SGM7227 High Speed USB 2.0 (480Mbps) DPDT Analog Switch

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1 GENERAL DECRIPTION The GM7227 is a high-speed, low-power double-pole/ double-throw (DPDT) analog switch that operates from a single 1.8V to 4.3V power supply. GM7227 is designed for the switching of high-speed UB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited UB I/Os. The GM7227 has low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed UB 2.0 (480 Mbps). Each switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. Its bandwidth is wide enough to pass high-speed UB 2.0 differential signals (480 Mb/s) with good signal integrity. FEATURE R ON is Typically 5Ω at 3.0V Voltage Operation: 1.8V to 4.3V Fast witching Times: t ON 15ns t OFF 20ns Crosstalk: -30dB at 250MHz Off-Isolation: -35dB at 250MHz Rail-to-Rail Input and Output Operation Break-Before-Make witching Extended Industrial Temperature Range: -40 to +85 Available in Green UTQFN L and MOP-10 Packages BLOCK DIAGRAM The GM7227 contains special circuitry on the D+/Dpins which allows the device to withstand a V BU short to D+ or D- when the UB devices are either powered off or powered on. D+ HD1+ HD2+ GM7227 is available in Green UTQFN L and MOP-10 packages. It operates over an ambient temperature range of -40 to +85. D- HD2- HD1- APPLICATION LOGIC Route ignals for UB 2.0 MP3 and Other Personal Media Players Digital Cameras and Camcorders Portable Instrumentation et-top Box PDAs OE REV. A. 3

2 PACKAGE/ORDERING INFORMATION MODEL GM7227 PIN- PACKAGE PECIFIED TEMPERATURE RANGE ORDERING NUMBER PACKAGE MARKING PACKAGE OPTION MOP to +85 GM7227YM10G/TR GM7227YM10 Tape and Reel, 3000 UTQFN L -40 to +85 GM7227YUWQ10G/TR 7227 Tape and Reel, 3000 ABOLUTE MAXIMUM RATING V CC to... 0V to 4.6V Analog, Digital voltage range v to (V CC) + 0.3V Continuous Current H or...±50ma Peak Current H or...±100ma Operating Temperature Range to +85 Junction Temperature torage Temperature Range to +150 Lead Temperature (soldering, 10s) ED usceptibility HBM V MM...400V NOTE: tresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION This integrated circuit can be damaged by ED if you don t pay attention to ED protection. GMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ED damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. GMICRO reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. Please contact GMICRO sales office to get the latest datasheet. 2

3 PIN CONFIGURATION (TOP VIEW) OE 8 HD2+ 7 HD2-6 5 HD1+ VCC OE HD2+ VCC HD1- D+ 3 8 HD2-1 2 D- 4 7 HD1+ D+ D- UTQFN L 5 6 HD1- MOP-10 PIN DECRIPTION PIN UTQFN L MOP-10 NAME 9 1 V CC Power upply 3 5 Ground 10 2 elect Input FUNCTION 8 10 OE Output Enable 5 7 HD1+ Multiplexed ource Inputs 4 6 HD1- Multiplexed ource Inputs 7 9 HD2+ Multiplexed ource Inputs 6 8 HD2- Multiplexed ource Inputs 1 3 D+ UB Data Bus 2 4 D- UB Data Bus FUNCTION TABLE OE HD1+, HD1- HD2+, HD2-0 0 ON OFF 0 1 OFF ON 1 OFF OFF witches hown For Logic 0 Input 3

4 ELECTRICAL CHARACTERITIC (V CC = +3.3V, T A = +25, unless otherwise noted.) PARAMETER YMBOL CONDITION MIN TYP MAX UNIT ANALOG WITCH Analog I/O Voltage (HD1+, HD1-, HD2+, HD2-) V I 0 V CC V On-Resistance R ON V CC = 3.0V, V I = 0V to 0.4V, I D = 8mA, Test Circuit Ω On-Resistance Match Between Channels On-Resistance Flatness Power Off Leakage Current (D+, D-) R ON R FLAT(ON) I OFF V CC = 3.0V, V I = 0V to 0.4V, I D = 8mA, Test Circuit 1 V CC = 3.0V, V I = 0V to 1.0V, I D = 8mA, Test Circuit 1 V CC = 0V, V D = 0V to 3.6V, V, V OE = 0V or 3.6 V Ω 1 2 Ω 1 μa Increase in I CC per Control Voltage I CCT V CC = 3.6V, V or V OE = 2.6V 5 μa ource Off Leakage Current Channel On Leakage Current DIGITAL INPUT I HD2(OFF), I HD1(OFF) I HD2(ON), I HD1(ON) V CC = 3.6V, V I = 3.3V/ 0.3V, V D = 0.3V/ 3.3V V CC = 3.6V, V I = 3.3V/ 0.3V, V D = 3.3V/ 0.3V or floating 1 μa 1 μa Input High Voltage V IH 1.6 V Input Low Voltage V IL 0.5 V Input Leakage Current I IN V CC = 3.0V, V, V OE = 0V or V CC 1 μa DYNAMIC CHARACTERITIC Turn-On Time t ON V I = 0.8V, R L = 50Ω, C L = 10pF, 15 ns Turn-Off Time Test Circuit 2 20 ns Break-Before-Make Time Delay t OFF t D V I = 0.8V, R L = 50Ω, C L = 10pF, Test Circuit ns Propagation Delay t PD R L = 50Ω, C L = 10pF 0.5 ns Off Isolation Channel-to-Channel Crosstalk 3dB Bandwidth O IO X TALK BW ignal = 0dBm, R L = 50Ω, f = 250MHz, Test Circuit 4 ignal = 0dBm, R L = 50Ω, f = 250MHz, Test Circuit 5 ignal = 0dBm, R L = 50Ω, C L = 5pF, Test Circuit 6-35 db -30 db 550 MHz Channel-to-Channel kew t KEW R L = 50Ω, C L = 10pF 130 ps Charge Injection elect Input to Common I/O HD+, HD-, D+, D- ON Capacitance POWER REQUIREMENT Q C ON V G =, C L = 1.0nF, R G = 0Ω, Q = C L x, Test Circuit 7 f = 1MHz 6.5 f = 250MHz 7 10 pc Power upply Range V CC V Power upply Current I CC V CC = 3.0V, V, V OE = 0V or V CC 1 μa pf 4

5 GM7227 TYPICAL PERFORMANCE CHARACTERITIC On Response (db) Response vs. Frequency CROTALK V CC = +3.3V T A = Frequency (MHz) On Response (db) Response vs. Frequency OFF-IOLATION V CC = +3.3V T A = Frequency (MHz) 5

6 TET CIRCUIT 8mA V1 H R ON = V1/8mA Test Circuit 1. On Resistance V I HD1n HD2n V IH V IL V 50% 50% 0.1µF R L C L V OH 90% 90% V V OL t ON t OFF Test Circuit 2. witching Times (t ON, t OFF ) V I HD1n V IH V 50% 0.1µF V HD2n R L C L V IL V OH 90% of V OH 0 t D Test Circuit 3. Break-Before-Make Time (t D ) 6

7 TET CIRCUIT (Cont.) V CC 0.1µF HD1n HD2n V CC ource ignal R L R L Test Circuit 4. Off Isolation 0.1µF V CC V CC H ource ignal R L N.C. H R L Channel To Channel Crosstalk = -20 log V H Test Circuit 5. Channel-to-Channel Crosstalk 7

8 TET CIRCUIT (Cont.) 0.1μF V CC V CC H ource ignal R L C L Test Circuit 6. -3dB Bandwidth V IH HD1n V V IL V G R G V HD2n C L ΔOUT Q = Δ C L Test Circuit 7. Charge Injection (Q) 8

9 APPLICATION NOTE Meeting UB 2.0 V BU hort Requirements Power-Off Protection For a V BU short circuit the switch is expected to withstand such a condition for at least 24 hours. The GM7227 has specially designed circuitry which prevents unintended signal bleed through as well as guaranteed system reliability during a power-down, over-voltage condition. The protection has been added to the common pins (D+, D-). Power-On Protection The UB 2.0 specification also notes that the UB device should be capable of withstanding a V BU short during transmission of data. This modification works by limiting current flow back into the V CC rail during the over-voltage event so current remains within the safe operating range. 9

10 GM7227 UB2.0 ignal Quality Compliance Test Results Figures 1 and 2 show the test results for UB eye diagram tests. Figure 1. Waveform Plot Figure 2. High peed ignal Quality Eye Diagram Test (V CC = 3.3V) 10

11 The following is a summary of the UB test Results. The GM7227 passes the high speed signal quality, eye diagram and jitter tests. Required Tests Overall result: Pass! ignal eye: Eye passes EOP width: 7.91 bits EOP width passes Measured signaling rate: MHz ignal rate passes Rising Edge Rate: V/μs (710.10ps equivalent rise-time) Passes Falling Edge Rate: V/μs (719.77ps equivalent rise-time) Passes Additional Information Consecutive jitter range: ps to ps, RM jitter ps Paired JK jitter range: ps to ps, RM jitter ps Paired KJ jitter range: ps to ps, RM jitter ps 11

12 PACKAGE OUTLINE DIMENION MOP-10 b E1 E 4.8 e RECOMMENDED LAND PATTERN (Unit: mm) D L A A1 A2 c θ ymbol Dimensions In Millimeters Dimensions In Inches MIN MAX MIN MAX A A A b c D E E e BC BC L θ

13 PACKAGE OUTLINE DIMENION UTQFN L 1.800± ± ( 9) TYP PIN #1 IDENTIFICATION CHAMFER ± REF PIN #1 DOT BY MARKING TOP VIEW 0.500± ± BOTTOM VIEW ± REF IDE VIEW RECOMMENDED LAND PATTERN NOTE: All linear dimensions are in millimeters. 13

14 TAPE AND REEL INFORMATION REEL DIMENION TAPE DIMENION P2 P0 W Q1 Q2 Q1 Q2 Q1 Q2 B0 Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P1 A0 K0 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIT OF TAPE AND REEL Package Type Reel Diameter Reel Width W1 A0 B0 K0 P0 P1 P2 W Pin1 Quadrant UTQFN L Q1 MOP Q1 14

15 CARTON BOX DIMENION NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIT OF CARTON BOX Reel Type Length Width Height Pizza/Carton 7 (Option)