-40 C +85 C V CC SCL INT/SQW SDA DS GND

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1 ; Rev 8; 7/10 AVAILABLE I 2 C (RTC) (TCXO) mil SO RTC AM/PM 12 I 2 C RST μp GPS 0 C +40 C ±2ppm -40 C +85 C ±3.5ppm 0 C +70 C -40 C +85 C 2100 (400kHz) I 2 C 3.3V ±3 C RST (UL) PART TEMP RANGE PIN-PACKAGE S# 0 C to +70 C 16 SO SN# -40 C to +85 C 16 SO # RoHS RoHS JESD97 e3 # RoHS R PU = t R /C B R PU R PU SCL SCL INT/SQW μp SDA RST PUSHBUTTON RESET SDA RST GND 32kHz V BAT 本文是英文数据资料的译文, 文中可能存在翻译上的不准确或错误如需进一步确认, 请在您的设计中参考英文资料有关价格供货及订购信息, 请联络 Maxim 亚洲销售中心 : ( 北中国区 ), ( 南中国区 ), 或访问 Maxim 的中文网站 :china.maximintegrated.com

2 ABSOLUTE MAXIMUM RATINGS Voltage Range on, V BAT, 32kHz, SCL, SDA, RST, INT/SQW Relative to Ground V to +6.0V Junction-to-Ambient Thermal Resistance (θ JA ) (Note 1)...73 C/W Junction-to-Case Thermal Resistance (θ JC ) (Note 1)...23 C/W Operating Temperature Range (noncondensing) C to +85 C Junction Temperature C Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS (T A = T MIN to T MAX, unless otherwise noted.) (Notes 2, 3) Storage Temperature Range C to +85 C Lead Temperature (soldering, 10s) C Soldering Temperature (reflow, 2 times max) Lead(Pb)-free C Containing lead(pb) C (See the Handling, PC Board Layout, and Assembly section.) Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to china.maxim-ic.com/thermal-tutorial. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS V Supply Voltage V BAT V 0.7 x V Logic 1 Input SDA, SCL + IH 0.3 Logic 0 Input SDA, SCL V IL x V V ELECTRICAL CHARACTERISTICS ( = 2.3V to 5.5V, = Active Supply (see Table 1), T A = T MIN to T MAX, unless otherwise noted.) (Typical values are at = 3.3V, V BAT = 3.0V, and T A = +25 C, unless otherwise noted.) (Notes 2, 3) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS = 3.63V 200 Active Supply Current I CCA (Notes 4, 5) μa = 5.5V 300 Standby Supply Current I CCS output on, SQW output off I 2 C bus inactive, 32kHz = 3.63V 110 (Note 5) = 5.5V 170 I = 3.63V 575 Temperature Conversion Current I 2 C bus inactive, 32kHz CCSCONV output on, SQW output off = 5.5V 650 μa Power-Fail Voltage V PF V Logic 0 Output, 32kHz, INT/SQW, SDA V OL I OL = 3mA 0.4 V Logic 0 Output, RST V OL I OL = 1mA 0.4 V Output Leakage Current 32kHz, INT/SQW, SDA I LO Output high impedance μa Input Leakage SCL I LI μa RST Pin I/O Leakage I OL RST high impedance (Note 6) μa V BAT Leakage Current ( Active) I BATLKG na μa 2 Maxim Integrated

3 ELECTRICAL CHARACTERISTICS (continued) ( = 2.3V to 5.5V, = Active Supply (see Table 1), T A = T MIN to T MAX, unless otherwise noted.) (Typical values are at = 3.3V, V BAT = 3.0V, and T A = +25 C, unless otherwise noted.) (Notes 2, 3) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Output Frequency f OUT = 3.3V or V BAT = 3.3V khz Frequency Stability vs. Temperature (Commercial) f/f OUT = 3.3V or 0 C to +40 C ±2 V BAT = 3.3V, aging offset = 00h >40 C to +70 C ±3.5 ppm = 3.3V or -40 C to <0 C ±3.5 Frequency Stability vs. f/f OUT V BAT = 3.3V, 0 C to +40 C ±2 ppm Temperature (Industrial) aging offset = 00h >40 C to +85 C ±3.5 Frequency Stability vs. Voltage f/v 1 ppm/v -40 C 0.7 Trim Register Frequency +25 C 0.1 f/lsb Specified at: ppm Sensitivity per LSB +70 C C 0.8 Temperature Accuracy Temp = 3.3V or V BAT = 3.3V C After reflow, First year ±1.0 Crystal Aging f/f O ppm not production tested 0 10 years ±5.0 ELECTRICAL CHARACTERISTICS ( = 0V, V BAT = 2.3V to 5.5V, T A = T MIN to T MAX, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS EOSC = 0, BBSQW = 0, V BAT = 3.63V 70 Active Battery Current I BATA μa SCL = 400kHz (Note 5) V BAT = 5.5V 150 EOSC = 0, BBSQW = 0, V BAT = 3.63V EN32kHz = 1, Timekeeping Battery Current I BATT SCL = SDA = 0V or SCL = SDA = V BAT (Note 5) V BAT = 5.5V Temperature Conversion Current I BATTC SCL = SDA = 0V or EOSC = 0, BBSQW = 0, V BAT = 3.63V 575 SCL = SDA = V BAT V BAT = 5.5V 650 μa μa Data-Retention Current I BATTDR EOSC = 1, SCL = SDA = 0V, +25 C 100 na Maxim Integrated 3

4 AC ELECTRICAL CHARACTERISTICS ( = (MIN) to (MAX) or V BAT = V BAT(MIN) to V BAT(MAX), V BAT >, T A = T MIN to T MAX, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Fast mode SCL Clock Frequency f SCL Standard mode khz Bus Free Time Between STOP and START Conditions Hold Time (Repeated) START Condition (Note 7) t BUF Fast mode 1.3 Standard mode 4.7 t HD:STA Fast mode 0.6 Standard mode 4.0 Low Period of SCL Clock t LOW Fast mode 1.3 Standard mode 4.7 High Period of SCL Clock t HIGH Fast mode 0.6 Standard mode 4.0 Data Hold Time (Notes 8, 9) t HD:DAT Fast mode Standard mode Data Setup Time (Note 10) t SU:DAT Fast mode 100 Standard mode 250 START Setup Time t SU:STA Fast mode 0.6 Standard mode 4.7 μs μs μs μs μs ns μs Rise Time of Both SDA and SCL Signals (Note 11) Fall Time of Both SDA and SCL Signals (Note 11) t R t F Fast mode Standard mode 0.1C B 1000 ns Fast mode Standard mode 0.1C B 300 ns Fast mode 0.6 Setup Time for STOP Condition t SU:STO Standard mode 4.7 Capacitive Load for Each Bus Line C B (Note 11) 400 pf Capacitance for SDA, SCL C I/O 10 pf Pulse Width of Spikes That Must Be Suppressed by the Input Filter t SP 30 ns Pushbutton Debounce PB DB 250 ms Reset Active Time t RST 250 ms Oscillator Stop Flag (OSF) Delay t OSF (Note 12) 100 ms Temperature Conversion Time t CONV ms POWER-SWITCH CHARACTERISTICS (T A = T MIN to T MAX ) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Fall Time; V PF(MAX) to V PF(MIN) t VCCF 300 μs Rise Time; V PF(MIN) to t VCCR 0 μs V PF(MAX) Recovery at Power-Up t REC (Note 13) ms 4 Maxim Integrated μs

5 RST PB DB t RST V PF(MAX) V PF V PF V PF(MIN) t VCCF tvccr t REC RST Maxim Integrated 5

6 I 2 C SDA t BUF t LOW t F t HD:STA t SP SCL t HD:STA t R t HIGH t SU:STA t SU:STO STOP START REPEATED START NOTE: TIMING IS REFERENCED TO V IL(MAX) AND V IH(MIN). t HD:DAT t SU:DAT WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data. Note 2: Limits at -40 C are guaranteed by design and not production tested. Note 3: All voltages are referenced to ground. Note 4: I CCA SCL clocking at max frequency = 400kHz. Note 5: Current is the averaged input current, which includes the temperature conversion current. Note 6: The RST pin has an internal 50kΩ (nominal) pullup resistor to. Note 7: After this period, the first clock pulse is generated. Note 8: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V IH(MIN) of the SCL signal) to bridge the undefined region of the falling edge of SCL. Note 9: The maximum t HD:DAT needs only to be met if the device does not stretch the low period (t LOW ) of the SCL signal. Note 10: A fast-mode device can be used in a standard-mode system, but the requirement t SU:DAT 250ns must then be met. This is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line t R(MAX) + t SU:DAT = = 1250ns before the SCL line is released. Note 11: C B total capacitance of one bus line in pf. Note 12: The parameter t OSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of 0.0V (MAX) and 2.3V V BAT 3.4V. Note 13: This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, t REC is bypassed and RST immediately goes high. The state of RST does not affect the I 2 C interface, RTC, or TCXO. 6 Maxim Integrated

7 ( = +3.3V, T A = +25 C, unless otherwise noted.) STANDBY SUPPLY CURRENT vs. SUPPLY VOLTAGE BSY = 0, SCL = SDA = RST ACTIVE toc SUPPLY CURRENT vs. SUPPLY VOLTAGE = 0V, BSY = 0, SDA = SCL = V BAT OR toc02 ICCS (μa) IBAT (μa) EN32kHz = 1 EN32kHz = (V) V BAT (V) IBAT (μa) SUPPLY CURRENT vs. TEMPERATURE = 0, EN32kHz = 1, BSY = 0, SDA = SCL = V BAT OR GND toc03 FREQUENCY DEVIATION (ppm) FREQUENCY DEVIATION vs. TEMPERATURE vs. AGING VALUE toc TEMPERATURE ( C) TEMPERATURE ( C) DELTA FREQUENCY (ppm) DELTA TIME AND FREQUENCY vs. TEMPERATURE CRYSTAL +20ppm CRYSTAL -20ppm TYPICAL CRYSTAL, UNCOMPENSATED TEMPERATURE ( C) ACCURACY BAND toc DELTA TIME (MIN/YEAR) Maxim Integrated 7

8 X1 OSCILLATOR AND CAPACITOR ARRAY N 32kHz X2 CONTROL LOGIC/ DIVIDER 1Hz SQUARE-WAVE BUFFER; INT/SQW CONTROL N INT/SQW V BAT GND POWER CONTROL TEMPERATURE SENSOR ALARM, STATUS, AND CONTROL REGISTERS SCL SDA I 2 C INTERFACE AND ADDRESS REGISTER DECODE 1Hz CLOCK AND CALENDAR REGISTERS USER BUFFER (7 BYTES) VOLTAGE REFERENCE; DEBOUNCE CIRCUIT; PUSHBUTTON RESET N RST 8 Maxim Integrated

9 1 32kHz 2 32kHz 0.1μF 1.0μF 3 INT/SQW 5.5V 5.5V (0Eh) INTCN INTCN 0 RS2 RS1 INTCN 1 INT/SQW ( ) INTCN 1 5.5V 4 RST / V PF V PF RST V PF t RST RST 50kΩ t REC RST GND 14 V BAT V BAT 0.1μF 1.0μF V BAT V BAT UL 15 SDA 16 SCL / I 2 C / 5.5V I 2 C 5.5V 32kHz RTC TCXO -40 C +85 C RTC ±2 / TCXO 32kHz RTC / INT/SQW / AM/PM 12 I 2 C RST Maxim Integrated 9

10 TCXO RTC 32kHz TCXO TCXO AGE AGE 64 V PF V PF V BAT V PF V BAT V BAT 1 1. SUPPLY CONDITION < V PF, < V BAT < V PF, > V BAT > V PF, < V BAT > V PF, > V BAT ACTIVE SUPPLY V BAT V BAT V PF I 2 C 1 I 2 C 2 ( V BAT ) 64 ( ) I 2 C (V BAT ) 01/01/ :00:00 (MM/DD/YY DOW HH:MM:SS) V BAT V BAT V BAT I BATA (I BATT ) I BATTC ( 3644 ) I BATTC I BATTDR (EOSC =1) ( ) RST RST RST (PB DB ) RST RST t RST RST V PF RST V PF RST 250ms (t REC ) ( ) t REC RST RST TCXO RTC AM/PM 12 INT/SQW INTCN 10 Maxim Integrated

11 1. A D D R ESS BIT 7 MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 06h 10 Year Year Year h A1M1 10 Seconds Seconds Alarm 1 Seconds h A1M2 10 Minutes Minutes Alarm 1 Minutes h A1M3 12/24 AM/PM AM/PM 10 Hour Hour Alarm 1 Hours 20 Hour Ah A1M4 DY/DT 10 Date Day Alarm 1 Day 1 7 Date Alarm 1 Date Bh A2M2 10 Minutes Minutes Alarm 2 Minutes Ch A2M3 12/24 AM/PM AM/PM 10 Hour Hour Alarm 2 Hours 20 Hour Dh A2M4 DY/DT 10 Date Day Alarm 2 Day 1 7 Date Alarm 2 Date Eh EOSC BBSQW CONV RS2 RS1 INTCN A2IE A1IE Control 0Fh OSF EN32kHz BSY A2F A1F Control/Status 10h SIGN DATA DATA DATA DATA DATA DATA DATA Aging Offset 11h SIGN DATA DATA DATA DATA DATA DATA DATA MSB of Temp 12h DATA DATA LSB of Temp BIT 0 LSB FUNCTION RANGE 00h 0 10 Seconds Seconds Seconds h 0 10 Minutes Minutes Minutes h 0 12/24 AM/PM AM/PM 10 Hour Hour Hours 20 Hour h Day Day h Date Date Date h Century Month Month Month/ Century Century 1 (12h) 00h I 2 C START 00h I 2 C V BAT I 2 C I 2 C SDA SCL I 2 C SCL SDA START 1 RTC (BCD) Maxim Integrated 11

12 AM/PM PM 24 5 (20 23 ) ( 7 ) ( 1 2 ) ( ) START 1 1Hz 500ms / 1 07h 0Ah 2 0Bh 0Dh ( INTCN ) INT/ SQW / 7 ( 2) 0 / 2 DY/DT ( / 6 ) 0 5 DY/DT 0 DY/DT 1 RTC 'A1F' 'A2F' 1 'A1IE' 'A2IE' 1 INTCN 1 INT/SQW 2. DY/DT ALARM 1 REGISTER MASK BITS (BIT 7) A1M4 A1M3 A1M2 A1M1 ALARM RATE X Alarm once per second X Alarm when seconds match X Alarm when minutes and seconds match X Alarm when hours, minutes, and seconds match Alarm when date, hours, minutes, and seconds match Alarm when day, hours, minutes, and seconds match DY/DT ALARM 2 REGISTER MASK BITS (BIT 7) A2M4 A2M3 A2M2 ALARM RATE X Alarm once per minute (00 seconds of every minute) X Alarm when minutes match X Alarm when hours and minutes match Alarm when date, hours, and minutes match Alarm when day, hours, and minutes match 12 Maxim Integrated

13 (0Eh) BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 NAME: EOSC BBSQW CONV RS2 RS1 INTCN A2IE A1IE POR: ( ) (0Eh) 7 (EOSC) 0 1 V BAT ( 0) EOSC EOSC 6 (BBSQW) 1 INTCN = 0 <V PF BBSQW 0 <V PF INT/SQW ( 0) 5 (CONV) 1 TCXO TCXO BSY 64 2ms BSY CONV 1 CONV BSY 0 CONV 4 3 (RS2 RS1) RS 1 (8.192kHz) RS2 RS1 SQUARE-WAVE OUTPUT FREQUENCY 0 0 1Hz kHz kHz kHz 2 (INTCN) INT/SQW INTCN 0 INT/SQW INTCN 1 INT/SQW ( ) INTCN INTCN (A2IE) 1 2 (A2F) INT/SQW ( INTCN = 1 ) A2IE 0 INTCN 0 A2F A2IE ( 0) 0 1 (A1IE) 1 1 (A1F) INT/SQW ( INTCN = 1 ) A1IE 0 INTCN 0 A1F INT/SQW A1IE ( 0) Maxim Integrated 13

14 (0Fh) BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 NAME: OSF EN32kHz BSY A2F A1F POR: X X X (0Fh) 7 (OSF) 1 1 OSF 1) 2) V BAT 3) EOSC 4) ( ) kHz (EN32kHz) 32kHz 1 32kHz kHz 0 32kHz 1 ( ) 32kHz kHz 2 (BSY) TCXO BSY (A2F) A2IE 1 INTCN 1 INT/SQW 0 A2F (A1F) A1IE 1 INTCN 1 INT/SQW 0 A1F LSB ( CONV ) 32kHz LSB (ppm) C LSB 0.1ppm Electrical Characteristics (10h) BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 NAME: Sign Data Data Data Data Data Data Data POR: Maxim Integrated

15 ( ) (11h) BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 NAME: Sign Data Data Data Data Data Data Data POR: ( ) (12h) BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 NAME: Data Data POR: (11h 12h) C 11h 12h 2 8 ( ) 11h 2 ( ) 12h b = C 0 C V BAT I 2 C I 2 C I 2 C (SCL) START STOP I 2 C SCL SDA I/O (100kHz ) (400kHz ) ( 2) START STOP START START STOP START STOP 9 SDA SDA STOP Maxim Integrated 15

16 MSB FIRST MSB LSB MSB LSB SDA SLAVE ADDRESS R/W ACK DATA ACK DATA ACK/ NACK SCL IDLE START CONDITION REPEATED IF MORE BYTES ARE TRANSFERRED STOP CONDITION REPEATED START 2. I 2 C 3 4 I 2 C R/W (MSB) ( ) <SLAVE ADDRESS> <R/W> <WORD ADDRESS (n)> <DATA (n)> <DATA (n + 1)> <DATA (n + X) S A XXXXXXXX A XXXXXXXX A XXXXXXXX A XXXXXXXX A P... S - START SLAVE TO MASTER A - ACKNOWLEDGE (ACK) P - STOP R/W - READ/WRITE OR DIRECTION BIT ADDRESS MASTER TO SLAVE DATA TRANSFERRED (X + 1 BYTES + ACKNOWLEDGE) 3. <SLAVE ADDRESS> <R/W> <DATA (n)> <DATA (n + 1)> <DATA (n + 2)> <DATA (n + X)> S A XXXXXXXX A XXXXXXXX A XXXXXXXX A... XXXXXXXX A P S - START MASTER TO SLAVE A - ACKNOWLEDGE (ACK) P - STOP A - NOT ACKNOWLEDGE (NACK) R/W - READ/WRITE OR DIRECTION BIT ADDRESS SLAVE TO MASTER DATA TRANSFERRED (X + 1 BYTES + ACKNOWLEDGE) NOTE: LAST DATA BYTE IS FOLLOWED BY A NACK Maxim Integrated

17 <SLAVE ADDRESS> <R/W> <WORD ADDRESS (n)> <SLAVE ADDRESS (n)> <R/W> S A XXXXXXXX A Sr A <DATA (n)> <DATA (n + 1)> <DATA (n + 2)> <DATA (n + X)> XXXXXXXX A XXXXXXXX A XXXXXXXX A XXXXXXXX A P... S - START MASTER TO SLAVE Sr - REPEATED START A - ACKNOWLEDGE (ACK) P - STOP A - NOT ACKNOWLEDGE (NACK) R/W - READ/WRITE OR DIRECTION BIT ADDRESS SLAVE TO MASTER DATA TRANSFERRED (X + 1 BYTES + ACKNOWLEDGE) NOTE: LAST DATA BYTE IS FOLLOWED BY A NACK. 5. / ( ) START STOP STOP START START (MSB) ( ) SDA SCL START STOP START (R/W) 0 SDA + 0 STOP ( ) SDA SCL START STOP START (R/W) 1 SDA Maxim Integrated 17

18 PCB - ( ) (MSD) IPC/ JEDEC J-STD TOP VIEW SUBSTRATE CONNECTED TO GROUND PROCESS: CMOS 32kHz 1 16 SCL 2 15 SDA INT/SQW RST V BAT GND china.maxim-ic. com/packages SO W16#H SO 18 Maxim Integrated

19 0 1/05 ±2 C ±3 C 1, 3 1 2/05 1 T A = -40 C to +85 C T A = T MIN to T MAX 2, 3, 4 8 UL S 1 2 6/05 V PF MIN 2.35V 2.45V 4 X1 V BAT I 2 C 1 MSB LSB = 00h 7 ( ) 7 ( ) I 2 C J-STD-020 PCB /05 RoHS RST UL EC > V BAT = Active Supply (see Table 1) 12 t REC , /06 32kHz RST 9 1 Powered By Active Supply V PF 10 BBSQW SQW ( 5 ) INT/SQW ( 2 ) 13 32kHz EC /08 POR RST 1 04h Maxim Integrated 19

20 ( ) Recommended DC Operating Conditions V PU INT/SQW SDA SCL 1 2, /08 Delta Time and Frequency vs. Temperature V BAT 32kHz TCXO POR (11h 12h) I 2 C ( 3 4 5) , 14, 15 14, 15 16, /10 S 1, /10 Absolute Maximum Ratings θ JA θ JC C ( (Pb)) +240 C ( ) V BAT 1 02h 09h 0Ch 20 (0Eh) BBSQW 1, 2, 3, 4, 6, 9, 11, 12, 13, 18 Maxim 北京办事处北京 8328 信箱邮政编码免费电话 : 电话 : 传真 : Maxim 不对 Maxim 产品以外的任何电路使用负责, 也不提供其专利许可 Maxim 保留在任何时间没有任何通报的前提下修改产品资料和规格的权利电气特性表中列出的参数值 ( 最小值和最大值 ) 均经过设计验证, 数据资料其它章节引用的参数值供设计人员参考 20 Maxim Integrated 160 Rio Robles, San Jose, CA USA Maxim Integrated Maxim 标志和 Maxim Integrated 是 Maxim Integrated Products, Inc. 的商标

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