARAHMAND FALL 2012

INTRODUCTION TO TRANSMISSION LINES DR. FARID FARAHMAND FALL 2012 INTRODUCTION TO TRANSMISSION LINES DR. FARID FARAHMAND FALL 2012 http://www.empowermentresources.com/stop_cointelpro/electromagnetic_warfare.htm RF Design In RF circuits RF energy has to be transported

More information

J.TAUSCH AND J.WHITE 1. Capacitance Extraction of 3-D Conductor Systems in. Dielectric Media with high Permittivity Ratios

J.TAUSCH AND J.WHITE 1. Capacitance Extraction of 3-D Conductor Systems in. Dielectric Media with high Permittivity Ratios JTAUSCH AND JWHITE Capacitance Extraction of -D Conductor Systems in Dielectric Media with high Permittivity Ratios Johannes Tausch and Jacob White Abstract The recent development of fast algorithms for

More information

Salphasic Distribution of Clock Signals Vernon L. Chi UNC Chapel Hill Department of Computer Science Microelectronic Systems Laboratory

Salphasic Distribution of Clock Signals Vernon L. Chi UNC Chapel Hill Department of Computer Science Microelectronic Systems Laboratory Vernon L. Chi UNC Chapel Hill Department of Computer Science Microelectronic Systems Laboratory Abstract The design of a synchronous system having a global clock must account for the phase shifts experienced

More information

ECE 497 JS Lecture - 18 Impact of Scaling

ECE 497 JS Lecture - 18 Impact of Scaling ECE 497 JS Lecture - 18 Impact of Scaling Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 Announcements Thursday April 8 th Speaker: Prof.

More information

Fast FDTD Simulation Using Laguerre Polynomials in MNA Framework

Fast FDTD Simulation Using Laguerre Polynomials in MNA Framework Fast FDTD Simulation Using Laguerre Polynomials in MNA Framework K. Srinivasan 1, E. Engin and M. Swaminathan 3 Georgia Institute of Technology School of Electrical and Computer Engineering 777 Atlantic

More information

Design for Manufacturability and Power Estimation. Physical issues verification (DSM)

Design for Manufacturability and Power Estimation. Physical issues verification (DSM) Design for Manufacturability and Power Estimation Lecture 25 Alessandra Nardi Thanks to Prof. Jan Rabaey and Prof. K. Keutzer Physical issues verification (DSM) Interconnects Signal Integrity P/G integrity

More information

Harmonic Modeling of Networks

Harmonic Modeling of Networks Harmonic Modeling of Networks Thomas H. Ortmeyer ECE Dept. Clarkson University Potsdam, NY 13699-5720 M. Fayyaz Akram Dept. of Elec. Eng. Univ. of Engineering and Technology Lahore, Pakistan Takashi Hiyama

More information