HFB20HJ20C. Ultrafast, Soft Recovery Diode. Features. Description. Absolute Maximum Ratings. 1 PD A V R = 200V I F(AV) = 20A
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1 PD A HEXFRED TM Features Reduced RFI and EMI Reduced Snubbing Extensive Characterization of Recovery Parameters Hermetic Surface Mount Ultrafast, Soft Recovery Diode V R = 200V I F(AV) = 20A t rr = 20ns Description HEXFRED TM diodes are optimized to reduce losses and EMI/RFI in high frequency power conditioning systems. An extensive characterization of the recovery behavior for different values of current, temperature and di/dt simplifies the calculations of losses in the operating conditions. The softness of the recovery eliminates the need for a snubber in most applications. These devices are ideally suited for power converters, motors drives and other applications where switching losses are significant portion of the total losses. Absolute Maximum Ratings Parameter Max. Units V R Cathode to Anode Voltage ( Per Leg ) 200 V I F(AV) Continuous Forward Current, T C = 85 C 20 A I FSM Single Pulse Forward Current, T C ( Per Leg) 25 P T C Maximum Power Dissipation 28 W, T STG Operating Junction and Storage Temperature Range -55 to +50 C Note: D.C. = 50% rect. wave /2 sine wave, 60 Hz, P.W. = 8.33 ms CASE STYLE (ISOLATED BASE) SMD-0.5 ANODE COMMON ANODE CATHODE 5/08/0
2 Electrical Characteristics ( Per Leg (unless otherwise specified) Parameter Min. Typ. Max. Units Test Conditions V BR Cathode Anode Breakdown Voltage 200 V I R = 0µA V F Forward Voltage.26 I F = A, = -55 C See Fig.. V I F = A,.30, See Fig I F = A, I R Reverse Leakage Current µa V R = V R Rated See Fig. 2.0 ma V R = V R Rated, C unction Capacitance, See Fig pf V R = 200V L S Series Inductance 4.8 nh Measured from center of cathode pad to center of anode pad Dynamic Recovery Characteristics ( Per Leg )@ (unless otherwise specified) Parameter Min. Typ. Max. Units Test Conditions t rr Reverse Recovery Time 20 ns I F =.0A,V R = 30V, di f /dt = 200A/µs t rr Reverse Recovery Time 27 ns See Fig. t rr I RRM Peak Recovery Current 3.5 T A J See Fig. I RRM2 5.5 A 6 V R = 60V Q rr Reverse Recovery Charge 54 T nc J See Fig. Q rr2 20 nc 7 di f /dt = 200A/µs di (rec)m /dt Peak Rate of Fall of Recovery Current 640 T A/µs J See Fig. di (rec)m /dt2 During t b 850 A/µs 8 Thermal - Mechanical Characteristics Parameter Typ. Max. Units R thjc Junction-to-Case, Single Leg Conducting 4.5 C/W Wt Weight.0 g 2
3 Instantaneous Forward Current - I F (A) Junction Capacitance - C T (pf) Reverse Current - I R (µa) C 0 C 75 C 25 C E-005 Fig. 2 - Typical Reverse Current Vs. Reverse Voltage ( Per Leg ) Reverse Voltage - V R (V) Tj Tj Tj = -55 C Forward Voltage Drop - V F (V) Fig. - Maximum Forward Voltage Drop Vs. Instantaneous Forward Current ( Per Leg ) Reverse Voltage - V R (V) Fig. 3 - Typical Junction Capacitance Vs. Reverse Voltage ( Per Leg ) Thermal Response (Z thjc ) 0. D = SINGLE PULSE (THERMAL RESPONSE) Notes:. Duty factor D = t / t 2 2. Peak = P DM x Z thjc + TC t, Rectangular Pulse Duration (sec) PDM t t2 Fig. 4 - Maximum Thermal Impedance Z thjc Characteristics ( Per Leg ) 3
4 Q rr - ( nc ) / dt - ( A / µs ) t rr - ( ns ) I RRM - ( A ) I F = A 30 I F = A 20 V R = 60V V R = 60V Fig. 5 - Typical Reverse Recovery Vs. di f /dt,( Per Leg) Fig. 6 -Typical Recovery Current Vs. di f /dt ( Per Leg) I F = A I F = A 0 00 V R = 60V di ( rec )M V R = 60V Fig. 7 - Typical Stored Charge Vs. di f /dt ( Per Leg) Fig. 8 - Typical di (rec)m /dt Vs. di f /dt ( Per Leg ) 4
5 REVERSE RECOVERY CIRCUIT dif/dt ADJUST L = 70µH G V R = 200V 0.0 Ω Fig. 9 - Reverse Recovery Parameter Test Circuit D S IRFP250 D.U.T. 0 I F di /dt f. di f/dt - Rate of change of current through zero crossing 2. I RRM - Peak reverse recovery current 3. trr - Reverse recovery time measured from zero crossing point of negative going I F to point where a line passing through 0.75 I RRM and 0.50 I RRM extrapolated to zero current t a 2 3 trr I RRM 4. Q rr - Area under curve defined by t rr and I RRM t rr X I RRM Q rr = 2 5. di (rec)m/dt - Peak rate of change of current during t b portion of t rr Fig. - Reverse Recovery Waveform and Definitions t b 0.75 I RRM Q rr I RRM di(rec)m/dt 5 Case Outline and Dimensions SMD-0.5 HEXFRED DOUBLE DIE = COMMON CATHODE 2 = ANODE 3 = ANODE 2 IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (3) TAC Fax: (3) Visit us at for sales contact information. Data and specifications subject to change without notice. 05/0 5
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