MAX471/MAX472 PART TEMP. RANGE PIN-PACKAGE. MAX471EPA 0 C to +70 C

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1 19-; Rev 2; 12/96 µ µ µ µ PART TEMP. RANGE PIN-PACKAGE CPA CSA EPA C to +7 C C to +7 C -4 C to +8 C 8 Plastic DIP 8 SO 8 Plastic DIP ESA -4 C to +8 C 8 SO CPA C to +7 C 8 Plastic DIP CSA C to +7 C 8 SO EPA -4 C to +8 C 8 Plastic DIP ESA -4 C to +8 C 8 SO TO 6 SHDN I LOAD 2 1k 2k I LOAD TO LOAD or CHARGER LOGIC SUPPLY DISCHARGE/CHARGE (1/A) TOP IEW SHDN DIP/SO Pin Configuration continued on last page. Maxim Integrated Products 1

2 ABSOLUTE MAXIMUM RATINGS Supply oltage,,, CC to...-., +4 RMS Current, to ( only)...±.a Peak Current, ( to )...see Figure Differential Input oltage, to RG2 ( only)...±. oltage at Any Pin Except only...-. to ( -.) only...-. to ( CC +.) oltage at...-. to +4 Current into SHDN,,,, RG2, CC...±mA Current into...+1ma, -ma Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS ( = + to +6, T A = T MIN to T MAX, unless otherwise noted. Typical values are at T A = +2 C.) Continuous Power Dissipation (T A = +7 C) (Note 1): Plastic DIP (derate 17.mW/ C above +7 C)...1.4W SO (derate 9.9mW/ C above +7 C)...791mW : Plastic DIP (derate 9.9mW/ C above +7 C)...727mW SO (derate.88mw/ C above +7 C)...471mW Operating Temperature Ranges MAX47_C_A... C to +7 C MAX47_E_A...-4 C to +8 C Junction Temperature Range...-6 C to +1 C Storage Temperature Range...-6 C to +16 C Lead Temperature (soldering, 1sec)...+ C Note 1: Due to special packaging considerations, (DIP, SO) has a higher power dissipation rating than the. and must be soldered to large copper traces to achieve this dissipation rating. PARAMETER Supply oltage Supply Current Sense Current Sense Resistor Current-Sense Ratio No-Load Error Low-Level Error Power-Supply Rejection Ratio Threshold (I LOAD required to switch ) Output Leakage Current Sink Current Shutdown Supply Current SHDN Input Low oltage SHDN Input Low Current SHDN Input High oltage SHDN Input High Current SYMBOL CONDITIONS MIN TYP MAX 6 I I LOAD = A, excludes I 11 I LOAD ± R SENSE 7 I / I LOAD = 1A, C I LOAD = 1 E I LOAD = A, C 2. = 1 E. I LOAD = ma, C ±2. = 1 E ±. PSRR 6, I LOAD = 1A.1 C ±4. ±6. E ±7. = 6 I OL =..1 I (SHDN) SHDN = 2.4; CC = to IL I IL IH I IH SHDN = SHDN = 2.4 Output oltage Range - 1. Output Resistance R I LOAD =.A, = to ( - 1.) 1 MΩ Rise, Fall Time t R, t F I LOAD = ma to.a, R = 2kΩ, C = pf, 1% to 9% Settling Time to 1% of Final alue t s I LOAD = 1mA to.a, R = 2kΩ, C = pf 2.4. UNITS A RMS mω ma/a %/ ma ma 4 µs 1 µs 2

3 ELECTRICAL CHARACTERISTICS ( CC = + to +6, = RG2 = 2Ω, T A = T MIN to T MAX, unless otherwise noted. Typical values are at T A = +2 C.) Supply oltage Supply Current PARAMETER Input Offset oltage (Note 2) Input Bias Current Input Bias-Current Matching Current Accuracy No-Load Error Low-Level Error Power-Supply Rejection Ratio Threshold ( SENSE required to switch ) Output Leakage Current Output Sink Current Shutdown Supply Current SHDN Input Low oltage SHDN Input Low Current SHDN Input High oltage SHDN Input High Current SYMBOL CONDITIONS MIN TYP MAX CC 6 I CC I LOAD = A, excludes I ; CC = to OS C 12 E 14 I, I RG2 2 I OS I - I GR2 ±.4 ±. I RG/I SENSE = 1m, C ±2 CC = 1 (Note ) E ±2. PSRR I CC(SHDN) IL I IL IH I IH CC = 1, C 2. SENSE = E CC = 1, C SENSE = m E CC 6, SENSE = 1m C CC = 1 E = 6 =. SHDN = 2.4; CC = to 2 SHDN = SHDN = 2.4 Output oltage Range CC - 1. Output Resistance R I = 1.mA 1 MΩ Rise, Fall Time t R, t F SENSE = m to 1m, R = 2kΩ, C = pf, 1% to 9% Settling Time to 1% of Final alue t s SENSE = m to 1m, R = 2kΩ, C = pf ±2. ± UNITS µ %/ µ ma 4 µs 1 µs Maximum Output Current I 1. ma % Note 2: OS is defined as the input voltage ( SENSE) required to give minimum I. Note : SENSE is the voltage across the sense resistor.

4 (Typical Operating Circuit () or circuit of Figure 4, = RG2 = 2Ω, R = 2kΩ (), T A = +2 C, unless otherwise noted.) SUPPLY CURRENT () SUPPLY CURRENT vs. SUPPLY OLTAGE T A = +8 C T A = +2 C T A = -4 C MAX ISHDN () SHUTDOWN CURRENT vs. SUPPLY OLTAGE T A = -4 C T A = +2 C T A = +8 C MAX THRESHOLD (ma) THRESHOLD vs. SUPPLY OLTAGE T A = -4 C T A = +2 C T A = +8 C MAX () () () OFFSET CURRENT () RESISTANCE (mω) NO-LOAD OFFSET CURRENT vs. SUPPLY OLTAGE T A = +2 C T A = -4 C T A = +8 C S+ = S () TO RESISTANCE vs. TEMPERATURE TEMPERATURE ( C) MAX MAX ERROR (%) I () ERROR vs. LOAD CURRENT I LOAD FROM TO -9 I LOAD FROM TO I LOAD (A) NO-LOAD PUT ERROR vs. SUPPLY OLTAGE = RG2 = Ω T A = -4 C T A = +8 C T A = +2 C CC () - MAX PSRR (%) ERROR (%) POWER-SUPPLY REJECTION RATIO vs. FREQUENCY I LOAD = 1A RS 1µF A Ω = TO. = TO 1 = m TO m POWER-SUPPLY FREQUENCY (khz) ERROR vs. SUPPLY OLTAGE T A = +2 C - RG2 = 6m, = RG2 = 2Ω T A = +8 C T A = -4 C CC () -6 MAX

5 (Typical Operating Circuit () or circuit of Figure 4, = RG2 = 2Ω, R = 2kΩ (), T A = +2 C, unless otherwise noted.) ERROR (%) ERROR vs. SENSE OLTAGE - RG2 RG SENSE (m) -1 I NOISE (RMS) NOISE vs. LOAD CURRENT 1mA 1mA 1mA 1A ISENSE -1 ma to 1mA TRANSIENT RESPONSE -1mA to +1mA TRANSIENT RESPONSE A LOAD CURRENT ma/div A LOAD CURRENT 1mA/div m/div 1µs/div CC = 1, R = 2kΩ 1%, PULL-UP = kω 1% m/div ma/div 1µs/div CC = 1, R = 2kΩ 1%, PULL-UP = kω 1% m/div START-UP DELAY A TO A TRANSIENT RESPONSE I LOAD 1A/div m/div SHDN /div 1m/div 1µs/div I LOAD = 1A, R = 2kΩ 1% R = 2kΩ 1% 1µs/div

6 1 2, 4 6, SHDN N.C. RG2 µ 7 CC 8 8 µ µ 6

7 2, Q1 A1 R SENSE A2 RG2 Q2 6, 7 8 COMP R SENSE POWER SOURCE OR BATTERY SENSE RG2 TO LOAD/CHARGER 6 A1 A2 Q1 Q2 7 CC 8 COMP 7

8 TO 6 LOGIC SUPPLY 1k TO LOAD/ CHARGER POWER SOURCE OR BATTERY TO 6 1 SHDN 2 N.C. 4 R SENSE RG2 8 CC 7 RG2 6 TO LOAD/CHARGER LOGIC SUPPLY 1k R 1k µ µ µ 8

9 SENSE CURRENT (A) T A = +2 C 1µ PULSE WIDTH (sec) DIP safe operating region Small DIP Outline fuse fuse time time 1µ 1m 1m Small Outline safe operating region % 1% 1%

10 POWER SOURCE OR BATTERY TO LOAD/CHARGER R SENSE." COPPER.1" COPPER." COPPER TO SHDN N.C. RG2 8 CC 7 RG2 6 1.k 1k µ ( - RG2) x IB +IOS xrg x 1 I FS x RSENSE µ µ µ µ 2Ω x 2 + 1Ω x 2 =.48% mω x A Note 4: Printed Circuit Design, by Gerald L. Ginsberg; McGraw-Hill, Inc.; page 18. 1

11 µ µ 11

12 SHDN 1 8 N.C CC RG2 DIP/SO 12 Maxim Integrated Products, 12 San Gabriel Drive, Sunnyvale, CA 9486 (48) Maxim Integrated Products is a registered trademark of Maxim Integrated Products.